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Arief S. Budiman, Ph.D. - Publications

Affiliations: 
2008 Stanford University, Palo Alto, CA 
Area:
materials science
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50 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2019 Ali HPA, Budiman A. Advances in In situ microfracture experimentation techniques: A case of nanoscale metal–metal multilayered materials Journal of Materials Research. 34: 1449-1468. DOI: 10.1557/Jmr.2019.75  0.326
2019 Tippabhotla SK, Radchenko I, Stan CV, Tamura N, Budiman AS. Stress evolution in silicon nanowires during electrochemical lithiation using in situ synchrotron X-ray microdiffraction Journal of Materials Research. 34: 1622-1631. DOI: 10.1557/Jmr.2019.27  0.413
2019 Ali HPA, Radchenko I, Li N, Budiman A. Effect of multilayer interface through in situ fracture of Cu/Nb and Al/Nb metallic multilayers Journal of Materials Research. 34: 1564-1573. DOI: 10.1557/Jmr.2018.449  0.32
2019 Tippabhotla SK, Song WJR, Subramani A, Stan CV, Tamura N, Tay AAO, Budiman AS. Stress and Fracture of Crystalline Silicon Cells in Solar Photovoltaic Modules – A Synchrotron X-ray Microdiffraction based Investigation Mrs Advances. 4: 2319-2335. DOI: 10.1557/Adv.2019.337  0.396
2019 Agarwal K, Sahay R, Baji A, Budiman AS. Biomimetic tough helicoidally structured material through novel electrospinning based additive manufacturing Mrs Advances. 4: 2345-2354. DOI: 10.1557/Adv.2019.313  0.3
2019 Tippabhotla SK, Diesta NG, Zhang X, Sridhara S, Stan CV, Tamura N, Tay AAO, Budiman AS. Thermomechanical residual stress evaluation in multi-crystalline silicon solar cells of photovoltaic modules with different encapsulation polymers using synchrotron X-ray microdiffraction Solar Energy Materials and Solar Cells. 193: 387-402. DOI: 10.1016/J.Solmat.2019.01.016  0.373
2019 Tippabhotla SK, Song WJR, Tay AAO, Budiman AS. Effect of encapsulants on the thermomechanical residual stress in the back-contact silicon solar cells of photovoltaic modules - A constrained local curvature model Solar Energy. 182: 134-147. DOI: 10.1016/J.Solener.2019.02.028  0.352
2018 Ali I, Tippabhotla SK, Radchenko I, Al-Obeidi A, Stan CV, Tamura N, Budiman AS. Probing stress states in silicon nanowires during electrochemical lithiation using in situ synchrotron X-ray microdiffraction Frontiers in Energy Research. 6: 19. DOI: 10.3389/Fenrg.2018.00019  0.431
2018 Budiman AS, Gan CL, Pey K, Sukharev V, Thomas O. Guest Editorial for IRSP 2018 Conference Ieee Transactions On Device and Materials Reliability. 18: 487-489. DOI: 10.1109/Tdmr.2018.2881614  0.324
2018 Ali HPA, Tamura N, Budiman AS. Probing Plasticity and Strain-Rate Effects of Indium Submicron Pillars Using Synchrotron Laue X-Ray Microdiffraction Ieee Transactions On Device and Materials Reliability. 18: 490-497. DOI: 10.1109/Tdmr.2018.2872562  0.435
2018 Song WJR, Tippabhotla SK, Tay AAO, Budiman AS. Numerical Simulation of the Evolution of Stress in Solar Cells During the Entire Manufacturing Cycle of a Conventional Silicon Wafer Based Photovoltaic Laminate Ieee Journal of Photovoltaics. 8: 210-217. DOI: 10.1109/Jphotov.2017.2775158  0.352
2018 Song WJR, Tippabhotla SK, Tay AAO, Budiman AS. Effect of interconnect geometry on the evolution of stresses in a solar photovoltaic laminate during and after lamination Solar Energy Materials and Solar Cells. 187: 241-248. DOI: 10.1016/J.Solmat.2018.07.026  0.367
