Pedro O. Quintero, Ph.D.
Affiliations: | 2008 | Mechanical Engineering | University of Maryland, College Park, College Park, MD |
Area:
Mechanical EngineeringGoogle:
"Pedro Quintero"Parents
Sign in to add mentor| F Patrick McCluskey | grad student | 2008 | University of Maryland | |
| (Development of a shifting melting point silver-indium paste via Transient Liquid Phase Sintering for high temperature environments.) | ||||
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Publications
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| Báez R, González LE, Jesús-López MXd, et al. (2020) Metallic Phase Change Material's Microstructural Stability Under Repetitive Melting/Solidification Cycles Journal of Electronic Packaging. 142 |
| Gonzalez-Nino D, Boteler LM, Ibitayo D, et al. (2018) Experimental evaluation of metallic phase change materials for thermal transient mitigation International Journal of Heat and Mass Transfer. 116: 512-519 |
| Quintero P, McCluskey P, Koene B. (2014) Thermomechanical reliability of a silver nano-colloid die attach for high temperature applications Microelectronics Reliability. 54: 220-225 |
| Diaz AJ, Ma D, Zinn A, et al. (2013) Tin Nanoparticle-Based Solder Paste for Low Temperature Processing Journal of Microelectronics and Electronic Packaging. 10: 129-137 |
| Rodriguez RI, Ibitayo D, Quintero PO. (2013) Thermal stability characterization of the Au-Sn bonding for high-temperature applications Ieee Transactions On Components, Packaging and Manufacturing Technology. 3: 549-557 |
| Rodriguez RI, Ibitayo D, Quintero PO. (2013) Kinetics of dissolution and isothermal solidification for gold-enriched solid-liquid interdiffusion (SLID) bonding Journal of Electronic Materials. 42: 2677-2685 |
| Molina M, Velasco A, Otaiio W, et al. (2012) Pressureless sintering progression of a silver nanoparticle attach material via micrographic analysis Proceedings - Imaps International Conference and Exhibition On High Temperature Electronics, Hitec 2012. 135-142 |
| Rodriguez RI, Ibitayo D, Quintero PO. (2011) High temperature die attach by low temperature solid-liquid interdiffusion Asme 2011 Pacific Rim Technical Conference and Exhibition On Packaging and Integration of Electronic and Photonic Systems, Interpack 2011. 1: 9-17 |
| Quintero PO, McCluskey FP. (2011) Temperature cycling reliability of high-temperature lead-free die-attach technologies Ieee Transactions On Device and Materials Reliability. 11: 531-539 |
| Quintero PO, Valentín R, Ma D. (2010) Pb-free synthesis: Decision matrix as a tool for alloy selection Journal of Microelectronics and Electronic Packaging. 7: 25-34 |