Year |
Citation |
Score |
2016 |
Lin S, Zheng X, Yao J, Djordjevic SS, Cunningham JE, Lee JH, Shubin I, Luo Y, Bovington J, Lee DY, Thacker HD, Raj K, Krishnamoorthy AV. Efficient, tunable flip-chip-integrated III-V/Si hybrid external-cavity laser array. Optics Express. 24: 21454-21462. PMID 27661885 DOI: 10.1364/Oe.24.021454 |
0.451 |
|
2016 |
Lee DY, Zheng X, Yao J, Luo Y, Lee JH, Lin S, Thacker H, Bovington J, Shubin I, Djordjevic SS, Cunningham JE, Raj K, Krishnamoorthy AV. Error-free operation of a polarization-insensitive 4λ x 25 Gbps silicon photonic WDM receiver with closed-loop thermal stabilization of Si microrings. Optics Express. 24: 13204-13209. PMID 27410337 DOI: 10.1364/Oe.24.013204 |
0.33 |
|
2016 |
Zhang C, Yang HS, Thacker HD, Shubin I, Cunningham JE, Bakir MS. Mechanically Flexible Interconnects With Contact Tip for Rematable Heterogeneous System Integration Ieee Transactions On Components, Packaging and Manufacturing Technology. 6: 1587-1594. DOI: 10.1109/Tcpmt.2016.2614997 |
0.582 |
|
2016 |
Luo Y, Zheng X, Lin S, Yao J, Thacker H, Shubin I, Cunningham JE, Lee JH, Djordjevic SS, Bovington J, Lee DY, Raj K, Krishnamoorthy AV. A Process-Tolerant Ring Modulator Based on Multi-Mode Waveguides Ieee Photonics Technology Letters. 28: 1391-1394. DOI: 10.1109/Lpt.2016.2544138 |
0.394 |
|
2016 |
Zheng X, Shubin I, Lee J, Lin S, Luo Y, Yao J, Djordjevic SS, Bovington J, Lee DY, Thacker HD, Zhang C, Raj K, Cunningham JE, Krishnamoorthy AV. III-V/Si Hybrid Laser Arrays Using Back End of the Line (BEOL) Integration Ieee Journal of Selected Topics in Quantum Electronics. 22: 204-217. DOI: 10.1109/Jstqe.2016.2593100 |
0.405 |
|
2016 |
Shubin I, Yao J, Lee JH, Djordjevic SS, Bovington J, Zhang C, Thacker H, Lin S, Lee D, Luo Y, Raj K, Cunningham JE, Krishnamoorthy AV, Zheng X. Hybrid III-V/SOI Optoelectronic Laser Module Proceedings - Electronic Components and Technology Conference. 2016: 1069-1074. DOI: 10.1109/ECTC.2016.297 |
0.317 |
|
2015 |
Shubin I, Zheng X, Thacker H, Djordjevic SS, Lin S, Amberg P, Yao J, Lexau J, Chang E, Liu F, Park N, Raj K, Ho R, Cunningham JE, Krishnamoorthy AV. Microring-based multi-chip WDM photonic module. Optics Express. 23: 13172-84. PMID 26074570 DOI: 10.1364/Oe.23.013172 |
0.452 |
|
2015 |
Thacker HD, Zheng X, Lexau J, Shafiiha R, Shubin I, Lin S, Djordjevic S, Amberg P, Chang E, Liu F, Simons J, Lee JH, Abed A, Liang H, Luo Y, et al. An all-solid-state, WDM silicon photonic digital link for chip-to-chip communications. Optics Express. 23: 12808-22. PMID 26074535 DOI: 10.1364/Oe.23.012808 |
0.385 |
|
2015 |
Thacker HD, Shafiiha R, Lexau J, Zheng X, Djordjevic SS, Lin S, Simons J, Abed A, Amberg P, Chang E, Shubin I, Lee JH, Luo Y, Yao J, Liu F, et al. Hybrid integration and packaging of an energy-efficient WDM silicon photonic chip-to-chip interconnect Proceedings - Electronic Components and Technology Conference. 2015: 762-767. DOI: 10.1109/ECTC.2015.7159678 |
0.317 |
|
2014 |