2018 Ali HPA, Radchenko I, Li N, Budiman A. The roles of interfaces and other microstructural features in Cu/Nb nanolayers as revealed by in situ beam bending experiments inside an scanning electron microscope (SEM) Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing. 738: 253-263. DOI: 10.1016/J.Msea.2018.09.094  0.389
2018 Radchenko I, Anwarali HP, Tippabhotla SK, Budiman AS. Effects of interface shear strength during failure of semicoherent Metal–Metal nanolaminates: An example of accumulative roll-bonded Cu/Nb Acta Materialia. 156: 125-135. DOI: 10.1016/J.Actamat.2018.06.023  0.378
2017 Handara VA, Radchenko I, Tippabhotla SK, Narayanan KR, Illya G, Kunz M, Tamura N, Budiman AS. Probing stress and fracture mechanism in encapsulated thin silicon solar cells by synchrotron X-ray microdiffraction Solar Energy Materials and Solar Cells. 162: 30-40. DOI: 10.1016/J.Solmat.2016.12.028  0.403
2017 Tippabhotla SK, Radchenko I, Stan CV, Tamura N, Budiman AS. Enabling the study of stress states using in situ µSXRD in the silicon nanowire anode during electrochemical lithiation in a specially designed Li-ion battery test cell Procedia Engineering. 215: 263-275. DOI: 10.1016/J.Proeng.2017.12.149  0.41
2017 Ali HPA, Kunz M, Tamura N, Budiman AS. Probing Plasticity Mechanisms in Low Melting Temperature Metallic Nanostructures Using Synchrotron X-Ray Microdiffraction Procedia Engineering. 215: 246-262. DOI: 10.1016/J.Proeng.2017.12.146  0.425
2017 Illya G, Handara V, Siahandan M, Nathania A, Budiman AS. Mechanical Studies of Solar Photovoltaics (PV) Backsheets Under Salt Damp Heat Environments Procedia Engineering. 215: 238-245. DOI: 10.1016/J.Proeng.2017.12.144  0.308
2017 Ali HPA, Budiman A. Designing Novel Metallic Multilayer Nanocomposites Through Atomic Engineering of Interfaces – Influence of Heat of Mixing Procedia Engineering. 215: 226-237. DOI: 10.1016/J.Proeng.2017.12.143  0.329
2017 Tippabhotla SK, Radchenko I, Song WJR, Illya G, Handara V, Kunz M, Tamura N, Tay AAO, Budiman AS. From cells to laminate: probing and modeling residual stress evolution in thin silicon photovoltaic modules using synchrotron X‐ray micro‐diffraction experiments and finite element simulations Progress in Photovoltaics. 25: 791-809. DOI: 10.1002/Pip.2891  0.389
2016 Tian T, Morusupalli R, Shin H, Son HY, Byun KY, Joo YC, Caramto R, Smith L, Shen YL, Kunz M, Tamura N, Budiman AS. On the Mechanical Stresses of Cu Through-Silicon Via (TSV) Samples Fabricated by SK Hynix vs. SEMATECH - Enabling Robust and Reliable 3-D Interconnect/Integrated Circuit (IC) Technology Procedia Engineering. 139: 101-111. DOI: 10.1016/J.Proeng.2015.09.242  0.42
2016 Tippabhotla SK, Radchenko I, Rengarajan KN, Illya G, Handara V, Kunz M, Tamura N, Budiman AS. Synchrotron X-ray Micro-diffraction - Probing Stress State in Encapsulated Thin Silicon Solar Cells Procedia Engineering. 139: 123-133. DOI: 10.1016/J.Proeng.2015.09.241  0.408
2016 Shivakumar R, Tippabhotla SK, Handara VA, Illya G, Tay AAO, Novoa F, Dauskardt RH, Budiman AS. Fracture Mechanics and Testing of Interface Adhesion Strength in Multilayered Structures - Application in Advanced Solar PV Materials and Technology Procedia Engineering. 139: 47-55. DOI: 10.1016/J.Proeng.2015.09.232  0.351
2016 Rengarajan KN, Radchenko I, Illya G, Handara V, Kunz M, Tamura N, Budiman AS. Low Stress Encapsulants? Influence of Encapsulation Materials on Stress and Fracture of Thin Silicon Solar Cells as Revealed by Synchrotron X-ray Submicron Diffraction☆ Procedia Engineering. 139: 76-86. DOI: 10.1016/J.Proeng.2015.09.230  0.41
