| Year |
Citation |
Score |
| 2017 |
Jang DW, Lee JH, Kim A, Lee SB, Hong SG. Self-Heating-Induced Deterioration of Electromechanical Performance in Polymer-Supported Metal Films for Flexible Electronics. Scientific Reports. 7: 12506. PMID 28970501 DOI: 10.1038/S41598-017-12705-9 |
0.405 |
|
| 2017 |
Lee Y, Sim G, Bae J, Kim J, Lee S. Tensile and fatigue behavior of polymer supported silver thin films at elevated temperatures Materials Letters. 193: 81-84. DOI: 10.1016/J.Matlet.2017.01.111 |
0.757 |
|
| 2017 |
Lee Y, Ha S, Park J, Lee S. Structure-dependent mechanical behavior of copper thin films Materials Characterization. 128: 68-74. DOI: 10.1016/J.Matchar.2017.03.036 |
0.363 |
|
| 2017 |
Lee J, Jang D, Hong S, Park BC, Kim J, Jung H, Lee S. Fracture mechanism and electromechanical behavior of chemical vapor deposited graphene on flexible substrate under tension Carbon. 118: 475-484. DOI: 10.1016/J.Carbon.2017.03.081 |
0.413 |
|
| 2017 |
Lee J, Lee H, Hong S, Lee S. Fatigue crack growth behavior of Mod.9Cr-1Mo steel at elevated temperatures: Effect of temperature, loading frequency and R ratio Journal of Mechanical Science and Technology. 31: 3665-3669. DOI: 10.1007/S12206-017-0706-Z |
0.413 |
|
| 2017 |
Lee J, Jang D, Hong S, Lee S. Evaluating the reliability of the cylinder liner of a low-speed marine engine subjected to high-cycle fatigue with high mean stress Journal of Mechanical Science and Technology. 31: 1639-1644. DOI: 10.1007/S12206-017-0311-1 |
0.331 |
|
| 2016 |
Lee KO, Lee SB. A comparison of methods for predicting the fatigue life of gray cast iron at elevated temperatures Fatigue and Fracture of Engineering Materials and Structures. 39: 439-452. DOI: 10.1111/Ffe.12368 |
0.333 |
|
| 2014 |
Jang J, Suk K, Park J, Paik K, Lee S. Warpage Behavior and Life Prediction of a Chip-on-Flex Package Under a Thermal Cycling Condition Ieee Transactions On Components, Packaging and Manufacturing Technology. 4: 1144-1151. DOI: 10.1109/Tcpmt.2014.2325975 |
0.371 |
|
| 2013 |
Kim S, Won S, Sim GD, Park I, Lee SB. Tensile characteristics of metal nanoparticle films on flexible polymer substrates for printed electronics applications. Nanotechnology. 24: 085701. PMID 23376972 DOI: 10.1088/0957-4484/24/8/085701 |
0.745 |
|
| 2013 |
Jang JW, Hwangbo Y, Kim JH, Lee HJ, Mag-Isa AE, Lee SB. Statistical characteristics of fatigue failure of copper thin films Journal of Engineering Materials and Technology, Transactions of the Asme. 135. DOI: 10.1115/1.4025319 |
0.423 |
|
| 2013 |
Sim GD, Lee YS, Lee SB, Vlassak JJ. Effects of stretching and cycling on the fatigue behavior of polymer-supported Ag thin films Materials Science and Engineering A. 575: 86-93. DOI: 10.1016/J.Msea.2013.03.043 |
0.784 |
|
| 2013 |
Sim GD, Park JH, Uchic MD, Shade PA, Lee SB, Vlassak JJ. An apparatus for performing microtensile tests at elevated temperatures inside a scanning electron microscope Acta Materialia. 61: 7500-7510. DOI: 10.1016/J.Actamat.2013.08.064 |
0.749 |
|
| 2012 |
Chung C, Sim G, Lee S, Paik K. Effects of Conductive Particles on the Electrical Stability and Reliability of Anisotropic Conductive Film Chip-on-Board Interconnections Ieee Transactions On Components, Packaging and Manufacturing Technology. 2: 359-366. DOI: 10.1109/Tcpmt.2012.2184287 |
0.694 |
|
| 2012 |
