Mehdi Asheghi - Publications

Affiliations: 
Carnegie Mellon University, Pittsburgh, PA 
Area:
Mechanical Engineering, Electronics and Electrical Engineering

106 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2021 Park J, Bae K, Kim TR, Perez C, Sood A, Asheghi M, Goodson KE, Park W. Direct Quantification of Heat Generation Due to Inelastic Scattering of Electrons Using a Nanocalorimeter. Advanced Science (Weinheim, Baden-Wurttemberg, Germany). 8: 2002876. PMID 33552867 DOI: 10.1002/advs.202002876  0.52
2020 Kim Y, Kwon H, Han HS, Kim HK, Kim B, Lee BC, Lee J, Asheghi M, Prinz FB, Goodson KE, Lim J, Sim U, Park W. Tunable Dielectric and Thermal Properties of Oxide Dielectrics via Substrate Biasing in Plasma Enhanced Atomic Layer Deposition. Acs Applied Materials & Interfaces. PMID 32915545 DOI: 10.1021/acsami.0c11086  0.52
2019 Sood A, Xiong F, Chen S, Cheaito R, Lian F, Asheghi M, Cui Y, Donadio D, Goodson KE, Pop E. Quasi-Ballistic Thermal Transport Across MoS Thin Films. Nano Letters. PMID 30808167 DOI: 10.1021/acs.nanolett.8b05174  0.52
2018 Zhang C, Palko JW, Rong G, Pringle KS, Barako MT, Dusseault TJ, Asheghi M, Santiago JG, Goodson KE. Tailoring permeability of microporous copper structures through template sintering. Acs Applied Materials & Interfaces. PMID 30096232 DOI: 10.1021/acsami.8b03774  0.52
2018 Rong G, Palko JW, Oyarzun DI, Zhang C, Hämmerle J, Asheghi M, Goodson KE, Santiago JG. A method for quantifying in plane permeability of porous thin films. Journal of Colloid and Interface Science. 530: 667-674. PMID 30007196 DOI: 10.1016/j.jcis.2018.05.062  0.52
2018 Park W, Sohn J, Romano G, Kodama T, Sood A, Katz JS, Kim BSY, So H, Ahn EC, Asheghi M, Kolpak AM, Goodson KE. Impact of thermally dead volume on phonon conduction along silicon nanoladders. Nanoscale. PMID 29873370 DOI: 10.1039/c8nr01788c  0.52
2018 Sood A, Cheaito R, Bai T, Kwon H, Wang Y, Li C, Yates L, Bougher T, Graham S, Asheghi M, Goorsky M, Goodson KE. Direct Visualization of Thermal Conductivity Suppression Due to Enhanced Phonon Scattering Near Individual Grain Boundaries. Nano Letters. PMID 29631399 DOI: 10.1021/acs.nanolett.8b00534  0.52
2017 Park W, Kodama T, Park J, Cho J, Sood A, Barako MT, Asheghi M, Goodson KE. Thermal Conduction across Metal-Dielectric Sidewall Interfaces. Acs Applied Materials & Interfaces. PMID 28786284 DOI: 10.1021/acsami.7b06567  0.52
2017 Park W, Romano G, Ahn EC, Kodama T, Park J, Barako MT, Sohn J, Kim SJ, Cho J, Marconnet AM, Asheghi M, Kolpak AM, Goodson KE. Phonon Conduction in Silicon Nanobeam Labyrinths. Scientific Reports. 7: 6233. PMID 28740212 DOI: 10.1038/s41598-017-06479-3  0.52
2016 Barako MT, Sood A, Zhang C, Wang J, Kodama T, Asheghi M, Zheng X, Braun PV, Goodson KE. Quasi-ballistic Electronic Thermal Conduction in Metal Inverse Opals. Nano Letters. PMID 26986050 DOI: 10.1021/acs.nanolett.6b00468  0.52
2016 Chaparala S, Gupta A, Asheghi M, Suhling J, Ikeda T, Luo X. Special section on InterPACK 2015 Journal of Electronic Packaging, Transactions of the Asme. 138. DOI: 10.1115/1.4032748  0.64
2016 Lee H, Agonafer DD, Won Y, Houshmand F, Gorle C, Asheghi M, Goodson KE. Thermal modeling of extreme heat flux microchannel coolers for GaN-on-SiC semiconductor devices Journal of Electronic Packaging, Transactions of the Asme. 138. DOI: 10.1115/1.4032655  0.64
2016 Palko JW, Lee H, Agonafer DD, Zhang C, Jung KW, Moss J, Wilbur JD, Dusseault TJ, Barako MT, Houshmand F, Rong G, Maitra T, Gorle C, Won Y, Rockosi D, ... ... Asheghi M, et al. High heat flux two-phase cooling of electronics with integrated diamond/porous copper heat sinks and microfluidic coolant supply Proceedings of the 15th Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm 2016. 1511-1517. DOI: 10.1109/ITHERM.2016.7517728  0.64