Zheng X, Chang E, Amberg P, Shubin I, Lexau J, Liu F, Thacker H, Djordjevic SS, Lin S, Luo Y, Yao J, Lee JH, Raj K, Ho R, Cunningham JE, et al. A high-speed, tunable silicon photonic ring modulator integrated with ultra-efficient active wavelength control. Optics Express. 22: 12628-33. PMID 24921379 DOI: 10.1364/Oe.22.012628 |
0.418 |
|
2014 |
Krishnamoorthy AV, Zheng X, Feng D, Lexau J, Buckwalter JF, Thacker HD, Liu F, Luo Y, Chang E, Amberg P, Shubin I, Djordjevic SS, Lee JH, Lin S, Liang H, et al. A low-power, high-speed, 9-channel germanium-silicon electro-absorption modulator array integrated with digital CMOS driver and wavelength multiplexer. Optics Express. 22: 12289-95. PMID 24921347 DOI: 10.1364/Oe.22.012289 |
0.412 |
|
2014 |
Lee JH, Shubin I, Yao J, Bickford J, Luo Y, Lin S, Djordjevic SS, Thacker HD, Cunningham JE, Raj K, Zheng X, Krishnamoorthy AV. High power and widely tunable Si hybrid external-cavity laser for power efficient Si photonics WDM links. Optics Express. 22: 7678-85. PMID 24718143 DOI: 10.1364/Oe.22.007678 |
0.37 |
|
2014 |
Krishnamoorthy AV, Zheng X, Feng D, Lexau J, Buckwalter JF, Thacker HD, Liu F, Luo Y, Chang E, Amberg P, Shubin I, Djordjevic SS, Lee JH, Lin S, Liang H, et al. A low-power, high-speed, 9-channel germaniumsilicon electro-absorption modulator array integrated with digital CMOS driver and wavelength multiplexer Optics Express. 22: 12289-12295. DOI: 10.1364/OE.22.012289 |
0.323 |
|
2013 |
Lin S, Djordjevic SS, Cunningham JE, Shubin I, Luo Y, Yao J, Li G, Thacker H, Lee JH, Raj K, Zheng X, Krishnamoorthy AV. Vertical-coupled high-efficiency tunable III-V- CMOS SOI hybrid external-cavity laser. Optics Express. 21: 32425-31. PMID 24514836 DOI: 10.1364/Oe.21.032425 |
0.301 |
|
2013 |
Lin S, Djordjevic SS, Cunningham JE, Shubin I, Luo Y, Yao J, Li G, Thacker H, Lee JH, Raj K, Zheng X, Krishnamoorthy AV. Vertical-coupled high-efficiency tunable III-VCMOS SOI hybrid external-cavity laser Optics Express. 21: 32425-32431. DOI: 10.1364/OE.21.032425 |
0.364 |
|
2013 |
Yao J, Shubin I, Zheng X, Li G, Luo Y, Thacker H, Lee JH, Bickford J, Raj K, Cunningham JE, Krishnamoorthy AV. Low loss optical interlayer coupling using reflector-enhanced grating couplers 2013 Optical Interconnects Conference, Oi 2013. 31-32. DOI: 10.1109/OIC.2013.6552909 |
0.334 |
|
2013 |
Ho R, Amberg P, Chang E, Koka P, Lexau J, Li G, Liu FY, Schwetman H, Shubin I, Thacker HD, Zheng X, Cunningham JE, Krishnamoorthy AV. Silicon photonic interconnects for large-scale computer systems Ieee Micro. 33: 68-78. DOI: 10.1109/Mm.2012.91 |
0.443 |
|
2013 |
Li G, Krishnamoorthy AV, Shubin I, Yao J, Luo Y, Thacker H, Zheng X, Raj K, Cunningham JE. Ring resonator modulators in silicon for interchip photonic links Ieee Journal On Selected Topics in Quantum Electronics. 19. DOI: 10.1109/Jstqe.2013.2278885 |
0.434 |
|
2013 |
Zheng X, Lin S, Luo Y, Yao J, Li G, Djordjevic SS, Lee JH, Thacker HD, Shubin I, Raj K, Cunningham JE, Krishnamoorthy AV. Efficient WDM laser sources towards terabyte/s silicon photonic interconnects Journal of Lightwave Technology. 31: 4142-4154. DOI: 10.1109/Jlt.2013.2288917 |
0.439 |
|
2013 |
