| Year |
Citation |
Score |
| 2020 |
Chu JP, Lai BZ, Yiu P, Shen YL, Chang CW. Metallic glass coating for improving diamond dicing performance. Scientific Reports. 10: 12432. PMID 32709992 DOI: 10.1038/S41598-020-69399-9 |
0.323 |
|
| 2020 |
Nikravesh S, Ryu D, Shen YL. Instabilities of Thin Films on a Compliant Substrate: Direct Numerical Simulations from Surface Wrinkling to Global Buckling. Scientific Reports. 10: 5728. PMID 32235886 DOI: 10.1038/S41598-020-62600-Z |
0.353 |
|
| 2020 |
Nikravesh S, Ryu D, Shen Y. Instability driven surface patterns: Insights from direct three-dimensional finite element simulations Extreme Mechanics Letters. 39: 100779. DOI: 10.1016/J.Eml.2020.100779 |
0.331 |
|
| 2019 |
Nikravesh S, Ryu D, Shen Y. Surface Instability of Composite Thin Films on Compliant Substrates: Direct Simulation Approach Frontiers in Materials. 6: 214. DOI: 10.3389/Fmats.2019.00214 |
0.327 |
|
| 2018 |
Tang G, Galluzzi M, Zhang B, Shen YL, Stadler FJ. Biomechanical Heterogeneity of Living Cells: Comparison between Atomic Force Microscopy and Finite Element Simulation. Langmuir : the Acs Journal of Surfaces and Colloids. PMID 30272980 DOI: 10.1021/Acs.Langmuir.8B02211 |
0.518 |
|
| 2018 |
Bigelow S, Shen Y. Parametric computational analysis of indentation-induced shear band formation in metal-ceramic multilayer coatings Surface & Coatings Technology. 350: 779-787. DOI: 10.1016/J.Surfcoat.2018.04.055 |
0.369 |
|
| 2017 |
Bigelow S, Shen Y. Indentation-Induced Shear Band Formation in Thin-Film Multilayers Frontiers in Materials. 4. DOI: 10.3389/Fmats.2017.00025 |
0.364 |
|
| 2017 |
Yu C, Chu JP, Jia H, Shen Y, Gao Y, Liaw PK, Yokoyama Y. Influence of thin-film metallic glass coating on fatigue behavior of bulk metallic glass: Experiments and finite element modeling Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing. 692: 146-155. DOI: 10.1016/J.Msea.2017.03.071 |
0.377 |
|
| 2016 |
Chu JP, Yu CC, Tanatsugu Y, Yasuzawa M, Shen YL. Non-stick syringe needles: Beneficial effects of thin film metallic glass coating. Scientific Reports. 6: 31847. PMID 27573062 DOI: 10.1038/Srep31847 |
0.301 |
|
| 2016 |
Jamison RD, Shen YL. Indentation and overall compression behavior of multilayered thin-film composites: Effect of undulating layer geometry Journal of Composite Materials. 50: 507-521. DOI: 10.1177/0021998315576768 |
0.355 |
|
| 2016 |
Martinez NJ, Shen YL. Analysis of Indentation-Derived Power-Law Creep Response Journal of Materials Engineering and Performance. 1-8. DOI: 10.1007/S11665-016-1934-6 |
0.331 |
|
| 2014 |
Johnson RW, Shen Y. Analysis of misalignment-induced deformation in three-dimensional semiconductor chip stacks Microelectronics International. 31: 61-70. DOI: 10.1108/Mi-12-2013-0085 |
0.344 |
|
| 2012 |
Neidigk MA, Shen YL. Predicting the effect of underfill filler volume fraction on solder fatigue life and residual stress for surface mount components using nonlinear viscoelastic analyses Ieee Transactions On Components, Packaging and Manufacturing Technology. 2: 1492-1500. DOI: 10.1109/Tcpmt.2012.2206811 |
0.531 |
|
| 2012 |
Morusupalli R, Rao R, Lee TK, Shen YL, Kunz M, Tamura N, Budiman AS. Critical temperature shift for stress induced voiding in advanced Cu interconnects for 32 nm and beyond Ieee International Reliability Physics Symposium Proceedings. EM.8.1-EM.8.3. DOI: 10.1016/J.Proeng.2015.09.229 |
0.333 |
|
| 2012 |
Chu JP, Greene JE, Jang JSC, Huang JC, Shen YL, Liaw PK, Yokoyama Y, Inoue A, Nieh TG. Bendable bulk metallic glass: Effects of a thin, adhesive, strong, and ductile coating Acta Materialia. 60: 3226-3238. DOI: 10.1016/J.Actamat.2012.02.037 |
0.368 |
|
| 2008 |
Shen Y. On the Elastic Assumption for Copper Lines in Interconnect Stress Modeling Ieee Transactions On Device and Materials Reliability. 8: 600-607. DOI: 10.1109/Tdmr.2008.2002360 |
0.329 |
|
| 2007 |
Gouldstone A, Chollacoop N, Dao M, Li J, Minor AM, Shen YL. Indentation across size scales and disciplines: Recent developments in experimentation and modeling Acta Materialia. 55: 4015-4039. DOI: 10.1016/J.Actamat.2006.08.044 |
0.306 |
|
| 2006 |
Shen Y. Effects of Dielectric Thermal Expansion and Elastic Modulus on the Stress and Deformation Fields in Copper Interconnects Mrs Proceedings. 914. DOI: 10.1557/Proc-0914-F04-10 |
0.355 |
|
| 2006 |
Mulholland M, Khraishi T, Shen YL, Horstemeyer M. Void growth and interaction experiments: Implications to the optimal straining rate in superplastic forming International Journal of Plasticity. 22: 1728-1744. DOI: 10.1016/J.Ijplas.2006.02.004 |
0.311 |
|
| 2004 |
Yan L, Khraishi TA, Shen Y, Horstemeyer MF. A distributed-dislocation method for treating free-surface image stresses in three-dimensional dislocation dynamics simulations Modelling and Simulation in Materials Science and Engineering. 12: S289-S301. DOI: 10.1088/0965-0393/12/4/S01 |
0.331 |
|
| 2004 |
Khraishi TA, Yan L, Shen Y. Dynamic simulations of the interaction between dislocations and dilute particle concentrations in metal–matrix composites (MMCs) International Journal of Plasticity. 20: 1039-1057. DOI: 10.1016/J.Ijplas.2003.10.003 |
0.33 |
|
| 2003 |
Khraishi TA, Yan L, Shen Y. Modelling Strengthening Mechanisms in Solids Using Dislocation Dynamics Materials. 263-271. DOI: 10.1115/Imece2003-43180 |
0.327 |
|
| 1996 |
Shen Y, Suresh S, Bernstein JB. Laser linking of metal interconnects: analysis and design considerations Ieee Transactions On Electron Devices. 43: 402-410. DOI: 10.1109/16.485653 |
0.323 |
|
| 1993 |
Shen Y. An analysis of shear band formation in {100}〈011〉 textured f.c.c. metals Philosophical Magazine Letters. 67: 73-76. DOI: 10.1080/09500839308243854 |
0.317 |
|
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