| Year |
Citation |
Score |
| 2023 |
Perez C, McLeod AJ, Chen ME, Yi SI, Vaziri S, Hood R, Ueda ST, Bao X, Asheghi M, Park W, Talin AA, Kumar S, Pop E, Kummel AC, Goodson KE. High Thermal Conductivity of Submicrometer Aluminum Nitride Thin Films Sputter-Deposited at Low Temperature. Acs Nano. PMID 37796248 DOI: 10.1021/acsnano.3c05485 |
0.395 |
|
| 2022 |
Khan AI, Wu X, Perez C, Won B, Kim K, Ramesh P, Kwon H, Tung MC, Lee Z, Oh IK, Saraswat K, Asheghi M, Goodson KE, Wong HP, Pop E. Unveiling the Effect of Superlattice Interfaces and Intermixing on Phase Change Memory Performance. Nano Letters. PMID 35876819 DOI: 10.1021/acs.nanolett.2c01869 |
0.316 |
|
| 2022 |
Liu T, Asheghi M, Goodson KE. Multiobjective Optimization of Graded, Hybrid Micropillar Wicks for Capillary-Fed Evaporation. Langmuir : the Acs Journal of Surfaces and Colloids. 38: 221-230. PMID 34967627 DOI: 10.1021/acs.langmuir.1c02429 |
0.332 |
|
| 2021 |
Kwon H, Perez C, Park W, Asheghi M, Goodson KE. Thermal Characterization of Metal-Oxide Interfaces Using Time-Domain Thermoreflectance with Nanograting Transducers. Acs Applied Materials & Interfaces. PMID 34797056 DOI: 10.1021/acsami.1c12422 |
0.383 |
|
| 2021 |
Kwon H, Khan AI, Perez C, Asheghi M, Pop E, Goodson KE. Uncovering Thermal and Electrical Properties of SbTe/GeTe Superlattice Films. Nano Letters. PMID 34270270 DOI: 10.1021/acs.nanolett.1c00947 |
0.444 |
|
| 2021 |
Kwon H, Perez C, Kim HK, Asheghi M, Park W, Goodson KE. Thermal Interface Enhancement via Inclusion of an Adhesive Layer Using Plasma-Enhanced Atomic Layer Deposition. Acs Applied Materials & Interfaces. PMID 33914509 DOI: 10.1021/acsami.0c19197 |
0.359 |
|
| 2020 |
Kim Y, Kwon H, Han HS, Kim HK, Kim B, Lee BC, Lee J, Asheghi M, Prinz FB, Goodson KE, Lim J, Sim U, Park W. Tunable Dielectric and Thermal Properties of Oxide Dielectrics via Substrate Biasing in Plasma Enhanced Atomic Layer Deposition. Acs Applied Materials & Interfaces. PMID 32915545 DOI: 10.1021/Acsami.0C11086 |
0.465 |
|
| 2020 |
Jung KW, Hazra S, Kwon H, Piazza A, Jih E, Asheghi M, Gupta MP, Degner M, Goodson KE. Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-Three-Dimensional Manifold Coolers—Part 2: Parametric Study of EMMCs for High Heat Flux (∼1 kW/cm2) Power Electronics Cooling Journal of Electronic Packaging. 142. DOI: 10.1115/1.4047883 |
0.42 |
|
| 2020 |
Hazra S, Jung KW, Iyengar M, Malone C, Asheghi M, Goodson KE. Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel Three-Dimensional-Manifold Coolers (EMMC)—Part 3: Addressing Challenges in Laser Micromachining-Based Manufacturing of Three-Dimensional-Manifolded Microcooler Devices Journal of Electronic Packaging. 142. DOI: 10.1115/1.4047847 |
0.349 |
|
| 2020 |
Jung KW, Cho E, Lee H, Kharangate C, Zhou F, Asheghi M, Dede EM, Goodson KE. Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-3D Manifold Coolers (EMMCs): Part 1—Experimental Study of Single-Phase Cooling Performance With R-245fa Journal of Electronic Packaging. 142. DOI: 10.1115/1.4047846 |
0.374 |
|
| 2020 |
Guo P, Burrow JA, Sevison GA, Kwon H, Perez C, Hendrickson JR, Smith EM, Asheghi M, Goodson KE, Agha I, Sarangan AM. Tungsten-doped Ge2Sb2Te5 phase change material for high-speed optical switching devices Applied Physics Letters. 116: 131901. DOI: 10.1063/1.5142552 |
0.398 |
|
| 2020 |
Liu T, Dunham MT, Jung KW, Chen B, Asheghi M, Goodson KE. Characterization and thermal modeling of a miniature silicon vapor chamber for die-level heat redistribution International Journal of Heat and Mass Transfer. 152: 119569. DOI: 10.1016/J.Ijheatmasstransfer.2020.119569 |
0.467 |
|
| 2020 |
Kharangate CR, Libeer W, Palko J, Lee H, Shi J, Asheghi M, Goodson KE. Investigation of 3D manifold architecture heat sinks in air-cooled condensers Applied Thermal Engineering. 167: 114700. DOI: 10.1016/J.Applthermaleng.2019.114700 |