Shubin I, Chow EM, Chow A, De Bruyker D, Thacker HD, Fujimoto K, Raj K, Krishnamoorthy AV, Mitchell JG, Cunningham JE. Package demonstration of an interposer with integrated TSVs and flexible compliant interconnects Proceedings - Electronic Components and Technology Conference. 329-333. DOI: 10.1109/ECTC.2013.6575591 |
0.371 |
|
2013 |
Lexau J, Zheng X, Chang E, Shubin I, Li G, Luo Y, Yao J, Thacker H, Lee JH, Liu F, Amberg P, Raj K, Cunningham JE, Krishnamoorthy AV, Ho R. Design considerations for a 33mW, 12.5 Gbps × 8 channel silicon photonic transmitter array Proceedings of the 2013 Ieee Asian Solid-State Circuits Conference, a-Sscc 2013. 37-40. DOI: 10.1109/ASSCC.2013.6690976 |
0.333 |
|
2012 |
Li G, Luo Y, Zheng X, Masini G, Mekis A, Sahni S, Thacker H, Yao J, Shubin I, Raj K, Cunningham JE, Krishnamoorthy AV. Improving CMOS-compatible Germanium photodetectors. Optics Express. 20: 26345-50. PMID 23187489 DOI: 10.1364/Oe.20.026345 |
0.355 |
|
2012 |
Li G, Yao J, Thacker H, Mekis A, Zheng X, Shubin I, Luo Y, Lee JH, Raj K, Cunningham JE, Krishnamoorthy AV. Ultralow-loss, high-density SOI optical waveguide routing for macrochip interconnects. Optics Express. 20: 12035-9. PMID 22714189 DOI: 10.1364/Oe.20.012035 |
0.472 |
|
2012 |
Zheng X, Luo Y, Li G, Shubin I, Thacker H, Yao J, Raj K, Cunningham JE, Krishnamoorthy AV. Enhanced optical bistability from self-heating due to free carrier absorption in substrate removed silicon ring modulators. Optics Express. 20: 11478-86. PMID 22565767 DOI: 10.1364/Oe.20.011478 |
0.442 |
|
2012 |
Luo Y, Zheng X, Li G, Shubin I, Thacker H, Yao J, Lee JH, Feng D, Fong J, Kung CC, Liao S, Shafiiha R, Asghari M, Raj K, Krishnamoorthy AV, et al. Strong electro-absorption in GeSi epitaxy on silicon-on-insulator (SOI) Micromachines. 3: 345-363. DOI: 10.3390/Mi3020345 |
0.4 |
|
2012 |
Zheng X, Luo Y, Li G, Shubin I, Thacker H, Yao J, Raj K, Cunningham JE, Krishnamoorthy AV. Enhanced optical bistability from self-heating due to free carrier absorption in substrate removed silicon ring modulators Optics Express. 20: 11478-11486. DOI: 10.1364/OE.20.011478 |
0.35 |
|
2012 |
Yao J, Zheng X, Shubin I, Li G, Thacker H, Luo Y, Lee JH, Raj K, Cunningham JE, Krishnamoorthy AV. Optical interlayer coupling design for optical interconnects based on mirror enhanced grating couplers 2012 Optical Interconnects Conference, Oic 2012. 27-28. DOI: 10.1109/OIC.2012.6224464 |
0.337 |
|
2012 |
Zheng X, Luo Y, Lexau J, Liu F, Li G, Thacker HD, Shubin I, Yao J, Ho R, Cunningham JE, Krishnamoorthy AV. 2-pJ/bit (On-Chip) 10-Gb/s digital CMOS silicon photonic link Ieee Photonics Technology Letters. 24: 1260-1262. DOI: 10.1109/Lpt.2012.2200885 |
0.398 |
|
2012 |
Zheng X, Liu F, Lexau J, Patil D, Li G, Luo Y, Thacker HD, Shubin I, Yao J, Raj K, Ho R, Cunningham JE, Krishnamoorthy AV. Ultralow power 80 Gb/s arrayed CMOS silicon photonic transceivers for WDM optical links Journal of Lightwave Technology. 30: 641-650. DOI: 10.1109/Jlt.2011.2179287 |
0.461 |
|
2012 |
Li G, Zheng X, Thacker H, Yao J, Luo Y, Shubin I, Raj K, Cunningham JE, Krishnamoorthy AV. 40 Gb/s thermally tunable CMOS ring modulator Ieee International Conference On Group Iv Photonics Gfp. DOI: 10.1109/GROUP4.2012.6324190 |
