Anupam Choubey, Ph.D.
Affiliations: | 2007 | Mechanical Engineering | University of Maryland, College Park, College Park, MD |
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"Anupam Choubey"Parents
Sign in to add mentor| Michael G. Pecht | grad student | 2007 | University of Maryland | |
| (Microstructural changes under isothermal aging and their influence on thermal fatigue reliability for tin-lead and lead-free solder joints, including microstructural changes under isothermal aging in mixed solder joints.) | ||||
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| Wang W, Choubey A, Azarian MH, et al. (2009) An assessment of immersion silver surface finish for lead-free electronics Journal of Electronic Materials. 38: 815-827 |
| Choubey A, Osterman M, Pecht M. (2008) Microstructure and intermetallic formation in SnAgCu BGA components attached with SnPb solder under isothermal aging Ieee Transactions On Device and Materials Reliability. 8: 160-166 |
| Choubey A, Yu H, Osterman M, et al. (2008) Intermetallics characterization of lead-free solder joints under isothermal aging Journal of Electronic Materials. 37: 1130-1138 |
| Choubey A, Osterman M, Pecht M, et al. (2007) Durability of repaired and aged lead-free electronic assemblies Ipc - Ipc Printed Circuits Expo, Apex and the Designers Summit 2007. 2: 1070-1081 |
| Choubey A, Wu J, Ganesan S, et al. (2006) Lead-free assemblies for high temperature applications Proceedings - 2006 Imaps International Conference and Exhibition On High Temperature Electronics, Hitec 2006. 384-389 |