2016 Radchenko I, Tippabhotla SK, Tamura N, Budiman AS. Probing Phase Transformations and Microstructural Evolutions at the Small Scales: Synchrotron X-ray Microdiffraction for Advanced Applications in 3D IC (Integrated Circuits) and Solar PV (Photovoltaic) Devices Journal of Electronic Materials. 45: 6222-6232. DOI: 10.1007/S11664-016-5012-5  0.421
2015 Budiman AS, Narayanan KR, Li N, Wang J, Tamura N, Kunz M, Misra A. Plasticity evolution in nanoscale Cu/Nb single-crystal multilayers as revealed by synchrotron X-ray microdiffraction Materials Science and Engineering A. 635: 6-12. DOI: 10.1016/J.Msea.2015.03.067  0.472
2014 Budiman AS, Illya G, Handara V, Caldwell WA, Bonelli C, Kunz M, Tamura N, Verstraeten D. Enabling thin silicon technologies for next generation c-Si solar PV renewable energy systems using synchrotron X-ray microdiffraction as stress and crack mechanism probe Solar Energy Materials and Solar Cells. 130: 303-308. DOI: 10.1016/J.Solmat.2014.07.029  0.387
2012 Budiman AS, Han SM, Li N, Wei QM, Dickerson P, Tamura N, Kunz M, Misra A. Plasticity in the nanoscale Cu/Nb single-crystal multilayers as revealed by synchrotron Laue x-ray microdiffraction Journal of Materials Research. 27: 599-611. DOI: 10.1557/Jmr.2011.421  0.64
2012 Kim Y, Budiman AS, Baldwin JK, Mara NA, Misra A, Han SM. Microcompression study of Al-Nb nanoscale multilayers Journal of Materials Research. 27: 592-598. DOI: 10.1557/Jmr.2011.414  0.53
2012 Budiman AS, Shin H, Kim BJ, Hwang SH, Son HY, Suh MS, Chung QH, Byun KY, Joo YC, Caramto R, Smith L, Kunz M, Tamura N. Comparison of mechanical stresses of Cu Through-Silicon Via (TSV) samples fabricated by Hynix vs. SEMATECH using synchrotron X-ray microdiffraction for 3-D integration and reliability 2012 Ieee International Interconnect Technology Conference, Iitc 2012. DOI: 10.1109/IITC.2012.6251661  0.317
2012 Morusupalli R, Rao R, Lee TK, Shen YL, Kunz M, Tamura N, Budiman AS. Critical temperature shift for stress induced voiding in advanced Cu interconnects for 32 nm and beyond Ieee International Reliability Physics Symposium Proceedings. EM.8.1-EM.8.3. DOI: 10.1016/J.Proeng.2015.09.229  0.447
2012 Budiman AS, Lee G, Burek MJ, Jang D, Han SMJ, Tamura N, Kunz M, Greer JR, Tsui TY. Plasticity of indium nanostructures as revealed by synchrotron X-ray microdiffraction Materials Science and Engineering A. 538: 89-97. DOI: 10.1016/J.Msea.2012.01.017  0.608
2012 Budiman AS, Shin HAS, Kim BJ, Hwang SH, Son HY, Suh MS, Chung QH, Byun KY, Tamura N, Kunz M, Joo YC. Measurement of stresses in Cu and Si around through-silicon via by synchrotron X-ray microdiffraction for 3-dimensional integrated circuits Microelectronics Reliability. 52: 530-533. DOI: 10.1016/J.Microrel.2011.10.016  0.423
2012 Shin HAS, Kim BJ, Kim JH, Hwang SH, Budiman AS, Son HY, Byun KY, Tamura N, Kunz M, Kim DI, Joo YC. Microstructure evolution and defect formation in Cu through-silicon vias (TSVs) during thermal annealing Journal of Electronic Materials. 41: 712-719. DOI: 10.1007/S11664-012-1943-7  0.393
2011 Budiman AS, Li N, Wei Q, Baldwin JK, Xiong J, Luo H, Trugman D, Jia QX, Tamura N, Kunz M, Chen K, Misra A. Growth and structural characterization of epitaxial Cu/Nb multilayers Thin Solid Films. 519: 4137-4143. DOI: 10.1016/J.Tsf.2010.12.077  0.311
2011 Burek MJ, Budiman AS, Jahed Z, Tamura N, Kunz M, Jin S, Han SMJ, Lee G, Zamecnik C, Tsui TY. Fabrication, microstructure, and mechanical properties of tin nanostructures Materials Science and Engineering A. 528: 5822-5832. DOI: 10.1016/J.Msea.2011.04.019  0.476