0.304 |
|
2012 |
Luo Y, Li G, Zheng X, Yao J, Thacker H, Lee JH, Cunningham JE, Raj K, Krishnamoorthy AV. Low-loss low-crosstalk silicon rib waveguide crossing with tapered multimode-interference design Ieee International Conference On Group Iv Photonics Gfp. 150-152. DOI: 10.1109/GROUP4.2012.6324116 |
0.301 |
|
2012 |
Cunningham JE, Shubin I, Thacker HD, Lee JH, Li G, Zheng X, Lexau J, Ho R, Mitchell JG, Luo Y, Yao J, Raj K, Krishnamoorthy AV. Scaling hybrid-integration of silicon photonics in Freescale 130nm to TSMC 40nm-CMOS VLSI drivers for low power communications Proceedings - Electronic Components and Technology Conference. 1518-1525. DOI: 10.1109/ECTC.2012.6249037 |
0.377 |
|
2012 |
Shubin I, Chow EM, Chow A, Thacker HD, DebBruyker D, Fujimoto K, Raj K, Krishnamoorthy AV, Mitchell JG, Cunningham JE. Integrating through-silicon vias with solder free, compliant interconnects for novel, large area interposers Proceedings - Electronic Components and Technology Conference. 263-267. DOI: 10.1109/ECTC.2012.6248838 |
0.362 |
|
2012 |
Shubin I, Li G, Zheng X, Luo Y, Thacker H, Yao J, Park N, Krishnamoorthy AV, Cunningham JE. Integration, processing and performance of low power thermally tunable CMOS-SOI WDM resonators Optical and Quantum Electronics. 44: 589-604. DOI: 10.1007/S11082-012-9577-9 |
0.461 |
|
2012 |
Zheng X, Luo Y, Lexau J, Liu F, Li G, Thacker H, Shubin I, Yao J, Ho R, Cunningham JE, Krishnamoorthy AV. A complete 10 Gbps chip-to-chip digital CMOS silicon photonic link 2012 Conference On Lasers and Electro-Optics, Cleo 2012. |
0.354 |
|
2011 |
Li G, Zheng X, Yao J, Thacker H, Shubin I, Luo Y, Raj K, Cunningham JE, Krishnamoorthy AV. 25Gb/s 1V-driving CMOS ring modulator with integrated thermal tuning. Optics Express. 19: 20435-43. PMID 21997052 DOI: 10.1364/Oe.19.020435 |
0.424 |
|
2011 |
Zheng X, Patil D, Lexau J, Liu F, Li G, Thacker H, Luo Y, Shubin I, Li J, Yao J, Dong P, Feng D, Asghari M, Pinguet T, Mekis A, et al. Ultra-efficient 10 Gb/s hybrid integrated silicon photonic transmitter and receiver. Optics Express. 19: 5172-86. PMID 21445153 DOI: 10.1364/Oe.19.005172 |
0.5 |
|
2011 |
Li G, Zheng X, Yao J, Thacker H, Shubin I, Luo Y, Raj K, Cunningham JE, Krishnamoorthy AV. 25Gb/s 1V-driving CMOS ring modulator with integrated thermal tuning Optics Express. 19: 20435-20443. DOI: 10.1364/OE.19.020435 |
0.35 |
|
2011 |
Zheng X, Patil D, Lexau J, Liu F, Li G, Thacker H, Luo Y, Shubin I, Li J, Yao J, Dong P, Feng D, Asghari M, Pinguet T, Mekis A, et al. Ultra-efficient 10Gb/s hybrid integrated silicon photonic transmitter and receiver Optics Express. 19: 5172-5186. DOI: 10.1364/OE.19.005172 |
0.423 |
|
2011 |
Thacker HD, Shubin I, Luo Y, Costa J, Lexau J, Zheng X, Li G, Yao J, Patil D, Liu F, Ho R, Pinguet T, Dong P, Feng D, Asghari M, et al. Hybrid-integrated silicon photonic bridge chips for ultralow energy inter-chip communications Proceedings of Spie - the International Society For Optical Engineering. 7944. DOI: 10.1117/12.876526 |
0.474 |
|
2011 |
