Anoop Desai, Ph.D.
Affiliations: | 2006 | University of Cincinnati, Cincinnati, OH |
Area:
Industrial EngineeringGoogle:
"Anoop Desai"Parents
Sign in to add mentor| Anil Mital | grad student | 2006 | University of Cincinnati | |
| (An integrated methodology for assembly, disassembly and maintenance for consumer products.) | ||||
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Publications
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| Desai A. (2019) Ease of product assembly through a time-based design methodology Assembly Automation. 39: 881-903 |
| Askew L, Desai A. (2018) Green and Environment Conscious Manufacturing and Management Techniques Industrial and Systems Engineering Review. 6: 10-20 |
| Desai A, Mital A. (2017) An interactive system framework to enable design for disassembly Journal of Manufacturing Technology Management. 28: 749-771 |
| Desai A, Mital A. (2011) Simplifying the product maintenance process by building ease of maintenance into the design International Journal of Industrial and Systems Engineering. 9: 434 |
| Desai A, Mital A. (2009) Managing quality: the transition from reactive to proactive strategies International Journal of Product Development. 8: 63 |
| Chiang WC, Mital A, Desai A. (2009) Extension of a QFD based design for functionality algorithm to enhance performance of complex consumer products International Journal of Product Development. 7: 372 |
| Chiang WC, Mital A, Desai A. (2009) A generic methodology based on Six-Sigma techniques for designing and manufacturing consumer products for functionality International Journal of Product Development. 7: 349 |
| Desai A, Thomassian JC. (2008) Engineering course design based on Quality Function Deployment (QFD) principles: Incorporation of diverse constituencies and continuous improvement Proceedings - Frontiers in Education Conference, Fie |
| Mital A, Desai A. (2007) Enhancing the product development process through a sequential approach part III: manufacturing International Journal of Product Development. 4: 186 |
| Mital A, Desai A. (2007) Enhancing the product development process through a sequential approach. Part II: assembly and disassembly International Journal of Product Development. 4: 171 |