0.375 |
|
| 2019 |
Sood A, Xiong F, Chen S, Cheaito R, Lian F, Asheghi M, Cui Y, Donadio D, Goodson KE, Pop E. Quasi-Ballistic Thermal Transport Across MoS Thin Films. Nano Letters. PMID 30808167 DOI: 10.1021/Acs.Nanolett.8B05174 |
0.526 |
|
| 2019 |
Liu T, Palko JW, Katz JS, Dede EM, Zhou F, Asheghi M, Goodson KE. Tunable, passive thermal regulation through liquid to vapor phase change Applied Physics Letters. 115: 254102. DOI: 10.1063/1.5133795 |
0.475 |
|
| 2019 |
Okabe KL, Sood A, Yalon E, Neumann CM, Asheghi M, Pop E, Goodson KE, Wong HP. Understanding the switching mechanism of interfacial phase change memory Journal of Applied Physics. 125: 184501. DOI: 10.1063/1.5093907 |
0.48 |
|
| 2019 |
Kong D, Jung KW, Jung S, Jung D, Schaadt J, Iyengar M, Malone C, Kharangate CR, Asheghi M, Goodson KE, Lee H. Single-phase thermal and hydraulic performance of embedded silicon micro-pin fin heat sinks using R245fa International Journal of Heat and Mass Transfer. 141: 145-155. DOI: 10.1016/J.Ijheatmasstransfer.2019.05.073 |
0.419 |
|
| 2019 |
Jung KW, Kharangate CR, Lee H, Palko J, Zhou F, Asheghi M, Dede EM, Goodson KE. Embedded cooling with 3D manifold for vehicle power electronics application: Single-phase thermal-fluid performance International Journal of Heat and Mass Transfer. 130: 1108-1119. DOI: 10.1016/J.Ijheatmasstransfer.2018.10.108 |
0.46 |
|
| 2018 |
Zhang C, Palko JW, Rong G, Pringle KS, Barako MT, Dusseault TJ, Asheghi M, Santiago JG, Goodson KE. Tailoring permeability of microporous copper structures through template sintering. Acs Applied Materials & Interfaces. PMID 30096232 DOI: 10.1021/Acsami.8B03774 |
0.353 |
|
| 2018 |
Rong G, Palko JW, Oyarzun DI, Zhang C, Hämmerle J, Asheghi M, Goodson KE, Santiago JG. A method for quantifying in plane permeability of porous thin films. Journal of Colloid and Interface Science. 530: 667-674. PMID 30007196 DOI: 10.1016/J.Jcis.2018.05.062 |
0.333 |
|
| 2018 |
Park W, Sohn J, Romano G, Kodama T, Sood A, Katz JS, Kim BSY, So H, Ahn EC, Asheghi M, Kolpak AM, Goodson KE. Impact of thermally dead volume on phonon conduction along silicon nanoladders. Nanoscale. PMID 29873370 DOI: 10.1039/C8Nr01788C |
0.475 |
|
| 2018 |
Sood A, Cheaito R, Bai T, Kwon H, Wang Y, Li C, Yates L, Bougher T, Graham S, Asheghi M, Goorsky M, Goodson KE. Direct Visualization of Thermal Conductivity Suppression Due to Enhanced Phonon Scattering Near Individual Grain Boundaries. Nano Letters. PMID 29631399 DOI: 10.1021/Acs.Nanolett.8B00534 |
0.473 |
|
| 2018 |
Lee H, Maitra T, Palko J, Kong D, Zhang C, Barako MT, Won Y, Asheghi M, Goodson KE. Enhanced Heat Transfer Using Microporous Copper Inverse Opals Journal of Electronic Packaging. 140. DOI: 10.1115/1.4040088 |
0.397 |
|
| 2018 |
Kharangate CR, Wook Jung K, Jung S, Kong D, Schaadt J, Iyengar M, Malone C, Lee H, Asheghi M, Goodson KE. Experimental Investigation of Embedded Micropin-Fins for Single-Phase Heat Transfer and Pressure Drop Journal of Electronic Packaging. 140. DOI: 10.1115/1.4039475 |
0.371 |
|
| 2018 |
Guo P, Burrow JA, Sevison GA, Sood A, Asheghi M, Hendrickson JR, Goodson KE, Agha I, Sarangan A. Improving the performance of Ge2Sb2Te5 materials via nickel doping: Towards RF-compatible phase-change devices Applied Physics Letters. 113: 171903. DOI: 10.1063/1.5053713 |
0.427 |
|
| 2017 |
Park W, Kodama T, Park J, Cho J, Sood A, Barako MT, Asheghi M, Goodson KE. Thermal Conduction across Metal-Dielectric Sidewall Interfaces. Acs Applied Materials & Interfaces. PMID 28786284 DOI: 10.1021/Acsami.7B06567 |
0.463 |
|
| 2017 |
Park W, Romano G, Ahn EC, Kodama T, Park J, Barako MT, Sohn J, Kim SJ, Cho J, Marconnet AM, Asheghi M, Kolpak AM, Goodson KE. Phonon Conduction in Silicon Nanobeam Labyrinths. Scientific Reports. 7: 6233. PMID 28740212 DOI: 10.1038/S41598-017-06479-3 |
0.415 |
|
| 2017 |