2016 Cornett J, Lane B, Dunham M, Asheghi M, Goodson K, Gao Y, Sun N, Chen B. Chip-scale thermal energy harvester using Bi2Te3 Iecon 2015 - 41st Annual Conference of the Ieee Industrial Electronics Society. 3326-3329. DOI: 10.1109/IECON.2015.7392612  0.64
2016 Cornett J, Chen B, Haidar S, Berney H, McGuinness P, Lane B, Gao Y, He Y, Sun N, Dunham M, Asheghi M, Goodson K, Yuan Y, Najafi K. Fabrication and Characterization of Bi2Te3-Based Chip-Scale Thermoelectric Energy Harvesting Devices Journal of Electronic Materials. 1-3. DOI: 10.1007/s11664-016-4992-5  0.64
2015 Ahn C, Fong SW, Kim Y, Lee S, Sood A, Neumann CM, Asheghi M, Goodson KE, Pop E, Wong HP. Energy-Efficient Phase-Change Memory with Graphene as Thermal Barrier. Nano Letters. PMID 26308280 DOI: 10.1021/acs.nanolett.5b02661  0.64
2015 Barako MT, Roy-Panzer S, English TS, Kodama T, Asheghi M, Kenny TW, Goodson KE. Thermal Conduction in Vertically Aligned Copper Nanowire Arrays and Composites. Acs Applied Materials & Interfaces. 7: 19251-9. PMID 26284489 DOI: 10.1021/acsami.5b05147  0.64
2015 Roy-Panzer S, Kodama T, Lingamneni S, Panzer MA, Asheghi M, Goodson KE. Thermal characterization and analysis of microliter liquid volumes using the three-omega method. The Review of Scientific Instruments. 86: 024901. PMID 25725871 DOI: 10.1063/1.4907353  0.64
2015 Houshmand F, Lee H, Asheghi M, Goodson KE. High heat flux subcooled flow boiling of methanol in microtubes Asme 2015 International Technical Conference and Exhibition On Packaging and Integration of Electronic and Photonic Microsystems, Interpack 2015, Collocated With the Asme 2015 13th International Conference On Nanochannels, Microchannels, and Minichannels. 3. DOI: 10.1115/IPACK2015-48734  0.64
2015 Lee H, Won Y, Houshmand F, Gorle C, Asheghi M, Goodson KE. Computational modeling of extreme heat flux microcooler for GaN-based HEMT Asme 2015 International Technical Conference and Exhibition On Packaging and Integration of Electronic and Photonic Microsystems, Interpack 2015, Collocated With the Asme 2015 13th International Conference On Nanochannels, Microchannels, and Minichannels. 2. DOI: 10.1115/IPACK2015-48670  0.64
2015 Liu T, Houshmand F, Gorle C, Scholl S, Lee H, Won Y, Asheghi M, Goodson K, Kazemi H, Vanhille K. Full scale simulation of an integrated monolithic heat sink for thermal management of a high power density gan-SiC chip Asme 2015 International Technical Conference and Exhibition On Packaging and Integration of Electronic and Photonic Microsystems, Interpack 2015, Collocated With the Asme 2015 13th International Conference On Nanochannels, Microchannels, and Minichannels. 1. DOI: 10.1115/IPACK2015-48592  0.64
2015 Dowling KM, Suria AJ, Won Y, Shankar A, Lee H, Asheghi M, Goodson KE, Senesky DG. Inductive coupled plasma etching of high aspect ratio silicon carbide microchannels for localized cooling Asme 2015 International Technical Conference and Exhibition On Packaging and Integration of Electronic and Photonic Microsystems, Interpack 2015, Collocated With the Asme 2015 13th International Conference On Nanochannels, Microchannels, and Minichannels. 3. DOI: 10.1115/IPACK2015-48409  0.64
2015 Zhang C, Rong G, Palko JW, Dusseault TJ, Asheghi M, Santiago JG, Goodson KE. Tailoring of permeability in copper inverse opal for electronic cooling applications Asme 2015 International Technical Conference and Exhibition On Packaging and Integration of Electronic and Photonic Microsystems, Interpack 2015, Collocated With the Asme 2015 13th International Conference On Nanochannels, Microchannels, and Minichannels. 2. DOI: 10.1115/IPACK2015-48262  0.64
