Aaron E. Pedigo, Ph.D.
Affiliations: | 2011 | Materials Engineering | Purdue University, West Lafayette, IN, United States |
Area:
Materials Science EngineeringGoogle:
"Aaron Pedigo"Parents
Sign in to add mentor| Carol A. Handwerker | grad student | 2011 | Purdue | |
| (The influence of the effective physical properties of tin electrodeposited films on the growth of tin whiskers.) | ||||
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| Sarobol P, Chen W, Pedigo AE, et al. (2013) Effects of local grain misorientation and β-Sn elastic anisotropy on whisker and hillock formation – CORRIGENDUM Journal of Materials Research. 28: 785-785 |
| Sarobol P, Chen WH, Pedigo AE, et al. (2013) Effects of local grain misorientation and β-Sn elastic anisotropy on whisker and hillock formation Journal of Materials Research. 28: 747-756 |
| Sarobol P, Wang Y, Chen WH, et al. (2013) A predictive model for whisker formation based on local microstructure and grain boundary properties Jom. 65: 1350-1361 |
| Sarobol P, Pedigo A, Koppes J, et al. (2011) Whisker Formation and Stress Relaxation in Tin Thin Films Microscopy and Microanalysis. 17: 1846-1847 |
| Sarobol P, Pedigo AE, Su P, et al. (2010) Defect morphology and texture in Sn, Sn-Cu, and Sn-Cu-Pb electroplated films Ieee Transactions On Electronics Packaging Manufacturing. 33: 159-164 |
| Pedigo AE, Handwerker CA, Blendell JE. (2008) Whiskers, hillocks, and film stress evolution in electroplated sn and Sn-Cu films Proceedings - Electronic Components and Technology Conference. 1498-1504 |