Park W, Sood A, Park J, Asheghi M, Sinclair R, Goodson KE. Enhanced Thermal Conduction Through Nanostructured Interfaces Nanoscale and Microscale Thermophysical Engineering. 21: 134-144. DOI: 10.1080/15567265.2017.1296910 |
0.452 |
|
| 2017 |
Park W, Shin DD, Kim SJ, Katz JS, Park J, Ahn CH, Kodama T, Asheghi M, Kenny TW, Goodson KE. Phonon conduction in silicon nanobeams Applied Physics Letters. 110: 213102. DOI: 10.1063/1.4983790 |
0.477 |
|
| 2017 |
Cho J, Francis D, Altman DH, Asheghi M, Goodson KE. Phonon conduction in GaN-diamond composite substrates Journal of Applied Physics. 121: 055105. DOI: 10.1063/1.4975468 |
0.485 |
|
| 2017 |
Palko JW, Lee H, Zhang C, Dusseault TJ, Maitra T, Won Y, Agonafer DD, Moss J, Houshmand F, Rong G, Wilbur JD, Rockosi D, Mykyta I, Resler D, Altman D, ... Asheghi M, et al. Extreme Two-Phase Cooling from Laser-Etched Diamond and Conformal, Template-Fabricated Microporous Copper Advanced Functional Materials. 27: 1703265. DOI: 10.1002/Adfm.201703265 |
0.448 |
|
| 2016 |
Barako MT, Sood A, Zhang C, Wang J, Kodama T, Asheghi M, Zheng X, Braun PV, Goodson KE. Quasi-ballistic Electronic Thermal Conduction in Metal Inverse Opals. Nano Letters. PMID 26986050 DOI: 10.1021/Acs.Nanolett.6B00468 |
0.463 |
|
| 2016 |
Lee H, Agonafer DD, Won Y, Houshmand F, Gorle C, Asheghi M, Goodson KE. Thermal modeling of extreme heat flux microchannel coolers for GaN-on-SiC semiconductor devices Journal of Electronic Packaging, Transactions of the Asme. 138. DOI: 10.1115/1.4032655 |
0.442 |
|
| 2016 |
Dunham MT, Lorenzi B, Andrews SC, Sood A, Asheghi M, Narducci D, Goodson KE. Enhanced phonon scattering by nanovoids in high thermoelectric power factor polysilicon thin films Applied Physics Letters. 109: 253104. DOI: 10.1063/1.4972483 |
0.432 |
|
| 2016 |
Fong SW, Sood A, Chen L, Kumari N, Asheghi M, Goodson KE, Gibson GA, Wong HP. Thermal conductivity measurement of amorphous dielectric multilayers for phase-change memory power reduction Journal of Applied Physics. 120: 015103. DOI: 10.1063/1.4955165 |
0.538 |
|
| 2016 |
Bozorg-Grayeli E, Sood A, Asheghi M, Gambin V, Sandhu R, Feygelson TI, Pate BB, Hobart KD, Goodson KE. Erratum: “Thermal conduction inhomogeneity of nanocrystalline diamond films by dual-side thermoreflectance” [Appl. Phys. Lett. 102, 111907 (2013)] Applied Physics Letters. 108: 179903. DOI: 10.1063/1.4948382 |
0.334 |
|
| 2016 |
Sood A, Cho J, Hobart KD, Feygelson TI, Pate BB, Asheghi M, Cahill DG, Goodson KE. Anisotropic and inhomogeneous thermal conduction in suspended thin-film polycrystalline diamond Journal of Applied Physics. 119: 175103. DOI: 10.1063/1.4948335 |
0.485 |
|
| 2016 |
Cornett J, Chen B, Haidar S, Berney H, McGuinness P, Lane B, Gao Y, He Y, Sun N, Dunham M, Asheghi M, Goodson K, Yuan Y, Najafi K. Fabrication and Characterization of Bi2Te3-Based Chip-Scale Thermoelectric Energy Harvesting Devices Journal of Electronic Materials. 1-3. DOI: 10.1007/S11664-016-4992-5 |
0.301 |
|
| 2015 |
Ahn C, Fong SW, Kim Y, Lee S, Sood A, Neumann CM, Asheghi M, Goodson KE, Pop E, Wong HP. Energy-Efficient Phase-Change Memory with Graphene as Thermal Barrier. Nano Letters. PMID 26308280 DOI: 10.1021/Acs.Nanolett.5B02661 |
0.339 |
|
| 2015 |
Barako MT, Roy-Panzer S, English TS, Kodama T, Asheghi M, Kenny TW, Goodson KE. Thermal Conduction in Vertically Aligned Copper Nanowire Arrays and Composites. Acs Applied Materials & Interfaces. 7: 19251-9. PMID 26284489 DOI: 10.1021/Acsami.5B05147 |
0.528 |
|
| 2015 |
Roy-Panzer S, Kodama T, Lingamneni S, Panzer MA, Asheghi M, Goodson KE. Thermal characterization and analysis of microliter liquid volumes using the three-omega method. The Review of Scientific Instruments. 86: 024901. PMID 25725871 DOI: 10.1063/1.4907353 |
0.47 |
|
| 2015 |
