☰

Pei-I Wang, Ph.D. - Publications

Affiliations: 
2001 Rensselaer Polytechnic Institute, Troy, NY, United States 
Area:
Materials Science Engineering
Tree Info Similar researchers PubMed Report error

33 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2012 Wang P, Li H, Lu T. Orientation Modulated Epitaxy of Cu Nanorods on Si(1 0 0) Substrate Ieee Transactions On Nanotechnology. 11: 542-545. DOI: 10.1109/Tnano.2012.2182778  0.427
2012 Wang P, Frey MD, Washington M, Nayak S, Lu T. Resistivity of sub-50 nm copper lines epitaxially grown on Si(100) substrate Thin Solid Films. 520: 6106-6108. DOI: 10.1016/J.Tsf.2012.05.070  0.327
2011 He M, Li H, Wang P, Lu T. Bias-temperature stress of Al on porous low-k dielectrics Microelectronics Reliability. 51: 1342-1345. DOI: 10.1016/J.Microrel.2011.03.004  0.369
2011 Wang P, Bult J, Ghoshal R, Ghoshal R, Lu T. Rapid ultraviolet-curing of epoxy siloxane films Materials Chemistry and Physics. 129: 678-682. DOI: 10.1016/J.Matchemphys.2011.05.007  0.336
2010 Li H, Snow P, He M, Wang PI, Wang GC, Lu TM. Biaxially textured Al film growth on CaF2 nanostructures toward a method of preparing single-crystalline Si film on glass substrates. Acs Nano. 4: 5627-32. PMID 20839785 DOI: 10.1021/Nn1011978  0.368
2010 He M, Ou Y, Wang P, Lu T. Kinetics of Ta ions penetration into porous low-k dielectrics under bias-temperature stress Applied Physics Letters. 96: 222901. DOI: 10.1063/1.3442485  0.314
2009 Wang PI, Parker TC, Karabacak T, Wang GC, Lu TM. Size control of Cu nanorods through oxygen-mediated growth and low temperature sintering. Nanotechnology. 20: 085605. PMID 19417453 DOI: 10.1088/0957-4484/20/8/085605  0.445
2009 Wang PI, Lee SH, Parker TC, Frey MD, Karabacak T, Lu JQ, Lu TM. Low temperature wafer bonding by copper nanorod array Electrochemical and Solid-State Letters. 12. DOI: 10.1149/1.3075900  0.414
2008 Cansizoglu MF, Watanabe F, Wang PI, Karabacak T. Evolution of crystal orientation in obliquely deposited magnesium nanostructures for hydrogen storage applications Materials Research Society Symposium Proceedings. 1042: 53-58. DOI: 10.1557/Proc-1042-S04-06  0.314
2008 Ou Y, Wang P, He M, Lu T-, Leung P, Spooner TA. Conduction Mechanisms of Ta/Porous SiCOH Films under Electrical Bias Journal of the Electrochemical Society. 155. DOI: 10.1149/1.2992125  0.376
2008 Ou Y, Wang PI, Vanamurthy LH, Bakhru H, Lu TM, Spencer G. Thermal stability study of pore sealing using parylene N Journal of the Electrochemical Society. 155. DOI: 10.1149/1.2967719  0.349
2008 Wang PI, Juneja JS, Ou Y, Lu TM, Spencer GS. Instability of metal barrier with porous methyl silsesquioxane films Journal of the Electrochemical Society. 155: H53-H58. DOI: 10.1149/1.2806030  0.416
2008 Wang P, Nalamasu O, Ghoshal R, Ghoshal R, Schaper CD, Li A, Lu T. Novel photocurable epoxy siloxane polymers for photolithography and imprint lithography applications Journal of Vacuum Science & Technology B. 26: 244-248. DOI: 10.1116/1.2834559  0.302
2007 Wang PI, Karabacak T, Yu J, Li HF, Pethuraja GG, Lee SH, Liu MZ, Lu JQ, Lu TM. Low temperature copper-nanorod bonding for 3D integration Materials Research Society Symposium Proceedings. 970: 225-230. DOI: 10.1557/Proc-0970-Y04-07  0.364
2007 Pimanpang S, Wang PI, Ye D, Juneja JS, Wang GC, Lu TM. Enhancement of Cu (hfac)2 chemisorption on the parylene surface by N2 plasma surface modification Journal of the Electrochemical Society. 154. DOI: 10.1149/1.2766606  0.408
2007 Senkevich JJ, Woods BW, McMahon JJ, Wang PI. Thermomechanical properties of parylene X, A room-temperature chemical vapor depositable crosslinkable polymer Chemical Vapor Deposition. 13: 55-59. DOI: 10.1002/Cvde.200606541  0.371
