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Oscar van der Straten, Ph.D. - Publications

Affiliations: 
2005 State University of New York, Albany, Albany, NY, United States 
Area:
Condensed Matter Physics
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22 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2013 Motoyama K, Van Der Straten O, Maniscalco J, He M. PVD Cu reflow seed process optimization for defect reduction in nanoscale Cu/Low-k dual damascene interconnects Journal of the Electrochemical Society. 160. DOI: 10.1149/2.035312jes  0.339
2013 Kelly J, Lin X, Nogami T, Van Der Straten O, Demarest J, Li J, Murphy R, Zhang X, Penny C, Parks C, Edelstein D. Electrodeposited Cu film morphology on thin PVD Cu seed layers Journal of the Electrochemical Society. 160. DOI: 10.1149/2.031312jes  0.379
2013 Kelly J, Lin X, Nogami T, Van Der Straten O, Demarest J, Li J, Murphy R, Zhang X, Penny C, Parks C, DeHaven P, Madan A, Edelstein D. Electrodeposited Cu film morphology on thin PVD Cu seed layers Ecs Transactions. 58: 17-28. DOI: 10.1149/05817.0017ecst  0.388
2013 Bolom T, Lee JY, Zhang X, Justison P, Oh M, Simon AH, Flaitz P, Nag J, Baumann FH, Filippi R, Kaltalioglu E, Van Der Straten O, Nogami T, Penny CJ, Edelstein D. Electrical properties and reliability of ALD TaN barrier for sub-90nmPitch Cu interconnects Advanced Metallization Conference (Amc). 1-6.  0.393
2012 Kelly J, Nogami T, Van Der Straten O, Demarest J, Li J, Penny C, Vo T, Parks C, Dehaven P, Hu CK, Liniger E. Electrolyte additive chemistry and feature size-dependent impurity incorporation for Cu interconnects Journal of the Electrochemical Society. 159: D563-D569. DOI: 10.1149/2.008210Jes  0.39
2012 Motoyama K, Van Der Straten O, Tomizawa H, Maniscalco J, Chen ST. Novel Cu reflow seed process for Cu/low-k 64nm pitch dual damascene interconnects and beyond 2012 Ieee International Interconnect Technology Conference, Iitc 2012. DOI: 10.1109/IITC.2012.6251656  0.328
2012 Chen JHC, Waskiewicz C, Fan SSC, Halle S, Koay CS, Xu Y, Saulnier N, Tseng CH, Yin Y, Mignot Y, Beard M, Morris B, Horak D, Mignot S, Shobha H, ... ... Van Der Straten O, et al. 56 nm pitch copper dual-damascene interconnects with triple pitch split metal and double pitch split via 2012 Ieee International Interconnect Technology Conference, Iitc 2012. DOI: 10.1109/IITC.2012.6251637  0.336
2011 Tomizawa H, Chen ST, Horak D, Kato H, Yin Y, Ishikawa M, Kelly J, Koay CS, Landie G, Burns S, Tsumura K, Tagami M, Shobha H, Sankarapandian M, Van Der Straten O, et al. Robust self-aligned via process for 64nm pitch Dual-Damascene interconnects using pitch split double exposure patterning scheme 2011 Ieee International Interconnect Technology Conference and 2011 Materials For Advanced Metallization, Iitc/Mam 2011. DOI: 10.1109/IITC.2011.5940305  0.309
2011 Kaloyeros AE, Eisenbraun ET, Dunn K, van der Straten O. Zero thickness diffusion barriers and metallization liners for nanoscale device applications Chemical Engineering Communications. 198: 1453-1481. DOI: 10.1080/00986445.2011.576450  0.474
2010 Van Der Straten O, Shobha H, Demarest J, Maniscalco J. Interactions of metal-organic PEALD TaN with ultra-low k dielectric materials Ecs Transactions. 33: 195-201. DOI: 10.1149/1.3485256  0.319
2010 Kelly J, Van Der Straten O, Vo T, Janek R, Dordi Y. Deposition of copper on ruthenium for Cu metallization Ecs Transactions. 33: 145-158. DOI: 10.1149/1.3485251  0.434
2010 Cabral C, Fletcher B, Rodbell K, Nitta S, Guillorn M, Joseph E, Engelmann S, Bruce R, Baker B, Huang Q, Kelly J, Van Der Straten O, Nogami T, Spooner T, Edelstein D. Metallization opportunities and challenges for future back-end-of-the-line technology Advanced Metallization Conference (Amc). 136-137.  0.386
2008 Van Der Straten O, Wynne J, Vo T, Maniscalco J, Nogami T, Ali I, Chiang S, Ren J, Ma P. PEALD Ru liner conformality and Cu trench fill characteristics Ecs Transactions. 16: 193-200. DOI: 110.1149/1.2979994  0.417
2007 Londergan AR, Elam JW, Van Der Straten O, De Gendt S, Bent SF, Kang SB. ECS Transactions - 3rd Symposium on Atomic Layer Deposition Applications: Preface Ecs Transactions. 11: iii.  0.341
2006 van der Straten O, Zhu Y, Rullan J, Dunn K, Kaloyeros AE. Study of copper-refractory metal interfaces via solid-state wetting for emerging nanoscale interconnect applications Journal of Materials Research. 21: 255-262. DOI: 10.1557/Jmr.2006.0040  0.443
2006 Van Der Straten O, Rossnagel SM, Doyle JP, Rodbell KP. Metal-organic atomic layer deposition of metals for applications in interconnect technology Ecs Transactions. 1: 51-56. DOI: 10.1149/1.2209329  0.441
2005 Kim H, Detavenier C, Van Der Straten O, Rossnagel SM, Kellock AJ, Park DG. Robust TaN x diffusion barrier for Cu-interconnect technology with subnanometer thickness by metal-organic plasma-enhanced atomic layer deposition Journal of Applied Physics. 98. DOI: 10.1063/1.1935761  0.427
2004 Van Der Straten O, Zhu Y, Dunn K, Eisenbraun ET, Kaloyeros AE. Atomic layer deposition of tantalum nitride for ultrathin liner applications in advanced copper metallization schemes Journal of Materials Research. 19: 447-453. DOI: 10.1557/Jmr.2004.19.2.447  0.485
2004 Van Der Straten O, Zhu Y, Rullan J, Topol K, Dunn K, Kaloyeros A. Atomic layer deposition of tantalum nitride on organosillcate and organic polymer-based low dielectric constant materials Materials Research Society Symposium Proceedings. 812: 165-170.  0.363
2003 Van Der Straten O, Zhu Y, Dunn K, Kaloyeros A. Enhancement of copper wetting via surfactant-based post-treatment of ultra-thin atomic layer deposited tantalum nitride liners Materials Research Society Symposium - Proceedings. 766: 453-458.  0.475
2002 Van Der Straten O, Zhu Y, Eisenbraun E, Kaloyeros A. Thermal and electrical barrier performance testing of ultrathin atomic layer deposition tantalum-based materials for nanoscale copper metallization Proceedings of the Ieee 2002 International Interconnect Technology Conference, Iitc 2002. 188-190. DOI: 10.1109/IITC.2002.1014929  0.533
2002 Van Der Straten O, Zhu Y, Eisenbraun E, Kaloyeros A. Optimization of ultrathin ALD tantalum nitride films for zero-thickness liner applications Materials Research Society Symposium - Proceedings. 716: 471-476.  0.49
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