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Aaron E. Pedigo, Ph.D. - Publications

Affiliations: 
2011 Materials Engineering Purdue University, West Lafayette, IN, United States 
Area:
Materials Science Engineering
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6 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2013 Sarobol P, Chen W, Pedigo AE, Su P, Blendell JE, Handwerker CA. Effects of local grain misorientation and β-Sn elastic anisotropy on whisker and hillock formation – CORRIGENDUM Journal of Materials Research. 28: 785-785. DOI: 10.1557/Jmr.2013.15  0.713
2013 Sarobol P, Chen WH, Pedigo AE, Su P, Blendell JE, Handwerker CA. Effects of local grain misorientation and β-Sn elastic anisotropy on whisker and hillock formation Journal of Materials Research. 28: 747-756. DOI: 10.1557/Jmr.2012.430  0.719
2013 Sarobol P, Wang Y, Chen WH, Pedigo AE, Koppes JP, Blendell JE, Handwerker CA. A predictive model for whisker formation based on local microstructure and grain boundary properties Jom. 65: 1350-1361. DOI: 10.1007/S11837-013-0717-X  0.645
2011 Sarobol P, Pedigo A, Koppes J, Wang Y, Chen W, Su P, Blendell J, Handwerker C. Whisker Formation and Stress Relaxation in Tin Thin Films Microscopy and Microanalysis. 17: 1846-1847. DOI: 10.1017/S1431927611010105  0.614
2010 Sarobol P, Pedigo AE, Su P, Blendell JE, Handwerker CA. Defect morphology and texture in Sn, Sn-Cu, and Sn-Cu-Pb electroplated films Ieee Transactions On Electronics Packaging Manufacturing. 33: 159-164. DOI: 10.1109/Tepm.2010.2046172  0.732
2008 Pedigo AE, Handwerker CA, Blendell JE. Whiskers, hillocks, and film stress evolution in electroplated sn and Sn-Cu films Proceedings - Electronic Components and Technology Conference. 1498-1504. DOI: 10.1109/ECTC.2008.4550174  0.753
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