☰

Aicha Elshabini - Publications

Affiliations: 
1979-1999 Virginia Polytechnic Institute and State University, Blacksburg, VA, United States 
 1999-2006 Electrical Engineering University of Arkansas, Fayetteville, Fayetteville, AR, United States 
 2006- Electrical and Computer Engineering University of Idaho, Moscow, ID, United States 
Area:
Electronics and Electrical Engineering
Website:
https://www.uidaho.edu/engr/events/academy-of-engineers/2018
Tree Info Similar researchers PubMed Report error

21/70 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2014 Barannyk LL, Aboutaleb HA, Elshabini A, Barlow F. Causality Verification Using Polynomial Periodic Continuations for Electrical Interconnects Journal of Microelectronics and Electronic Packaging. 11: 181-196. DOI: 10.4071/Imaps.428  0.588
2013 Tork HS, Elshabini A, Barlow F. Tunable BaSrTiO3, BaZrTiO3 Ferroelectric Capacitors Embedded Inside Low Temperature Cofired Ceramics (LTCC) Journal of Microelectronics and Electronic Packaging. 10: 95-101. DOI: 10.4071/Imaps.380  0.635
2011 Abousaif E, Elshabini A, Barlow F. A novel design of substrate integrated waveguide (SIW) E-Plane inductive strip filter implemented using LTCC Journal of Microelectronics and Electronic Packaging. 8: 121-128. DOI: 10.4071/Imaps.304  0.459
2011 Abdelnaby AH, Potirniche GP, Elshabini A, Barlow F, Parker R. A Comparison of Back Grinding Processes for Bare Silicon and Through-Silicon Via Wafers Using Numerical Simulations Journal of Microelectronics and Electronic Packaging. 8: 146-153. DOI: 10.4071/Imaps.298  0.581
2011 Abousaif E, Elshabini A, Barlow F. Waveguide inductive strip filter embedded in LTCC Proceedings - 2011 Imaps/Acers 7th International Conference and Exhibition On Ceramic Interconnect and Ceramic Microsystems Technologies, Cicmt 2011. 43-49.  0.512
2010 Rabeea AA, Barlow F, Elshabini A. Develop procedure for designing fourth order microstrip dual-mode bandpass filters 2010 10th Mediterranean Microwave Symposium, Mms 2010. 236-240. DOI: 10.1109/MMW.2010.5605183  0.414
2009 Barlow F, Wood J, Elshabini A, Stephens EF, Feeler R, Kemner G, Junghans J. Fabrication of precise fluidic structures in LTCC International Journal of Applied Ceramic Technology. 6: 18-23. DOI: 10.1111/J.1744-7402.2008.02315.X  0.614
2009 Rabeea AA, Barlow F, Elshabini A. Design methodology for designing second order microstrip dual-mode filters 2009 Mediterrannean Microwave Symposium, Mms 2009. DOI: 10.1109/MMS.2009.5409787  0.399
2008 Feeler R, Junghans J, Stephens E, Kemner G, Barlow F, Wood J, Elshabini A. Advanced Laser Diode Cooling Concepts Mrs Proceedings. 1076. DOI: 10.1557/Proc-1076-K07-06  0.554
2006 Wang G, Folk EC, Barlow F, Elshabini A. Fabrication of microvias for multilayer LTCC substrates Ieee Transactions On Electronics Packaging Manufacturing. 29: 32-41. DOI: 10.1109/Tepm.2005.862633  0.598
2005 Wang G, Van M, Barlow F, Elshabini A. An interdigital bandpass filter embedded in LTCC for 5-GHz wireless LAN applications Ieee Microwave and Wireless Components Letters. 15: 357-359. DOI: 10.1109/Lmwc.2005.847711  0.705
2003 Magableh F, Wang V, Elshabini A, Barlow F. LTCC based slow wave filters for wireless and handheld products Proceedings of Spie - the International Society For Optical Engineering. 5231: 18-22.  0.428
2003 Folk M, Wang V, Elshabini A, Barlow F. Embedded Passives in Low-Temperature Co-Fired Ceramic for RF & Microwave Applications Proceedings of Spie - the International Society For Optical Engineering. 5288: 627-632.  0.312
