Haiyu Qi, Ph.D.
Affiliations: | 2006 | University of Maryland, College Park, College Park, MD |
Area:
Mechanical EngineeringGoogle:
"Haiyu Qi"Parents
Sign in to add mentor| Michael G. Pecht | grad student | 2006 | University of Maryland | |
| (Plastic ball grid array (PBGA) solder joint reliability assessment under combined thermal cycling and vibration loading conditions.) | ||||
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Publications
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| Qi H, Osterman M, Pecht M. (2009) Design of Experiments for Board-Level Solder Joint Reliability of PBGA Package Under Various Manufacturing and Multiple Environmental Loading Conditions Ieee Transactions On Electronics Packaging Manufacturing. 32: 32-40 |
| Qi H, Osterman M, Pecht M. (2009) A Rapid Life-Prediction Approach for PBGA Solder Joints Under Combined Thermal Cycling and Vibration Loading Conditions Ieee Transactions On Components and Packaging Technologies. 32: 283-292 |
| Qi H, Vichare NM, Azarian MH, et al. (2008) Analysis of solder joint failure criteria and measurement techniques in the qualification of electronic products Ieee Transactions On Components and Packaging Technologies. 31: 469-477 |
| Qi H, Zhang Q, Tinsley EC, et al. (2008) High Cycle Cyclic Torsion Fatigue of PBGA Pb-Free Solder Joints Ieee Transactions On Components and Packaging Technologies. 31: 309-314 |
| Qi H, Osterman M, Pecht M. (2008) Modeling of Combined Temperature Cycling and Vibration Loading on PBGA Solder Joints Using an Incremental Damage Superposition Approach Ieee Transactions On Advanced Packaging. 31: 463-472 |
| Qi H, Ganesan S, Pecht MG. (2008) No-fault-found and intermittent failures in electronic products. Microelectronics Reliability. 48: 663-674 |
| Qi H, Osterman M, Pecht M. (2007) Plastic Ball Grid Array Solder Joint Reliability for Avionics Applications Ieee Transactions On Components and Packaging Technologies. 30: 242-247 |
| Matkowski P, Qi H. (2005) Vibration tests utilization in the study of reliability of connections in microelectronics Proceedings of 2005 International Students and Young Scientists Workshop - Photonics and Microsystems. 2005: 61-64 |