Jang J, Suk K, Paik K, Lee S. Measurement and Analysis for Residual Warpage of Chip-on-Flex (COF) and Chip-in-Flex (CIF) Packages Ieee Transactions On Components, Packaging and Manufacturing Technology. 2: 834-840. DOI: 10.1109/Tcpmt.2011.2175732 |
0.337 |
|
| 2012 |
Sim G, Won S, Lee S. Tensile and fatigue behaviors of printed Ag thin films on flexible substrates Applied Physics Letters. 101: 191907. DOI: 10.1063/1.4766447 |
0.74 |
|
| 2012 |
Sim GD, Hwangbo Y, Kim HH, Lee SB, Vlassak JJ. Fatigue of polymer-supported Ag thin films Scripta Materialia. 66: 915-918. DOI: 10.1016/J.Scriptamat.2012.02.030 |
0.779 |
|
| 2012 |
Lee K, Lee S. Modeling of materials behavior at various temperatures of hot isostatically pressed superalloys Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing. 541: 81-87. DOI: 10.1016/J.Msea.2012.02.005 |
0.348 |
|
| 2012 |
Jang K, Park J, Lee S, Paik K. A study on thermal cycling (T/C) reliability of anisotropic conductive film (ACF) flip chip assembly for thin chip-on-board (COB) packages Microelectronics Reliability. 52: 1174-1181. DOI: 10.1016/J.Microrel.2011.12.022 |
0.341 |
|
| 2012 |
Yang SY, Kwon W, Lee S. Chip warpage model for reliability prediction of delamination failures Microelectronics Reliability. 52: 718-724. DOI: 10.1016/J.Microrel.2011.11.013 |
0.354 |
|
| 2012 |
Kim HH, Lee SB. Effect of a brazing process on mechanical and fatigue behavior of alclad aluminum 3005 Journal of Mechanical Science and Technology. 26: 2111-2115. DOI: 10.1007/S12206-012-0525-1 |
0.405 |
|
| 2011 |
Bae KH, Lee SB. The effect of specimen geometry on the low cycle fatigue life of metallic materials Materials At High Temperatures. 28: 33-39. DOI: 10.3184/096034011X12982896521562 |
0.448 |
|
| 2011 |
Sim GD, Won S, Jin CY, Park I, Lee SB, Vlassak JJ. Improving the stretchability of as-deposited Ag coatings on poly-ethylene-terephthalate substrates through use of an acrylic primer Journal of Applied Physics. 109. DOI: 10.1063/1.3567917 |
0.751 |
|
| 2011 |
Baek DC, Lee SB. Fatigue behavior of electrodeposited nanocrystalline nickel films Procedia Engineering. 10: 3006-3011. DOI: 10.1016/J.Proeng.2011.04.498 |
0.439 |
|
| 2011 |
Bae K, Kim H, Lee S. Competing damage mechanisms in the thermo-mechanical fatigue of AISI 304L stainless steel Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing. 529: 417-424. DOI: 10.1016/J.Msea.2011.09.054 |
0.413 |
|
| 2011 |
Bae K, Kim H, Lee S. A simple life prediction method for 304L stainless steel structures under fatigue-dominated thermo-mechanical fatigue loadings Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing. 529: 370-377. DOI: 10.1016/J.Msea.2011.09.045 |
0.417 |
|
| 2010 |
Lee S. Reliability Assessment of Advanced Materials and Structures Journal of Solid Mechanics and Materials Engineering. 4: 639-651. DOI: 10.1299/Jmmp.4.639 |
0.426 |
|
| 2010 |
Park J, Jang K, Paik K, Lee S. A Study of Hygrothermal Behavior of ACF Flip Chip Packages With Moiré Interferometry Ieee Transactions On Components and Packaging Technologies. 33: 215-221. DOI: 10.1109/Tcapt.2009.2036154 |
0.419 |
|
| 2010 |
Kim D, Lee S. Structural damage identification of a cantilever beam using excitation force level control Mechanical Systems and Signal Processing. 24: 1814-1830. DOI: 10.1016/J.Ymssp.2010.02.007 |
0.374 |
|
| 2010 |
Sim G, Chung C, Paik K, Lee S. Moisture induced interface weakening in ACF package Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing. 528: 698-705. DOI: 10.1016/J.Msea.2010.09.051 |
0.74 |
|
| 2009 |
