John E. Blendell
Affiliations: | Materials Engineering | Purdue University, West Lafayette, IN, United States |
Area:
Materials Science EngineeringGoogle:
"John Blendell"Children
Sign in to add traineeYuanyuan Jing | grad student | 2011 | Purdue |
Meredith E. Dubelman | grad student | 2013 | Purdue |
Christoher M. Fancher | grad student | 2013 | Purdue |
Matthias C. Ehmke | grad student | 2014 | Purdue |
BETA: Related publications
See more...
Publications
You can help our author matching system! If you notice any publications incorrectly attributed to this author, please sign in and mark matches as correct or incorrect. |
Chen W, Wang C, Sarobol P, et al. (2020) Local variations in grain formation, grain boundary sliding, and whisker growth along grain boundaries in large-grain Sn films Scripta Materialia. 187: 458-463 |
Rheinheimer W, Lowing D, Blendell JE. (2020) Grain growth in Nio–MgO and its dependence on faceting and the equilibrium crystal shape Scripta Materialia. 178: 236-239 |
Rheinheimer W, Blendell JE, Handwerker CA. (2020) Equilibrium and kinetic shapes of grains in polycrystals Acta Materialia. 191: 101-110 |
Cai X, Handwerker CA, Blendell JE, et al. (2020) Shallow grain formation in Sn thin films Acta Materialia. 192: 1-10 |
Yazawa K, Uchida H, Blendell JE. (2020) Origin of Grain Size Effects on Voltage‐Driven Ferroelastic Domain Evolution in Polycrystalline Tetragonal Lead Zirconate Titanate Thin Film Advanced Functional Materials. 30: 1909100 |
Fancher CM, Blendell JE, Bowman KJ. (2017) Decoupling of superposed textures in an electrically biased piezoceramic with a 100 preferred orientation Applied Physics Letters. 110: 62901 |
Zhang Y, Glaum J, Ehmke MC, et al. (2016) Unipolar Fatigue Behavior of BCTZ Lead-Free Piezoelectric Ceramics Journal of the American Ceramic Society |
Zhang Y, Glaum J, Ehmke MC, et al. (2016) High Bipolar Fatigue Resistance of BCTZ Lead-Free Piezoelectric Ceramics Journal of the American Ceramic Society. 99: 174-182 |
Chen WH, Sarobol P, Handwerker CA, et al. (2016) Heterogeneous Stress Relaxation Processes at Grain Boundaries in High-Sn Solder Films: Effects of Sn Anisotropy and Grain Geometry During Thermal Cycling Jom. 1-12 |
Zhang Y, Glaum J, Ehmke MC, et al. (2015) The ageing and de-ageing behaviour of (Ba |