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Shuji Tanaka - Publications

Affiliations: 
Tohoku University, Sendai-shi, Miyagi-ken, Japan 
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185 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2020 Qi X, Yoshida S, Tanaka S. Development of Sputter Epitaxy Technique of Pure-Perovskite (001)(100)-Oriented Sm-doped Pb(Mg1/3, Nb2/3)O3-PbTiO3 on Si. Ieee Transactions On Ultrasonics, Ferroelectrics, and Frequency Control. PMID 32746221 DOI: 10.1109/Tuffc.2020.3011649  0.317
2020 Froemel J, Akita S, Tanaka S. Simple Device to Measure Pressure Using the Stress Impedance Effect of Amorphous Soft Magnetic Thin Film. Micromachines. 11. PMID 32629856 DOI: 10.3390/Mi11070649  0.343
2020 Esashi M, Tanaka S, Aoyagi S, Mineta T, Suzumori K, Dohi T, Miki N. Special Issue on MEMS for Robotics and Mechatronics Journal of Robotics and Mechatronics. 32: 279-280. DOI: 10.20965/Jrm.2020.P0279  0.41
2020 Ebihara R, Yoshida S, Tanaka S. Fabrication of c-Axis-Oriented PZT-Based Monocrystalline Thin Film with High Insulation Property on Si Substrate Ieej Transactions On Sensors and Micromachines. 140: 137-143. DOI: 10.1541/Ieejsmas.140.137  0.327
2020 Vergara A, Tsukamoto T, Fang W, Tanaka S. Integration of buried piezoresistive sensors and PZT thin film for dynamic and static position sensing of MEMS actuator Journal of Micromechanics and Microengineering. DOI: 10.1088/1361-6439/Abb756  0.304
2020 Liu Z, Yoshida S, Horie T, Okamoto S, Takayama R, Tanaka S. Feasibility study of ultrasonic biometrics based on finger vessel imaging by epitaxial-PZT/Si piezoelectric micromachined ultrasonic transducer Sensors and Actuators a: Physical. 312: 112145. DOI: 10.1016/J.Sna.2020.112145  0.327
2020 Khan MJ, Tsukamoto T, Farisi MSA, Tanaka S. Fabrication method of micromachined quartz glass resonator using sacrificial supporting structures Sensors and Actuators a-Physical. 305: 111922. DOI: 10.1016/J.Sna.2020.111922  0.335
2019 Iguchi F, Kubota K, Inagaki Y, Tanaka S, Sata N, Esashi M, Yugami H. Low Temperature Operating Micro Solid Oxide Fuel Cells with Perovskite Type Proton Conductors Ecs Transactions. 35: 777-783. DOI: 10.1149/1.3570058  0.379
2019 Baranov P, Nesterenko T, Barbin E, Koleda A, Tanaka S, Tsukamoto T, Kulinich I, Zykov D, Shelupanov A. A novel multiple-axis MEMS gyroscope-accelerometer with decoupling frames Sensor Review. 39: 670-681. DOI: 10.1108/Sr-05-2018-0133  0.332
2019 Liu C, Froemel J, Chen J, Tsukamoto T, Tanaka S. Laterally vibrating MEMS resonant vacuum sensor based on cavity-SOI process for evaluation of wide range of sealed cavity pressure Microsystem Technologies-Micro-and Nanosystems-Information Storage and Processing Systems. 25: 487-497. DOI: 10.1007/S00542-018-3984-1  0.365
2019 Moriyama M, Suzuki Y, Totsu K, Hirano H, Tanaka S. Metal‐bonding‐based hermetic wafer‐level MEMS packaging technology using in‐plane feedthrough: Hermeticity and high frequency characteristics of thick gold film feedthrough Electrical Engineering in Japan. 206: 44-53. DOI: 10.1002/Eej.23193  0.303
2018 Satoh S, Fukushi H, Esashi M, Tanaka S. Comprehensive Die Shear Test of Silicon Packages Bonded by Thermocompression of Al Layers with Thin Sn Capping or Insertions. Micromachines. 9. PMID 30424107 DOI: 10.3390/Mi9040174  0.482
2018 Makihata M, Muroyama M, Tanaka S, Nakayama T, Nonomura Y, Esashi M. Design and Fabrication Technology of Low Profile Tactile Sensor with Digital Interface for Whole Body Robot Skin. Sensors (Basel, Switzerland). 18. PMID 30037093 DOI: 10.3390/S18072374  0.527
2018 Yoshida S, Morimura T, Wasa K, Tanaka S. Investigation of Piezoelectricity and Curie Temperature of Pb(Mg1/3,Nb2/3)O3-PbTiO3 Epitaxial Thin Film on Si Prepared by Sputter Deposition with Fast Cooling. Ieee Transactions On Ultrasonics, Ferroelectrics, and Frequency Control. PMID 29994255 DOI: 10.1109/Tuffc.2018.2847423  0.325
2018 Shao C, Tanaka S, Nakayama T, Hata Y, Muroyama M. Electrical Design and Evaluation of Asynchronous Serial Bus Communication Network of 48 Sensor Platform LSIs with Single-Ended I/O for Integrated MEMS-LSI Sensors. Sensors (Basel, Switzerland). 18. PMID 29342923 DOI: 10.3390/S18010231  0.306
2018 Moriyama M, Suzuki Y, Totsu K, Hirano H, Tanaka S. Metal-Bonding-Based Hermetic Wafer-Level MEMS Packaging Technology Using In-Plane Feedthrough: —Hermeticity and High Frequency Characteristics of Thick Gold Film Feedthrough— Ieej Transactions On Sensors and Micromachines. 138: 485-494. DOI: 10.1541/Ieejsmas.138.485  0.326
2018 Takahata T, Hirano H, Froemel J, Tanaka S, Takakuwa Y. Wafer-level High Vacuum Packaging using Titanium Thin Film as Bonding and Gettering Material Ieej Transactions On Sensors and Micromachines. 138: 387-391. DOI: 10.1541/Ieejsmas.138.387  0.307
2018 Kaneko R, Froemel J, Tanaka S. Development of PVDF-TrFE/SiO2 composite film bulk acoustic resonator Sensors and Actuators a-Physical. 284: 120-128. DOI: 10.1016/J.Sna.2018.10.025  0.341
2018 Farisi MSA, Hirano H, Tanaka S. Low-temperature hermetic thermo-compression bonding using electroplated copper sealing frame planarized by fly-cutting for wafer-level MEMS packaging Sensors and Actuators a-Physical. 279: 671-679. DOI: 10.1016/J.Sna.2018.06.021  0.344
2018 Hata Y, Suzuki Y, Muroyama M, Nakayama T, Nonomura Y, Chand R, Hirano H, Omura Y, Fujiyoshi M, Tanaka S. Integrated 3-axis tactile sensor using quad-seesaw-electrode structure on platform LSI with through silicon vias Sensors and Actuators a-Physical. 273: 30-41. DOI: 10.1016/J.Sna.2018.02.013  0.339
2018 SATOH S, FUKUSHI H, ESASHI M, TANAKA S. Role of Thin Sn Layer for Low Temperature Al-Al Thermo-compression Bonding of Wafer-Level Hermetic Sealing Electronics and Communications in Japan. 101: 33-40. DOI: 10.1002/ECJ.12060  0.38