2002 Barlow F, Lostetter A, Elshabini A. Low cost flex substrates for miniaturized electronic assemblies Microelectronics Reliability. 42: 1091-1099. DOI: 10.1016/S0026-2714(02)00061-6  0.633
2002 Wang G, Barlow FD, Elshabini A. Simulation, characterization and design of embedded resistors in LTCC for high frequency applications Proceedings of Spie - the International Society For Optical Engineering. 4931: 851-859.  0.334
2002 Wang G, Barlow F, Elshabini A. Modeling and control of resistance tolerance for embedded resistors in LTCC Proceedings - Electronic Components and Technology Conference. 516-525.  0.579
2001 Wang G, Rajagopalan V, Barlow FD, Elshabini A, Brown W, Ang SS. Design and fabrication of embedded resistors in LTCC for high frequency applications Proceedings of Spie - the International Society For Optical Engineering. 4587: 325-331.  0.313
2000 Lostetter AB, Barlow F, Elshabini A. An overview to integrated power module design for high power electronics packaging Microelectronics Reliability. 40: 365-379. DOI: 10.1016/S0026-2714(99)00219-X  0.611
1998 Barlow F, Elshabini A. Compact low voltage high current power supply for digital applications Proceedings of Spie - the International Society For Optical Engineering. 3582: 138-143.  0.575
1998 Lostetter AB, Barlow F, Elshabini A. Multilayer interconnects for a high power packaging strategy Proceedings of Spie - the International Society For Optical Engineering. 3582: 330-334.  0.6
1998 Lostetter AB, Barlow F, Elshabini A. Integrated Power Modules (IPMs), a novel MCM approach to high power electronics design and packaging International Journal of Microcircuits and Electronic Packaging. 21: 274-278.  0.312
Low-probability matches (unlikely to be authored by this person)
2002 Ulrich R, Schaper L, Date A, Wasef M, Xi Y, Thakre M, Pandey R, Elshabini A, Ang S, Brown W. Fabrication options for thin film integrated capacitors Proceedings of Spie - the International Society For Optical Engineering. 4217: 330-335.  0.298
2000 Ulrich RK, Brown WD, Ang SS, Barlow FD, Elshabini A, Lenihan TG, Naseem HA, Nelms DM, Parkerson JP, Schaper LW, Morcan G. Getting aggressive with passive devices Ieee Circuits and Devices Magazine. 16: 17-25. DOI: 10.1109/101.876902  0.298
2003 Saxena K, Wang G, Ang S, Elshabini A, Barlow F. LTCC based MEMS impingement coolers Proceedings of Spie - the International Society For Optical Engineering. 5231: 211-216.  0.264
2000 Quach H, Ang SS, Barlow F, Elshabini A, Olejniczak K, Malshe A, Brown WD. A flip-chip power electronics packaging technology on a flexible polymeric substrates Proceedings of the Electronic Packaging Technology Conference, Eptc. 2000: 302-307. DOI: 10.1109/EPTC.2000.906391  0.246
2011 Kulkarni S, Arifeen S, Patterson B, Potirniche G, Elshabini A, Barlow F. Evaluation of ceramic substrates for high power and high temperature applications Proceedings - 2011 Imaps/Acers 7th International Conference and Exhibition On Ceramic Interconnect and Ceramic Microsystems Technologies, Cicmt 2011. 199-206.  0.241
2003 Lostetter AB, Hornberger J, Lal SM, Olejniczak K, Mantooth A, Elshabini A. Development of Silicon-Carbide (SiC) Static-Induction-Transistor (SIT) Based Half-Bridge Power Converters Proceedings of Spie - the International Society For Optical Engineering. 5288: 339-344.  0.24