Cho J, Li Z, Asheghi M, Goodson KE. NEAR-JUNCTION THERMAL MANAGEMENT: THERMAL CONDUCTION IN GALLIUM NITRIDE COMPOSITE SUBSTRATES Annual Review of Heat Transfer. 18: 7-45. DOI: 10.1615/Annualrevheattransfer.2015011335 |
0.455 |
|
| 2015 |
Cho J, Francis D, Chao PC, Asheghi M, Goodson KE. Cross-plane phonon conduction in polycrystalline silicon films Journal of Heat Transfer. 137. DOI: 10.1115/1.4029820 |
0.455 |
|
| 2015 |
Won Y, Cho J, Agonafer D, Asheghi M, Goodson KE. Fundamental Cooling Limits for High Power Density Gallium Nitride Electronics Ieee Transactions On Components, Packaging and Manufacturing Technology. DOI: 10.1109/Tcpmt.2015.2433132 |
0.43 |
|
| 2015 |
Palko JW, Zhang C, Wilbur JD, Dusseault TJ, Asheghi M, Goodson KE, Santiago JG. Approaching the limits of two-phase boiling heat transfer: High heat flux and low superheat Applied Physics Letters. 107. DOI: 10.1063/1.4938202 |
0.399 |
|
| 2015 |
Dunham MT, Barako MT, LeBlanc S, Asheghi M, Chen B, Goodson KE. Power density optimization for micro thermoelectric generators Energy. 93: 2006-2017. DOI: 10.1016/J.Energy.2015.10.032 |
0.416 |
|
| 2014 |
Jeyasingh R, Fong SW, Lee J, Li Z, Chang KW, Mantegazza D, Asheghi M, Goodson KE, Wong HS. Ultrafast characterization of phase-change material crystallization properties in the melt-quenched amorphous phase. Nano Letters. 14: 3419-26. PMID 24798660 DOI: 10.1021/Nl500940Z |
0.415 |
|
| 2014 |
Barako MT, Gao Y, Won Y, Marconnet AM, Asheghi M, Goodson KE. Reactive metal bonding of carbon nanotube arrays for thermal interface applications Ieee Transactions On Components, Packaging and Manufacturing Technology. 4: 1906-1913. DOI: 10.1109/Tcpmt.2014.2369371 |
0.454 |
|
| 2014 |
Sood A, Cho J, Hobart KD, Feygelson T, Pate B, Asheghi M, Goodson KE. Anisotropic and nonhomogeneous thermal conduction in 1 μm thick CVD diamond Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 1192-1198. DOI: 10.1109/ITHERM.2014.6892415 |
0.374 |
|
| 2014 |
Cho J, Chu KK, Chao PC, McGray C, Asheghi M, Goodson KE. Thermal conduction normal to thin silicon nitride films on diamond and GaN Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 1186-1191. DOI: 10.1109/ITHERM.2014.6892414 |
0.356 |
|
| 2014 |
Lingamneni S, Asheghi M, Goodson KE. A parametric study of Microporous Metal Matrix-Phase Change Material composite heat spreaders for transient thermal applications Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 870-875. DOI: 10.1109/ITHERM.2014.6892372 |
0.31 |
|
| 2014 |
Fong SW, Jeyasingh R, Asheghi M, Goodson KE, Wong HSP. Characterization of phase-change layer thermal properties using a micro-thermal stage Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 744-749. DOI: 10.1109/ITHERM.2014.6892355 |
0.395 |
|
| 2014 |
Barako MT, Weisse JM, Roy S, Kodama T, Dusseault TJ, Motoyama M, Asheghi M, Prinz FB, Zheng X, Goodson KE. Thermal conduction in nanoporous copper inverse opal films Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 736-743. DOI: 10.1109/ITHERM.2014.6892354 |
0.325 |
|
| 2014 |
Park W, Marconnet AM, Kodama T, Park J, Sinclair R, Asheghi M, Goodson KE. Phonon thermal conduction in periodically porous silicon nanobeams Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 637-640. DOI: 10.1109/ITHERM.2014.6892341 |
0.378 |
|
| 2014 |
Won Y, Barako MT, Agonafer DD, Asheghi M, Goodson KE. Mechanical and thermal properties of copper inverse opals for two-phase convection enhancement Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 326-332. DOI: 10.1109/ITHERM.2014.6892299 |
0.311 |
|
| 2014 |
Cho J, Won Y, Francis D, Asheghi M, Goodson KE. Thermal interface resistance measurements for GaN-on-diamond composite substrates Technical Digest - Ieee Compound Semiconductor Integrated Circuit Symposium, Csic. DOI: 10.1109/CSICS.2014.6978583 |
0.329 |
|
| 2014 |
Cho J, Li Y, Hoke WE, Altman DH, Asheghi M, Goodson KE. Phonon scattering in strained transition layers for GaN heteroepitaxy Physical Review B - Condensed Matter and Materials Physics. 89. DOI: 10.1103/Physrevb.89.115301 |