2017 Asano S, Muroyama M, Nakayama T, Hata Y, Nonomura Y, Tanaka S. 3-Axis Fully-Integrated Capacitive Tactile Sensor with Flip-Bonded CMOS on LTCC Interposer. Sensors (Basel, Switzerland). 17. PMID 29068429 DOI: 10.3390/S17112451  0.344
2017 Thao PN, Yoshida S, Tanaka S. Epitaxial growth of metallic buffer layer structure andc-axis oriented Pb(Mn1/3,Nb2/3)O3–Pb(Zr,Ti)O3thin film on Si for high performance piezoelectric micromachined ultrasonic transducer Japanese Journal of Applied Physics. 56: 127201. DOI: 10.7567/Jjap.56.127201  0.337
2017 Hayasaka T, Yoshida S, Tanaka S. Development of buffer layer structure for epitaxial growth of (100)/(001)Pb(Zr,Ti)O3-based thin film on (111)Si wafer Japanese Journal of Applied Physics. 56: 071501. DOI: 10.7567/Jjap.56.071501  0.313
2017 Esashi M, Tanaka S. Heterogeneous Integration of MEMS on LSI Journal of Japan Institute of Electronics Packaging. 20: 372-375. DOI: 10.5104/Jiep.20.372  0.444
2017 Zhang G, Anand A, Hikichi K, Tanaka S, Esashi M, Hashimoto KY, Taniguchi S, Pokharel RK. A 1.9GHz Low-Phase-Noise Complementary Cross-Coupled FBAR-VCO without Additional Voltage Headroom in 0.18µm CMOS Technology Ieice Transactions On Electronics. 363-369. DOI: 10.1587/Transele.E100.C.363  0.449
2017 Satoh S, Fukushi H, Esashi M, Tanaka S. Role of Thin Sn Layer for Low Temperature Al-Al Thermo-compression Bonding of Wafer-level Hermetic Sealing Ieej Transactions On Sensors and Micromachines. 137: 432-437. DOI: 10.1541/IEEJSMAS.137.432  0.38
2017 SATOH S, FUKUSHI H, ESASHI M, TANAKA S. Low-Temperature Al-Al Thermocompression Bonding with Sn Oxidation Protect Layer for Wafer-Level Hermetic Sealing Electronics and Communications in Japan. 100: 43-50. DOI: 10.1541/Ieejsmas.136.237  0.454
2017 Zhu Y, Tsukamoto T, Tanaka S. On-chip electrochromic micro display for a disposable bio-sensor chip Journal of Micromechanics and Microengineering. 27: 125012. DOI: 10.1088/1361-6439/Aa8F1C  0.349
2017 Tsukamoto T, Asao H, Tanaka S. Stylus type MEMS texture sensor covered with corrugated diaphragm Journal of Micromechanics and Microengineering. 27: 095006. DOI: 10.1088/1361-6439/Aa7Ec2  0.307
2017 Zhou Z, Yoshida S, Tanaka S. Epitaxial PMnN-PZT/Si MEMS ultrasonic rangefinder with 2 m range at 1 V drive Sensors and Actuators a: Physical. 266: 352-360. DOI: 10.1016/J.Sna.2017.09.058  0.33
2017 Hata Y, Nonomura Y, Omura Y, Nakayama T, Fujiyoshi M, Funabashi H, Akashi T, Muroyama M, Tanaka S. Quad-seesaw-electrode type 3-axis tactile sensor with low nonlinearities and low cross-axis sensitivities Sensors and Actuators a-Physical. 266: 24-35. DOI: 10.1016/J.Sna.2017.09.015  0.339
2017 Liu C, Hirano H, Froemel J, Tanaka S. Wafer-level vacuum sealing using AgAg thermocompression bonding after fly-cut planarization Sensors and Actuators a: Physical. 261: 210-218. DOI: 10.1016/J.Sna.2017.05.020  0.358
2017 Satoh S, Fukushi H, Esashi M, Tanaka S. Low‐Temperature Al‐Al Thermocompression Bonding with Sn Oxidation Protect Layer for Wafer‐Level Hermetic Sealing Electronics and Communications in Japan. 100: 43-50. DOI: 10.1002/Ecj.11975  0.486
2016 Esashi M, Tanaka S. Stacked Integration of MEMS on LSI. Micromachines. 7. PMID 30404308 DOI: 10.3390/Mi7080137  0.519
2016 Wasa K, Yoshida S, Hanzawa H, Adachi H, Matsunaga T, Tanaka S. Structure and Ferroelectric Properties of High Tc BiScO3-PbTiO3 Epitaxial Thin Films. Ieee Transactions On Ultrasonics, Ferroelectrics, and Frequency Control. PMID 27214896 DOI: 10.1109/Tuffc.2016.2569624  0.308
2016 Kochhar A, Yamamoto Y, Teshigahara A, Hashimoto KY, Tanaka S, Esashi M. Wave Propagation Direction and c-axis Tilt Angle Influence on the Performance of ScAlN/Sapphire based SAW Devices. Ieee Transactions On Ultrasonics, Ferroelectrics, and Frequency Control. PMID 26978772 DOI: 10.1109/Tuffc.2016.2539226  0.474
2016 Nishizawa S, Yoshida S, Wasa K, Tanaka S. Sputter Deposition of YSZ Epitaxial Buffer Layer at Wafer Level for Piezoelectric MEMS Utilizing PZT-based Monocrystalline Thin Film Ieej Transactions On Sensors and Micromachines. 136: 437-442. DOI: 10.1541/Ieejsmas.136.437  0.308
2016 Miyaguchi H, Muroyama M, Yoshida S, Ikegami N, Kojima A, Tanaka S, Esashi M. Development of a 17×17 Parallel Electron Beam Lithography System Ieej Transactions On Sensors and Micromachines. 136: 413-419. DOI: 10.1541/Ieejsmas.136.413  0.422
2016 Al Farisi MS, Hirano H, Frömel J, Tanaka S. Wafer-level hermetic thermo-compression bonding using electroplated gold sealing frame planarized by fly-cutting Journal of Micromechanics and Microengineering. 27: 015029. DOI: 10.1088/1361-6439/27/1/015029  0.354
2016 Yoshida S, Hanzawa H, Wasa K, Tanaka S. Enhanced curie temperature and high heat resistivity of PMnN-PZT monocrystalline thin film on Si Sensors and Actuators a: Physical. 251: 100-107. DOI: 10.1016/J.Sna.2016.10.009  0.313
2016 Moura TDO, Tsukamoto T, Monteiro DWdL, Tanaka S. Hybrid MEMS-SMA structure for intraocular lenses Sensors and Actuators a-Physical. 243: 15-24. DOI: 10.1016/J.Sna.2016.03.005  0.31
2016 Yoshida S, Hanzawa H, Wasa K, Tanaka S. Fabrication and characterization of large figure-of-merit epitaxial PMnN-PZT/Si transducer for piezoelectric MEMS sensors Sensors and Actuators, a: Physical. 239: 201-208. DOI: 10.1016/J.Sna.2016.01.031  0.348
2016 Kaushik N, Sharma P, Nishijima M, Makino A, Esashi M, Tanaka S. Structural, mechanical and optical properties of thin films deposited from a graphitic carbon nitride target Diamond and Related Materials. 66: 149-156. DOI: 10.1016/J.Diamond.2016.04.007  0.464
