Eberhard Bamberg
Affiliations: | Mechanical Engineering | University of Utah, Salt Lake City, UT |
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"Eberhard Bamberg"
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Publications
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Greer J, Petruska AJ, Mahoney AW, et al. (2014) Experimental investigation of wire electrical discharge machining of NdFeB permanent magnets with an RC-type machine Journal of Materials Engineering and Performance. 23: 1392-1401 |
Lee S, Scarpulla MA, Bamberg E. (2013) Effect of metal coating on machinability of high purity germanium using wire electrical discharge machining Journal of Materials Processing Technology. 213: 811-817 |
Sharma R, Tathireddy P, Lee S, et al. (2011) Application-specific customizable architectures of Utah neural interfaces Procedia Engineering. 25: 1016-1019 |
Shah A, Mufti NA, Rakwal D, et al. (2011) Material removal rate, kerf, and surface roughness of tungsten carbide machined with wire electrical discharge machining Journal of Materials Engineering and Performance. 20: 71-76 |
Heamawatanachai S, Bamberg E. (2010) Cutting force model of orbital single-point micromachining tool International Journal of Machine Tools and Manufacture. 50: 815-823 |
Heamawatanachai S, Bamberg E. (2009) Design and characterization of a PZT driven micromachining tool based on single-point tool tip geometry Precision Engineering. 33: 387-394 |
Rakwal D, Bamberg E. (2009) Slicing, cleaning and kerf analysis of germanium wafers machined by wire electrical discharge machining Journal of Materials Processing Technology. 209: 3740-3751 |
Bamberg E, Heamawatanachai S. (2009) Orbital electrode actuation to improve efficiency of drilling micro-holes by micro-EDM Journal of Materials Processing Technology. 209: 1826-1834 |
Rakwal D, Heamawatanachai S, Tathireddy P, et al. (2009) Fabrication of compliant high aspect ratio silicon microelectrode arrays using micro-wire electrical discharge machining Microsystem Technologies. 15: 789-797 |
Bamberg E, Rakwal D. (2008) Experimental investigation of wire electrical discharge machining of gallium-doped germanium Journal of Materials Processing Technology. 197: 419-427 |