Luo Y, Simons J, Costa J, Shubin I, Chen W, Frans B, Robinson M, Shafiiha R, Liao S, Feng NN, Zheng X, Li G, Yao J, Thacker H, Asghari M, et al. Experimental studies of the Franz-Keldysh effect in CVD grown GeSi epi on SOI Proceedings of Spie - the International Society For Optical Engineering. 7944. DOI: 10.1117/12.876492 |
0.379 |
|
2011 |
Yao J, Zheng X, Li G, Shubin I, Luo Y, Thacker H, Mekis A, Pinguet T, Sahni S, Raj K, Cunningham JE, Krishnamoorthy AV. Grating-coupler-based optical proximity coupling for scalable computing systems Proceedings of Spie - the International Society For Optical Engineering. 7944. DOI: 10.1117/12.876443 |
0.52 |
|
2011 |
Shubin I, Zheng X, Li G, Thacker H, Yao J, Guenin B, Pinguet T, Mekis A, Krishnamoorthy AV, Cunningham JE. Low power thermal tuning of SOI-CMOS photonic structures Proceedings of Spie - the International Society For Optical Engineering. 7944. DOI: 10.1117/12.876428 |
0.411 |
|
2011 |
Krishnamoorthy AV, Zheng X, Li G, Dong P, Feng D, Pinguet T, Mekis A, Schwetman H, Lexau J, Patil D, Liu F, Koka P, McCracken M, Shubin I, Thacker H, et al. Dense WDM silicon photonic interconnects for compact high-end computing systems 2011 Ieee Winter Topicals, Wtm 2011. 108-110. DOI: 10.1109/PHOTWTM.2011.5730071 |
0.327 |
|
2011 |
Cunningham JE, Krishnamoorthy AV, Ho R, Shubin I, Thacker H, Lexau J, Lee DC, Feng D, Chow E, Luo Y, Zheng X, Li G, Yao J, Pinguet T, Raj K, et al. Integration and packaging of a macrochip with silicon nanophotonic links Ieee Journal On Selected Topics in Quantum Electronics. 17: 546-558. DOI: 10.1109/Jstqe.2010.2091674 |
0.477 |
|
2011 |
Thacker HD, Ogunsola OO, Muler AV, Meindl JD. Wafer-testing of optoelectonic - Gigascale CMOS integrated circuits Ieee Journal On Selected Topics in Quantum Electronics. 17: 659-670. DOI: 10.1109/Jstqe.2010.2089431 |
0.802 |
|
2011 |
Krishnamoorthy AV, Zheng X, Li G, Yao J, Pinguet T, Mekis A, Thacker H, Shubin I, Luo Y, Raj K, Cunningham JE. Exploiting CMOS Manufacturing to Reduce Tuning Requirements for Resonant Optical Devices Ieee Photonics Journal. 3: 567-579. DOI: 10.1109/Jphot.2011.2140367 |
0.42 |
|
2011 |
Zheng X, Liu F, Patil D, Lexau J, Li G, Luo Y, Thacker H, Shubin I, Yao J, Raj K, Cunningham JE, Ho R, Krishnamoorthy AV. Sub pJ/bit WDM silicon photonic communications for many-core computing systems 2011 Ico International Conference On Information Photonics, Ip 2011. DOI: 10.1109/ICO-IP.2011.5953764 |
0.357 |
|
2011 |
Yao J, Zheng X, Li G, Shubin I, Thacker H, Luo Y, Raj K, Cunningham JE, Krishnamoorthy AV. Grating-coupler based low-loss optical interlayer coupling Ieee International Conference On Group Iv Photonics Gfp. 383-385. DOI: 10.1109/GROUP4.2011.6053824 |
0.352 |
|
2011 |
Li G, Zheng X, Yao J, Thacker H, Shubin I, Luo Y, Raj K, Cunningham JE, Krishnamoorthy AV. High-efficiency 25Gb/s CMOS ring modulator with integrated thermal tuning Ieee International Conference On Group Iv Photonics Gfp. 8-10. DOI: 10.1109/GROUP4.2011.6053698 |
0.33 |
|
2011 |
