Year |
Citation |
Score |
2020 |
Parker AS, Taylor LS, Beaudoin SP. The role of surface energy heterogeneity on crystal morphology during solid-state crystallization at the amorphous atazanavir–water interface Crystengcomm. 22: 3179-3187. DOI: 10.1039/C9Ce02007A |
0.339 |
|
2020 |
Stevenson MC, Beaudoin SP, Corti DS. Toward an Improved Method for Determining the Hamaker Constant of Solid Materials Using Atomic Force Microscopy. I. Quasi-Static Analysis for Arbitrary Surface Roughness The Journal of Physical Chemistry C. 124: 3014-3027. DOI: 10.1021/Acs.Jpcc.9B09669 |
0.396 |
|
2018 |
Jaiswal RP, Beaudoin SP. The London - van der Waals Force Field of a Chemically Patterned Surface to Enable Selective Adhesion. Langmuir : the Acs Journal of Surfaces and Colloids. PMID 30540192 DOI: 10.1021/Acs.Langmuir.8B03502 |
0.816 |
|
2018 |
Fronczak SG, Browne CA, Krenek EC, Beaudoin SP, Corti DS. Non-contact AFM measurement of the Hamaker constants of solids: Calibrating cantilever geometries. Journal of Colloid and Interface Science. 517: 213-220. PMID 29427887 DOI: 10.1016/J.Jcis.2018.01.108 |
0.412 |
|
2018 |
Fronczak SG, Thorpe JMN, Thomas MC, Cassidy MJ, Evans JL, Beaudoin SP. The number of measurements of a surface’s topography and the expected variation in adhesion to the surface Journal of Adhesion Science and Technology. 32: 2099-2110. DOI: 10.1080/01694243.2018.1461446 |
0.567 |
|
2018 |
Laster JS, Ezeamaku CD, Beaudoin SP, Boudouris BW. Impact of surface chemistry on the adhesion of an energetic small molecule to a conducting polymer surface Colloids and Surfaces a: Physicochemical and Engineering Aspects. 551: 74-80. DOI: 10.1016/J.Colsurfa.2018.04.040 |
0.423 |
|
2018 |
Hoss DJ, Mukherjee S, Boudouris BW, Beaudoin SP. Energetic Microparticle Adhesion to Functionalized Surfaces Propellants, Explosives, Pyrotechnics. 43: 862-868. DOI: 10.1002/Prep.201800060 |
0.399 |
|
2017 |
Fronczak SG, Dong J, Franses EI, Browne CA, Krenek EC, Beaudoin SP, Corti DS. Correction to "A New "Quasi-Dynamic" Method for Determining the Hamaker Constant of Solids using an Atomic Force Microscope". Langmuir : the Acs Journal of Surfaces and Colloids. PMID 28756674 DOI: 10.1021/Acs.Langmuir.7B02203 |
0.388 |
|
2017 |
Thomas MC, Beaudoin SP. An enhanced centrifuge-based approach to powder characterization: Experimental and theoretical determination of a size-dependent effective Hamaker constant distribution Powder Technology. 306: 96-102. DOI: 10.1016/J.Powtec.2016.10.017 |
0.444 |
|
2017 |
Hoss DJ, Boudouris BW, Beaudoin SP. Analyzing adhesion in microstructured systems through a robust computational approach Surface and Interface Analysis. 49: 1165-1170. DOI: 10.1002/Sia.6282 |
0.421 |
|
2016 |
Fronczak SG, Dong J, Browne CA, Krenek E, Franses EI, Beaudoin SP, Corti DS. A New "Quasi-Dynamic" Method for Determining the Hamaker Constant of Solids Using an Atomic Force Microscope. Langmuir : the Acs Journal of Surfaces and Colloids. PMID 28036189 DOI: 10.1021/Acs.Langmuir.6B04063 |
0.327 |
|
2016 |
Chaffee-Cipich MN, Hoss DJ, Sweat ML, Beaudoin SP. Contact between traps and surfaces during contact sampling of explosives in security settings. Forensic Science International. 260: 85-94. PMID 26836243 DOI: 10.1016/j.forsciint.2015.12.041 |
0.313 |
|
2016 |