2015 Gorlé C, Lee H, Houshmand F, Asheghi M, Goodson K, Parida PR. Validation study for VOF simulations of boiling in a microchannel Asme 2015 International Technical Conference and Exhibition On Packaging and Integration of Electronic and Photonic Microsystems, Interpack 2015, Collocated With the Asme 2015 13th International Conference On Nanochannels, Microchannels, and Minichannels. 3. DOI: 10.1115/IPACK2015-48129  0.64
2015 Scholl S, Gorle C, Houshmand F, Asheghi M, Goodson K, Verstraete T. Numerical optimization of advanced monolithic micro coolers for high heat flux microelectronics Asme 2015 International Technical Conference and Exhibition On Packaging and Integration of Electronic and Photonic Microsystems, Interpack 2015, Collocated With the Asme 2015 13th International Conference On Nanochannels, Microchannels, and Minichannels. 3. DOI: 10.1115/IPACK2015-48123  0.64
2015 Scholl S, Gorle C, Houshmand F, Liu T, Lee H, Won Y, Asheghi M, Goodson K, Kazemi H. Numerical simulation of advanced monolithic microcooler designs for high heat flux microelectronics Asme 2015 International Technical Conference and Exhibition On Packaging and Integration of Electronic and Photonic Microsystems, Interpack 2015, Collocated With the Asme 2015 13th International Conference On Nanochannels, Microchannels, and Minichannels. 2. DOI: 10.1115/IPACK2015-48122  0.64
2015 Cho J, Francis D, Chao PC, Asheghi M, Goodson KE. Cross-plane phonon conduction in polycrystalline silicon films Journal of Heat Transfer. 137. DOI: 10.1115/1.4029820  0.64
2015 Won Y, Cho J, Agonafer D, Asheghi M, Goodson KE. Fundamental Cooling Limits for High Power Density Gallium Nitride Electronics Ieee Transactions On Components, Packaging and Manufacturing Technology. DOI: 10.1109/TCPMT.2015.2433132  0.64
2015 Palko JW, Zhang C, Wilbur JD, Dusseault TJ, Asheghi M, Goodson KE, Santiago JG. Approaching the limits of two-phase boiling heat transfer: High heat flux and low superheat Applied Physics Letters. 107. DOI: 10.1063/1.4938202  0.64
2015 Dunham MT, Barako MT, LeBlanc S, Asheghi M, Chen B, Goodson KE. Power density optimization for micro thermoelectric generators Energy. 93: 2006-2017. DOI: 10.1016/j.energy.2015.10.032  0.64
2014 Jeyasingh R, Fong SW, Lee J, Li Z, Chang KW, Mantegazza D, Asheghi M, Goodson KE, Wong HS. Ultrafast characterization of phase-change material crystallization properties in the melt-quenched amorphous phase. Nano Letters. 14: 3419-26. PMID 24798660 DOI: 10.1021/nl500940z  0.64
2014 Barako MT, Gao Y, Won Y, Marconnet AM, Asheghi M, Goodson KE. Reactive metal bonding of carbon nanotube arrays for thermal interface applications Ieee Transactions On Components, Packaging and Manufacturing Technology. 4: 1906-1913. DOI: 10.1109/TCPMT.2014.2369371  0.64
2014 Vasquez Guzman PA, Sood A, Mleczko MJ, Wang B, Wong Philip HS, Nishi Y, Asheghi M, Goodson KE. Cross plane thermal conductance of graphene-metal interfaces Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 1385-1389. DOI: 10.1109/ITHERM.2014.6892441  0.64
2014 Harrison KL, Dalvi C, Asheghi M, Howe RT. Analysis of asperity dominated contacts in nanoelectromechanical relays using thin films Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 1256-1260. DOI: 10.1109/ITHERM.2014.6892425  0.64
2014 Sood A, Cho J, Hobart KD, Feygelson T, Pate B, Asheghi M, Goodson KE. Anisotropic and nonhomogeneous thermal conduction in 1 μm thick CVD diamond Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 1192-1198. DOI: 10.1109/ITHERM.2014.6892415  0.64
