☰

Robert K. Kinyanjui, Ph.D. - Publications

Affiliations: 
2005 State University of New York at Binghamton, Vestal, NY, United States 
Area:
Materials Science Engineering
Tree Info Similar researchers PubMed Report error

4 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2005 Lehman LP, Kinyanjui RK, Wang J, Xing Y, Zavalij L, Borgesen P, Cotts EJ. Microstructure and damage evolution in Sn-Ag-Cu solder joints Proceedings - Electronic Components and Technology Conference. 1: 674-681.  0.664
2004 Lehman LP, Athavale SN, Fullem TZ, Giamis AC, Kinyanjui RK, Lowenstein M, Mather K, Patel R, Rae D, Wang J, Xing Y, Zavalij L, Borgesen P, Cotts EJ. Growth of Sn and intermetallic compounds in Sn-Ag-Cu solder Journal of Electronic Materials. 33: 1429-1439. DOI: 10.1007/S11664-004-0083-0  0.379
2003 Lehman LP, Kinyanjui RK, Zavalij L, Zribi A, Cotts EJ. Growth and selection of intermetallic species in Sn-Ag-Cu No-Pb solder systems based on pad metallurgies and thermal histories Proceedings - Electronic Components and Technology Conference. 1215-1221.  0.736
2002 Kinyanjui RK, Zribi A, Cotts EJ. Effects of reflow conditions on the formation of Au-Ni-Sn compounds at the interface of Au-Pb-Sn and Au-Sn solder joints with Ni substrate Proceedings - Electronic Components and Technology Conference. 161-167.  0.65
Show low-probability matches.