Jinshan Huo - Publications
Affiliations: | 2004 | Oregon Health and Science University, Portland, OR |
Year | Citation | Score | |||
---|---|---|---|---|---|
2005 | Huo J, Solanki R, McAndrew J. A novel electroplanarization system for replacement of CMP Electrochemical and Solid-State Letters. 8. DOI: 10.1149/1.1848292 | 0.468 | |||
2004 | Huo J, Solanki R, McAndrew J. Study of anodic layers and their effects on electropolishing of bulk and electroplated films of copper Journal of Applied Electrochemistry. 34: 305-314. DOI: 10.1023/B:Jach.0000015621.31360.14 | 0.521 | |||
2003 | Huo J, Solanki R, McAndrew J. Electrochemical Polishing of Copper for Microelectronic Applications Surface Engineering. 19: 11-16. DOI: 10.1179/026708402225010047 | 0.436 | |||
2002 | Huo J, Solanki R, McAndrew J. Characteristics of copper films produced via atomic layer deposition Journal of Materials Research. 17: 2394-2398. DOI: 10.1557/Jmr.2002.0350 | 0.498 | |||
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