Gang Feng, Ph.D. - Publications

Affiliations: 
2006 Stanford University, Palo Alto, CA 
Area:
materials science

17 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2018 Khare HS, Lahouij I, Jackson A, Feng G, Chen Z, Cooper G, Carpick RW. Nanoscale Generation of Robust Solid Films from Liquid Dispersed Nanoparticles via In-situ Atomic Force Microscopy: Growth Kinetics and Nanomechanical Properties. Acs Applied Materials & Interfaces. PMID 30335945 DOI: 10.1021/Acsami.8B16680  0.304
2016 Jung JY, Qaiser N, Feng G, Hwang BI, Kim T, Kim JH, Han SM. Size-dependent hardness of five-fold twin structured Ag nanowires. Physical Chemistry Chemical Physics : Pccp. PMID 27966698 DOI: 10.1039/C6Cp07424C  0.544
2015 Zhang D, Xu Y, Feng G, Huang YR, Lee D. Comparing sintering and atomic layer deposition as methods to mechanically reinforce nanocolloidal crystals Journal of Materials Research. 30: 3717-3727. DOI: 10.1557/Jmr.2015.347  0.314
2015 Zhang D, Zhang L, Lee D, Cheng X, Feng G. Suppressing unstable deformation of nanocolloidal crystals with atomic layer deposition Materials Science and Engineering A. 639: 514-518. DOI: 10.1016/J.Msea.2015.04.061  0.312
2015 Cho Y, Lee SY, Ellerthorpe L, Feng G, Lin G, Wu G, Yin J, Yang S. Elastoplastic Inverse Opals as Power-Free Mechanochromic Sensors for Force Recording Advanced Functional Materials. 25: 6041-6049. DOI: 10.1002/Adfm.201502774  0.312
2014 Brugarolas T, Gianola DS, Zhang L, Campbell GM, Bassani JL, Feng G, Lee D. Tailoring and understanding the mechanical properties of nanoparticle-shelled bubbles. Acs Applied Materials & Interfaces. 6: 11558-72. PMID 24956417 DOI: 10.1021/Am502290H  0.305
2014 He MR, Felfer PJ, Dasgupta S, Samudrala SK, Malone PJ, Feng G, Hemker KJ, Cairney JM, Gianola DS. Understanding the mechanical behavior of nanocrystalline Al-O thin films with complex microstructures Acta Materialia. 77: 269-283. DOI: 10.1016/J.Actamat.2014.05.058  0.523
2013 Min Han S, Feng G, Young Jung J, Joon Jung H, Groves JR, Nix WD, Cui Y. Critical-temperature/Peierls-stress dependent size effects in body centered cubic nanopillars Applied Physics Letters. 102. DOI: 10.1063/1.4776658  0.464
2012 Zhang L, Prosser JH, Feng G, Lee D. Mechanical properties of atomic layer deposition-reinforced nanoparticle thin films. Nanoscale. 4: 6543-52. PMID 22968288 DOI: 10.1039/C2Nr32016A  0.317
2012 Askari D, Feng G. Finite element analysis of nanowire indentation on a flat substrate Journal of Materials Research. 27: 586-591. DOI: 10.1557/Jmr.2011.420  0.329
2009 Feng G, Qu S, Huang Y, Nix WD. A quantitative analysis for the stress field around an elastoplastic indentation/contact Journal of Materials Research. 24: 704-718. DOI: 10.1557/Jmr.2009.0097  0.471
2007 Nix WD, Greer JR, Feng G, Lilleodden ET. Deformation at the nanometer and micrometer length scales: Effects of strain gradients and dislocation starvation Thin Solid Films. 515: 3152-3157. DOI: 10.1016/J.Tsf.2006.01.030  0.68
2007 Feng G, Qu S, Huang Y, Nix WD. An analytical expression for the stress field around an elastoplastic indentation/contact Acta Materialia. 55: 2929-2938. DOI: 10.1016/J.Actamat.2006.12.030  0.446
2006 Feng G, Nix WD, Yoon Y, Lee CJ. A study of the mechanical properties of nanowires using nanoindentation Journal of Applied Physics. 99. DOI: 10.1063/1.2189020  0.49
2006 Huang Y, Zhang F, Hwang KC, Nix WD, Pharr GM, Feng G. A model of size effects in nano-indentation Journal of the Mechanics and Physics of Solids. 54: 1668-1686. DOI: 10.1016/J.Jmps.2006.02.002  0.516
2004 O'Hayre R, Feng G, Nix WD, Prinz FB. Quantitative Impedance measurement using atomic force microscopy Journal of Applied Physics. 96: 3540-3549. DOI: 10.1063/1.1778217  0.454
2004 Feng G, Nix WD. Indentation size effect in MgO Scripta Materialia. 51: 599-603. DOI: 10.1016/J.Scriptamat.2004.05.034  0.495
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