2015 Ogashiwa T, Totsu K, Nishizawa M, Ishida H, Sasaki Y, Miyairi M, Murai H, Kanehira Y, Tanaka S, Esashi M. Hermetic Seal Bonding at Low-temperature with Sub-micron Gold Particles for Wafer Level Packaging International Symposium On Microelectronics. 2015: 000073-000078. DOI: 10.4071/ISOM-2015-TP32  0.401
2015 Miyaguchi H, Muroyama M, Yoshida S, Ikegami N, Kojima A, Kaneko R, Totsu K, Tanaka S, Koshida N, Esashi M. An LSI for Massive Parallel Electron Beam Lithography: Its Design and Evaluation Ieej Transactions On Sensors and Micromachines. 135: 374-381. DOI: 10.1541/Ieejsmas.135.374  0.42
2015 Asano S, Pokharel R, Anand A, Hirano H, Tanaka S. Monolithic integration of BST thin film varactors and Au electroplated thick film inductors above IC Ieej Transactions On Sensors and Micromachines. 135: 323-329. DOI: 10.1541/Ieejsmas.135.323  0.346
2015 Hashimoto KY, Kimura T, Matsumura T, Hirano H, Kadota M, Esashi M, Tanaka S. Moving tunable filters forward Ieee Microwave Magazine. 16: 89-97. DOI: 10.1109/Mmm.2015.2431237  0.465
2015 Hayasaka T, Yoshida S, Inoue KY, Nakano M, Matsue T, Esashi M, Tanaka S. Integration of Boron-Doped Diamond Microelectrode on CMOS-Based Amperometric Sensor Array by Film Transfer Technology Journal of Microelectromechanical Systems. 24: 958-967. DOI: 10.1109/Jmems.2014.2360837  0.527
2015 Samoto T, Hirano H, Somekawa T, Hikichi K, Fujita M, Esashi M, Tanaka S. Wafer–to–wafer transfer process of barium strontium titanate for frequency tuning applications using laser pre-irradiation Journal of Micromechanics and Microengineering. 25: 035015. DOI: 10.1088/0960-1317/25/3/035015  0.499
2015 Tsukamoto T, Wang M, Tanaka S. IR sensor array using photo-patternable temperature sensitive paint for thermal imaging Journal of Micromechanics and Microengineering. 25. DOI: 10.1088/0960-1317/25/10/104011  0.334
2015 Asano S, Muroyama M, Bartley T, Kojima T, Nakayama T, Yamaguchi U, Yamada H, Nonomura Y, Hata Y, Funabashi H, Tanaka S. Surface-mountable capacitive tactile sensors with flipped CMOS-diaphragm on a flexible and stretchable bus line Sensors and Actuators, a: Physical. DOI: 10.1016/J.Sna.2016.01.043  0.356
2015 Naono T, Fujii T, Esashi M, Tanaka S. Non-resonant 2-D piezoelectric MEMS optical scanner actuated by Nb doped PZT thin film Sensors and Actuators, a: Physical. 233: 147-157. DOI: 10.1016/J.Sna.2015.06.029  0.505
2015 Suzuki Y, Totsu K, Moriyama M, Esashi M, Tanaka S. Free-standing subwavelength grid infrared cut filter of 90mm diameter for LPP EUV light source Sensors and Actuators a: Physical. 231: 59-64. DOI: 10.1016/J.Sna.2014.07.006  0.492
2014 Yoshida S, Hanzawa H, Wasa K, Esashi M, Tanaka S. Highly c-axis-oriented monocrystalline Pb(Zr, Ti)O₃ thin films on si wafer prepared by fast cooling immediately after sputter deposition. Ieee Transactions On Ultrasonics, Ferroelectrics, and Frequency Control. 61: 1552-8. PMID 25167155 DOI: 10.1109/Tuffc.2014.3069  0.494
2014 Kaushik N, Sharma P, Ahadian S, Khademhosseini A, Takahashi M, Makino A, Tanaka S, Esashi M. Metallic glass thin films for potential biomedical applications. Journal of Biomedical Materials Research. Part B, Applied Biomaterials. 102: 1544-52. PMID 24610895 DOI: 10.1002/Jbm.B.33135  0.498
2014 Kadota M, Kuratani Y, Kimura T, Esashi M, Tanaka S. Ultra-wideband and high frequency resonators using shear horizontal type plate wave in LiNbO3 thin plate Japanese Journal of Applied Physics. 53. DOI: 10.7567/Jjap.53.07Kd03  0.477
2014 Makihata M, Muroyama M, Nakano Y, Nakayama T, Yamaguchi U, Yamada H, Nonomura Y, Funabashi H, Hata Y, Tanaka S, Esashi M. Development of a 35Mbps Asynchronous Bus Based Communication System for Tactile Sensors Ieej Transactions On Sensors and Micromachines. 134: 300-307. DOI: 10.1541/Ieejsmas.134.300  0.446
2014 Kimura T, Kobayashi H, Kishimoto Y, Kato H, Inaba M, Hashimoto KY, Matsumura T, Hirano H, Kadota M, Esashi M, Tanaka S. Bandwidth-tunable filter consisting of SAW resonators and BaSrTiO3 varactors directly fabricated on a LiTaO3 wafer Ieee International Ultrasonics Symposium, Ius. 795-798. DOI: 10.1109/ULTSYM.2014.0195  0.403
2014 Konno A, Kadota M, Kushibiki JI, Ohashi Y, Esashi M, Yamamoto Y, Tanaka S. Determination of full material constants of ScAlN thin film from bulk and leaky Lamb waves in MEMS-based samples Ieee International Ultrasonics Symposium, Ius. 273-276. DOI: 10.1109/ULTSYM.2014.0068  0.38
2014 Kaushik N, Sharma P, Makino A, Tanaka S, Esashi M. Potential of Metallic Glass Thin Films as a Soft Magnetic Underlayer for ${\rm L}1_{0}$ FePt-Based Recording Media Ieee Transactions On Magnetics. 50: 1-4. DOI: 10.1109/Tmag.2013.2285307  0.486
2014 Zhang G, Anand A, Kamada K, Amalina S, Kanaya H, Pokharel RK, Hikichi K, Tanaka S, Esashi M, Hashimoto KY, Taniguchi S. A 1.9 GHz low phase noise complementary cross-coupled FBAR-VCO in 0.18 μm CMOS technology European Microwave Week 2014: "Connecting the Future", Eumw 2014 - Conference Proceedings; Eumic 2014: 9th European Microwave Integrated Circuits Conference. 253-256. DOI: 10.1109/EuMIC.2014.6997840  0.407
2014 Yoshida S, Esashi M, Tanaka S. Development of UV-assisted ozone steam etching and investigation of its usability for SU-8 removal Journal of Micromechanics and Microengineering. 24: 035007. DOI: 10.1088/0960-1317/24/3/035007  0.489
2014 Hajika R, Yoshida S, Kanamori Y, Esashi M, Tanaka S. An investigation of the mechanical strengthening effect of hydrogen anneal for silicon torsion bar Journal of Micromechanics and Microengineering. 24: 105014. DOI: 10.1088/0960-1317/24/10/105014  0.495
2014 Naono T, Fujii T, Esashi M, Tanaka S. A large-scan-angle piezoelectric MEMS optical scanner actuated by a Nb-doped PZT thin film Journal of Micromechanics and Microengineering. 24: 15010. DOI: 10.1088/0960-1317/24/1/015010  0.523
