Rajiv C. Dunne, Ph.D.
Affiliations: | 2000 | Georgia Institute of Technology, Atlanta, GA |
Area:
Mechanical EngineeringGoogle:
"Rajiv Dunne"Parents
Sign in to add mentor| Suresh Sitaraman | grad student | 2000 | Georgia Tech | |
| (An integrated process modeling methodology and module for sequential multilayered high -density substrate fabrication for microelectronic packages.) | ||||
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Publications
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| Dunne RC, Sitaraman SK. (2002) An integrated process modeling methodology and module for sequential multilayered substrate fabrication using a coupled cure-thermal-stress analysis approach Ieee Transactions On Electronics Packaging Manufacturing. 25: 326-334 |
| Dunne RC, Sitaraman SK, Luo S, et al. (2002) Cure kinetics modeling and process optimization of the ViaLux 81 epoxy photodielectric dry film (PDDF) material for microvia applications Journal of Applied Polymer Science. 84: 691-700 |
| Dunne RC, Sitaraman SK, Luo S, et al. (2001) Thermal and mechanical characterization of ViaLux™ 81: A novel epoxy photo-dielectric dry film (PDDF) for microvia applications Ieee Transactions On Components and Packaging Technologies. 24: 436-444 |
| Dunne RC, Sitaraman SK, Luo S, et al. (2000) Investigation of the curing behavior of a novel epoxy photo-dielectric dry film (ViaLuxTM 81) for high density interconnect applications Journal of Applied Polymer Science. 78: 430-437 |
| Dunne RC, Sitaraman SK. (1997) Warpage and Interfacial Stress Distribution in a Single-Level Integrated Module (SLIM) Journal of Electronic Packaging, Transactions of the Asme. 119: 197-203 |
| Dunne RC, Smith K, Sitaraman SK. (1997) Thermo-mechanical behavior of vias in HDI structures American Society of Mechanical Engineers, Eep. 19: 1305-1310 |