Year |
Citation |
Score |
2019 |
Ma B, Shan L, Dogruoz MB, Agonafer D. Evolution of Microdroplet Morphology Confined on Asymmetric Micropillar Structures. Langmuir : the Acs Journal of Surfaces and Colloids. PMID 31424229 DOI: 10.1021/Acs.Langmuir.9B01410 |
0.396 |
|
2019 |
Li J, Shan L, Ma B, Jiang X, Solomon A, Iyengar M, Padilla J, Agonafer D. Investigation of the confinement effect on the evaporation behavior of a droplet pinned on a micropillar structure. Journal of Colloid and Interface Science. 555: 583-594. PMID 31404842 DOI: 10.1016/J.Jcis.2019.07.096 |
0.378 |
|
2019 |
Shan L, Ma B, Li J, Dogruoz B, Agonafer D. Investigation of the evaporation heat transfer mechanism of a non-axisymmetric droplet confined on a heated micropillar structure International Journal of Heat and Mass Transfer. 141: 191-203. DOI: 10.1016/J.Ijheatmasstransfer.2019.06.042 |
0.517 |
|
2019 |
Shan L, Li J, Ma B, Jiang X, Dogruoz B, Agonafer D. Experimental investigation of evaporation from asymmetric microdroplets confined on heated micropillar structures Experimental Thermal and Fluid Science. 109: 109889. DOI: 10.1016/J.Expthermflusci.2019.109889 |
0.513 |
|
2017 |
Agonafer DD, Lee H, Vasquez PA, Won Y, Jung KW, Lingamneni S, Ma B, Shan L, Shuai S, Du Z, Maitra T, Palko JW, Goodson KE. Porous micropillar structures for retaining low surface tension liquids. Journal of Colloid and Interface Science. 514: 316-327. PMID 29275250 DOI: 10.1016/J.Jcis.2017.12.011 |
0.434 |
|
2017 |
Palko JW, Lee H, Zhang C, Dusseault TJ, Maitra T, Won Y, Agonafer DD, Moss J, Houshmand F, Rong G, Wilbur JD, Rockosi D, Mykyta I, Resler D, Altman D, et al. Extreme Two-Phase Cooling from Laser-Etched Diamond and Conformal, Template-Fabricated Microporous Copper Advanced Functional Materials. 27: 1703265. DOI: 10.1002/Adfm.201703265 |
0.445 |
|
2016 |
Lee H, Agonafer DD, Won Y, Houshmand F, Gorle C, Asheghi M, Goodson KE. Thermal modeling of extreme heat flux microchannel coolers for GaN-on-SiC semiconductor devices Journal of Electronic Packaging, Transactions of the Asme. 138. DOI: 10.1115/1.4032655 |
0.447 |
|
2016 |
Palko JW, Lee H, Agonafer DD, Zhang C, Jung KW, Moss J, Wilbur JD, Dusseault TJ, Barako MT, Houshmand F, Rong G, Maitra T, Gorle C, Won Y, Rockosi D, et al. High heat flux two-phase cooling of electronics with integrated diamond/porous copper heat sinks and microfluidic coolant supply Proceedings of the 15th Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm 2016. 1511-1517. DOI: 10.1109/ITHERM.2016.7517728 |
0.405 |
|
2015 |
Agonafer DD, Lopez K, Palko JW, Won Y, Santiago JG, Goodson KE. Burst behavior at a capillary tip: Effect of low and high surface tension. Journal of Colloid and Interface Science. 455: 1-5. PMID 26046980 DOI: 10.1016/J.Jcis.2015.05.033 |
0.428 |
|
2015 |
Won Y, Cho J, Agonafer D, Asheghi M, Goodson KE. Fundamental Cooling Limits for High Power Density Gallium Nitride Electronics Ieee Transactions On Components, Packaging and Manufacturing Technology. DOI: 10.1109/Tcpmt.2015.2433132 |
0.397 |
|
2011 |
Agonafer DD, Yeom J, Shannon MA. Three-dimensional CFD model of pressure drop in TAS devices in a microchannel Journal of Electronic Packaging, Transactions of the Asme. 133. DOI: 10.1115/1.4004217 |
0.408 |
|
2009 |
Prakash S, Akberov R, Agonafer D, Armijo AD, Shannon MA. Influence of boundary conditions on sub-millimeter combustion Energy and Fuels. 23: 3549-3557. DOI: 10.1021/Ef900040Q |
0.418 |
|
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