2014 Cho J, Chu KK, Chao PC, McGray C, Asheghi M, Goodson KE. Thermal conduction normal to thin silicon nitride films on diamond and GaN Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 1186-1191. DOI: 10.1109/ITHERM.2014.6892414  0.64
2014 Lingamneni S, Asheghi M, Goodson KE. A parametric study of Microporous Metal Matrix-Phase Change Material composite heat spreaders for transient thermal applications Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 870-875. DOI: 10.1109/ITHERM.2014.6892372  0.64
2014 Sood A, Eryilmaz SB, Jeyasingh R, Cho J, Asheghi M, Wong HSP, Goodson KE. Thermal characterization of nanostructured superlattices of TiN/TaN: Applications as electrodes in phase change memory Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 765-770. DOI: 10.1109/ITHERM.2014.6892358  0.64
2014 Dusseault TJ, Gires J, Barako MT, Won Y, Agonafer DD, Asheghi M, Santiago JG, Goodson KE. Inverse opals for fluid delivery in electronics cooling systems Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 750-755. DOI: 10.1109/ITHERM.2014.6892356  0.64
2014 Fong SW, Jeyasingh R, Asheghi M, Goodson KE, Wong HSP. Characterization of phase-change layer thermal properties using a micro-thermal stage Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 744-749. DOI: 10.1109/ITHERM.2014.6892355  0.64
2014 Barako MT, Weisse JM, Roy S, Kodama T, Dusseault TJ, Motoyama M, Asheghi M, Prinz FB, Zheng X, Goodson KE. Thermal conduction in nanoporous copper inverse opal films Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 736-743. DOI: 10.1109/ITHERM.2014.6892354  0.64
2014 Park W, Marconnet AM, Kodama T, Park J, Sinclair R, Asheghi M, Goodson KE. Phonon thermal conduction in periodically porous silicon nanobeams Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 637-640. DOI: 10.1109/ITHERM.2014.6892341  0.64
2014 Won Y, Barako MT, Agonafer DD, Asheghi M, Goodson KE. Mechanical and thermal properties of copper inverse opals for two-phase convection enhancement Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 326-332. DOI: 10.1109/ITHERM.2014.6892299  0.64
2014 Agonafer DD, Lopez K, Won Y, Palko J, Asheghi M, Santiago JG, Goodson KE. Phase-separation of wetting fluids using nanoporous alumina membranes and micro-glass capillaries Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 306-316. DOI: 10.1109/ITHERM.2014.6892297  0.64
2014 Cho J, Won Y, Francis D, Asheghi M, Goodson KE. Thermal interface resistance measurements for GaN-on-diamond composite substrates Technical Digest - Ieee Compound Semiconductor Integrated Circuit Symposium, Csic. DOI: 10.1109/CSICS.2014.6978583  0.64
2014 Agonafer DD, Palko J, Won Y, Lopez K, Dusseault T, Gires J, Asheghi M, Santiago JG, Goodson KE. Progress on phase separation microfluidics Technical Digest - Ieee Compound Semiconductor Integrated Circuit Symposium, Csic. DOI: 10.1109/CSICS.2014.6978575  0.64
2014 Won Y, Houshmand F, Agonafer D, Asheghi M, Goodson KE. Microfluidic heat exchangers for high power density GaN on SiC Technical Digest - Ieee Compound Semiconductor Integrated Circuit Symposium, Csic. DOI: 10.1109/CSICS.2014.6978568  0.64
2014 Cho J, Li Y, Hoke WE, Altman DH, Asheghi M, Goodson KE. Phonon scattering in strained transition layers for GaN heteroepitaxy Physical Review B - Condensed Matter and Materials Physics. 89. DOI: 10.1103/PhysRevB.89.115301  0.64
2014 Sood A, Rowlette JA, Caneau CG, Bozorg-Grayeli E, Asheghi M, Goodson KE. Thermal conduction in lattice-matched superlattices of InGaAs/InAlAs Applied Physics Letters. 105. DOI: 10.1063/1.4892575  0.64