Thacker HD, Shubin I, Luo Y, Costa J, Lexau J, Zheng X, Li G, Yao J, Li J, Patil D, Liu F, Ho R, Feng D, Asghari M, Pinguet T, et al. Hybrid integration of silicon nanophotonics with 40nm-CMOS VLSI drivers and receivers Proceedings - Electronic Components and Technology Conference. 829-835. DOI: 10.1109/ECTC.2011.5898607 |
0.36 |
|
2011 |
Zheng X, Liu F, Lexau J, Patil D, Li G, Luo Y, Thacker H, Shubin I, Yao J, Raj K, Ho R, Cunningham JE, Krishnamoorthy AV. Ultra-low power arrayed CMOS silicon photonic transceivers for an 80 Gbps WDM optical link Optics Infobase Conference Papers. |
0.338 |
|
2010 |
Cunningham JE, Shubin I, Zheng X, Pinguet T, Mekis A, Luo Y, Thacker H, Li G, Yao J, Raj K, Krishnamoorthy AV. Highly-efficient thermally-tuned resonant optical filters. Optics Express. 18: 19055-63. PMID 20940799 DOI: 10.1364/Oe.18.019055 |
0.383 |
|
2010 |
Zheng X, Shubin I, Li G, Pinguet T, Mekis A, Yao J, Thacker H, Luo Y, Costa J, Raj K, Cunningham JE, Krishnamoorthy AV. A tunable 1x4 silicon CMOS photonic wavelength multiplexer/demultiplexer for dense optical interconnects. Optics Express. 18: 5151-60. PMID 20389528 DOI: 10.1364/Oe.18.005151 |
0.428 |
|
2010 |
Zheng X, Lexau J, Luo Y, Thacker H, Pinguet T, Mekis A, Li G, Shi J, Amberg P, Pinckney N, Raj K, Ho R, Cunningham JE, Krishnamoorthy AV. Ultra-low-energy all-CMOS modulator integrated with driver. Optics Express. 18: 3059-70. PMID 20174136 DOI: 10.1364/Oe.18.003059 |
0.414 |
|
2010 |
Zheng X, Liu F, Patil D, Thacker H, Luo Y, Pinguet T, Mekis A, Yao J, Li G, Shi J, Raj K, Lexau J, Alon E, Ho R, Cunningham JE, et al. A sub-picojoule-per-bit CMOS photonic receiver for densely integrated systems. Optics Express. 18: 204-11. PMID 20173840 DOI: 10.1364/Oe.18.000204 |
0.454 |
|
2010 |
Zheng X, Shubin I, Li G, Pinguet T, Mekis A, Yao J, Thacker H, Luo Y, Costa J, Raj K, Cunningham JE, Krishnamoorthy AV. A tunable 1×4 silicon CMOS photonic wavelength multiplexer/ demultiplexer for dense optical interconnects Optics Express. 18: 5151-5160. DOI: 10.1364/OE.18.005151 |
0.355 |
|
2010 |
Zheng X, Lexau J, Luo Y, Thacker H, Pinguet T, Mekis A, Li G, Shi J, Amberg P, Pinckney N, Raj K, Ho R, Cunningham JE, Krishnamoorthy AV. Ultra-low-energy all-CMOS modulator integrated with driver Optics Express. 18: 3059-3070. DOI: 10.1364/OE.18.003059 |
0.34 |
|
2010 |
Zheng X, Cunningham JE, Li G, Luo Y, Thacker H, Yao J, Ho R, Lexau J, Liu F, Patil D, Amberg P, Pinckney N, Dong P, Feng D, Asghari M, et al. Ultra-low power silicon photonic transceivers for inter/intra-chip interconnects Proceedings of Spie - the International Society For Optical Engineering. 7797. DOI: 10.1117/12.863087 |
0.506 |
|
2010 |
Shubin I, Zheng X, Thacker H, Yao J, Costa J, Luo Y, Li G, Krishnamoorthy AV, Cunningham JE, Pinguet T, Mekis A. Thermally tunable SOI CMOS photonics circuits Proceedings of Spie - the International Society For Optical Engineering. 7607. DOI: 10.1117/12.842903 |
0.327 |
|
2010 |
Li G, Zheng X, Lexau J, Luo Y, Thacker H, Pinguet T, Dong P, Feng D, Liao S, Shafiiha R, Asghari M, Yao J, Shi J, Shubin IN, Patil D, et al. Ultralow-power silicon photonic interconnect for high-performance computing systems Proceedings of Spie - the International Society For Optical Engineering. 7607. DOI: 10.1117/12.842884 |