Thomas M, Krenek E, Beaudoin S. Capillary Forces Described by Effective Contact Angle Distributions via Simulations of the Centrifuge Technique Mrs Advances. 1: 2237-2245. DOI: 10.1557/Adv.2016.516 |
0.603 |
|
2016 |
Harrison AJ, Beaudoin SP, Corti DS. Wang-Landau Monte Carlo simulation of capillary forces at low relative humidity in atomic force microscopy Journal of Adhesion Science and Technology. 30: 1165-1177. DOI: 10.1080/01694243.2016.1143581 |
0.423 |
|
2016 |
Sweat ML, Parker AS, Beaudoin SP. Compressive Behavior of Idealized Granules for the Simulation of Composition C-4 Propellants, Explosives, Pyrotechnics. 41: 855-863. DOI: 10.1002/Prep.201600036 |
0.369 |
|
2016 |
Laster JS, Deom NA, Beaudoin SP, Boudouris BW. Design of free-standing microstructured conducting polymer films for enhanced particle removal from non-uniform surfaces Journal of Polymer Science, Part B: Polymer Physics. 54: 1968-1974. DOI: 10.1002/Polb.24102 |
0.318 |
|
2015 |
Harrison AJ, Corti DS, Beaudoin SP. Capillary Forces in Nanoparticle Adhesion: A Review of AFM Methods Particulate Science and Technology. DOI: 10.1080/02726351.2015.1045641 |
0.399 |
|
2013 |
Harrison AJ, Bilgili EA, Beaudoin SP, Taylor LS. Atomic force microscope infrared spectroscopy of griseofulvin nanocrystals. Analytical Chemistry. 85: 11449-55. PMID 24171582 DOI: 10.1021/Ac4025889 |
0.359 |
|
2013 |
Zarate NV, Harrison AJ, Litster JD, Beaudoin SP. Effect of relative humidity on onset of capillary forces for rough surfaces. Journal of Colloid and Interface Science. 411: 265-72. PMID 24079555 DOI: 10.1016/J.Jcis.2013.05.048 |
0.689 |
|
2013 |
Chaffee-Cipich MN, Sturtevant BD, Beaudoin SP. Adhesion of explosives. Analytical Chemistry. 85: 5358-66. PMID 23510004 DOI: 10.1021/Ac302758N |
0.613 |
|
2013 |
Smith KM, Butterbaugh JW, Beaudoin SP. Effects of Coating Thickness on Particle Adhesion in Microelectronics-Based Systems Ecs Journal of Solid State Science and Technology. 2: P488-P491. DOI: 10.1149/2.025311Jss |
0.416 |
|
2012 |
Jaiswal RP, Beaudoin SP. Approximate scheme for calculating van der Waals interactions between finite cylindrical volume elements. Langmuir : the Acs Journal of Surfaces and Colloids. 28: 8359-70. PMID 22620674 DOI: 10.1021/La203987Q |
0.789 |
|
2012 |
Kilroy CM, Jaiswal RP, Beaudoin SP. Adhesion of contaminant particles to advanced photomask materials Ieee Transactions On Semiconductor Manufacturing. 25: 37-44. DOI: 10.1109/Tsm.2011.2176519 |
0.827 |
|
2012 |
Balachandran DK, Jallo LJ, Davé RN, Beaudoin SP. Adhesion of dry nano-coated microparticles to stainless steel: A physical interpretation Powder Technology. 226: 1-9. DOI: 10.1016/J.Powtec.2012.02.035 |
0.793 |
|
2011 |
Kishore V, Paderi JE, Akkus A, Smith KM, Balachandran D, Beaudoin S, Panitch A, Akkus O. Incorporation of a decorin biomimetic enhances the mechanical properties of electrochemically aligned collagen threads. Acta Biomaterialia. 7: 2428-36. PMID 21356334 DOI: 10.1016/J.Actbio.2011.02.035 |
0.733 |
|
2011 |
Jaiswal RP, Beaudoin SP. Nanoparticle adhesion models: Applications in particulate contaminant removal from extreme ultraviolet lithography photomasks Journal of Adhesion Science and Technology. 25: 781-797. DOI: 10.1163/016942410X511123 |
0.817 |
|
2011 |
