Kevin Skadron

Affiliations: 
University of Virginia, Charlottesville, VA 
Area:
Computer Science
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"Kevin Skadron"

Parents

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Douglas Clark grad student 1999 Princeton
 (Characterizing and Removing Branch Misdirections.)

Children

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John W. Haskins grad student 2003 UVA
Michele Co grad student 2006 UVA
Yingmin Li grad student 2006 UVA
Tibor Horvath grad student 2008 UVA
Karthik Sankaranarayanan grad student 2009 UVA
David Tarjan grad student 2009 UVA
Jiayuan Meng grad student 2010 UVA
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Publications

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Wang K, Sadredini E, Skadron K. (2016) Sequential pattern mining with the micron automata processor 2016 Acm International Conference On Computing Frontiers - Proceedings. 135-144
Cheng E, Mirkhani S, Szafaryn LG, et al. (2016) CLEAR: Crosslayer exploration for architecting resilience combining hardware and software techniques to tolerate soft errors in processor cores Proceedings - Design Automation Conference. 5
Angstadt K, Weimer W, Skadron K. (2016) RAPID programming of pattern-recognition processors International Conference On Architectural Support For Programming Languages and Operating Systems - Asplos. 2: 593-605
Falsafi B, Stan M, Skadron K, et al. (2016) Near-Memory Data Services Ieee Micro. 36: 6-7
Nickolls J, Buck I, Garland M, et al. (2016) Scalable parallel programming 2008 Ieee Hot Chips 20 Symposium, Hcs 2008
El-Hadedy M, Skadron K. (2015) Hardware overhead analysis of programmability in ARX crypto processing Acm International Conference Proceeding Series. 14
Zhang R, Mazumdar K, Meyer BH, et al. (2015) A cross-layer design exploration of charge-recycled power-delivery in many-layer 3D-IC Proceedings - Design Automation Conference. 2015
Mozafari SH, Skadron K, Meyer BH. (2015) Yield-aware performance-cost characterization for multi-core SIMT Proceedings of the Acm Great Lakes Symposium On Vlsi, Glsvlsi. 20: 237-240
Faust GG, Zhang R, Skadron K, et al. (2015) ArchFP: Rapid prototyping of pre-RTL floorplans Ieee/Ifip International Conference On Vlsi and System-On-Chip, Vlsi-Soc. 7: 183-188
Zhang R, Meyer BH, Wang K, et al. (2015) Tolerating the Consequences of Multiple EM-Induced C4 Bump Failures Ieee Transactions On Very Large Scale Integration (Vlsi) Systems
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