| Year |
Citation |
Score |
| 2019 |
Chen B, He J, Guo Y, Pan S, Ye X, Fan J. Multi-Ports ( [$2^{n}$ ) 2×-Thru De-Embedding: Theory, Validation, and Mode Conversion Characterization Ieee Transactions On Electromagnetic Compatibility. 61: 1261-1270. DOI: 10.1109/Temc.2019.2908782 |
0.444 |
|
| 2018 |
Chen Y, Deng H, Chen B, Zai R, Hsu J, Ye X, Fan J, Drewniak J. Signal-signal D-probe and unified launch pad designs Ieee Electromagnetic Compatibility Magazine. 7: 101-106. DOI: 10.1109/Memc.2018.8479348 |
0.587 |
|
| 2017 |
Jin S, Chen B, Fang X, Gao H, Ye X, Fan J. Improved “Root-Omega” Method for Transmission-Line-Based Material Property Extraction for Multilayer PCBs Ieee Transactions On Electromagnetic Compatibility. 59: 1356-1367. DOI: 10.1109/Temc.2017.2679543 |
0.501 |
|
| 2017 |
Chu Y, Xiao K, Ho Y, Friar R, Ouyang G, Lee B, Zhang Z, Ye X, Phares C, Tabatchnick J, Vasanth A, Kaur G. SNEM: Full S-Parameter Synthesis From Near-End Measurement Ieee Transactions On Electromagnetic Compatibility. 59: 1302-1311. DOI: 10.1109/Temc.2017.2655104 |
0.406 |
|
| 2017 |
Ye L, Li C, Sun X, Jin S, Chen B, Ye X, Fan J. Thru-Reflect-Line Calibration Technique: Error Analysis for Characteristic Impedance Variations in the Line Standards Ieee Transactions On Electromagnetic Compatibility. 59: 779-788. DOI: 10.1109/Temc.2016.2623813 |
0.427 |
|
| 2017 |
Huang S, Lee B, Wu B, Xiao K, Ye X. Absorbing Termination for High-Frequency Measurements of Interconnects Ieee Transactions On Components, Packaging and Manufacturing Technology. 7: 1173-1184. DOI: 10.1109/Tcpmt.2017.2696981 |
0.366 |
|
| 2016 |
Huang S, Ye X, Kang N, Lee B, Xiao K. Suppression of couplings in high-speed interconnects using absorbing materials Ieee Transactions On Electromagnetic Compatibility. 58: 1432-1439. DOI: 10.1109/Temc.2016.2582867 |
0.385 |
|
| 2016 |
Huang S, Xiao K, Lee B, Ye X. Stub Effect Mitigations Using Absorbing Materials Ieee Transactions On Components, Packaging and Manufacturing Technology. 6: 1233-1244. DOI: 10.1109/Tcpmt.2016.2582385 |
0.396 |
|
| 2010 |
Fan J, Ye X, Kim J, Archambeault B, Orlandi A. Signal Integrity Design for High-Speed Digital Circuits: Progress and Directions Ieee Transactions On Electromagnetic Compatibility. 52: 392-400. DOI: 10.1109/Temc.2010.2045381 |
0.511 |
|
| 2002 |
Ye X, Drewniak JL. FDTD modeling incorporating a two-port network for I/O line EMI filtering design Ieee Transactions On Electromagnetic Compatibility. 44: 175-181. DOI: 10.1109/15.990724 |
0.568 |
|
| 2002 |
Ye X, Drewniak JL, Nadolny J, Hockanson DM. High-performance inter-PCB connectors: analysis of EMI characteristics Ieee Transactions On Electromagnetic Compatibility. 44: 165-174. DOI: 10.1109/15.990723 |
0.625 |
|
| 2001 |
Yang F, Zhang X, Ye X, Rahmat-Samii Y. Wide-band E-shaped patch antennas for wireless communications Ieee Transactions On Antennas and Propagation. 49: 1094-1100. DOI: 10.1109/8.933489 |
0.319 |
|
| 2001 |
Ye X, Drewniak JL. Incorporating two-port networks with S-parameters into FDTD Ieee Microwave and Wireless Components Letters. 11: 77-79. DOI: 10.1109/7260.914308 |
0.551 |
|
| 2001 |
Ye X, Koledintseva MY, Li M, Drewniak JL. DC power-bus design using FDTD modeling with dispersive media and surface mount technology components Ieee Transactions On Electromagnetic Compatibility. 43: 579-587. DOI: 10.1109/15.974638 |
0.611 |
|
| 2001 |
Ye X, Hockanson DA, Li M, Ren Y, Cui W, Drewniak JL, DuBroff RE. EMI mitigation with multilayer power-bus stacks and via stitching of reference planes Ieee Transactions On Electromagnetic Compatibility. 43: 538-548. DOI: 10.1109/15.974633 |
0.583 |
|
| 2001 |
Hockanson DM, Ye X, Drewniak JL, Hubing TH, Van Doren TP, DuBroff RE. FDTD and experimental investigation of EMI from stacked-card PCB configurations Ieee Transactions On Electromagnetic Compatibility. 43: 1-10. DOI: 10.1109/15.917923 |
0.599 |
|
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