0.416 |
|
2010 |
Thacker HD, Shubin I, Zheng X, Costa J, Luo Y, Li G, Yao J, Shi J, Lexau J, Ho R, Raj K, Mitchell JG, Cunningham JE, Krishnamoorthy AV. CMOS-photonic "macrochip" packaging 2010 23rd Annual Meeting of the Ieee Photonics Society, Photinics 2010. 485-486. DOI: 10.1109/Photonics.2010.5698972 |
0.397 |
|
2010 |
Krishnamoorthy AV, Ho R, Zheng X, Li G, Cunningham JE, Feng D, Dong P, Pinguet T, Mekis A, Schwetman H, Lexau J, Patil D, Liu F, Koka P, McCracken M, ... ... Thacker H, et al. Low-power photonic links: Breaking the picojoule-per-bit barrier 2010 23rd Annual Meeting of the Ieee Photonics Society, Photinics 2010. 228-229. DOI: 10.1109/Photonics.2010.5698842 |
0.474 |
|
2010 |
Thacker HD, Luo Y, Shi J, Shubin I, Lexau J, Zheng X, Li G, Yao J, Costa J, Pinguet T, Mekis A, Dong P, Liao S, Feng D, Asghari M, et al. Flip-chip integrated silicon photonic bridge chips for sub-picojoule per bit optical links Proceedings - Electronic Components and Technology Conference. 240-246. DOI: 10.1109/ECTC.2010.5490965 |
0.411 |
|
2010 |
Krishnamoorthy AV, Zheng X, Li G, Dong P, Feng D, Pinguet T, Mekis A, Schwetman H, Lexau J, Patil D, Liu F, Koka P, McCracken M, Shubin I, Thacker H, et al. Compacting high-end computing systems with dense WDM silicon photonic interconnects Technical Digest - Ieee Compound Semiconductor Integrated Circuit Symposium, Csic. DOI: 10.1109/CSICS.2010.5619671 |
0.32 |
|
2010 |
Li G, Zheng X, Lexau J, Luo Y, Thacker H, Dong P, Liao S, Feng D, Zheng D, Shafiiha R, Asghari M, Yao J, Shi J, Amberg P, Pinckney N, et al. Ultralow-power high-performance si photonic transmitter Optics Infobase Conference Papers. |
0.345 |
|
2009 |
Zheng X, Lexau J, luo Y, Thacker H, Pinguet T, Mekis A, Li G, Shi J, Amberg P, Pinckney N, Raj K, Ho R, Cunningham JE, Krishnamoorthy AV. An ultra-low power all CMOS Si photonic transmitter Optics Infobase Conference Papers. DOI: 10.1364/Fio.2009.Pdpb5 |
0.484 |
|
2008 |
Sekar D, King C, Dang B, Spencer T, Thacker H, Joseph P, Bakir M, Meindl J. A 3D-IC technology with integrated microchannel cooling 2008 Ieee International Interconnect Technology Conference, Iitc. 13-15. DOI: 10.1109/IITC.2008.4546911 |
0.767 |
|
2008 |
Bakir MS, King C, Sekar D, Thacker H, Dang B, Huang G, Naeemi A, Meindl JD. 3D heterogeneous integrated systems: Liquid cooling, power delivery, and implementation Proceedings of the Custom Integrated Circuits Conference. 663-670. DOI: 10.1109/CICC.2008.4672173 |
0.717 |
|
2007 |
Thacker HD, Meindl JD. Prospects for wafer-level testing of gigascale chips with electrical and optical I/O interconnects Proceedings - International Test Conference. DOI: 10.1109/TEST.2006.297668 |
0.623 |
|
2007 |
Thacker H, Ogunsola O, Carson A, Bakir M, Meindl J. Optical through-wafer interconnects for 3D hyper-integration Conference Proceedings - Lasers and Electro-Optics Society Annual Meeting-Leos. 28-29. DOI: 10.1109/LEOS.2006.278802 |
0.771 |
|
2006 |