0.425 |
|
| 2014 |
Sood A, Rowlette JA, Caneau CG, Bozorg-Grayeli E, Asheghi M, Goodson KE. Thermal conduction in lattice-matched superlattices of InGaAs/InAlAs Applied Physics Letters. 105. DOI: 10.1063/1.4892575 |
0.452 |
|
| 2013 |
Bozorg-Grayeli E, Reifenberg JP, Asheghi M, Wong HP, Goodson KE. THERMAL TRANSPORT IN PHASE CHANGE MEMORY MATERIALS Annual Review of Heat Transfer. 16: 397-428. DOI: 10.1615/Annualrevheattransfer.V16.130 |
0.389 |
|
| 2013 |
Lee J, Kodama T, Won Y, Asheghi M, Goodson KE. Impact of annealing on the thermoelectric properties Ge 2Sb2Te5 films Materials Research Society Symposium Proceedings. 1490: 223-228. DOI: 10.1557/Opl.2012.1573 |
0.39 |
|
| 2013 |
Marconnet AM, Asheghi M, Goodson KE. From the Casimir limit to phononic crystals: 20 years of phonon transport studies using silicon-on-insulator technology Journal of Heat Transfer. 135. DOI: 10.1115/1.4023577 |
0.306 |
|
| 2013 |
Cho J, Li Z, Bozorg-Grayeli E, Kodama T, Francis D, Ejeckam F, Faili F, Asheghi M, Goodson KE. Improved thermal interfaces of GaN-Diamond composite substrates for HEMT applications Ieee Transactions On Components, Packaging and Manufacturing Technology. 3: 79-85. DOI: 10.1109/Tcpmt.2012.2223818 |
0.513 |
|
| 2013 |
Lee J, Bozorg-Grayeli E, Kim S, Asheghi M, Philip Wong HS, Goodson KE. Phonon and electron transport through Ge2Sb2Te 5 films and interfaces bounded by metals Applied Physics Letters. 102. DOI: 10.1063/1.4807141 |
0.458 |
|
| 2013 |
Bozorg-Grayeli E, Sood A, Asheghi M, Gambin V, Sandhu R, Feygelson TI, Pate BB, Hobart K, Goodson KE. Thermal conduction inhomogeneity of nanocrystalline diamond films by dual-side thermoreflectance Applied Physics Letters. 102. DOI: 10.1063/1.4796168 |
0.441 |
|
| 2013 |
Barako MT, Park W, Marconnet AM, Asheghi M, Goodson KE. Thermal cycling, mechanical degradation, and the effective figure of merit of a thermoelectric module Journal of Electronic Materials. 42: 372-381. DOI: 10.1007/S11664-012-2366-1 |
0.436 |
|
| 2012 |
Li Z, Tan S, Bozorg-Grayeli E, Kodama T, Asheghi M, Delgado G, Panzer M, Pokrovsky A, Wack D, Goodson KE. Phonon dominated heat conduction normal to Mo/Si multilayers with period below 10 nm. Nano Letters. 12: 3121-6. PMID 22563928 DOI: 10.1021/Nl300996R |
0.456 |
|
| 2012 |
Lee J, Asheghi M, Goodson KE. Impact of thermoelectric phenomena on phase-change memory performance metrics and scaling. Nanotechnology. 23: 205201. PMID 22543873 DOI: 10.1088/0957-4484/23/20/205201 |
0.43 |
|
| 2012 |
Li Z, Jeyasingh RGD, Lee J, Asheghi M, Wong HSP, Goodson KE. Electrothermal modeling and design strategies for multibit phase change memory Asme 2012 3rd International Conference On Micro/Nanoscale Heat and Mass Transfer, Mnhmt 2012. 777-783. DOI: 10.1109/Ted.2012.2219311 |
0.418 |
|
| 2012 |
Cho J, Bozorg-Grayeli E, Altman DH, Asheghi M, Goodson KE. Low thermal resistances at GaN-SiC interfaces for HEMT technology Ieee Electron Device Letters. 33: 378-380. DOI: 10.1109/Led.2011.2181481 |
0.472 |
|
| 2012 |
Lee J, Kim S, Marconnet A, In'T Zandt MAA, Asheghi M, Philip Wong HSP, Goodson KE. Thermoelectric characterization and power generation using a silicon-on-insulator substrate Journal of Microelectromechanical Systems. 21: 4-6. DOI: 10.1109/Jmems.2011.2175704 |
0.382 |
|
| 2012 |
Bozorg-Grayeli E, Li Z, Gambin V, Asheghi M, Goodson KE. Thermal conductivity, anisotropy, and interface resistances of diamond on poly-AlN Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm. 1059-1064. DOI: 10.1109/ITHERM.2012.6231541 |
0.379 |
|
| 2012 |
Cho J, Li Z, Bozorg-Grayeli E, Kodama T, Francis D, Ejeckam F, Faili F, Asheghi M, Goodson KE. Thermal characterization of GaN-on-diamond substrates for HEMT applications Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm. 435-439. DOI: 10.1109/ITHERM.2012.6231463 |
