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Sheldon X.-D. Tan

Affiliations: 
Electrical Engineering University of California, Riverside, Riverside, CA, United States 
Area:
Electronics and Electrical Engineering
Website:
https://www.engr.ucr.edu/people/sheldontan.html
Google:
"Sheldon X.-D. Tan"
Bio:

https://intra.ece.ucr.edu/~stan/main/
https://scholar.google.com/citations?user=ugsbzTsAAAAJ&hl=en

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Parents

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Chuan-Jin Richard Shi grad student 1999 University of Iowa (Computer Science Tree)
 (Symbolic analysis of large analog circuits with determinant decision diagrams.)

Children

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Junjie Yang grad student 2005 UC Riverside
Jeffrey Fan grad student 2007 UC Riverside
Hang Li grad student 2007 UC Riverside
Ning Mi grad student 2009 UC Riverside
Duo Li grad student 2010 UC Riverside
Ruijing Shen grad student 2011 UC Riverside
Hai Wang grad student 2012 UC Riverside
Xue-Xin Liu grad student 2013 UC Riverside
Zao Liu grad student 2014 UC Riverside
Taeyoung Kim grad student 2013-2017 UC Riverside

Collaborators

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Publications

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Wang H, Guo X, Tan SX, et al. (2020) Leakage-Aware Predictive Thermal Management for Multicore Systems Using Echo State Network Ieee Transactions On Computer-Aided Design of Integrated Circuits and Systems. 39: 1400-1413
Wang H, Tang D, Zhang M, et al. (2019) GDP: A Greedy Based Dynamic Power Budgeting Method for Multi/Many-Core Systems in Dark Silicon Ieee Transactions On Computers. 68: 526-541
Wang S, Kim T, Sun Z, et al. (2018) Recovery-Aware Proactive TSV Repair for Electromigration Lifetime Enhancement in 3-D ICs Ieee Transactions On Very Large Scale Integration (Vlsi) Systems. 26: 531-543
Peng S, Zhou H, Kim T, et al. (2018) Physics-Based Compact TDDB Models for Low- $k$ BEOL Copper Interconnects With Time-Varying Voltage Stressing Ieee Transactions On Very Large Scale Integration (Vlsi) Systems. 26: 239-248
Wang H, Wan J, Tan SX, et al. (2018) A Fast Leakage-Aware Full-Chip Transient Thermal Estimation Method Ieee Transactions On Computers. 67: 617-630
Kim T, Tan SX, Cook C, et al. (2018) Detection of counterfeited ICs via on-chip sensor and post-fabrication authentication policy Integration. 63: 31-40
Tan SX, Amrouch H, Kim T, et al. (2018) Recent advances in EM and BTI induced reliability modeling, analysis and optimization (invited) Integration. 60: 132-152
Kim T, Liu Z, Tan SX. (2018) Dynamic reliability management based on resource-based EM modeling for multi-core microprocessors Microelectronics Journal. 74: 106-115
Kim T, Sun Z, Chen H, et al. (2017) Energy and Lifetime Optimizations for Dark Silicon Manycore Microprocessor Considering Both Hard and Soft Errors Ieee Transactions On Very Large Scale Integration (Vlsi) Systems. 25: 2561-2574
Chen H, Tan SX, Peng J, et al. (2017) Analytical Modeling of Electromigration Failure for VLSI Interconnect Tree Considering Temperature and Segment Length Effects Ieee Transactions On Device and Materials Reliability. 17: 653-666
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