2014 Liu T, Tsai Y, Lin Y, Ono T, Tanaka S, Wu T. Design and fabrication of a phononic-crystal-based Love wave resonator in GHz range Aip Advances. 4: 124201. DOI: 10.1063/1.4902018  0.334
2014 Chand R, Esashi M, Tanaka S. P-N junction and metal contact reliability of SiC diode in high temperature (873 K) environment Solid-State Electronics. 94: 82-85. DOI: 10.1016/J.Sse.2014.02.006  0.463
2014 Tanaka S. Wafer-level hermetic MEMS packaging by anodic bonding and its reliability issues Microelectronics Reliability. 54: 875-881. DOI: 10.1016/J.Microrel.2014.02.001  0.323
2014 Nishino H, Yoshida S, Kojima A, Ikegami N, Tanaka S, Koshida N, Esashi M. Fabrication of Pierce-Type Nanocrystalline Si Electron-Emitter Array for Massively Parallel Electron Beam Lithography Ieej Transactions On Sensors and Micromachines. 134: 146-153. DOI: 10.1002/Ecj.11804  0.508
2013 Konno A, Hirano H, Inaba M, Hashimoto K, Esashi M, Tanaka S. Tunable Surface Acoustic Wave Filter Using Integrated Micro-Electro-Mechanical-System Based Varactors Made of Electroplated Gold Japanese Journal of Applied Physics. 52: 07HD13. DOI: 10.7567/Jjap.52.07Hd13  0.496
2013 Zhang G, Kochhar A, Yoshida K, Tanaka S, Hashimoto K, Esashi M, Kanaya H, Pokharel RK. A low phase noise FBAR based multiband VCO design Ieice Electronics Express. 10. DOI: 10.1587/Elex.10.20130425  0.459
2013 Zhang G, Kochhar A, Yoshida K, Tanaka S, Hashimoto K, Esashi M, Pokharel RK. The methods of maintaining low frequency stability in FBAR based cross-coupled VCO design Ieice Electronics Express. 10. DOI: 10.1587/Elex.10.20130296  0.464
2013 Makihata M, Muroyama M, Nakano Y, Nakayama T, Yamaguchi U, Yamada H, Nonomura Y, Funabashi H, Hata Y, Tanaka S, Esashi M. CMOS-MEMS集積化触覚センサの検査・修正・実装技術;CMOS-MEMS集積化触覚センサの検査・修正・実装技術;Testing, Repairing and Packaging Technology for the CMOS-MEMS Integrated Tactile Sensor Ieej Transactions On Sensors and Micromachines. 133: 243-249. DOI: 10.1541/Ieejsmas.133.243  0.485
2013 Suzuki Y, Totsu K, Watanabe H, Moriyama M, Esashi M, Tanaka S. Low-Stress Epitaxial Polysilicon Process for Micromirror Devices Ieej Transactions On Sensors and Micromachines. 133: 223-228. DOI: 10.1541/Ieejsmas.133.223  0.454
2013 Hirano H, Rasly M, Kaushik N, Esashi M, Tanaka S. Particle Removal without Causing Damage to MEMS Structure Ieej Transactions On Sensors and Micromachines. 133: 157-163. DOI: 10.1541/Ieejsmas.133.157  0.405
2013 IGUCHI F, MURAYAMA S, INAGAKI Y, TANAKA S, ESASHI M, YUGAMI H. F221004 Thermal Design and Fabrication of Micro SOFC for Mobile Electronic Devices The Proceedings of Mechanical Engineering Congress, Japan. 2013: _F221004-1-_F221004-. DOI: 10.1299/JSMEMECJ.2013._F221004-1  0.385
2013 Esashi M, Tanaka S. Heterogeneous integration by adhesive bonding Micro and Nano Systems Letters. 1: 3. DOI: 10.1186/2213-9621-1-3  0.524
2013 Kadota M, Esashi M, Tanaka S, Kuratani Y, Kimura T. High frequency resonators with wide bandwidth using SH0 mode plate wave in thin LiNbO3 Ieee International Ultrasonics Symposium, Ius. 1680-1683. DOI: 10.1109/ULTSYM.2013.0428  0.396
2013 Kadota M, Esashi M, Tanaka S, Ida Y, Kimura T. Improvement of insertion loss of band pass tunable filter using SAW resonators and GaAs diode variable capacitors Ieee International Ultrasonics Symposium, Ius. 1668-1671. DOI: 10.1109/ULTSYM.2013.0425  0.409
2013 Yoshida S, Yanagida H, Esashi M, Tanaka S. Simple Removal Technology of Chemically Stable Polymer in MEMS Using Ozone Solution Journal of Microelectromechanical Systems. 22: 87-93. DOI: 10.1109/Jmems.2012.2217374  0.435
2013 Yoshida S, Wang N, Kumano M, Kawai Y, Tanaka S, Esashi M. Fabrication and characterization of laterally-driven piezoelectric bimorph MEMS actuator with sol–gel-based high-aspect-ratio PZT structure Journal of Micromechanics and Microengineering. 23: 065014. DOI: 10.1088/0960-1317/23/6/065014  0.514
2013 Hirano H, Kimura T, Koutsaroff IP, Kadota M, Hashimoto KY, Esashi M, Tanaka S. Integration of BST varactors with surface acoustic wave device by film transfer technology for tunable RF filters Journal of Micromechanics and Microengineering. 23. DOI: 10.1088/0960-1317/23/2/025005  0.535
2013 Tsukamoto T, Esashi M, Tanaka S. High spatial, temporal and temperature resolution thermal imaging method using Eu(TTA)3 temperature sensitive paint Journal of Micromechanics and Microengineering. 23: 114015. DOI: 10.1088/0960-1317/23/11/114015  0.436
2013 Hatakeyama Y, Esashi M, Tanaka S. A Stochastic Counting MEMS Sensor Using White Noise Oscillation for a High-Temperature Environment Electronics and Communications in Japan. 96: 62-70. DOI: 10.1002/Ecj.10400  0.479
2012 Tanaka S, Park K, Esashi M. Lithium-niobate-based surface acoustic wave oscillator directly integrated with CMOS sustaining amplifier. Ieee Transactions On Ultrasonics, Ferroelectrics, and Frequency Control. 59: 1800-5. PMID 22899126 DOI: 10.1109/Tuffc.2012.2384  0.517
2012 Minh PN, Ono T, Tanaka S, Esashi M. Near-field optical apertured tip and modified structures for local field enhancement. Applied Optics. 40: 2479-84. PMID 18357258 DOI: 10.1364/Ao.40.002479  0.458
2012 Hashimoto KY, Hirano H, Tanaka S, Esashi M. Functional RF Devices Powered by MEMS Technologies Advances in Science and Technology. 81: 75-83. DOI: 10.4028/Www.Scientific.Net/Ast.81.75  0.487
2012 Esashi M, Tanaka S. Integrated Microsystems Advances in Science and Technology. 81: 55-64. DOI: 10.4028/www.scientific.net/AST.81.55  0.426
2012 Makihata M, Muroyama M, Tanaka S, Yamada H, Nakayama T, Yamaguchi U, Mima K, Nonomura Y, Fujiyoshi M, Esashi M. MEMS-CMOS Integrated Tactile Sensor with Digital Signal Processing for Robot Application Mrs Proceedings. 1427. DOI: 10.1557/Opl.2012.1489  0.487