Smith KM, Butterbaugh JW, Beaudoin SP. Effects of varying surface film thickness on particle adhesion in semiconductor material-based systems Ecs Transactions. 41: 243-250. DOI: 10.1149/1.3630850 |
0.326 |
|
2010 |
Farrell M, Beaudoin S. Surface forces and protein adsorption on dextran- and polyethylene glycol-modified polydimethylsiloxane. Colloids and Surfaces. B, Biointerfaces. 81: 468-75. PMID 20801620 DOI: 10.1016/J.Colsurfb.2010.07.059 |
0.494 |
|
2009 |
Jaiswal RP, Kumar G, Kilroy CM, Beaudoin SP. Modeling and validation of the van der Waals force during the adhesion of nanoscale objects to rough surfaces: a detailed description. Langmuir : the Acs Journal of Surfaces and Colloids. 25: 10612-23. PMID 19735133 DOI: 10.1021/La804275M |
0.827 |
|
2009 |
Kim BS, Beaudoin SP. Electrochemical analysis of surface films on copper in phosphoric acid, with a focus on planarization Journal of the Electrochemical Society. 156: H390-H395. DOI: 10.1149/1.3095461 |
0.324 |
|
2008 |
Kumar G, Smith S, Jaiswal R, Beaudoin S. Scaling of van der Waals and electrostatic adhesion interactions from the micro- to the nano-scale Journal of Adhesion Science and Technology. 22: 407-428. DOI: 10.1163/156856108X305714 |
0.822 |
|
2008 |
Kim BS, Tucker MH, Kelchner JD, Beaudoin SP. Study on the mechanical properties of CMP pads Ieee Transactions On Semiconductor Manufacturing. 21: 454-463. DOI: 10.1109/Tsm.2008.2001223 |
0.316 |
|
2007 |
Jaiswaf RP, Kilroy CM, Kumar G, Banerjee S, Beaudoin SP. Particle adhesion to photomask surfaces Ecs Transactions. 11: 465-469. DOI: 10.1149/1.2779411 |
0.374 |
|
2006 |
Eichenlaub S, Kumar G, Beaudoin S. A modeling approach to describe the adhesion of rough, asymmetric particles to surfaces. Journal of Colloid and Interface Science. 299: 656-64. PMID 16631774 DOI: 10.1016/J.Jcis.2006.03.010 |
0.59 |
|
2006 |
Visintin PM, Eichenlaub SK, Portnow LE, Carbonell RG, Beaudoin SP, Schauer CK, DeSimone JM. Studies on CO 2-based slurries and fluorinated silica and alumina particles for chemical mechanical polishing of copper films Journal of the Electrochemical Society. 153: G1064-G1071. DOI: 10.1149/1.2358085 |
0.551 |
|
2006 |
Kumar G, Beaudoin S. Undercut removal of micrometer-scale particles from surfaces Journal of the Electrochemical Society. 153: G175-G181. DOI: 10.1149/1.2149224 |
0.567 |
|
2005 |
Burdick GM, Berman NS, Beaudoin SP. Hydrodynamic particle removal from surfaces Thin Solid Films. 488: 116-123. DOI: 10.1016/J.Tsf.2005.04.112 |
0.523 |
|
2004 |
Castillo-Mejia D, Kelchner J, Beaudoin S. Polishing Pad Surface Morphology and Chemical Mechanical Planarization Journal of the Electrochemical Society. 151: G271-G278. DOI: 10.1149/1.1649751 |
0.349 |
|
2003 |
Burdick GM, Berman NS, Beaudoin SP. A Theoretical Evaluation of Hydrodynamic and Brush Contact Effects on Particle Removal during Brush Scrubbing Journal of the Electrochemical Society. 150: G658-G665. DOI: 10.1149/1.1605422 |
0.467 |
|
2003 |
Burdick GM, Berman NS, Beaudoin SP. A theoretical analysis of brush scrubbing following chemical mechanical polishing Journal of the Electrochemical Society. 150: G140-G147. DOI: 10.1149/1.1534098 |
0.503 |
|
2003 |
Castillo-Mejia D, Gold S, Burrows V, Beaudoin S. The effect of interactions between water and polishing pads on chemical mechanical polishing removal rates Journal of the Electrochemical Society. 150: G76-G82. DOI: 10.1149/1.1531973 |
