Chunhui Chung, Ph.D.
Affiliations: | 2010 | Mechanical Engineering | Stony Brook University, Stony Brook, NY, United States |
Area:
Mechanical EngineeringGoogle:
"Chunhui Chung"Parents
Sign in to add mentor| Imin Kao | grad student | 2010 | SUNY Stony Brook | |
| (Modeling and experimental study of wafer manufacturing and machining processes.) | ||||
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Publications
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| Chung C, Tran MQ, Liu MK. (2020) Estimation of Process Damping Coefficient Using Dynamic Cutting Force Model International Journal of Precision Engineering and Manufacturing. 21: 623-632 |
| Liu MK, Tran MQ, Chung C, et al. (2020) Hybrid model- and signal-based chatter detection in the milling process Journal of Mechanical Science and Technology. 34: 1-10 |
| Chung C, Lin CH. (2018) Study on the performance of nanocomposite wire guides in wire sawing process International Journal of Modern Physics B. 32: 1840077 |
| Chen Y, Huang A, Ellingham T, et al. (2018) Mechanical properties and thermal characteristics of poly(lactic acid) and paraffin wax blends prepared by conventional melt compounding and sub-critical gas-assisted processing (SGAP) European Polymer Journal. 98: 262-272 |
| Kuo C, Hsu Y, Chung C, et al. (2017) Multiple criteria optimisation in coated abrasive grinding of titanium alloy using minimum quantity lubrication International Journal of Machine Tools & Manufacture. 115: 47-59 |
| Chung C, Le VN. (2015) Depth of cut per abrasive in fixed diamond wire sawing The International Journal of Advanced Manufacturing Technology. 80: 1337-1346 |
| Chung C, Nhat LV. (2014) Generation of diamond wire sliced wafer surface based on the distribution of diamond grits International Journal of Precision Engineering and Manufacturing. 15: 789-796 |
| Chung C, Tsay GD, Tsai M. (2014) Distribution of diamond grains in fixed abrasive wire sawing process The International Journal of Advanced Manufacturing Technology. 73: 1485-1494 |
| Zhu X, Chung C, Korach CS, et al. (2013) Experimental study and modeling of the effect of mixed size abrasive grits on surface topology and removal rate in wafer lapping Wear. 305: 14-22 |
| Chung C, Kao I. (2012) Green's function and forced vibration response of damped axially moving wire Jvc/Journal of Vibration and Control. 18: 1798-1808 |