Dennis W. Mueller

Affiliations: 
University of North Texas, Denton, TX, United States 
Area:
Materials Science Engineering
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"Dennis Mueller"
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Publications

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Vinogradova E, Osei-Yiadom E, Smith CE, et al. (2009) Effects of plasmas on porous low dielectric constant CVD SiOCH films Microelectronic Engineering. 86: 176-180
Vinogradova E, Smith CE, Mueller D, et al. (2008) Moisture Adsorption in Plasma-Damaged Porous Low-k Dielectrics Mrs Proceedings. 1079
Vinogradova E, Smith CE, Mueller DW, et al. (2008) Application of deuterium exchange to analyze moisture uptake characteristics of porous low-dielectric-constant SiOCH films Electrochemical and Solid-State Letters. 11: H255-H257
Wang J, Cha D, Matz P, et al. (2007) TEM-EELS Study on the Ash Damage and Repair of Porous Low-k Films Microscopy and Microanalysis. 13: 794-795
Smith C, Mueller D, Matz P, et al. (2006) Topographical and chemical surface modification of porous MSQ using silylating agents with different numbers of methoxy groups Mrs Proceedings. 914
Orozco-Teran R, Gorman B, Mueller D, et al. (2005) Effect of silylation on triethoxyfluorosilane xerogel films by means of atmospheric pressure drying Thin Solid Films. 471: 145-153
Gorman BP, Orozco-Teran RA, Zhang Z, et al. (2004) Rapid repair of plasma ash damage in low-k dielectrics using supercritical CO 2 Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures. 22: 1210-1212
Dong H, Gorman B, Zhang Z, et al. (2004) Reinforcement mechanism for mechanically enhanced xerogel films Journal of Non-Crystalline Solids. 350: 345-350
Roepsch JA, Gorman BP, Mueller DW, et al. (2004) Dielectric behavior of triethoxyfluorosilane aerogels Journal of Non-Crystalline Solids. 336: 53-58
Gorman BP, Mueller DW, Reidy RF. (2003) Drying and Functionalization of Triethoxyfluorosilane-Based Low-k Dielectrics in CO2 Electrochemical and Solid-State Letters. 6
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