2006 Ee YC, Juneja JS, Wang PI, Lu TM, Bakhru H, Chan L, Law SB, Yong C, Chen Z, Xu S. Bias-temperature stability of Ti-Si-N-O films Journal of the Electrochemical Society. 153. DOI: 10.1149/1.2184070  0.383
2006 Wang PI, Juneja JS, Murarka SP, Lu TM, Jezewski C, Ghoshal R, Bakhru H. Stability of Cu on epoxy siloxane polymer under bias temperature stress Journal of the Electrochemical Society. 153. DOI: 10.1149/1.2172569  0.59
2006 Wang PI, Wu Z, Lu TM, Interrante LV. A novel polycarbosilane-based low- k dielectric material Journal of the Electrochemical Society. 153. DOI: 10.1149/1.2167932  0.482
2006 Pimanpang S, Wang PI, Juneja JS, Wang GC, Lu TM. Interfacial interaction of in situ Cu growth on tetrasulfide self-assembled monolayer on plasma treated parylene surface Journal of Vacuum Science and Technology a: Vacuum, Surfaces and Films. 24: 1884-1891. DOI: 10.1116/1.2333574  0.397
2006 Karabacak T, Deluca JS, Wang PI, Ten Eyck GA, Ye D, Wang GC, Lu TM. Low temperature melting of copper nanorod arrays Journal of Applied Physics. 99. DOI: 10.1063/1.2180437  0.448
2006 Juneja JS, Wang PI, Karabacak T, Lu TM. Dielectric barriers, pore sealing, and metallization Thin Solid Films. 504: 239-242. DOI: 10.1016/J.Tsf.2005.09.164  0.366
2005 Jezewski C, Lanford WA, Wiegand CJ, Singh JP, Wang PI, Senkevich JJ, Lu TM. Inductively coupled hydrogen plasma-assisted Cu ALD on metallic and dielectric surfaces Journal of the Electrochemical Society. 152. DOI: 10.1149/1.1850340  0.429
2005 Karabacak T, Wang PI, Wang GC, Lu TM. Phase transformation of single crystal β-tungsten nanorods at elevated temperatures Thin Solid Films. 493: 293-296. DOI: 10.1016/J.Tsf.2005.06.059  0.329
2004 Wang PI, Juneja JS, Murarka S, Lu TM, Ghoshal R. Novel epoxy siloxane polymer as low-k dielectric Materials Research Society Symposium Proceedings. 812: 31-36. DOI: 10.1557/Proc-812-F4.4  0.539
2004 Wang P, Zhao Y, Wang G, Lu T. Novel growth mechanism of single crystalline Cu nanorods by electron beam irradiation Nanotechnology. 15: 218-222. DOI: 10.1088/0957-4484/15/1/039  0.406
2004 Senkevich JJ, Wang PI, Wiegand CJ, Lu TM. Bias-temperature stability of ultrathin parylene-capped dielectrics: Influence of surface oxygen on copper ion diffusion Applied Physics Letters. 84: 2617-2619. DOI: 10.1063/1.1691488  0.457
2002 Zhao Y-, Ye D-, Wang P, Wang G-, Lu T-. FABRICATION OF Si NANOCOLUMNS AND Si SQUARE SPIRALS ON SELF-ASSEMBLED MONOLAYER COLLOID SUBSTRATES International Journal of Nanoscience. 1: 87-97. DOI: 10.1142/S0219581X02000073  0.321
2001 Wang PI, Murarka SP, Kaminski DA, Bedell S, Lanford WA. Surface Segregation of Al of the Bilayers of Pure Cu and Cu-Al Alloy Films Journal of the Electrochemical Society. 148. DOI: 10.1149/1.1387239  0.584
2001 Wang PI, Murarka SP, Yang GR, Lu TM. Evolution of the Cu-Al Alloy/SiO2 Interfaces during Bias Temperature Stressing Journal of the Electrochemical Society. 148. DOI: 10.1149/1.1341247  0.58
2000 Wang P, Murarka SP, Yang G-, Barnat E, Lu T-, Chen Y-, Li X, Rajan K. Characterization of Cu-Al alloy/SiO 2 interface microstructure Mrs Proceedings. 615. DOI: 10.1557/Proc-615-G7.5.1  0.597
1999 Wang PI, Yang GR, Murarka SP, Lu TM. X-ray photoelectron spectroscopic studies of Cu-Al alloy/SiO2 interfaces Materials Research Society Symposium - Proceedings. 564: 347-352. DOI: 10.1557/Proc-564-347  0.627
1998 Wang PI, Murarka SP, Bedell S, Lanford WA. Homogenization of the bilayers of Cu-Al alloy and pure copper to produce Cu-0.3 at.% Al alloy films Materials Research Society Symposium - Proceedings. 514: 281-286. DOI: 10.1557/Proc-514-281  0.611
Show low-probability matches.