Adrian M. Kopacz, Ph.D.

Affiliations: 
2011 Mechanical Engineering Northwestern University, Evanston, IL 
Area:
Mechanical Engineering, Biomechanics Biophysics, Nanotechnology
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"Adrian Kopacz"

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Wing K. Liu grad student 2011 Northwestern
 (Immersed Molecular Electrokinetic Finite Element Method for the Analysis of Pathogen Screening Nanotip Sensor.)
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Publications

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O'Keeffe SC, Tang S, Kopacz AM, et al. (2015) Multiscale ductile fracture integrating tomographic characterization and 3-D simulation Acta Materialia. 82: 503-510
Tefft BJ, Kopacz AM, Liu WK, et al. (2015) Enhancement of Endothelial Cell Retention on ePTFE Vascular Constructs by siRNA-Mediated SHP-1 or SHP-2 Gene Silencing Cellular and Molecular Bioengineering. 8: 507-516
Lee TR, Greene MS, Jiang Z, et al. (2014) Quantifying uncertainties in the microvascular transport of nanoparticles. Biomechanics and Modeling in Mechanobiology. 13: 515-26
Lee TR, Choi M, Kopacz AM, et al. (2013) On the near-wall accumulation of injectable particles in the microcirculation: smaller is not better. Scientific Reports. 3: 2079
Tang S, Kopacz AM, Chan O'Keeffe S, et al. (2013) Three-dimensional ductile fracture analysis with a hybrid multiresolution approach and microtomography Journal of the Mechanics and Physics of Solids. 61: 2108-2124
Kopacz AM, Liu WK. (2013) Immersed molecular electrokinetic finite element method Computational Mechanics. 52: 193-199
Kim H, Man HB, Saha B, et al. (2012) Multiscale Simulation as a Framework for the Enhanced Design of Nanodiamond-Polyethylenimine-based Gene Delivery. The Journal of Physical Chemistry Letters. 3: 3791-3797
Yeo WH, Kopacz AM, Kim JH, et al. (2012) Dielectrophoretic concentration of low-abundance nanoparticles using a nanostructured tip. Nanotechnology. 23: 485707
Kopacz AM, Yeo WH, Chung JH, et al. (2012) Nanoscale sensor analysis using the immersed molecular electrokinetic finite element method. Nanoscale. 4: 5189-94
Kopacz AM, Patankar NA, Liu WK. (2012) The immersed molecular finite element method Computer Methods in Applied Mechanics and Engineering. 233: 28-39
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