1999 Lostetter AB, Barlow F, Elshabini A. An overview to integrated power module design for high power electronics packaging Microelectronics Reliability. 40: 365-379.  0.234
2001 Lostetter AB, Olejniczak KJ, Malshe AP, Brown WD, Elshabini A. Silicon carbide power die packaging in diamond substrate multichip power module applications Proceedings of Spie - the International Society For Optical Engineering. 4587: 389-393.  0.233
2007 Stephens EF, Feeler R, Kemner G, Barlow F, Wood J, Elshabini A. Micro-fluidic Optoelectronic Packages based on LTCC Proceedings - 2007 International Symposium On Microelectronics, Imaps 2007. 429-436.  0.233
1998 Lostetter A, Barlow F, Elshabini A. Thernial evaluation and comparison study of power baseplate materials Advancing Microelectronics. 25: 25-27.  0.227
2008 Feeler R, Junghans J, Stephens E, Kemner G, Barlow F, Wood J, Elshabini A. Advanced laser diode cooling concepts Materials Research Society Symposium Proceedings. 1076: 119-124.  0.226
2013 Elgame D, Barannyk L, Elshabini A, Barlow F. Comparison of passive enforcement techniques for DRAM package models Ieee Workshop On Microelectronics and Electron Devices, Wmed. 25-28. DOI: 10.1109/WMED.2013.6544510  0.222
2003 Elvey E, Wang V, Folk M, Tan C, Barlow F, Elshabini A. Process and material challenges associated with the next generation of LTCC based products Proceedings - Electrochemical Society. 27: 141-155.  0.219
2006 Rowden B, Wang G, Barlow F, Elshabini A, Zawicki L, Barrier G, Duncan B, Krueger D, Lopez C. Investigation of the via fill process for high density multilayer LTCC substrates Proceedings - 2006 International Symposium On Microelectronics, Imaps 2006. 926-931.  0.214
2014 Barannyk LL, Aboutaleb HA, Elshabini A, Barlow F. Causality verification using polynomial periodic continuations for electrical interconnects Journal of Microelectronics and Electronic Packaging. 11: 181-196. DOI: 10.407l/imaps.428  0.2
2015 Barannyk LL, Aboutaleb HA, Elshabini A, Barlow FD. Spectrally Accurate Causality Enforcement Using SVD-Based Fourier Continuations for High-Speed Digital Interconnects Ieee Transactions On Components, Packaging and Manufacturing Technology. DOI: 10.1109/TCPMT.2015.2444388  0.195
2005 Vanam K, Junghans J, Barlow F, Selvam RP, Balda JC, Elshabini A. A novel packaging methodology for spray cooling of power semiconductor devices using dielectric liquids Conference Proceedings - Ieee Applied Power Electronics Conference and Exposition - Apec. 3: 2014-2018. DOI: 10.1109/APEC.2005.1453335  0.194
1999 Lostetter AB, White J, Barlow F, Elshabini A. Utilization of polymer thick film (PTF) and flex technologies for low cost power electronics packaging of DC/DC down converters Proceedings of Spie - the International Society For Optical Engineering. 3906: 625-630.  0.193
2009 Rao G, Kulkarni S, Barlow F, Elshabini A. Encapsulation of power modules for extreme environment electronics Proceedings - 2009 International Symposium On Microelectronics, Imaps 2009. 678-685.  0.19
2011 Abdelnaby AH, Potirniche GP, Barlow F, Elshabini A, Parker R. Finite element modeling of a back grinding process for Through Silicon Vias 2011 Ieee Workshop On Microelectronics and Electron Devices, Wmed 2011. DOI: 10.1109/WMED.2011.5767273  0.189
2011 Abdelnaby AH, Potirniche GP, Barlow F, Poulsen B, Elshabini A, Parker R, Jiang T. Numerical Simulations of a Back Grinding Process for Silicon Wafers Advances and Applications in Electroceramics. 226: 3-11. DOI: 10.1002/9781118144480.ch1  0.189