2013 Lee J, Kodama T, Won Y, Asheghi M, Goodson KE. Impact of annealing on the thermoelectric properties Ge 2Sb2Te5 films Materials Research Society Symposium Proceedings. 1490: 223-228. DOI: 10.1557/opl.2012.1573  0.64
2013 Cho J, Chao PC, Asheghi M, Goodson KE. Conduction normal to polysilicon films on diamond Asme 2013 4th International Conference On Micro/Nanoscale Heat and Mass Transfer, Mnhmt 2013. DOI: 10.1115/MNHMT2013-22171  0.64
2013 Roy S, Kodama T, Lingamneni S, Panzer MA, Asheghi M, Goodson KE. Towards thermal characterization of pico-liter volumes using the 3omega method Asme International Mechanical Engineering Congress and Exposition, Proceedings (Imece). 8. DOI: 10.1115/IMECE2013-66428  0.64
2013 Marconnet AM, Asheghi M, Goodson KE. From the Casimir limit to phononic crystals: 20 years of phonon transport studies using silicon-on-insulator technology Journal of Heat Transfer. 135. DOI: 10.1115/1.4023577  0.64
2013 Cho J, Li Z, Bozorg-Grayeli E, Kodama T, Francis D, Ejeckam F, Faili F, Asheghi M, Goodson KE. Improved thermal interfaces of GaN-Diamond composite substrates for HEMT applications Ieee Transactions On Components, Packaging and Manufacturing Technology. 3: 79-85. DOI: 10.1109/TCPMT.2012.2223818  0.64
2013 Won Y, Cho J, Agonafer D, Asheghi M, Goodson KE. Cooling limits for GaN HEMT technology Technical Digest - Ieee Compound Semiconductor Integrated Circuit Symposium, Csic. DOI: 10.1109/CSICS.2013.6659222  0.64
2013 Lee J, Bozorg-Grayeli E, Kim S, Asheghi M, Philip Wong HS, Goodson KE. Phonon and electron transport through Ge2Sb2Te 5 films and interfaces bounded by metals Applied Physics Letters. 102. DOI: 10.1063/1.4807141  0.64
2013 Bozorg-Grayeli E, Sood A, Asheghi M, Gambin V, Sandhu R, Feygelson TI, Pate BB, Hobart K, Goodson KE. Thermal conduction inhomogeneity of nanocrystalline diamond films by dual-side thermoreflectance Applied Physics Letters. 102. DOI: 10.1063/1.4796168  0.64
2013 Barako MT, Park W, Marconnet AM, Asheghi M, Goodson KE. Thermal cycling, mechanical degradation, and the effective figure of merit of a thermoelectric module Journal of Electronic Materials. 42: 372-381. DOI: 10.1007/s11664-012-2366-1  0.64
2012 Li Z, Tan S, Bozorg-Grayeli E, Kodama T, Asheghi M, Delgado G, Panzer M, Pokrovsky A, Wack D, Goodson KE. Phonon dominated heat conduction normal to Mo/Si multilayers with period below 10 nm. Nano Letters. 12: 3121-6. PMID 22563928 DOI: 10.1021/nl300996r  0.64
2012 Lee J, Asheghi M, Goodson KE. Impact of thermoelectric phenomena on phase-change memory performance metrics and scaling. Nanotechnology. 23: 205201. PMID 22543873 DOI: 10.1088/0957-4484/23/20/205201  0.64
2012 Ahn C, Lee B, Jeyasingh RGD, Asheghi M, Hurkx F, Goodson KE, Wong HSP. Effect of resistance drift on the activation energy for crystallization in phase change memory Japanese Journal of Applied Physics. 51. DOI: 10.1143/JJAP.51.02BD06  0.64
2012 Li Z, Jeyasingh RGD, Lee J, Asheghi M, Wong HSP, Goodson KE. Electrothermal modeling and design strategies for multibit phase change memory Asme 2012 3rd International Conference On Micro/Nanoscale Heat and Mass Transfer, Mnhmt 2012. 777-783. DOI: 10.1115/MNHMT2012-75129  0.64
2012 Lee J, Kodama T, Won Y, Asheghi M, Goodson KE. Thermoelectric characterization of Ge2Sb2Te 5 films for phase-change memory Asme 2012 3rd International Conference On Micro/Nanoscale Heat and Mass Transfer, Mnhmt 2012. 687-693. DOI: 10.1115/MNHMT2012-75092  0.64
