Deli Liu, Ph.D. - Publications
Affiliations: | 2004 | Rensselaer Polytechnic Institute, Troy, NY, United States |
Area:
Condensed Matter Physics, Mechanical EngineeringYear | Citation | Score | |||
---|---|---|---|---|---|
2006 | Kim YS, Shin J, Cho JH, Ten Eyck GA, Liu DL, Pimanpang S, Lu TM, Senkevich JJ, Shin HS. Surface characterization of copper electroless deposition on atomic layer deposited palladium on iridium and tungsten Surface and Coatings Technology. 200: 5760-5766. DOI: 10.1016/J.Surfcoat.2005.08.142 | 0.603 | |||
2005 | Eyck GAT, Senkevich JJ, Tang F, Liu D, Pimanpang S, Karaback T, Wang GC, Lu TM, Jezewski C, Lanford WA. Plasma-assisted atomic layer deposition of palladium Chemical Vapor Deposition. 11: 60-66. DOI: 10.1002/Cvde.200306312 | 0.583 | |||
2004 | Jezewski C, Wiegand CJ, Ye D, Mallikarjunan A, Liu D, Jin C, Lanford WA, Wang GC, Senkevich JJ, Lu TM. Molecular Caulking: A pore sealing CVD polymer for ultralow k dielectrics Journal of the Electrochemical Society. 151. DOI: 10.1149/1.1751195 | 0.527 | |||
2003 | Liu DL, Ye DX, Khan F, Tang F, Lim BK, Picu RC, Wang GC, Lu TM. Mechanics of patterned helical Si springs on Si substrate. Journal of Nanoscience and Nanotechnology. 3: 492-5. PMID 15002128 DOI: 10.1166/jnn.2003.235 | 0.573 | |||
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