Ogunsola OO, Thacker HD, Bachim BL, Bakir MS, Pikarsky J, Gaylord TK, Meindl JD. Chip-level waveguide-mirror-pillar optical interconnect structure Ieee Photonics Technology Letters. 18: 1672-1674. DOI: 10.1109/Lpt.2006.879533 |
0.776 |
|
2006 |
Dang B, Bakir MS, Patel CS, Thacker HD, Meindl JD. Sea-of-Leads MEMS I/O interconnects for low-k IC packaging Journal of Microelectromechanical Systems. 15: 523-530. DOI: 10.1109/Jmems.2006.876792 |
0.774 |
|
2006 |
Ogunsola OO, Thacker HD, Bachim BL, Bakir MS, Gaylord TK, Meindl JD. Polymer pillars as optical I/O for gigascale chips using mirror-terminated waveguides 2006 International Interconnect Technology Conference, Iitc. 170-172. DOI: 10.1109/IITC.2006.1648679 |
0.774 |
|
2006 |
Bakir MS, Dang B, Thacker HD, Ogunsola OO, Ogra R, Meindl JD. Dual-mode electrical-optical flip-chip I/O interconnects and a compatible probe substrate for wafer-level testing Proceedings - Electronic Components and Technology Conference. 2006: 768-775. DOI: 10.1109/ECTC.2006.1645744 |
0.785 |
|
2005 |
Thacker HD, Ogunsola OO, Bakir MS, Meindl JD. High-density probe substrate for testing optical interconnects Proceedings of the Ieee 2005 International Interconnect Technology Conference, Iitc. 159-161. |
0.769 |
|
2005 |
Thacker H, Ogunsola O, Bakir M, Meindl J. Probe module for wafer-level testing of gigascale chips with electrical and optical I/O interconnects Proceedings of the Asme/Pacific Rim Technical Conference and Exhibition On Integration and Packaging of Mems, Nems, and Electronic Systems: Advances in Electronic Packaging 2005. 1593-1599. |
0.777 |
|
2004 |
Dang B, Patel C, Thacker H, Bakir M, Martin K, Meindl J. Optimal implementation of sea of leads (SoL) compliant interconnect technology Proceedings of the Ieee 2004 International Interconnect Technology Conference. 99-101. |
0.531 |
|
2004 |
Thacker H, Mule A, Villalaz R, Gaylord T, Meindl J. Compliant probe substrates with two-material, air-clad, grating-in-waveguide optical I/O interconnects Conference Proceedings - Lasers and Electro-Optics Society Annual Meeting-Leos. 1: 439-440. |
0.39 |
|
2003 |
Bakir MS, Reed HA, Thacker HD, Patel CS, Kohl PA, Martin KP, Meindl JD. Sea of leads (SoL) ultrahigh density wafer-level chip input/output interconnections for gigascale integration (GSI) Ieee Transactions On Electron Devices. 50: 2039-2048. DOI: 10.1109/Ted.2003.816528 |
0.761 |
|
2002 |
Bakir MS, Thacker HD, Zhou Z, Kohl PA, Martin KP, Meindl JD. Sea of leads microwave characterization and process integration with FEOL and BEOL Proceedings of the Ieee 2002 International Interconnect Technology Conference, Iitc 2002. 116-118. DOI: 10.1109/IITC.2002.1014906 |
0.581 |
|
2002 |
Thacker HD, Bakir MS, Keezer DC, Martin KP, Meindl JD. Compliant probe substrates for testing high pin-count chip scale packages Proceedings - Electronic Components and Technology Conference. 1188-1193. |
0.681 |
|
2002 |
Bakir M, Mulé A, Thacker H, Kohl P, Martin K, Meindl J. Sol-compliant wafer-level package technologies Semiconductor International. 25: 61-64. |
0.388 |
|
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