2012 Li Z, Tan S, Kodama T, Bozorg-Grayeli E, Asheghi M, Goodson KE. Electron-phonon coupled two-dimensional heat transfer in nanoscale metal/dielectric multilayers Asme 2012 Heat Transfer Summer Conf. Collocated With the Asme 2012 Fluids Engineering Div. Summer Meeting and the Asme 2012 10th Int. Conf. On Nanochannels, Microchannels and Minichannels, Ht 2012. 1: 579-587. DOI: 10.1115/HT2012-58350  0.64
2012 Li Z, Jeyasingh RGD, Lee J, Asheghi M, Wong HSP, Goodson KE. Electrothermal modeling and design strategies for multibit phase-change memory Ieee Transactions On Electron Devices. 59: 3561-3567. DOI: 10.1109/TED.2012.2219311  0.64
2012 Cho J, Bozorg-Grayeli E, Altman DH, Asheghi M, Goodson KE. Low thermal resistances at GaN-SiC interfaces for HEMT technology Ieee Electron Device Letters. 33: 378-380. DOI: 10.1109/LED.2011.2181481  0.64
2012 Lee J, Kim S, Marconnet A, In'T Zandt MAA, Asheghi M, Philip Wong HSP, Goodson KE. Thermoelectric characterization and power generation using a silicon-on-insulator substrate Journal of Microelectromechanical Systems. 21: 4-6. DOI: 10.1109/JMEMS.2011.2175704  0.64
2012 Hom L, Durieux A, Miler J, Asheghi M, Ramani K, Goodson KE. Calibration methodology for interposing liquid coolants for infrared thermography of microprocessors Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm. 1412-1419. DOI: 10.1109/ITHERM.2012.6231585  0.64
2012 Barako MT, Gao Y, Marconnet AM, Asheghi M, Goodson KE. Solder-bonded carbon nanotube thermal interface materials Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm. 1225-1233. DOI: 10.1109/ITHERM.2012.6231562  0.64
2012 Bozorg-Grayeli E, Li Z, Gambin V, Asheghi M, Goodson KE. Thermal conductivity, anisotropy, and interface resistances of diamond on poly-AlN Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm. 1059-1064. DOI: 10.1109/ITHERM.2012.6231541  0.64
2012 Cho J, Li Z, Bozorg-Grayeli E, Kodama T, Francis D, Ejeckam F, Faili F, Asheghi M, Goodson KE. Thermal characterization of GaN-on-diamond substrates for HEMT applications Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm. 435-439. DOI: 10.1109/ITHERM.2012.6231463  0.64
2012 Kodama T, Park W, Marconnet A, Lee J, Asheghi M, Goodson KE. In-plane thermal conductivity measurement on nanoscale conductive materials with on-substrate device configuration Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm. 250-255. DOI: 10.1109/ITHERM.2012.6231437  0.64
2012 Aminfar A, Bozorg Grayeli E, Asheghi M, Goodson KE. Analysis of HEMT multilayered structures using a 2D finite volume model Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm. 224-234. DOI: 10.1109/ITHERM.2012.6231434  0.64
2012 Park W, Barako MT, Marconnet AM, Asheghi M, Goodson KE. Effect of thermal cycling on commercial thermoelectric modules Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm. 107-112. DOI: 10.1109/ITHERM.2012.6231420  0.64
2012 Barako MT, Park W, Marconnet AM, Asheghi M, Goodson KE. A reliability study with infrared imaging of thermoelectric modules under thermal cycling Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm. 86-92. DOI: 10.1109/ITHERM.2012.6231417  0.64
2012 Marconnet AM, Motoyama M, Barako MT, Gao Y, Pozder S, Fowler B, Ramakrishna K, Mortland G, Asheghi M, Goodson KE. Nanoscale conformable coatings for enhanced thermal conduction of carbon nanotube films Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm. 15-19. DOI: 10.1109/ITHERM.2012.6231408  0.64
2012 Cho J, Li Y, Altman DH, Hoke WE, Asheghi M, Goodson KE. Temperature dependent thermal resistances at GaN-substrate interfaces in GaN composite substrates Technical Digest - Ieee Compound Semiconductor Integrated Circuit Symposium, Csic. DOI: 10.1109/CSICS.2012.6340094  0.64
