Dietmar Kissinger
Affiliations: | Ulm University, Ulm, Baden-Württemberg, Germany |
Website:
https://www.uni-ulm.de/in/ebs/institut/mitarbeiter-innen/dietmar-kissinger/Google:
"Dietmar Kissinger"Children
Sign in to add trainee| Mohsin Tarar | post-doc | Ulm University | |
| Defu Wang | research scientist | 2015-2019 | Innovations for High Performance Microelectronics |
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Publications
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| Kissinger D, Kahmen G, Weigel R. (2021) Millimeter-Wave and Terahertz Transceivers in SiGe BiCMOS Technologies Ieee Transactions On Microwave Theory and Techniques. 69: 4541-4560 |
| Wang D, Eissa MH, Schmalz K, et al. (2021) 240-GHz Reflectometer-Based Dielectric Sensor With Integrated Transducers in a 130-nm SiGe BiCMOS Technology Ieee Transactions On Microwave Theory and Techniques. 69: 1027-1035 |
| Wang D, Eissa MH, Schmalz K, et al. (2020) 480-GHz Sensor With Subharmonic Mixer and Integrated Transducer in a 130-nm SiGe BiCMOS Technology Ieee Microwave and Wireless Components Letters. 30: 908-911 |
| Wang D, Ng HJ, Kissinger D, et al. (2019) 240-GHz Four-Channel Power-Tuning Heterodyne Sensing Readout System With Reflection and Transmission Measurements in a 130-nm SiGe BiCMOS Technology Ieee Transactions On Microwave Theory and Techniques. 67: 5296-5306 |
| Ahmad WA, Kucharski M, Di Serio A, et al. (2019) Planar Highly Efficient High-Gain 165 GHz On-Chip Antennas for Integrated Radar Sensors Ieee Antennas and Wireless Propagation Letters. 18: 2429-2433 |
| Frank M, Reissland T, Lurz F, et al. (2018) Antenna and Package Design for 61- and 122-GHz Radar Sensors in Embedded Wafer-Level Ball Grid Array Technology Ieee Transactions On Microwave Theory and Techniques. 66: 5156-5168 |
| Wang D, Schmalz K, Eissa MH, et al. (2018) Integrated 240-GHz Dielectric Sensor With dc Readout Circuit in a 130-nm SiGe BiCMOS Technology Ieee Transactions On Microwave Theory and Techniques. 66: 4232-4241 |
| Hagelauer A, Wojnowski M, Pressel K, et al. (2018) Integrated Systems-in-Package: Heterogeneous Integration of Millimeter-Wave Active Circuits and Passives in Fan-Out Wafer-Level Packaging Technologies Ieee Microwave Magazine. 19: 48-56 |
| Kucharski M, Eissa MH, Malignaggi A, et al. (2018) D-Band Frequency Quadruplers in BiCMOS Technology Ieee Journal of Solid-State Circuits. 53: 2465-2478 |
| Jamal FI, Guha S, Eissa MH, et al. (2018) A Fully Integrated Low-Power 30 GHz Complex Dielectric Sensor in a 0.25-$\mu$m BiCMOS Technology Ieee Journal of Electromagnetics, Rf and Microwaves in Medicine and Biology. 2: 163-171 |