2012 Esashi M, Tanaka S. MEMS on LSI by Adhesive Bonding and Wafer Level Packaging Mrs Proceedings. 1427. DOI: 10.1557/Opl.2012.1402  0.524
2012 Matsumura T, Esashi M, Harada H, Tanaka S. Fabrication Technology of Ruthenium Microelectrode Pattern for RF MEMS Ieej Transactions On Sensors and Micromachines. 132: 71-76. DOI: 10.1541/Ieejsmas.132.71  0.477
2012 Nakano Y, Muroyama M, Makihata M, Tanaka S, Matsuzaki S, Yamada H, Nakayama T, Yamaguchi U, Nonomura Y, Fujiyoshi M, Esashi M. A Simulated Network System Prototype for Development of a Networked Tactile Sensor System with Integrated MEMS-LSI Tactile Sensors Ieej Transactions On Sensors and Micromachines. 132: 288-295. DOI: 10.1541/Ieejsmas.132.288  0.449
2012 Moriyama M, Kawai Y, Tanaka S, Esashi M. Low-Voltage-Driven Thin Film PZT Stacked Actuator for RF-MEMS Switches Ieej Transactions On Sensors and Micromachines. 132: 282-287. DOI: 10.1541/Ieejsmas.132.282  0.478
2012 Suzuki Y, Tanaka S, Hatakeyama Y, Esashi M. Development of Double-side SiC PECVD System for MEMS Ieej Transactions On Sensors and Micromachines. 132: 114-118. DOI: 10.1541/Ieejsmas.132.114  0.47
2012 Lee J, Kawai Y, Tanaka S, Lin Y, Gessner T, Esashi M. Fabrication of Freestanding Pb(Zr,Ti)O Film Microstructures Using Ge Sacrificial Layer Japanese Journal of Applied Physics. 51: 21502. DOI: 10.1143/Jjap.51.021502  0.499
2012 Guo B, Wang B, Wen L, Helin P, Claes G, De Coster J, Du Bois B, Verbist A, Van Hoof R, Vereecke G, Haspeslagh L, Tilmans HAC, Decoutere S, Osman H, Puers R, ... ... Tanaka S, et al. Poly-SiGe-based MEMS thin-film encapsulation Journal of Microelectromechanical Systems. 21: 110-120. DOI: 10.1109/Jmems.2011.2170823  0.37
2012 Tsukamoto T, Esashi M, Tanaka S. Magnetocaloric cooling of a thermally-isolated microstructure Journal of Micromechanics and Microengineering. 22: 094008. DOI: 10.1088/0960-1317/22/9/094008  0.454
2012 Makihata M, Tanaka S, Muroyama M, Matsuzaki S, Yamada H, Nakayama T, Yamaguchi U, Mima K, Nonomura Y, Fujiyoshi M, Esashi M. Integration and packaging technology of MEMS-on-CMOS capacitive tactile sensor for robot application using thick BCB isolation layer and backside-grooved electrical connection Sensors and Actuators a: Physical. 188: 103-110. DOI: 10.1016/J.Sna.2012.04.032  0.528
2012 Yasue T, Komatsu T, Nakamura N, Hashimoto K, Hirano H, Esashi M, Tanaka S. Wideband tunable Love wave filter using electrostatically actuated MEMS variable capacitors integrated on lithium niobate Sensors and Actuators a: Physical. 188: 456-462. DOI: 10.1016/J.Sna.2012.01.017  0.484
2012 Tanaka S, Mohri M, Ogashiwa T, Fukushi H, Tanaka K, Nakamura D, Nishimori T, Esashi M. Electrical interconnection in anodic bonding of silicon wafer to LTCC wafer using highly compliant porous bumps made from submicron gold particles Sensors and Actuators a: Physical. 188: 198-202. DOI: 10.1016/J.Sna.2012.01.003  0.509
2012 Kim HH, Yoon SH, Ahn CH, Tanaka S, Esashi M, Ko SC, Jang WI, Go JS. Fabrication of a piezoelectric microcantilever array with a large initial deflection and an application to electrical energy harvesting International Journal of Precision Engineering and Manufacturing. 13: 1671-1677. DOI: 10.1007/S12541-012-0219-8  0.519
2012 Matsumura T, Esashi M, Harada H, Tanaka S. Vibration mode observation of piezoelectric disk‐type resonator by high‐frequency laser Doppler vibrometer Electronics and Communications in Japan. 95: 33-41. DOI: 10.1002/Ecj.10406  0.464
2012 Matsuzaki S, Tanaka S, Esashi M. Anodic bonding between LTCC wafer and Si wafer with Sn-Cu-based electrical connection Electronics and Communications in Japan. 95: 49-56. DOI: 10.1002/Ecj.10401  0.495
2011 Kuypers JH, Tanaka S, Esashi M. Imprinted laminate wafer-level packaging for SAW ID-tags and SAW delay line sensors. Ieee Transactions On Ultrasonics, Ferroelectrics, and Frequency Control. 58: 406-13. PMID 21342826 DOI: 10.1109/Tuffc.2011.1818  0.538
2011 Yugami H, Kubota K, Inagaki Y, Iguchi F, Tanaka S, Sata N, Esashi M. Low-Temperature Operating Micro Solid Oxide Fuel Cells with Perovskite-type Proton Conductors Mrs Proceedings. 1330. DOI: 10.1557/Opl.2011.1397  0.488
2011 Muroyama M, Makihata M, Nakano Y, Matsuzaki S, Yamada H, Yamaguchi U, Nakayama T, Nonomura Y, Fujiyoshi M, Tanaka S, Esashi M. Development of an LSI for Tactile Sensor Systems on the Whole-Body of Robots Ieej Transactions On Sensors and Micromachines. 131: 302-309. DOI: 10.1541/Ieejsmas.131.302  0.441
2011 Matsuzaki S, Tanaka S, Esashi M. Anodic Bonding between LTCC Substrate and Si Substrate with Electrical Connections Ieej Transactions On Sensors and Micromachines. 131: 189-194. DOI: 10.1541/Ieejsmas.131.189  0.499
2011 Hatakeyama Y, Esashi M, Tanaka S. Stochastic Counting MEMS Sensor Using White Noise Oscillation for High Temperature Environment Ieej Transactions On Sensors and Micromachines. 131: 178-184. DOI: 10.1541/Ieejsmas.131.178  0.461
2011 Yanagida H, Yoshida S, Esashi M, Tanaka S. Etching Technology Using Ozone for Chemically Stable Polymer in MEMS Ieej Transactions On Sensors and Micromachines. 131: 122-127. DOI: 10.1541/Ieejsmas.131.122  0.435
2011 Matsumura T, Esashi M, Harada H, Tanaka S. Vibration Mode Observation of Piezoelectric Disk-type Resonator by High Frequency Laser Doppler Vibrometer Ieej Transactions On Electronics, Information and Systems. 131: 1086-1093. DOI: 10.1541/Ieejeiss.131.1086  0.464
2011 Makihata M, Tanaka S, Muroyama M, Matsuzaki S, Yamada H, Nakayama T, Yamaguchi U, Mima K, Nonomura Y, Fujiyoshi M, Esashi M. Adhesive wafer bonding using a molded thick benzocyclobutene layer for wafer-level integration of MEMS and LSI Journal of Micromechanics and Microengineering. 21: 085002. DOI: 10.1088/0960-1317/21/8/085002  0.514