0.338 |
|
| 2012 |
Kodama T, Park W, Marconnet A, Lee J, Asheghi M, Goodson KE. In-plane thermal conductivity measurement on nanoscale conductive materials with on-substrate device configuration Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm. 250-255. DOI: 10.1109/ITHERM.2012.6231437 |
0.353 |
|
| 2012 |
Park W, Barako MT, Marconnet AM, Asheghi M, Goodson KE. Effect of thermal cycling on commercial thermoelectric modules Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm. 107-112. DOI: 10.1109/ITHERM.2012.6231420 |
0.312 |
|
| 2012 |
Cho J, Li Y, Altman DH, Hoke WE, Asheghi M, Goodson KE. Temperature dependent thermal resistances at GaN-substrate interfaces in GaN composite substrates Technical Digest - Ieee Compound Semiconductor Integrated Circuit Symposium, Csic. DOI: 10.1109/CSICS.2012.6340094 |
0.321 |
|
| 2012 |
Marconnet AM, Kodama T, Asheghi M, Goodson KE. Phonon conduction in periodically porous silicon nanobridges Nanoscale and Microscale Thermophysical Engineering. 16: 199-219. DOI: 10.1080/15567265.2012.732195 |
0.497 |
|
| 2012 |
Bozorg-Grayeli E, Li Z, Asheghi M, Delgado G, Pokrovsky A, Panzer M, Wack D, Goodson KE. Thermal conduction properties of Mo/Si multilayers for extreme ultraviolet optics Journal of Applied Physics. 112. DOI: 10.1063/1.4759450 |
0.527 |
|
| 2012 |
Lee J, Kodama T, Won Y, Asheghi M, Goodson KE. Phase purity and the thermoelectric properties of Ge 2Sb 2Te 5 films down to 25 nm thickness Journal of Applied Physics. 112. DOI: 10.1063/1.4731252 |
0.407 |
|
| 2012 |
Won Y, Lee J, Asheghi M, Kenny TW, Goodson KE. Phase and thickness dependent modulus of Ge 2Sb 2Te 5 films down to 25 nm thickness Applied Physics Letters. 100. DOI: 10.1063/1.3699227 |
0.366 |
|
| 2011 |
Kim S, Lee B, Asheghi M, Hurkx F, Reifenberg JP, Goodson KE, Wong HSP. Resistance and threshold switching voltage drift behavior in phase-change memory and their temperature dependence at microsecond time scales studied using a micro-thermal stage Ieee Transactions On Electron Devices. 58: 584-592. DOI: 10.1109/Ted.2010.2095502 |
0.396 |
|
| 2011 |
Li Z, Lee J, Reifenberg JP, Asheghi M, Jeyasingh RGD, Wong HSP, Goodson KE. Grain boundaries, phase impurities, and anisotropic thermal conduction in phase-change memory Ieee Electron Device Letters. 32: 961-963. DOI: 10.1109/Led.2011.2150193 |
0.448 |
|
| 2011 |
Lee J, Kim S, Jeyasingh R, Asheghi M, Wong HSP, Goodson KE. Microthermal stage for electrothermal characterization of phase-change memory Ieee Electron Device Letters. 32: 952-954. DOI: 10.1109/Led.2011.2144952 |
0.532 |
|
| 2011 |
Bozorg-Grayeli E, Li Z, Asheghi M, Delgado G, Pokrovsky A, Panzer M, Wack D, Goodson KE. High temperature thermal properties of thin tantalum nitride films Applied Physics Letters. 99. DOI: 10.1063/1.3672098 |
0.548 |
|
| 2011 |
Ahn C, Lee B, Jeyasingh RGD, Asheghi M, Hurkx GAM, Goodson KE, Philip Wong HS. Crystallization properties and their drift dependence in phase-change memory studied with a micro-thermal stage Journal of Applied Physics. 110. DOI: 10.1063/1.3667295 |
0.392 |
|
| 2011 |
Lee J, Li Z, Reifenberg JP, Lee S, Sinclair R, Asheghi M, Goodson KE. Thermal conductivity anisotropy and grain structure in Ge 2Sb2Te5 films Journal of Applied Physics. 109. DOI: 10.1063/1.3573505 |
0.506 |
|
| 2010 |
Li Z, Lee J, Reifenberg JP, Asheghi M, Philip Wong HS, Goodson KE. IN-plane thermal conduction and conductivity anisotropy in Ge 2Sb2Te5 films for phase change memory Asme International Mechanical Engineering Congress and Exposition, Proceedings (Imece). 10: 651-658. DOI: 10.1115/IMECE2010-40459 |
0.347 |
|
| 2010 |
Reifenberg JP, Chang KW, Panzer MA, Kim S, Rowlette JA, Asheghi M, Wong HSP, Goodson KE. Thermal boundary resistance measurements for phase-change memory devices Ieee Electron Device Letters. 31: 56-58. DOI: 10.1109/Led.2009.2035139 |