Yoo JY, Kim I, Lee SB. Measurement and characterization of the moisture-induced properties of ACF package Journal of Electronic Packaging, Transactions of the Asme. 131: 0210121-0210128. DOI: 10.1115/1.3111252 |
0.329 |
|
| 2009 |
Kim I, Lee S. Development of a Novel Microimpact-Fatigue Tester and Its Application to Impact Reliability of Lead-Free Solder Joints Ieee Transactions On Components and Packaging Technologies. 32: 542-549. DOI: 10.1109/Tcapt.2009.2027426 |
0.4 |
|
| 2009 |
Son H, Kim I, Lee S, Jung G, Park B, Paik K. Thermal cycling reliability of Cu/SnAg double-bump flip chip assemblies for 100 μm pitch applications Journal of Applied Physics. 105: 13522. DOI: 10.1063/1.3042236 |
0.318 |
|
| 2009 |
Lee K, Bae K, Lee S. Comparison of prediction methods for low-cycle fatigue life of HIP superalloys at elevated temperatures for turbopump reliability Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing. 519: 112-120. DOI: 10.1016/J.Msea.2009.04.044 |
0.328 |
|
| 2008 |
Park J, Lee S. Health Monitoring for Electronic Package Using a Simple Moiré Interferometry Journal of Solid Mechanics and Materials Engineering. 2: 822-830. DOI: 10.1299/Jmmp.2.822 |
0.408 |
|
| 2008 |
Kim I, Lee S. Reliability and Failure Analysis of Lead-Free Solder Joints for PBGA Package Under a Cyclic Bending Load Ieee Transactions On Components and Packaging Technologies. 31: 478-484. DOI: 10.1109/Tcapt.2008.921650 |
0.442 |
|
| 2008 |
Yang SY, Kim I, Lee S. A Study on the Thermal Fatigue Behavior of Solder Joints Under Power Cycling Conditions Ieee Transactions On Components and Packaging Technologies. 31: 3-12. DOI: 10.1109/Tcapt.2007.906294 |
0.423 |
|
| 2008 |
Hong S, Kim M, Lee S, Lee CS. Characterization of Deformation Behaviors and Elastic Moduli of Multilayered Films in Piezoelectric Inkjet Head Ieee\/Asme Journal of Microelectromechanical Systems. 17: 1155-1163. DOI: 10.1109/Jmems.2008.2004795 |
0.399 |
|
| 2008 |
Lee K, Hong S, Lee S. A new energy-based fatigue damage parameter in life prediction of high-temperature structural materials Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing. 496: 471-477. DOI: 10.1016/J.Msea.2008.07.035 |
0.434 |
|
| 2008 |
Lee S, Kim I, Park T. Fatigue and fracture assessment for reliability in electronics packaging International Journal of Fracture. 150: 91-104. DOI: 10.1007/S10704-008-9224-4 |
0.431 |
|
| 2007 |
Chung C, Kwon W, Jang K, Park J, Lee S, Paik K. Effects of the Functional Groups of Nonconductive Films (NCFs) on Material Properties and Reliability of NCF Flip-Chip-On-Organic Boards Ieee Transactions On Components and Packaging Technologies. 30: 464-471. DOI: 10.1109/Tcapt.2007.898738 |
0.35 |
|
| 2007 |
Hong SG, Lee SB, Byun TS. Temperature effect on the low-cycle fatigue behavior of type 316L stainless steel: Cyclic non-stabilization and an invariable fatigue parameter Materials Science and Engineering A. 457: 139-147. DOI: 10.1016/J.Msea.2006.12.035 |
0.422 |
|
| 2007 |
Lee S, Choi ST, Earmme YY. Erratum to “Analysis of vertical cracking phenomena in tensile-strained epitaxial film on a substrate: Part I. Mathematical formulation” [International Journal of Solids and Structures 43 (2006) 3401–3413] International Journal of Solids and Structures. 44: 5801. DOI: 10.1016/J.Ijsolstr.2007.04.027 |
0.456 |
|
| 2006 |
Lee K, Hong S, Lee S. A Description of Thermomechanical Behavior Using a Rheological Model Transactions of the Korean Society of Mechanical Engineers A. 30: 757-764. DOI: 10.3795/Ksme-A.2006.30.7.757 |
