Eberhard Bamberg

Affiliations: 
Mechanical Engineering University of Utah, Salt Lake City, UT 
Area:
Mechanical Engineering
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"Eberhard Bamberg"
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Publications

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Greer J, Petruska AJ, Mahoney AW, et al. (2014) Experimental investigation of wire electrical discharge machining of NdFeB permanent magnets with an RC-type machine Journal of Materials Engineering and Performance. 23: 1392-1401
Lee S, Scarpulla MA, Bamberg E. (2013) Effect of metal coating on machinability of high purity germanium using wire electrical discharge machining Journal of Materials Processing Technology. 213: 811-817
Sharma R, Tathireddy P, Lee S, et al. (2011) Application-specific customizable architectures of Utah neural interfaces Procedia Engineering. 25: 1016-1019
Shah A, Mufti NA, Rakwal D, et al. (2011) Material removal rate, kerf, and surface roughness of tungsten carbide machined with wire electrical discharge machining Journal of Materials Engineering and Performance. 20: 71-76
Heamawatanachai S, Bamberg E. (2010) Cutting force model of orbital single-point micromachining tool International Journal of Machine Tools and Manufacture. 50: 815-823
Heamawatanachai S, Bamberg E. (2009) Design and characterization of a PZT driven micromachining tool based on single-point tool tip geometry Precision Engineering. 33: 387-394
Rakwal D, Bamberg E. (2009) Slicing, cleaning and kerf analysis of germanium wafers machined by wire electrical discharge machining Journal of Materials Processing Technology. 209: 3740-3751
Bamberg E, Heamawatanachai S. (2009) Orbital electrode actuation to improve efficiency of drilling micro-holes by micro-EDM Journal of Materials Processing Technology. 209: 1826-1834
Rakwal D, Heamawatanachai S, Tathireddy P, et al. (2009) Fabrication of compliant high aspect ratio silicon microelectrode arrays using micro-wire electrical discharge machining Microsystem Technologies. 15: 789-797
Bamberg E, Rakwal D. (2008) Experimental investigation of wire electrical discharge machining of gallium-doped germanium Journal of Materials Processing Technology. 197: 419-427
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