2008 Rink K, Barlow F, Elshabini A. Leakage rates through LTCC substrates for extreme environment applications Proceedings - 2008 International Symposium On Microelectronics, Imaps 2008. 1147-1151.  0.186
2013 Arifeen S, Potirniche G, Elshabini A, Barlow F. Modeling of failure in aluminum alloy braze for a high temperature thermoelectric assembly 46th International Symposium On Microelectronics, Imaps 2013. 957-963.  0.186
2014 Barannyk LL, Aboutaleb HA, Elshabini A, Barlow F. Causality enforcement of high-speed interconnects via periodic continuations Proceedings - 2014 47th International Symposium On Microelectronics, Imaps 2014. 236-241.  0.184
2012 Patterson B, Kulkarni S, Elshabini A, Barlow F. Evaluation of direct bond aluminum substrates for power electronic applications in extreme environments Proceedings - Imaps/Acers 8th International Conference and Exhibition On Ceramic Interconnect and Ceramic Microsystems Technologies, Cicmt 2012. 12-17.  0.183
1998 Dunson DL, Sankarapandian MS, Oyama H, Webster J, Barlow FD, Elshabini A, McGrath JE. Evaluation of a novel polyimide for use as a low-loss, low dielectric constant interlayer in electronic packaging applications Proceedings of Spie - the International Society For Optical Engineering. 3582: 230-235.  0.178
1999 Jittinorasett S, Barlow F, McGrath J, Elshabini A. UBM formation on single die/dice for flip chip applications Proceedings of Spie - the International Society For Optical Engineering. 3906: 39-44.  0.177
2007 Vanam K, Barlow F, Ozpineci B, Marlino LD, Chinthavali MS, Tolbert LM, Elshabini A. High-temperature sic packaging for HEV traction applications Proceedings - 2007 International Symposium On Microelectronics, Imaps 2007. 575-580.  0.177
2008 Kulkarni S, Barlow F, Elshabini A, Edgeman R. SiC & GaN die attach for extreme environment electronics Proceedings - 2008 International Symposium On Microelectronics, Imaps 2008. 1119-1125.  0.171
2011 Abdelnaby AH, Potimiche GP, Elshabini A, Barlow F, Parker R. A comparison of back grinding processes for bare silicon and through-silicon via wafers using numerical simulations Journal of Microelectronics and Electronic Packaging. 8: 146-153.  0.171
2002 Barlow F, Glover M, Mincy J, Porter E, Schaper L, Elshabini A. MCM-D/C based on Cu/BCB thin film and LTCC: Lessons learned Proceedings of Spie - the International Society For Optical Engineering. 4931: 548-553.  0.17
2012 Abdelnaby AH, Potirniche GP, Elshabini A, Barlow F, Groothuis SK, Parker RS. Numerical simulation of heat generation during the back grinding process of silicon wafers 2012 Ieee Workshop On Microelectronics and Electron Devices, Wmed 2012. 5-8. DOI: 10.1109/WMED.2012.6202614  0.166
2013 Elshabini A, Barlow F, Islam S, Wang PJ. Advanced devices and electronic packaging for harsh environment 46th International Symposium On Microelectronics, Imaps 2013. 937-950.  0.165
2014 Arifeen SU, Wolemiwa V, Nwoke D, Barannyk LL, Potirniche GP, Elshabini A, Barlow F. Finite element analysis and fatigue life prediction of an aluminum alloy braze for high temperature thermoelectric generator package assembly Asme International Mechanical Engineering Congress and Exposition, Proceedings (Imece). 10. DOI: 10.1115/IMECE2014-38829  0.161
2015 Barannyk LL, Tran HH, Nguyen LV, Elshabini A, Barlow F. Delay estimation using SVD-based causal fourier continuations for high speed interconnects 2015 Ieee 24th Conference On Electrical Performance of Electronic Packaging and Systems, Epeps 2015. 225-228. DOI: 10.1109/EPEPS.2015.7347167  0.16