0.318 |
|
| 2006 |
Kwon W, Yang S, Lee S, Paik K. Contraction Stresses Development of Anisotropic Conductive Films (ACFs) Flip Chip Interconnection: Prediction and Measurement Ieee Transactions On Components and Packaging Technologies. 29: 688-695. DOI: 10.1109/Tcapt.2006.881763 |
0.336 |
|
| 2006 |
Lee S, Choi ST, Earmme YY. Analysis of vertical cracking phenomena in tensile-strained epitaxial film on a substrate: Part I. Mathematical formulation International Journal of Solids and Structures. 43: 3401-3413. DOI: 10.1016/J.Ijsolstr.2005.05.002 |
0.461 |
|
| 2005 |
Park T, Lee S. Low Cycle Fatigue Testing of Ball Grid Array Solder Joints under Mixed-Mode Loading Conditions Journal of Electronic Packaging. 127: 237-244. DOI: 10.1115/1.1871192 |
0.411 |
|
| 2005 |
Hong S, Lee S. Mechanism of dynamic strain aging and characterization of its effect on the low-cycle fatigue behavior in type 316L stainless steel Journal of Nuclear Materials. 340: 307-314. DOI: 10.1016/J.Jnucmat.2004.12.012 |
0.361 |
|
| 2005 |
Lim J, Hong S, Lee S. Application of local stress–strain approaches in the prediction of fatigue crack initiation life for cyclically non-stabilized and non-Masing steel International Journal of Fatigue. 27: 1653-1660. DOI: 10.1016/J.Ijfatigue.2005.07.014 |
0.415 |
|
| 2005 |
Lee K, Hong S, Yoon S, Lee S. A new high temperature life correlation model for austenitic and ferritic stainless steels International Journal of Fatigue. 27: 1559-1563. DOI: 10.1016/J.Ijfatigue.2005.06.039 |
0.397 |
|
| 2005 |
Hong S, Lee K, Lee S. Dynamic strain aging effect on the fatigue resistance of type 316L stainless steel International Journal of Fatigue. 27: 1420-1424. DOI: 10.1016/J.Ijfatigue.2005.06.037 |
0.427 |
|
| 2004 |
Lim J, Hong S, Lee S. The Prediction of Fatigue Crack Initiation Life of Cylindrical Notch Specimens Using Local Strain Approximation Transactions of the Korean Society of Mechanical Engineers A. 28: 791-798. DOI: 10.3795/Ksme-A.2004.28.6.791 |
0.429 |
|
| 2004 |
Lee K, Yoon S, Hong S, Kim B, Lee S. Low Cycle Fatigue Behavior of 429EM Stainless Steel at Elevated Temperature Transactions of the Korean Society of Mechanical Engineers A. 28: 427-434. DOI: 10.3795/Ksme-A.2004.28.4.427 |
0.464 |
|
| 2004 |
Hong S, Yoon S, Lee S. The Influence of Temperature on Low Cycle Fatigue Behavior of Prior Cold Worked 316L Stainless Steel (I) - Monotonic and Cyclic Behavior - Transactions of the Korean Society of Mechanical Engineers A. 28: 333-342. DOI: 10.3795/Ksme-A.2004.28.4.333 |
0.43 |
|
| 2004 |
Kim I, Park T, Lee S. A Comparative Study of the Fatigue Behavior of SnAgCu and SnPb Solder Joints Transactions of the Korean Society of Mechanical Engineers A. 28: 1856-1863. DOI: 10.3795/Ksme-A.2004.28.12.1856 |
0.45 |
|
| 2004 |
Lim J, Lee S. Applicability Evaluation of Modified Overlay Model on the Cyclic Behavior of 316L Stainless Steel at Room Temperature Transactions of the Korean Society of Mechanical Engineers A. 28: 1603-1611. DOI: 10.3795/Ksme-A.2004.28.10.1603 |
0.371 |
|
| 2004 |
Kim D, Lee S. Experimental Verifications of Fatigue Crack Identification Method Using Excitation Force Level Control for a Cantilever Beam Transactions of the Korean Society of Mechanical Engineers A. 28: 1467-1474. DOI: 10.3795/Ksme-A.2004.28.10.1467 |
0.35 |
|
| 2004 |