0.506 |
|
| 2010 |
Lee J, Reifenberg JP, Bozorg-Grayeli E, Hom L, Li Z, Kim S, Asheghi M, Wong HSP, Goodson KE. Decoupled thermal resistances of phase change material and their impact on PCM devices 2010 12th Ieee Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm 2010. DOI: 10.1109/ITHERM.2010.5501412 |
0.315 |
|
| 2009 |
Lee J, Reifenberg JP, Li Z, Hom L, Asheghi M, Kim S, Wong HSP, Goodson KE. Measurement of anisotropy in the thermal conductivity of Ge 2Sb2Te5 films Proceedings - 2009 10th Non-Volatile Memory Technology Symposium, Nvmts 2009. 52-57. DOI: 10.1109/NVMT.2009.5429777 |
0.342 |
|
| 2009 |
Etessam-Yazdani K, Asheghi M, Hamann HF. Experimental Investigation of Scaling Effect on Thermal Transport in Nanoscale Hot Spots Nanoscale and Microscale Thermophysical Engineering. 13: 203-217. DOI: 10.1080/15567260903276908 |
0.5 |
|
| 2009 |
Yang Y, Hamann HF, Asheghi M. Thermal Conductivity Measurements and Modeling of Phase-Change Ge2Sb2Te5Materials Nanoscale and Microscale Thermophysical Engineering. 13: 88-98. DOI: 10.1080/15567260902827909 |
0.533 |
|
| 2008 |
Small E, Sadeghipour SM, Pileggi L, Asheghi M. Thermal analyses of confined cell design for Phase Change Random Access Memory (PCRAM) 2008 11th Ieee Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, I-Therm. 1046-1054. DOI: 10.1109/ITHERM.2008.4544378 |
0.307 |
|
| 2008 |
Ryu HJ, Klein LJ, Asheghi M, Hamann HF. Experimental investigation of nanoscale thermal transport in hotspots at cryogenic temperatures 2008 11th Ieee Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, I-Therm. 925-930. DOI: 10.1109/ITHERM.2008.4544366 |
0.314 |
|
| 2007 |
Zhang S, Rabin Y, Yang Y, Asheghi M. Nanoscale Calorimetry Using a Suspended Bridge Configuration Journal of Microelectromechanical Systems. 16: 861-871. DOI: 10.1109/Jmems.2007.896944 |
0.467 |
|
| 2006 |
Liu W, Etessam-Yazdani K, Hussin R, Asheghi M. Modeling and Data for Thermal Conductivity of Ultrathin Single-Crystal SOI Layers at High Temperature Ieee Transactions On Electron Devices. 53: 1868-1876. DOI: 10.1109/Ted.2006.877874 |
0.531 |
|
| 2006 |
Li P, Pileggi LT, Asheghi M, Chandra R. IC thermal simulation and modeling via efficient multigrid-based approaches Ieee Transactions On Computer-Aided Design of Integrated Circuits and Systems. 25: 1763-1776. DOI: 10.1109/Tcad.2005.858276 |
0.435 |
|
| 2006 |
Lo K, Wenjun L, Pileggi L, Asheghi M. An electronic packaging design for reduction of thermal interface resistance Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 2006: 525-528. DOI: 10.1109/ITHERM.2006.1645389 |
0.41 |
|
| 2006 |
Yang Y, Li C, Sadeghipour SM, Dieker H, Wuttig M, Asheghi M. Thermal characterization of dielectric and phase change materials for the optical recording applications Journal of Applied Physics. 100: 024102. DOI: 10.1063/1.2209723 |
0.77 |
|
| 2006 |
Yang Y, Zhu J, White RM, Asheghi M. Field-dependent thermal and electrical transports in Cu∕CoFe multilayer Journal of Applied Physics. 99: 063703. DOI: 10.1063/1.2174124 |
0.773 |
|
| 2006 |
Small E, Yang Y, Sadeghipour SM, Asheghi M. Simulation of the writing on the patterned optical phase-change recording media Journal of Applied Physics. 99: 033101. DOI: 10.1063/1.2165411 |
0.722 |
|
| 2006 |
Yang Y, Sadeghipour SM, Liu W, Asheghi M, Touzelbaev M. Thermal characterization of the high-thermal-conductivity dielectrics High Thermal Conductivity Materials. 69-118. DOI: 10.1007/0-387-25100-6_3 |
0.385 |
|
| 2005 |
Small E, Sadeghipour SM, Asheghi M. Heat Sinks With Enhanced Heat Transfer Capability for Electronic Cooling Applications Journal of Electronic Packaging. 128: 285-290. DOI: 10.1115/1.2229230 |
0.39 |
|
| 2005 |
Sadeghipour SM, Asheghi M. Rapid Thermal Characterization of the High Thermal Conductivity Film Layers by the Film-on Substrate Technique Journal of Electronic Packaging. 128: 125-129. DOI: 10.1115/1.2165213 |