2011 Tsukamoto T, Esashi M, Tanaka S. A micro thermal switch with a stiffness-enhanced thermal isolation structure Journal of Micromechanics and Microengineering. 21: 104008. DOI: 10.1088/0960-1317/21/10/104008  0.46
2010 Randles AB, Esashi M, Tanaka S. Etch rate dependence on crystal orientation of lithium niobate. Ieee Transactions On Ultrasonics, Ferroelectrics, and Frequency Control. 57: 2372-80. PMID 21041126 DOI: 10.1109/Tuffc.2010.1705  0.493
2010 Hino R, Matsumura T, Esashi M, Tanaka S. Stress Control of AlN Thin Film Sputter-Deposited Using ECR Plasma Ieej Transactions On Sensors and Micromachines. 130: 523-527. DOI: 10.1541/Ieejsmas.130.523  0.448
2010 Kano M, Ishii M, Yoshinaga H, Esashi M, Tanaka S. Passive Dew Droplet Removal from Hydrogen Sensors for Fuel Cell Applications Ieej Transactions On Sensors and Micromachines. 130: 517-522. DOI: 10.1541/Ieejsmas.130.517  0.473
2010 Takahashi T, Makihata M, Esashi M, Tanaka S. Evaluation and Application of Resist for Alkaline Wet Etching Ieej Transactions On Sensors and Micromachines. 130: 421-425. DOI: 10.1541/Ieejsmas.130.421  0.48
2010 Park K, Esashi M, Tanaka S. Preparation of Thin Lithium Niobate Layer on Silicon Wafer for Wafer-level Integration of Acoustic Devices and LSI Ieej Transactions On Sensors and Micromachines. 130: 236-241. DOI: 10.1541/Ieejsmas.130.236  0.491
2010 Fujita M, Izawa Y, Tsurumi Y, Tanaka S, Fukushi H, Sueda K, Nakata Y, Esashi M, Miyanaga N. Debris-free Low-stress High-speed Laser-assisted Dicing for Multi-layered MEMS Ieej Transactions On Sensors and Micromachines. 130: 118-123. DOI: 10.1541/Ieejsmas.130.118  0.475
2010 Tsukamoto T, Esashi M, Tanaka S. Carbon-Nanotube-Enhanced Thermal Contactor in Low Contact Pressure Region Japanese Journal of Applied Physics. 49: 070210. DOI: 10.1143/Jjap.49.070210  0.468
2010 Matsuo H, Kawai Y, Tanaka S, Esashi M. Investigation for (100)-/(001)-Oriented Pb(Zr,Ti)O3Films Using Platinum Nanofacets and PbTiO3Seeding Layer Japanese Journal of Applied Physics. 49: 061503. DOI: 10.1143/Jjap.49.061503  0.481
2010 Matsumura T, Esashi M, Harada H, Tanaka S. Multi-band radio-frequency filters fabricated using polyimide-based membrane transfer bonding technology Journal of Micromechanics and Microengineering. 20: 95027. DOI: 10.1088/0960-1317/20/9/095027  0.541
2010 Yoshida K, Tanaka S, Hagihara Y, Tomonari S, Esashi M. Normally closed electrostatic microvalve with pressure balance mechanism for portable fuel cell application Sensors and Actuators a: Physical. 157: 290-298. DOI: 10.1016/J.Sna.2009.11.030  0.462
2010 Yoshida K, Tanaka S, Hagihara Y, Tomonari S, Esashi M. Normally closed electrostatic microvalve with pressure balance mechanism for portable fuel cell application. Part I: Design and simulation Sensors and Actuators a: Physical. 157: 299-306. DOI: 10.1016/J.Sna.2009.11.029  0.449
2010 Ohno T, Tanaka S, Esashi M. Fabrication of Deep Silicon Microstructures by the Combination of Anodization and p++ Etch Stop Ieej Transactions On Electrical and Electronic Engineering. 5: 493-497. DOI: 10.1002/Tee.20563  0.313
2009 Kuypers JH, Reindl LM, Tanaka S, Esashi M. Maximum accuracy evaluation scheme for wireless saw delay-line sensors. Ieee Transactions On Ultrasonics, Ferroelectrics, and Frequency Control. 55: 1640-52. PMID 18986954 DOI: 10.1109/Tuffc.2008.840  0.454
2009 Itoh A, Watanabe M, Habu H, Tokudome S, Hori K, Saito H, Kondo K, Tanaka S, Esashi M. MICRO SOLID PROPELLANT THRUSTER FOR SMALL SATELLITE International Journal of Energetic Materials and Chemical Propulsion. 8: 321-327. DOI: 10.1615/Intjenergeticmaterialschemprop.V8.I4.50  0.441
2009 Izawa Y, Tsurumi Y, Tanaka S, Fukushi H, Sueda K, Nakata Y, Esashi M, Miyanaga N, Fujita M. Debris-Free High-Speed Laser-Assisted Low-Stress Dicing for Multi-Layered MEMS Ieej Transactions On Sensors and Micromachines. 129: 63-68. DOI: 10.1541/IEEJSMAS.129.63  0.374
2009 Muroyama M, Makihata M, Matsuzaki S, Yamada H, Yamaguchi U, Nakayama T, Nonomura Y, Tanaka S, Esashi M. LSI Design for Sensing Data Transmission by Interruption in Tactile Sensor Systems Ieej Transactions On Sensors and Micromachines. 129: 450-460. DOI: 10.1541/Ieejsmas.129.450  0.452
2009 TAKAHASHI T, IGUCHI F, YUGAMI H, ESASHI M, TANAKA S. Deposition and Microfabrication of Gd-Doped CeO_2 for Micro SOFC Operating at Low Temperature(Hydrogen Fuel Cell and SOFC,Power and Energy System Symposium) Transactions of the Japan Society of Mechanical Engineers Series B. 75: 524-526. DOI: 10.1299/Kikaib.75.751_524  0.469
2009 Tsukamoto T, Esashi M, Tanaka S. Long working range mercury droplet actuation Journal of Micromechanics and Microengineering. 19: 094016. DOI: 10.1088/0960-1317/19/9/094016  0.465
2009 Ye S, Hamakawa S, Tanaka S, Sato K, Esashi M, Mizukami F. A one-step conversion of benzene to phenol using MEMS-based Pd membrane microreactors Chemical Engineering Journal. 155: 829-837. DOI: 10.1016/J.Cej.2009.09.007  0.423
2008 Izawa Y, Tsurumi Y, Tanaka S, Kikuchi H, Sueda K, Nakata Y, Esashi M, Miyanaga N, Fujita M. Debris-Free Laser-Assisted Low-Stress Dicing for Multi-Layered MEMS Ieej Transactions On Sensors and Micromachines. 128: 91-96. DOI: 10.1541/Ieejsmas.128.91  0.456
2008 Larangot B, Tanaka S, Esashi M. Fabrication of Anti-Corrosive Capacitive Vacuum Sensors with a Silicon Carbide/Polysilicon Bi-Layer Diaphragm and Electrical Through-Hole Connections on the Opposite Side Ieej Transactions On Sensors and Micromachines. 128: 331-336. DOI: 10.1541/Ieejsmas.128.331  0.524
2008 Hashimoto S, Kuypers JH, Tanaka S, Esashi M. Design and Fabrication of Passive Wireless SAW Sensor for Pressure Measurement Ieej Transactions On Sensors and Micromachines. 128: 230-234. DOI: 10.1541/Ieejsmas.128.230  0.5
