☰

Rajiv C. Dunne, Ph.D. - Publications

Affiliations: 
2000 Georgia Institute of Technology, Atlanta, GA 
Area:
Mechanical Engineering
Tree Info Similar researchers PubMed Report error

6 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2002 Dunne RC, Sitaraman SK. An integrated process modeling methodology and module for sequential multilayered substrate fabrication using a coupled cure-thermal-stress analysis approach Ieee Transactions On Electronics Packaging Manufacturing. 25: 326-334. DOI: 10.1109/TEPM.2002.807733  0.55
2002 Dunne RC, Sitaraman SK, Luo S, Wong CP, Estes WE, Periyasamy M. Cure kinetics modeling and process optimization of the ViaLux 81 epoxy photodielectric dry film (PDDF) material for microvia applications Journal of Applied Polymer Science. 84: 691-700. DOI: 10.1002/App.2345  0.483
2001 Dunne RC, Sitaraman SK, Luo S, Wong CP, Estes WE, Periyasamy M, Coburn J. Thermal and mechanical characterization of ViaLux™ 81: A novel epoxy photo-dielectric dry film (PDDF) for microvia applications Ieee Transactions On Components and Packaging Technologies. 24: 436-444. DOI: 10.1109/6144.946491  0.505
2000 Dunne RC, Sitaraman SK, Luo S, Rao Y, Wong CP, Estes WE, Gonzalez CG, Coburn JC, Periyasamy M. Investigation of the curing behavior of a novel epoxy photo-dielectric dry film (ViaLuxTM 81) for high density interconnect applications Journal of Applied Polymer Science. 78: 430-437. DOI: 10.1002/1097-4628(20001010)78:2<430::Aid-App230>3.0.Co;2-G  0.512
1997 Dunne RC, Sitaraman SK. Warpage and Interfacial Stress Distribution in a Single-Level Integrated Module (SLIM) Journal of Electronic Packaging, Transactions of the Asme. 119: 197-203. DOI: 10.1115/1.2792234  0.474
1997 Dunne RC, Smith K, Sitaraman SK. Thermo-mechanical behavior of vias in HDI structures American Society of Mechanical Engineers, Eep. 19: 1305-1310.  0.322
Show low-probability matches.