Park TS, Baek DC, Lee SB. An experimental technique for the strain measurement of small structures using pattern recognition Sensors and Actuators, a: Physical. 115: 15-22. DOI: 10.1016/J.Sna.2004.03.028 |
0.335 |
|
| 2004 |
Yoon S, Hong S, Lee S. Phenomenological description of cyclic deformation using the overlay model Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing. 364: 17-26. DOI: 10.1016/J.Msea.2003.09.098 |
0.366 |
|
| 2004 |
Hong S, Lee S. Dynamic strain aging under tensile and LCF loading conditions, and their comparison in cold worked 316L stainless steel Journal of Nuclear Materials. 328: 232-242. DOI: 10.1016/J.Jnucmat.2004.04.331 |
0.4 |
|
| 2004 |
Hong S, Lee S. The tensile and low-cycle fatigue behavior of cold worked 316L stainless steel: influence of dynamic strain aging International Journal of Fatigue. 26: 899-910. DOI: 10.1016/J.Ijfatigue.2003.12.002 |
0.444 |
|
| 2003 |
Hong S, Lee S. The Influence of Dynamic Strain Aging on Tensile and LCF Properties of Prior Cold Worked 316L Stainless Steel Transactions of the Korean Society of Mechanical Engineers A. 27: 1398-1408. DOI: 10.3795/Ksme-A.2003.27.8.1398 |
0.427 |
|
| 2003 |
Yoon S, Hong S, Lee S. Description of Hysteresis Loops using Modified Overlay Model Transactions of the Korean Society of Mechanical Engineers A. 27: 1856-1863. DOI: 10.3795/Ksme-A.2003.27.11.1856 |
0.369 |
|
| 2003 |
Hong S, Yoon S, Lee S. The Influence of Temperature on Low Cycle Fatigue Behavior of Prior Cold Worked 316L Stainless Steel (II) - Life Prediction and Failure Mechanism - Transactions of the Korean Society of Mechanical Engineers A. 27: 1676-1685. DOI: 10.3795/Ksme-A.2003.27.10.1676 |
0.443 |
|
| 2003 |
Kim J, Lee S, Hong S. Fatigue crack growth behavior of Al7050-T7451 attachment lugs under flight spectrum variation Theoretical and Applied Fracture Mechanics. 40: 135-144. DOI: 10.1016/S0167-8442(03)00041-7 |
0.413 |
|
| 2003 |
Hong S, Yoon S, Lee S. The effect of temperature on low-cycle fatigue behavior of prior cold worked 316L stainless steel International Journal of Fatigue. 25: 1293-1300. DOI: 10.1016/S0142-1123(03)00154-3 |
0.434 |
|
| 2003 |
Yoon S, Hong S, Lee S, Kim B. Low cycle fatigue testing of 429EM stainless steel pipe International Journal of Fatigue. 25: 1301-1307. DOI: 10.1016/J.Ijfatigue.2003.08.015 |
0.358 |
|
| 2003 |
Kim J, Hong S, Lee S. Evaluation of Stress Intensity Factor for A Partially Patched Crack Using an Approximate Weight Function Ksme International Journal. 17: 1659-1664. DOI: 10.1007/Bf02983595 |
0.366 |
|
| 2001 |
Kim J, Lee S. A tensile crack in creeping solids with large damage near the crack tip International Journal of Fracture. 112: 43-55. DOI: 10.1023/A:1013541132299 |
0.409 |
|
| 2001 |
Kim J, Lee S. Behavior of plasticity-induced crack closure and roughness-induced crack closure in aluminum alloy International Journal of Fatigue. 23: 247-251. DOI: 10.1016/S0142-1123(01)00155-4 |
0.41 |
|
| 2000 |
Lee S, Park T, Ham S. Experimental Techniques for Fatigue Reliability of BGA Solder Bumps in Electronic Packaging. Jsme International Journal Series a-Solid Mechanics and Material Engineering. 43: 400-407. DOI: 10.1299/Jsmea.43.400 |
0.431 |
|
| 2000 |
Kim J, Lee S. A Simple Method for Calculating the Stress Intensity Factor of a One-Sided Reinforced Crack International Journal of Fracture. 106: 35-40. DOI: 10.1023/A:1007674218331 |
0.341 |
|
| 2000 |