2012 Marconnet AM, Kodama T, Asheghi M, Goodson KE. Phonon conduction in periodically porous silicon nanobridges Nanoscale and Microscale Thermophysical Engineering. 16: 199-219. DOI: 10.1080/15567265.2012.732195  0.64
2012 Bozorg-Grayeli E, Li Z, Asheghi M, Delgado G, Pokrovsky A, Panzer M, Wack D, Goodson KE. Thermal conduction properties of Mo/Si multilayers for extreme ultraviolet optics Journal of Applied Physics. 112. DOI: 10.1063/1.4759450  0.64
2012 Lee J, Kodama T, Won Y, Asheghi M, Goodson KE. Phase purity and the thermoelectric properties of Ge 2Sb 2Te 5 films down to 25 nm thickness Journal of Applied Physics. 112. DOI: 10.1063/1.4731252  0.64
2012 Won Y, Lee J, Asheghi M, Kenny TW, Goodson KE. Phase and thickness dependent modulus of Ge 2Sb 2Te 5 films down to 25 nm thickness Applied Physics Letters. 100. DOI: 10.1063/1.3699227  0.64
2011 Kim S, Lee B, Asheghi M, Hurkx F, Reifenberg JP, Goodson KE, Wong HSP. Resistance and threshold switching voltage drift behavior in phase-change memory and their temperature dependence at microsecond time scales studied using a micro-thermal stage Ieee Transactions On Electron Devices. 58: 584-592. DOI: 10.1109/TED.2010.2095502  0.64
2011 Li Z, Lee J, Reifenberg JP, Asheghi M, Jeyasingh RGD, Wong HSP, Goodson KE. Grain boundaries, phase impurities, and anisotropic thermal conduction in phase-change memory Ieee Electron Device Letters. 32: 961-963. DOI: 10.1109/LED.2011.2150193  0.64
2011 Lee J, Kim S, Jeyasingh R, Asheghi M, Wong HSP, Goodson KE. Microthermal stage for electrothermal characterization of phase-change memory Ieee Electron Device Letters. 32: 952-954. DOI: 10.1109/LED.2011.2144952  0.64
2011 Bozorg-Grayeli E, Li Z, Asheghi M, Delgado G, Pokrovsky A, Panzer M, Wack D, Goodson KE. High temperature thermal properties of thin tantalum nitride films Applied Physics Letters. 99. DOI: 10.1063/1.3672098  0.64
2011 Ahn C, Lee B, Jeyasingh RGD, Asheghi M, Hurkx GAM, Goodson KE, Philip Wong HS. Crystallization properties and their drift dependence in phase-change memory studied with a micro-thermal stage Journal of Applied Physics. 110. DOI: 10.1063/1.3667295  0.64
2011 Lee J, Li Z, Reifenberg JP, Lee S, Sinclair R, Asheghi M, Goodson KE. Thermal conductivity anisotropy and grain structure in Ge 2Sb2Te5 films Journal of Applied Physics. 109. DOI: 10.1063/1.3573505  0.64
2010 Li Z, Lee J, Reifenberg JP, Asheghi M, Philip Wong HS, Goodson KE. IN-plane thermal conduction and conductivity anisotropy in Ge 2Sb2Te5 films for phase change memory Asme International Mechanical Engineering Congress and Exposition, Proceedings (Imece). 10: 651-658. DOI: 10.1115/IMECE2010-40459  0.64
2010 Reifenberg JP, Chang KW, Panzer MA, Kim S, Rowlette JA, Asheghi M, Wong HSP, Goodson KE. Thermal boundary resistance measurements for phase-change memory devices Ieee Electron Device Letters. 31: 56-58. DOI: 10.1109/LED.2009.2035139  0.64
2010 Wong HSP, Raoux S, Kim S, Liang J, Reifenberg JP, Rajendran B, Asheghi M, Goodson KE. Phase change memory Proceedings of the Ieee. 98: 2201-2227. DOI: 10.1109/JPROC.2010.2070050  0.64
2010 Lee J, Reifenberg JP, Bozorg-Grayeli E, Hom L, Li Z, Kim S, Asheghi M, Wong HSP, Goodson KE. Decoupled thermal resistances of phase change material and their impact on PCM devices 2010 12th Ieee Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm 2010. DOI: 10.1109/ITHERM.2010.5501412  0.64
2009 Lee J, Reifenberg JP, Li Z, Hom L, Asheghi M, Kim S, Wong HSP, Goodson KE. Measurement of anisotropy in the thermal conductivity of Ge 2Sb2Te5 films Proceedings - 2009 10th Non-Volatile Memory Technology Symposium, Nvmts 2009. 52-57. DOI: 10.1109/NVMT.2009.5429777  0.64