2005 Wang G, Barlow F, Elshabini A. Interconnection of fine lines to micro vias in high density multilayer LTCC substrates Proceedings - 2005 International Symposium On Microelectronics, Imaps 2005. 810-815.  0.151
2013 Aboutaleb H, Baranny LL, Elshabini A, Barlow F. A new method for causality enforcement of DRAM package models using discrete hilbert transforms Ieee Workshop On Microelectronics and Electron Devices, Wmed. 21-24. DOI: 10.1109/WMED.2013.6544509  0.148
2001 Elshabini A. Low cost power electronics packaging Advancing Microelectronics. 28.  0.146
2015 Tran H, Barannyk L, Elshabini A, Barlow F. A Study of Differential Signaling: Stable and Accurate Mixed-Mode Conversion and Extraction of Differential S-Parameters Ieee Workshop On Microelectronics and Electron Devices, Wmed. 2015: 24-27. DOI: 10.1109/WMED.2015.7093953  0.14
2013 Abdelnaby AH, Potirniche GP, Barlow F, Elshabini A, Groothuis S, Parker R. Numerical simulation of silicon wafer warpage due to thin film residual stresses Ieee Workshop On Microelectronics and Electron Devices, Wmed. 9-12. DOI: 10.1109/WMED.2013.6544506  0.134
2005 Selvam RP, Bhaskara S, Balda JC, Barlow F, Elshabini A. Computer modeling of liquid droplet impact on heat transfer during spray cooling Proceedings of the Asme Summer Heat Transfer Conference. 2: 179-188. DOI: 10.1115/HT2005-72569  0.127
2004 Rowden B, Barlow F, Balda J, Elshabini A, Garcia G, Leidhold R, De Angelo C, Bossio G, Forchetti D. Integrated motors and controllers for 42V automotive auxiliary motor applications Ieee Workshop On Power Electronics in Transportation. 97-102.  0.127
2000 Lostetter AB, Barlow F, Elshabini A, Olejniczak K, Ang S. Polymer Thick Film (PTF) and flex technologies for low cost power electronics packaging Iwipp 2000 - International Workshop On Integrated Power Packaging. 33-40. DOI: 10.1109/IWIPP.2000.885178  0.126
2001 Elshabini A. Foreword Ieee Transactions On Advanced Packaging. 24: 463. DOI: 10.1109/TADVP.2001.982830  0.12
2015 Barannyk LL, Tran HH, Elshabini A, Barlow FD. Time delay extraction from frequency domain data using causal fourier continuations for high-speed interconnects Electronics. 4: 799-826. DOI: 10.3390/electronics4040799  0.113
2000 Hasselman DPH, Donaldson KY, Barlow FD, Elshabini AA, Schiroky GH, Yaskoff JP, Dietz RL. Interfacial thermal resistance and temperature dependence of three adhesives for electronic packaging Ieee Transactions On Components and Packaging Technologies. 23: 633-637. DOI: 10.1109/6144.888846  0.105
2001 Selvam RP, Jung Y, Khater J, Ang S, Elshabini A. Computer modeling to optimize the heat removal capacity of the micro-jet array Proceedings of Spie - the International Society For Optical Engineering. 4587: 616-621.  0.103
2000 Brown W, Elshabini A, Ang S, Balda J, Barlow F, Couvillion R, Malshe A, Malstrom R, Mantooth A, Martin T, Naseem H, Jones R, Waite W, Brown R, et al. Curriculum restructure to answer critical needs in packaging for energy efficiency/renewable energy systems, wireless, and mixed-signal systems areas Proceedings - Electronic Components and Technology Conference. 1278-1284.  0.076
1996 Elshemey WM, Elsayed AA, Elshabini AA. Radioactivity distribution and isocount mapping in tissue equivalent phantom using slow coincidence arrangement Radiation Physics and Chemistry. 47: 723-726. DOI: 10.1016/0969-806X(95)00094-E  0.036
Hide low-probability matches.