2008 Tanaka S, Kondo K, Habu H, Itoh A, Watanabe M, Hori K, Esashi M. Test of B/Ti multilayer reactive igniters for a micro solid rocket array thruster Sensors and Actuators a: Physical. 144: 361-366. DOI: 10.1016/J.Sna.2008.02.015  0.454
2008 Satoh D, Tanaka S, Esashi M. Electrostatically Controlled, Pneumatically Actuated Microvalve with Low Pressure Loss Ieej Transactions On Electrical and Electronic Engineering. 3: 305-312. DOI: 10.1002/Tee.20271  0.456
2008 Tanaka S, Miura Y, Kang P, Hikichi K, Esashi M. MEMS-based Air Turbine with Radial-inflow Type Journal Bearing Ieej Transactions On Electrical and Electronic Engineering. 3: 297-304. DOI: 10.1002/Tee.20270  0.523
2007 Randles AB, Esashi M, Tanaka S. Etch Stop Process for Fabrication of Thin Diaphragms in Lithium Niobate Japanese Journal of Applied Physics. 46: L1099-L1101. DOI: 10.1143/Jjap.46.L1099  0.498
2007 Tanaka S, Esashi M, Isomura K, Hikichi K, Endo Y, Togo S. Hydroinertia Gas Bearing System to Achieve 470m∕s Tip Speed of 10mm-Diameter Impellers Journal of Tribology. 129: 655-659. DOI: 10.1115/1.2736707  0.453
2007 Kang P, Tanaka S, Esashi M. Cavity-through deep reactive ion etching of directly-bonded silicon wafers Transducers and Eurosensors '07 - 4th International Conference On Solid-State Sensors, Actuators and Microsystems. 549-553. DOI: 10.1109/SENSOR.2007.4300189  0.444
2007 Nakajima A, Kang P, Honda N, Hikichi K, Esashi M, Tanaka S. Fabrication and high-speed characterization of SU-8 shrouded two-dimensional microimpellers Journal of Micromechanics and Microengineering. 17: S230-S236. DOI: 10.1088/0960-1317/17/9/S04  0.481
2007 Tanaka S, Fujimoto S, Ito O, Choe S, Esashi M. Laterally stacked glass substrates with high density electrical feedthroughs Journal of Micromechanics and Microengineering. 17: 597-602. DOI: 10.1088/0960-1317/17/3/023  0.517
2006 Itoh T, Tanaka S, Li J, Watanabe R, Esashi M. Silicon-Carbide Microfabrication by Silicon Lost Molding for Glass-Press Molds Journal of Microelectromechanical Systems. 15: 859-863. DOI: 10.1109/Jmems.2006.872231  0.511
2006 Yoshida K, Tanaka S, Tomonari S, Satoh D, Esashi M. High-Energy Density Miniature Thermoelectric Generator Using Catalytic Combustion Journal of Microelectromechanical Systems. 15: 195-203. DOI: 10.1109/Jmems.2005.859202  0.499
2006 Takahashi T, Tanaka S, Esashi M. Development of anin situchemical vapor deposition method for an alumina catalyst bed in a suspended membrane micro fuel reformer Journal of Micromechanics and Microengineering. 16: S206-S210. DOI: 10.1088/0960-1317/16/9/S06  0.454
2006 Yoshida K, Tanaka S, Hiraki H, Esashi M. A micro fuel reformer integrated with a combustor and a microchannel evaporator Journal of Micromechanics and Microengineering. 16: S191-S197. DOI: 10.1088/0960-1317/16/9/S04  0.463
2006 Min K, Tanaka S, Esashi M. Fabrication of novel MEMS-based polymer electrolyte fuel cell architectures with catalytic electrodes supported on porous SiO2 Journal of Micromechanics and Microengineering. 16: 505-511. DOI: 10.1088/0960-1317/16/3/005  0.5
2006 Totsu K, Fujishiro K, Tanaka S, Esashi M. Fabrication of three-dimensional microstructure using maskless gray-scale lithography Sensors and Actuators a-Physical. 130: 387-392. DOI: 10.1016/J.Sna.2005.12.008  0.47
2005 Yoshida K, Hagihara Y, Saitoh M, Tomonari S, Tanaka S, Esashi M. Microvalve to Control Fuel for Portable Fuel Cells Ieej Transactions On Sensors and Micromachines. 125: 418-423. DOI: 10.1541/Ieejsmas.125.418  0.474
2005 Tanaka S, Min K, Kato N, Oikawa H, Esashi M. Application of Screen-Printed Catalytic Electrodes to MEMS-Based Fuel Cells Ieej Transactions On Sensors and Micromachines. 125: 413-417. DOI: 10.1541/Ieejsmas.125.413  0.458
2005 Norimatsu T, Tanaka S, Esashi M. Vertical Diaphragm Electrostatic Actuator for a High Density Ink Jet Printer Head Ieej Transactions On Sensors and Micromachines. 125: 350-354. DOI: 10.1541/Ieejsmas.125.350  0.523
2005 Genda T, Tanaka S, Esashi M. Charging Method of Micropatterned Electrets by Contact Electrification Using Mercury Japanese Journal of Applied Physics. 44: 5062-5067. DOI: 10.1143/Jjap.44.5062  0.422
2005 Isomura K, Tanaka S, Togo S, Esashi M. Development of high-speed micro-gas bearings for three-dimensional micro-turbo machines Journal of Micromechanics and Microengineering. 15: S222-S227. DOI: 10.1088/0960-1317/15/9/S08  0.461
2005 Chang K, Tanaka S, Esashi M. A micro-fuel processor with trench-refilled thick silicon dioxide for thermal isolation fabricated by water-immersion contact photolithography Journal of Micromechanics and Microengineering. 15: S171-S178. DOI: 10.1088/0960-1317/15/9/S01  0.5
2005 Kang P, Tanaka S, Esashi M. Demonstration of a MEMS-based turbocharger on a single rotor Journal of Micromechanics and Microengineering. 15: 1076-1087. DOI: 10.1088/0960-1317/15/5/026  0.498
2005 Ye S, Tanaka S, Esashi M, Hamakawa S, Hanaoka T, Mizukami F. Thin palladium membrane microreactors with oxidized porous silicon support and their application Journal of Micromechanics and Microengineering. 15: 2011-2018. DOI: 10.1088/0960-1317/15/11/004  0.472
2005 Satoh D, Tanaka S, Yoshida K, Esashi M. Micro-ejector to supply fuel–air mixture to a micro-combustor Sensors and Actuators a: Physical. 119: 528-536. DOI: 10.1016/J.Sna.2004.10.028  0.475
2004 Rajanna K, Tanaka S, Itoh T, Esashi M. Reaction bonding of microstructured silicon carbide using polymer and silicon thin film Materials Science Forum. 1527-1530. DOI: 10.4028/Www.Scientific.Net/Msf.457-460.1527  0.51