2008 Small E, Sadeghipour SM, Pileggi L, Asheghi M. Thermal analyses of confined cell design for Phase Change Random Access Memory (PCRAM) 2008 11th Ieee Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, I-Therm. 1046-1054. DOI: 10.1109/ITHERM.2008.4544378  0.64
2008 Ryu HJ, Klein LJ, Asheghi M, Hamann HF. Experimental investigation of nanoscale thermal transport in hotspots at cryogenic temperatures 2008 11th Ieee Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, I-Therm. 925-930. DOI: 10.1109/ITHERM.2008.4544366  0.64
2007 Yang Y, Zhu J, Jeong T, Asheghi M. Predictions of field-dependent thermal and electrical transport in a Cu/CoFe multilayer 2007 Proceedings of the Asme/Jsme Thermal Engineering Summer Heat Transfer Conference - Ht 2007. 2: 905-909. DOI: 10.1115/HT2007-32831  0.64
2006 Li P, Pileggi LT, Asheghi M, Chandra R. IC thermal simulation and modeling via efficient multigrid-based approaches Ieee Transactions On Computer-Aided Design of Integrated Circuits and Systems. 25: 1763-1776. DOI: 10.1109/TCAD.2005.858276  0.64
2006 Sadeghipour SM, Pileggi L, Asheghi M. Phase change random access memory, thermal analysis Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 2006: 660-665. DOI: 10.1109/ITHERM.2006.1645408  0.64
2006 Lo K, Wenjun L, Pileggi L, Asheghi M. An electronic packaging design for reduction of thermal interface resistance Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 2006: 525-528. DOI: 10.1109/ITHERM.2006.1645389  0.64
2006 Yang Y, Sadeghipour SM, Liu W, Asheghi M, Touzelbaev M. Thermal characterization of the high-thermal-conductivity dielectrics High Thermal Conductivity Materials. 69-118. DOI: 10.1007/0-387-25100-6_3  0.64
2004 Asheghi M, Liu W, Goodson KE. Effect of phonon dispersion on transport properties of single-crystalline dielectrics American Society of Mechanical Engineers, Electronic and Photonic Packaging, Epp. 4: 113-123. DOI: 10.1115/IMECE2004-62244  0.64
2004 Li P, Pileggi LT, Asheghi M, Chandra R. Efficient full-chip thermal modeling and analysis Ieee/Acm International Conference On Computer-Aided Design, Digest of Technical Papers, Iccad. 319-326. DOI: 10.1109/ICCAD.2004.1382594  0.64
2004 Yang Y, Shojaeizadeh S, Bain JA, Zhu JG, Asheghi M. Detailed modeling of temperature rise in giant magnetoresistive sensor during an electrostatic discharge event Journal of Applied Physics. 95: 6780-6782. DOI: 10.1063/1.1652426  0.64
2002 Asheghi M, Yang Y, Sadeghipour SM, Bain JA, Barmak K, Jhon MS, Gellman AJ, Schlesinger E, Zhu JG, White RM. Nanoscale energy transport in information technology research with an application to high-density data storage devices and systems American Society of Mechanical Engineers, Heat Transfer Division, (Publication) Htd. 372: 1-14. DOI: 10.1115/IMECE2002-32110  0.64
2001 Sverdrup PG, Sinha S, Asheghi M, Uma S, Goodson KE. Measurement of ballistic phonon conduction near hotspots in silicon Applied Physics Letters. 78: 3331-3333. DOI: 10.1063/1.1371536  0.64
2001 Uma S, McConnell AD, Asheghi M, Kurabayashi K, Goodson KE. Temperature-dependent thermal conductivity of undoped polycrystalline silicon layers International Journal of Thermophysics. 22: 605-616. DOI: 10.1023/A:1010791302387  0.64
1999 Kurabayashi K, Asheghi M, Touzelbaev M, Goodson KE. Measurement of the thermal conductivity anisotropy in polyimide films Journal of Microelectromechanical Systems. 8: 180-191. DOI: 10.1109/84.767114  0.64
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