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Dnyanesh C. Tamboli, Ph.D. - Publications

Affiliations: 
2000 University of Central Florida, Orlando, FL, United States 
Area:
Materials Science Engineering
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6 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2004 Du T, Tamboli D, Desai V, Seal S. Mechanism of Copper Removal during CMP in Acidic H 2 O 2 Slurry Journal of the Electrochemical Society. 151. DOI: 10.1149/1.1648029  0.645
2004 Du T, Tamboli D, Luo Y, Desai V. Electrochemical characterization of copper chemical mechanical planarization in KIO3 slurry Applied Surface Science. 229: 167-174. DOI: 10.1016/J.Apsusc.2004.01.062  0.629
2003 Du T, Tamboli D, Desai V. Electrochemical characterization of copper chemical mechanical polishing Microelectronic Engineering. 69: 1-9. DOI: 10.1016/S0167-9317(03)00222-3  0.644
1999 Tamboli D, Seal S, Desai V. XPS and electrochemical studies on tungsten-oxidizer interaction in chemical mechanical polishing Materials Research Society Symposium - Proceedings. 566: 89-95. DOI: 10.1557/Proc-566-89  0.47
1999 Tamboli D, Seal S, Desai V, Maury A. Studies on passivation behavior of tungsten in application to chemical mechanical polishing Journal of Vacuum Science & Technology a: Vacuum, Surfaces, and Films. 17: 1168-1173. DOI: 10.1116/1.581790  0.607
1998 Desai VH, Tamboli DC, Cheruvu NS. Oxidation characteristics of Nickel based superalloys in steam Proceedings of the Asme Turbo Expo. 5. DOI: 10.1115/98-GT-587  0.529
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