2004 Kondo K, Tanaka S, Habu H, Tokudome S, Hori K, Saito H, Itoh A, Watanabe M, Esashi M. Vacuum test of a micro-solid propellant rocket array thruster Ieice Electronics Express. 1: 222-227. DOI: 10.1587/Elex.1.222  0.492
2004 ISOMURA K, TANAKA S, TOGO S, KANEBAKO H, MURAYAMA M, SAJI N, SATO F, ESASHI M. Development of Micromachine Gas Turbine for Portable Power Generation Jsme International Journal Series B. 47: 459-464. DOI: 10.1299/Jsmeb.47.459  0.466
2004 ESASHI M, ONO T, TANAKA S. Micro Industry Equipments Jsme International Journal Series B. 47: 429-438. DOI: 10.1299/Jsmeb.47.429  0.476
2004 Li J, Sugimoto S, Tanaka S, Esashi M, Watanabe R. Manufacturing Silicon Carbide Microrotors by Reactive Hot Isostatic Pressing within Micromachined Silicon Molds Journal of the American Ceramic Society. 85: 261-263. DOI: 10.1111/J.1151-2916.2002.Tb00077.X  0.503
2004 Tanaka S, Isomura K, Togo S, Esashi M. Turbo test rig with hydroinertia air bearings for a palmtop gas turbine Journal of Micromechanics and Microengineering. 14: 1449-1454. DOI: 10.1088/0960-1317/14/11/003  0.463
2004 Tanaka S, Chang K, Min K, Satoh D, Yoshida K, Esashi M. MEMS-based components of a miniature fuel cell/fuel reformer system Chemical Engineering Journal. 101: 143-149. DOI: 10.1016/J.Cej.2004.01.017  0.457
2003 Tanaka S, Hosokawa R, Tokudome S, Hori K, Saito H, Watanabe M, Esashi M. MEMS-Based Solid Propellant Rocket Array Thruster with Electrical Feedthroughs. Transactions of the Japan Society For Aeronautical and Space Sciences. 46: 47-51. DOI: 10.2322/Tjsass.46.47  0.492
2003 Chang K, Tanaka S, Esashi M. MEMS-Based Fuel Reformer with Suspended Membrane Structure Ieej Transactions On Sensors and Micromachines. 123: 346-350. DOI: 10.1541/Ieejsmas.123.346  0.485
2003 Tanaka S, Higashitani A, Sugie K, Esashi M. Ieej Transactions On Sensors and Micromachines. 123: 340-345. DOI: 10.1541/Ieejsmas.123.340  0.457
2003 Genda T, Tanaka S, Esashi M. Design of High Power Electrostatic Motor and Generator Using Electrets Ieej Transactions On Sensors and Micromachines. 123: 331-339. DOI: 10.1541/Ieejsmas.123.331  0.423
2003 TANAKA S, CHANG KS, SATO D, YOSHIDA K, ESASHI M. Microreactors for Portable Power Sources The Proceedings of the Thermal Engineering Conference. 2003: 453-454. DOI: 10.1299/JSMETED.2003.453  0.333
2003 RANDLES AB, POKINES BJ, TANAKA S, ESASHI M. DEEP STRUCTURES WET ETCHED INTO LITHIUM NIOBATE USING A PHYSICAL MASK International Journal of Computational Engineering Science. 4: 497-500. DOI: 10.1142/S1465876303001605  0.492
2003 Tanaka S, Yamada T, Sugimoto S, Li J, Esashi M. Silicon nitride ceramic-based two-dimensional microcombustor Journal of Micromechanics and Microengineering. 13: 502-508. DOI: 10.1088/0960-1317/13/3/321  0.503
2003 Hara M, Tanaka S, Esashi M. Rotational infrared polarization modulator using a MEMS-based air turbine with different types of journal bearing Journal of Micromechanics and Microengineering. 13: 223-228. DOI: 10.1088/0960-1317/13/2/309  0.451
2003 Li J, Tanaka S, Umeki T, Sugimoto S, Esashi M, Watanabe R. Microfabrication of thermoelectric materials by silicon molding process Sensors and Actuators a-Physical. 108: 97-102. DOI: 10.1016/S0924-4247(03)00369-8  0.497
2002 Itoh T, Tanaka S, Li J, Watanabe R, Esashi M. Micromachining of Silicon Carbide by Silicon Lost Molding, Chemical Vapor Deposition And Reaction-Sintering The Japan Society of Applied Physics. DOI: 10.7567/Ssdm.2002.P14-1  0.487
2002 Min K, Tanaka S, Esashi M. MEMS-Based Polymer Electrolyte Fuel Cell Electrochemistry. 70: 924-927. DOI: 10.5796/Electrochemistry.70.924  0.427
2002 Li JF, Sugimoto S, Tanaka S, Watanabe R, Esashi M. Manufacturing Miniature Si-Based Ceramic Rotors by Micro Reaction Sintering Key Engineering Materials. 703-708. DOI: 10.4028/Www.Scientific.Net/Kem.224-226.703  0.472
2002 TANAKA S, ESASHI M. New Development of Power Sources for Portable Devices Journal of the Society of Mechanical Engineers. 105: 35-39. DOI: 10.1299/Jsmemag.105.998_35  0.44
2002 Tanaka S, Hara M, Esashi M. Mechanical polarization modulator using micro-turbo machinery for Fourier transform infrared spectroscopy Sensors and Actuators a: Physical. 96: 215-222. DOI: 10.1016/S0924-4247(01)00760-9  0.465
2002 Minh PN, Ono T, Tanaka S, Goto K, Esashi M. Near-field recording with high optical throughput aperture array Sensors and Actuators a: Physical. 95: 168-174. DOI: 10.1016/S0924-4247(01)00727-0  0.353
2001 Lee SH, Iijima T, Nakamura K, Tanaka S, Esashi M. Characteristics of Thick Sol-Gel Lead Zirconate Titanate Films for Angular Rate Sensor Application Mrs Proceedings. 687. DOI: 10.1557/Proc-687-B5.46  0.451
2001 Tanaka S, Rajanna K, Abe T, Esashi M. Deep reactive ion etching of silicon carbide Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures. 19: 2173. DOI: 10.1116/1.1418401  0.469
2001 Tanaka S, Sugimoto S, Li J, Watanabe R, Esashi M. Silicon carbide micro-reaction-sintering using micromachined silicon molds Journal of Microelectromechanical Systems. 10: 55-61. DOI: 10.1109/84.911092  0.483
2000 ESASHI M, ONO T, TANAKA S. Journal of the Surface Finishing Society of Japan. 51: 874-879. DOI: 10.4139/Sfj.51.874  0.457
1997 Hatakeyama M, Tanaka S, Ichiki K, Toma Y, Nakao M, Hatamura Y. Novel fast atom beam (FAB) processes for fabricating functional nanostructures on three-dimensional microstructures Microsystem Technologies-Micro-and Nanosystems-Information Storage and Processing Systems. 3: 112-116. DOI: 10.1007/S005420050066  0.302
1996 Ichiki K, Hatakeyama M, Tanaka S, Nakao M, Hatamura Y. New fast atom beam processing with separated masks for fabricating multiple microstructures Thin Solid Films. 630-633. DOI: 10.1016/0040-6090(96)08708-1  0.333
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