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Timothy S. Cale

Affiliations: 
1981-1997 Chemical engineering Arizona State University, Tempe, AZ, United States 
 1998-2007 Chemical engineering Rensselaer Polytechnic Institute, Troy, NY, United States 
Area:
Chemical engineering
Google:
"Timothy Shaun Cale" OR "Timothy S Cale"
Bio:

http://process-evolution.com/cale/bio/cale_pe_5page_161210.pdf
https://books.google.com/books?id=-ShKAQAAIAAJ
DOI: 10.1016/0021-9517(83)90331-7

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Parents

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James T. Richardson grad student 1980 University of Houston
 (In-situ characterization of Ni-Cu/SiO2 catalysts)

Children

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Douglas K. Ludlow grad student 1986 Arizona State
Pushkar Jain grad student 2003 RPI
Yongchai Kwon grad student 2003 RPI
Dae-Lok Bae grad student 2004 RPI
Max O. Bloomfield grad student 2007 RPI

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Publications

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Kwon Y, Jindal A, Augur R, et al. (2008) Evaluation of BCB bonded and thinned wafer stacks for three-dimensional integration Journal of the Electrochemical Society. 155
Cale TS, Lu JQ, Gutmann RJ. (2008) Three-dimensional integration in microelectronics: Motivation, processing, and thermomechanical modeling Chemical Engineering Communications. 195: 847-888
Bloomfield MO, Bentz DN, Cale TS. (2008) Stress-induced grain boundary migration in polycrystalline copper Journal of Electronic Materials. 37: 249-263
Kwon Y, Seok J, Lu JQ, et al. (2007) Critical adhesion energy at the interface between benzocyclobutene and silicon nitride layers Journal of the Electrochemical Society. 154
Gobbert MK, Cale TS. (2007) Modeling multiscale effects on transients during chemical vapor deposition Surface and Coatings Technology. 201: 8830-8837
Cale TS, Bloomfield MO, Gobbert MK. (2007) Two deterministic approaches to topography evolution Surface and Coatings Technology. 201: 8873-8877
Bloomfield MO, Bentz DN, Lu JQ, et al. (2007) Thermally induced stresses in 3D-IC inter-wafer interconnects: A combined grain-continuum and continuum approach Microelectronic Engineering. 84: 2750-2756
Gobbert MK, Webster SG, Cale TS. (2007) A Galerkin method for the simulation of the transient 2-D/2-D and 3-D/3-D linear Boltzmann equation Journal of Scientific Computing. 30: 237-273
Bentz DN, Bloomfield MO, Cale TS. (2006) Grain-Focused Microstructure Simulations: Stress-Induced Evolution of Polycrystalline Films Advances in Science and Technology. 45: 1178-1183
Gobbert MK, Cale TS. (2006) Effect of the Knudsen number on transient times during chemical vapor deposition International Journal For Multiscale Computational Engineering. 4: 319-335
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