2011 Burek MJ, Jin S, Leung MC, Jahed Z, Wu J, Budiman AS, Tamura N, Kunz M, Tsui TY. Grain boundary effects on the mechanical properties of bismuth nanostructures Acta Materialia. 59: 4709-4718. DOI: 10.1016/J.Actamat.2011.04.017  0.384
2010 Lee G, Kim JY, Budiman AS, Tamura N, Kunz M, Chen K, Burek MJ, Greer JR, Tsui TY. Fabrication, structure and mechanical properties of indium nanopillars Acta Materialia. 58: 1361-1368. DOI: 10.1016/J.Actamat.2009.10.042  0.623
2010 Budiman AS, Hau-Riege CS, Baek WC, Lor C, Huang A, Kim HS, Neubauer G, Pak J, Besser PR, Nix WD. Electromigration-induced plastic deformation in Cu interconnects: Effects on current density exponent, n, and implications for em reliability assessment Journal of Electronic Materials. 39: 2483-2488. DOI: 10.1007/S11664-010-1356-4  0.505
2009 Budiman AS, Besser PR, Hau-Riege CS, Marathe A, Joo YC, Tamura N, Patel JR, Nix WD. Electromigration-induced plasticity: Texture correlation and implications for reliability assessment Journal of Electronic Materials. 38: 379-391. DOI: 10.1007/S11664-008-0602-5  0.548
2008 Budiman AS, Han SM, Greer JR, Tamura N, Patel JR, Nix WD. A search for evidence of strain gradient hardening in Au submicron pillars under uniaxial compression using synchrotron X-ray microdiffraction Acta Materialia. 56: 602-608. DOI: 10.1016/J.Actamat.2007.10.031  0.699
2008 Feng G, Budiman AS, Nix WD, Tamura N, Patel JR. Indentation size effects in single crystal copper as revealed by synchrotron x-ray microdiffraction Journal of Applied Physics. 104. DOI: 10.1007/978-981-287-335-4_6  0.55
2007 Budiman AS, Hau-Riege CS, Besser PR, Marathe A, Joo YC, Tamura N, Patel JR, Nix WD. Plasticity-amplified diffusivity: Dislocation cores as fast diffusion paths in CU interconnects Annual Proceedings - Reliability Physics (Symposium). 122-127. DOI: 10.1109/RELPHY.2007.369880  0.427
2007 Budiman AS, Hau-Riege CS, Besser PR, Marathe A, Joo YC, Tamura N, Patel JR, Nix WD. Electromigration-induced plasticity and texture in Cu interconnects Aip Conference Proceedings. 945: 56-65. DOI: 10.1063/1.2815784  0.458
2006 Budiman A, Tamura N, Valek BC, Gadre K, Maiz J, Spolenak R, Patel JR, Nix WD. Electromigration-Induced Plastic Deformation in Cu Damascene Interconnect Lines as Revealed by Synchrotron X-Ray Microdiffraction Mrs Proceedings. 914. DOI: 10.1557/PROC-0914-F06-05  0.543
2006 Budiman AS, Tamura N, Valek BC, Gadre K, Maiz J, Spolenak R, Patel JR, Nix WD. Electromigration-induced plastic deformation in Cu damascene interconnect lines as revealed by synchrotron X-ray microdiffraction Materials Research Society Symposium Proceedings. 914: 295-304. DOI: 10.1557/Proc-0914-F06-05  0.576
2006 Budiman AS, Nix WD, Tamura N, Valek BC, Gadre K, Maiz J, Spolenak R, Patel JR. Crystal plasticity in Cu damascene interconnect lines undergoing electromigration as revealed by synchrotron x-ray microdiffraction Applied Physics Letters. 88. DOI: 10.1063/1.2210451  0.605
2006 Greer JR, Budiman A, Nix WD. Size effect in plasticity of gold at the sub-micron scale Microscopy and Microanalysis. 12: 940-941. DOI: 10.1017/S1431927606069583  0.579
2005 Morusupalli RR, Nix WD, Patel JR, Budiman AS. Comparison of line stress predictions with measured electromigration failure times Materials Research Society Symposium Proceedings. 863: 253-258.  0.406
2004 Budiman AS, Tamura N, Valek BC, Gadre K, Maiz J, Spolenak R, Caldwell WA, Nix WD, Patell JR. Unexpected mode of plastic deformation in Cu damascene lines undergoing electromigration Materials Research Society Symposium Proceedings. 812: 345-350. DOI: 10.1557/Proc-812-F7.3  0.501
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