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Brigid A. Mullany - Publications

Affiliations: 
Mechanical Engineering (PhD) University of North Carolina, Charlotte, Charlotte, NC, United States 
Area:
Mechanical Engineering, Materials Science Engineering, Optics Physics

26 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2020 Guo C, Shi Z, Mullany BA, Linke BS, Yamaguchi H, Chaudhari R, Hucker S, Shih A. Recent Advancements in Machining With Abrasives Journal of Manufacturing Science and Engineering-Transactions of the Asme. 142: 1-36. DOI: 10.1115/1.4047353  0.334
2019 Shahinian H, Mullany B. Polishing spherical BK7 workpieces with fiber-based tools Optical Engineering. 58: 1. DOI: 10.1117/1.Oe.58.9.092610  0.392
2019 Azimi F, Mullany B. Geometric surface feature detection using statistical based metrics Precision Engineering. 60: 602-609. DOI: 10.1016/J.Precisioneng.2019.07.016  0.337
2018 Shahinian H, Cherukuri H, Mullany B. Evaluation of fiber-based tools for glass polishing using experimental and computational approaches. Applied Optics. 55: 4307-16. PMID 27411180 DOI: 10.1364/Ao.55.004307  0.383
2017 Dahlberg J, Tkacik PT, Mullany B, Fleischhauer E, Shahinian H, Azimi F, Navare J, Owen S, Bisel T, Martin T, Sholar J, Keanini RG. An Analog Macroscopic Technique for Studying Molecular Hydrodynamic Processes in Dense Gases and Liquids. Journal of Visualized Experiments : Jove. PMID 29286423 DOI: 10.3791/56632  0.331
2017 Shahinian H, Hassan M, Cherukuri H, Mullany BA. Fiber-based tools: material removal and mid-spatial frequency error reduction. Applied Optics. 56: 8266-8274. PMID 29047693 DOI: 10.1364/Ao.56.008266  0.376
2017 Mullany B, Shahinian H, Navare J, Azimi F, Fleischhauer E, Tkacik P, Keanini R. The application of computational fluid dynamics to vibratory finishing processes Cirp Annals. 66: 309-312. DOI: 10.1016/J.Cirp.2017.04.087  0.352
2016 Shahinian H, Mullany B. Optical Polishing Using Fiber Based Tools Procedia Cirp. 45: 183-186. DOI: 10.1016/J.Procir.2016.02.166  0.361
2016 Fleischhauer E, Azimi F, Tkacik P, Keanini R, Mullany B. Application of particle image velocimetry (PIV) to vibrational finishing Journal of Materials Processing Technology. 229: 322-328. DOI: 10.1016/J.Jmatprotec.2015.09.017  0.395
2016 Uhlmann E, Mullany B, Biermann D, Rajurkar K, Hausotte T, Brinksmeier E. Process chains for high-precision components with micro-scale features Cirp Annals. 65: 549-572. DOI: 10.1016/J.Cirp.2016.05.001  0.355
2014 Zheng B, Dong Y, Mullany B, Morse E, Davies A. An optical positioning sensor by combining optical projection and a virtual camera model Proceedings of Spie - the International Society For Optical Engineering. 9223. DOI: 10.1117/12.2065523  0.572
2014 Dong Y, Hutchens T, Mullany B, Morse E, Davies A. Using a three-dimensional optical simulation to investigate uncertainty in image-based dimensional measurements Optical Engineering. 53. DOI: 10.1117/1.Oe.53.9.092007  0.31
2013 Zheng B, Dong Y, Davies A, Mullany B, Morse E. Using Optical Projection in Close-range Photogrammetry for 6DOF Sensor Positioning Photogrammetric Engineering & Remote Sensing. 79: 79-86. DOI: 10.14358/Pers.79.1.79  0.576
2013 Howard SC, Chesna JW, Smith ST, Mullany BA. On the Development of an Experimental Testing Platform for the Vortex Machining Process Journal of Manufacturing Science and Engineering. 135. DOI: 10.1115/1.4025011  0.594
2013 Zheng B, Dong Y, Mullany B, Morse E, Davies A. Positioning sensor by combining photogrammetry, optical projection and a virtual camera model Measurement Science and Technology. 24. DOI: 10.1088/0957-0233/24/10/105106  0.585
2013 Mullany B, Mainuddin M, Williams W, Keanini R. An experimental and analytical investigation into the effects of process vibrations on material removal rates during polishing Journal of Applied Physics. 113. DOI: 10.1063/1.4809555  0.666
2012 Howard SC, Chesna JW, Mullany B, Smith ST. Observations during vortex machining process development Asme 2012 International Manufacturing Science and Engineering Conference Collocated With the 40th North American Manufacturing Research Conference and in Participation With the Int. Conf., Msec 2012. 25-31. DOI: 10.1115/MSEC2012-7272  0.526
2012 Mullany B, Mainuddin M. The influence of process vibrations on precision polishing metrics Cirp Annals - Manufacturing Technology. 61: 555-558. DOI: 10.1016/J.Cirp.2012.03.120  0.682
2010 Mullany B, Turner S. Optical polishing pitches: impact frequency responses and indentation depths. Applied Optics. 49: 442-9. PMID 20090809 DOI: 10.1364/Ao.49.000442  0.349
2010 Williams W, Mullany B, Parker W, Moyer P, Randles M. Using quantum dots to evaluate subsurface damage depths and formation mechanisms in glass Cirp Annals. 59: 569-572. DOI: 10.1016/J.Cirp.2010.03.137  0.606
2009 Williams WB, Mullany BA, Parker WC, Moyer PJ, Randles MH. Using quantum dots to tag subsurface damage in lapped and polished glass samples. Applied Optics. 48: 5155-63. PMID 19767933 DOI: 10.1364/Ao.48.005155  0.624
2009 Nowakowski BK, Smith ST, Mullany BA, Woody SC. Vortex machining: Localized surface modification using an oscillating fiber probe Machining Science and Technology. 13: 561-570. DOI: 10.1080/10910340903451407  0.388
2007 Davies MA, Ueda T, M'Saoubi R, Mullany B, Cooke AL. On The Measurement of Temperature in Material Removal Processes Cirp Annals - Manufacturing Technology. 56: 581-604. DOI: 10.1016/J.Cirp.2007.10.009  0.327
2003 Mullany B, Byrne G. The effect of slurry viscosity on chemical–mechanical polishing of silicon wafers Journal of Materials Processing Technology. 132: 28-34. DOI: 10.1016/S0924-0136(02)00205-4  0.34
2003 Evans C, Paul E, Dornfeld D, Lucca D, Byrne G, Tricard M, Klocke F, Dambon O, Mullany B. Material Removal Mechanisms in Lapping and Polishing Cirp Annals. 52: 611-633. DOI: 10.1016/S0007-8506(07)60207-8  0.387
1999 Byrne G, Mullany B, Young P. The Effect of Pad Wear on the Chemical Mechanical Polishing of Silicon Wafers Cirp Annals. 48: 143-146. DOI: 10.1016/S0007-8506(07)63151-5  0.361
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