Kim J, Lee S. Fatigue crack opening stress based on the strip-yield model Theoretical and Applied Fracture Mechanics. 34: 73-84. DOI: 10.1016/S0167-8442(00)00025-2 |
0.405 |
|
| 2000 |
Kim J, Lee S. Calculation of stress intensity factor using weight function method for a patched crack with debonding region Engineering Fracture Mechanics. 67: 303-310. DOI: 10.1016/S0013-7944(00)00058-8 |
0.371 |
|
| 2000 |
Kim J, Lee S. Prediction of crack opening stress for part-through cracks and its verification using a modified strip-yield model Engineering Fracture Mechanics. 66: 1-14. DOI: 10.1016/S0013-7944(00)00006-0 |
0.381 |
|
| 1998 |
You B, Lee S. Fatigue Crack Growth Behaviour Of Sm45C Steel Under Mixed‐Mode I And Ii Loading Fatigue & Fracture of Engineering Materials & Structures. 21: 1037-1048. DOI: 10.1046/J.1460-2695.1998.00103.X |
0.384 |
|
| 1998 |
Meng L, Lee S. Eigenspectra and Orders of Singularity at a Crack Tip for a Power-Law Creeping Medium International Journal of Fracture. 92: 55-70. DOI: 10.1023/A:1007460017129 |
0.335 |
|
| 1998 |
Kim J, Lee S. Stress intensity factors and crack initiation directions for ceramic/metal joint Theoretical and Applied Fracture Mechanics. 30: 27-38. DOI: 10.1016/S0167-8442(98)00041-X |
0.385 |
|
| 1997 |
Lee B, Kim H, Lee S. Normal And Tangential Force Calibration In Fretting Fatigue Test Experimental Techniques. 21: 9-12. DOI: 10.1111/J.1747-1567.1997.Tb00501.X |
0.402 |
|
| 1997 |
Lee S, Kim J. Finite-element analysis and X-ray measurement of the residual stresses of ceramic/metal joints Journal of Materials Processing Technology. 67: 167-172. DOI: 10.1016/S0924-0136(96)02838-5 |
0.373 |
|
| 1997 |
Kim H, Lee S. Crack initiation and growth behaviour of Al 2024-T4 under fretting fatigue International Journal of Fatigue. 19: 243-251. DOI: 10.1016/S0142-1123(96)00055-2 |
0.407 |
|
| 1997 |
Lee S, Kim J. A mechanistic model for fatigue life prediction of solder joints for electronic packages International Journal of Fatigue. 19: 85-91. DOI: 10.1016/0142-1123(95)00094-1 |
0.444 |
|
| 1996 |
Lee S. Fatigue failure of welded vertical members of a steel truss bridge Engineering Failure Analysis. 3: 103-108. DOI: 10.1016/1350-6307(96)00003-9 |
0.377 |
|
| 1996 |
You BR, Lee SB. A critical review on multiaxial fatigue assessments of metals International Journal of Fatigue. 18: 235-244. DOI: 10.1016/0142-1123(96)00002-3 |
0.377 |
|
| 1995 |
Lee S, Miller AK. A Phenomenological Model for Intergranular Failure by r-type and Wedge-Type Cavitation Journal of Engineering Materials and Technology-Transactions of the Asme. 117: 311-321. DOI: 10.1115/1.2804545 |
0.4 |
|
| 1995 |
Lee S. Thermal fatigue failure and design modification of a steam exhaust silencer Engineering Failure Analysis. 2: 247-255. DOI: 10.1016/1350-6307(95)00024-0 |
0.334 |
|
| 1995 |
Lee S. Failure analysis and design modification of a briquetting machine roller Engineering Failure Analysis. 2: 287-295. DOI: 10.1016/1350-6307(95)00023-9 |
0.39 |
|
| 1995 |
Lee S, Kobayashi H, Huh J-. Fatigue strength and fracture mechanism of ceramic-metal joints under cyclic bending International Journal of Fatigue. 17: 427-435. DOI: 10.1016/0142-1123(95)00024-N |
0.426 |
|
| 1994 |
Lee SB, Noh SI. Mixed mode crack growth in SM45C and Z02-NKDT steel subjected to repeated impact and fatigue Theoretical and Applied Fracture Mechanics. 21: 1-8. DOI: 10.1016/0167-8442(94)90002-7 |
0.308 |
|
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