0.406 |
|
2003 |
Pruden KG, Sinclair K, Beaudoin S. Characterization of parylene-N and parylene-C photooxidation Journal of Polymer Science, Part a: Polymer Chemistry. 41: 1486-1496. DOI: 10.1002/Pola.10681 |
0.335 |
|
2002 |
Eichenlaub S, Chan C, Beaudoin SP. Hamaker constants in integrated circuit metalization. Journal of Colloid and Interface Science. 248: 389-97. PMID 16290543 DOI: 10.1006/Jcis.2002.8241 |
0.532 |
|
2002 |
Cooper K, Eichenlaub S, Gupta A, Beaudoin S. Adhesion of alumina particles to thin films Journal of the Electrochemical Society. 149: G239-G244. DOI: 10.1149/1.1452122 |
0.49 |
|
2001 |
Cooper K, Gupta A, Beaudoin S. Simulation of the Adhesion of Particles to Surfaces. Journal of Colloid and Interface Science. 234: 284-292. PMID 11161514 DOI: 10.1006/Jcis.2000.7276 |
0.503 |
|
2001 |
Eichenlaub S, Cooper K, Gupta A, Beaudoin S. New insights into particle adhesion Solid State Phenomena. 76: 283-290. DOI: 10.4028/Www.Scientific.Net/Ssp.76-77.283 |
0.4 |
|
2001 |
Cooper K, Gupta A, Beaudoin S. Simulation of Particle Adhesion Implications in Chemical Mechanical Polishing and Post Chemical Mechanical Polishing Cleaning Journal of the Electrochemical Society. 148: G662-G667. DOI: 10.1149/1.1409975 |
0.513 |
|
2001 |
Burdick G, Berman N, Beaudoin S. Journal of Nanoparticle Research. 3: 453-465. DOI: 10.1023/A:1012593318108 |
0.436 |
|
2000 |
Cooper K, Ohler N, Gupta A, Beaudoin S. Analysis of Contact Interactions between a Rough Deformable Colloid and a Smooth Substrate. Journal of Colloid and Interface Science. 222: 63-74. PMID 10655126 DOI: 10.1006/Jcis.1999.6561 |
0.57 |
|
2000 |
Castillo-Mejia D, Perlov A, Beaudoin S. Qualitative prediction of SiO2 removal rates during chemical mechanical polishing Journal of the Electrochemical Society. 147: 4671-4675. DOI: 10.1149/1.1394121 |
0.351 |
|
1999 |
Wang D, Zutshi A, Bibby T, Beaudoin SP, Cale TS. Effects of carrier film physical properties on W CMP Thin Solid Films. 345: 278-283. DOI: 10.1016/S0040-6090(98)01486-2 |
0.314 |
|
1998 |
Zhang G, Burdick G, Dai F, Bibby T, Beaudoin S. Assessment of post-CMP cleaning mechanisms using statistically-designed experiments Thin Solid Films. 332: 379-384. DOI: 10.1016/S0040-6090(98)01038-4 |
0.375 |
|
1997 |
Srinivasa-Murthy C, Wang D, Beaudoin SP, Bibby T, Holland K, Cale TS. Stress distribution in chemical mechanical polishing Thin Solid Films. 308: 533-537. DOI: 10.1016/S0040-6090(97)00433-1 |
0.33 |
|
1996 |
Beaudoin SP, Carbonell RG, Grant CS. Dynamic and equilibrium phase behavior in the C12-E5-abietic acid-H2O system Journal of Colloid and Interface Science. 182: 465-472. DOI: 10.1006/Jcis.1996.0489 |
0.709 |
|
1995 |
Beaudoin SP, Grant CS, Carbonell RG. Removal of organic films from solid surfaces using aqueous solutions of nonionic surfactants. 2. Theory Industrial & Engineering Chemistry Research. 34: 3318-3325. DOI: 10.1021/Ie00037A018 |
0.709 |
|
1995 |
Beaudoin SP, Grant CS, Carbonell RG. Removal of organic films from solid surfaces using aqueous solutions of nonionic surfactants. 1. Experiments Industrial & Engineering Chemistry Research. 34: 3307-3317. DOI: 10.1021/Ie00037A017 |
0.731 |
|
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