0.539 |
|
| 2005 |
Yang Y, White RM, Asheghi M. Thermal Characterization of Cu∕CoFe Multilayer for Giant Magnetoresistive Head Applications Journal of Heat Transfer. 128: 113-120. DOI: 10.1115/1.2136916 |
0.775 |
|
| 2005 |
Liu W, Asheghi M. Thermal Conductivity Measurements of Ultra-Thin Single Crystal Silicon Layers Journal of Heat Transfer. 128: 75-83. DOI: 10.1115/1.2130403 |
0.552 |
|
| 2005 |
Liu W, Asheghi M. Thermal conduction in ultrathin pure and doped single-crystal silicon layers at high temperatures Journal of Applied Physics. 98: 123523. DOI: 10.1063/1.2149497 |
0.537 |
|
| 2005 |
Behkam B, Yang Y, Asheghi M. Thermal property measurement of thin aluminum oxide layers for giant magnetoresistive (GMR) head applications International Journal of Heat and Mass Transfer. 48: 2023-2031. DOI: 10.1016/J.Ijheatmasstransfer.2004.12.010 |
0.771 |
|
| 2004 |
Da Silva LW, Kaviany M, Asheghi M. Measured performance of a micro thermoelectric cooler Proceedings of the Asme Heat Transfer/Fluids Engineering Summer Conference 2004, Ht/Fed 2004. 415-422. DOI: 10.1115/Ht-Fed2004-56412 |
0.416 |
|
| 2004 |
Li P, Pileggi LT, Asheghi M, Chandra R. Efficient full-chip thermal modeling and analysis Ieee/Acm International Conference On Computer-Aided Design, Digest of Technical Papers, Iccad. 319-326. DOI: 10.1109/ICCAD.2004.1382594 |
0.307 |
|
| 2004 |
Liu W, Asheghi M. Phonon–boundary scattering in ultrathin single-crystal silicon layers Applied Physics Letters. 84: 3819-3821. DOI: 10.1063/1.1741039 |
0.546 |
|
| 2004 |
Yang Y, Liu W, Asheghi M. Thermal and electrical characterization of Cu/CoFe superlattices Applied Physics Letters. 84: 3121-3123. DOI: 10.1063/1.1713033 |
0.453 |
|
| 2004 |
Yang Y, Shojaeizadeh S, Bain JA, Zhu JG, Asheghi M. Detailed modeling of temperature rise in giant magnetoresistive sensor during an electrostatic discharge event Journal of Applied Physics. 95: 6780-6782. DOI: 10.1063/1.1652426 |
0.743 |
|
| 2002 |
Zhang L, Koo J, Jiang L, Asheghi M, Goodson KE, Santiago JG, Kenny TW. Measurements and modeling of two-phase flow in microchannels with nearly constant heat flux boundary conditions Ieee\/Asme Journal of Microelectromechanical Systems. 11: 12-19. DOI: 10.1109/84.982858 |
0.367 |
|
| 2002 |
Asheghi M, Kurabayashi K, Kasnavi R, Goodson KE. Thermal conduction in doped single-crystal silicon films Journal of Applied Physics. 91: 5079-5088. DOI: 10.1063/1.1458057 |
0.504 |
|
| 2001 |
Sverdrup PG, Sinha S, Asheghi M, Uma S, Goodson KE. Measurement of ballistic phonon conduction near hotspots in silicon Applied Physics Letters. 78: 3331-3333. DOI: 10.1063/1.1371536 |
0.465 |
|
| 2001 |
Uma S, McConnell AD, Asheghi M, Kurabayashi K, Goodson KE. Temperature-dependent thermal conductivity of undoped polycrystalline silicon layers International Journal of Thermophysics. 22: 605-616. DOI: 10.1023/A:1010791302387 |
0.542 |
|
| 1999 |
Kurabayashi K, Asheghi M, Touzelbaev M, Goodson KE. Measurement of the thermal conductivity anisotropy in polyimide films Journal of Microelectromechanical Systems. 8: 180-191. DOI: 10.1109/84.767114 |
0.45 |
|
| 1999 |
Chui BW, Asheghi M, Ju YS, Goodson KE, Kenny TW, Mamin HJ. Intrinsic-Carrier Thermal Runaway In Silicon Microcantilevers Microscale Thermophysical Engineering. 3: 217-228. DOI: 10.1080/108939599199765 |
0.506 |
|
| 1998 |
Asheghi M, Touzelbaev MN, Goodson KE, Leung YK, Wong SS. Temperature-Dependent Thermal Conductivity of Single-Crystal Silicon Layers in SOI Substrates Journal of Heat Transfer. 120: 30-36. DOI: 10.1115/1.2830059 |
0.548 |
|
| 1997 |
Asheghi M, Leung YK, Wong SS, Goodson KE. Phonon-boundary scattering in thin silicon layers Applied Physics Letters. 71: 1798-1800. DOI: 10.1063/1.119402 |
0.499 |
|
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