Year |
Citation |
Score |
2021 |
Park J, Bae K, Kim TR, Perez C, Sood A, Asheghi M, Goodson KE, Park W. Direct Quantification of Heat Generation Due to Inelastic Scattering of Electrons Using a Nanocalorimeter. Advanced Science (Weinheim, Baden-Wurttemberg, Germany). 8: 2002876. PMID 33552867 DOI: 10.1002/advs.202002876 |
0.52 |
|
2020 |
Kim Y, Kwon H, Han HS, Kim HK, Kim B, Lee BC, Lee J, Asheghi M, Prinz FB, Goodson KE, Lim J, Sim U, Park W. Tunable Dielectric and Thermal Properties of Oxide Dielectrics via Substrate Biasing in Plasma Enhanced Atomic Layer Deposition. Acs Applied Materials & Interfaces. PMID 32915545 DOI: 10.1021/acsami.0c11086 |
0.52 |
|
2019 |
Sood A, Xiong F, Chen S, Cheaito R, Lian F, Asheghi M, Cui Y, Donadio D, Goodson KE, Pop E. Quasi-Ballistic Thermal Transport Across MoS Thin Films. Nano Letters. PMID 30808167 DOI: 10.1021/acs.nanolett.8b05174 |
0.52 |
|
2018 |
Zhang C, Palko JW, Rong G, Pringle KS, Barako MT, Dusseault TJ, Asheghi M, Santiago JG, Goodson KE. Tailoring permeability of microporous copper structures through template sintering. Acs Applied Materials & Interfaces. PMID 30096232 DOI: 10.1021/acsami.8b03774 |
0.52 |
|
2018 |
Rong G, Palko JW, Oyarzun DI, Zhang C, Hämmerle J, Asheghi M, Goodson KE, Santiago JG. A method for quantifying in plane permeability of porous thin films. Journal of Colloid and Interface Science. 530: 667-674. PMID 30007196 DOI: 10.1016/j.jcis.2018.05.062 |
0.52 |
|
2018 |
Park W, Sohn J, Romano G, Kodama T, Sood A, Katz JS, Kim BSY, So H, Ahn EC, Asheghi M, Kolpak AM, Goodson KE. Impact of thermally dead volume on phonon conduction along silicon nanoladders. Nanoscale. PMID 29873370 DOI: 10.1039/c8nr01788c |
0.52 |
|
2018 |
Sood A, Cheaito R, Bai T, Kwon H, Wang Y, Li C, Yates L, Bougher T, Graham S, Asheghi M, Goorsky M, Goodson KE. Direct Visualization of Thermal Conductivity Suppression Due to Enhanced Phonon Scattering Near Individual Grain Boundaries. Nano Letters. PMID 29631399 DOI: 10.1021/acs.nanolett.8b00534 |
0.52 |
|
2017 |
Park W, Kodama T, Park J, Cho J, Sood A, Barako MT, Asheghi M, Goodson KE. Thermal Conduction across Metal-Dielectric Sidewall Interfaces. Acs Applied Materials & Interfaces. PMID 28786284 DOI: 10.1021/acsami.7b06567 |
0.52 |
|
2017 |
Park W, Romano G, Ahn EC, Kodama T, Park J, Barako MT, Sohn J, Kim SJ, Cho J, Marconnet AM, Asheghi M, Kolpak AM, Goodson KE. Phonon Conduction in Silicon Nanobeam Labyrinths. Scientific Reports. 7: 6233. PMID 28740212 DOI: 10.1038/s41598-017-06479-3 |
0.52 |
|
2016 |
Barako MT, Sood A, Zhang C, Wang J, Kodama T, Asheghi M, Zheng X, Braun PV, Goodson KE. Quasi-ballistic Electronic Thermal Conduction in Metal Inverse Opals. Nano Letters. PMID 26986050 DOI: 10.1021/acs.nanolett.6b00468 |
0.52 |
|
2016 |
Chaparala S, Gupta A, Asheghi M, Suhling J, Ikeda T, Luo X. Special section on InterPACK 2015 Journal of Electronic Packaging, Transactions of the Asme. 138. DOI: 10.1115/1.4032748 |
0.64 |
|
2016 |
Lee H, Agonafer DD, Won Y, Houshmand F, Gorle C, Asheghi M, Goodson KE. Thermal modeling of extreme heat flux microchannel coolers for GaN-on-SiC semiconductor devices Journal of Electronic Packaging, Transactions of the Asme. 138. DOI: 10.1115/1.4032655 |
0.64 |
|
2016 |
Palko JW, Lee H, Agonafer DD, Zhang C, Jung KW, Moss J, Wilbur JD, Dusseault TJ, Barako MT, Houshmand F, Rong G, Maitra T, Gorle C, Won Y, Rockosi D, ... ... Asheghi M, et al. High heat flux two-phase cooling of electronics with integrated diamond/porous copper heat sinks and microfluidic coolant supply Proceedings of the 15th Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm 2016. 1511-1517. DOI: 10.1109/ITHERM.2016.7517728 |
0.64 |
|
2016 |
Cornett J, Lane B, Dunham M, Asheghi M, Goodson K, Gao Y, Sun N, Chen B. Chip-scale thermal energy harvester using Bi2Te3 Iecon 2015 - 41st Annual Conference of the Ieee Industrial Electronics Society. 3326-3329. DOI: 10.1109/IECON.2015.7392612 |
0.64 |
|
2016 |
Cornett J, Chen B, Haidar S, Berney H, McGuinness P, Lane B, Gao Y, He Y, Sun N, Dunham M, Asheghi M, Goodson K, Yuan Y, Najafi K. Fabrication and Characterization of Bi2Te3-Based Chip-Scale Thermoelectric Energy Harvesting Devices Journal of Electronic Materials. 1-3. DOI: 10.1007/s11664-016-4992-5 |
0.64 |
|
2015 |
Ahn C, Fong SW, Kim Y, Lee S, Sood A, Neumann CM, Asheghi M, Goodson KE, Pop E, Wong HP. Energy-Efficient Phase-Change Memory with Graphene as Thermal Barrier. Nano Letters. PMID 26308280 DOI: 10.1021/acs.nanolett.5b02661 |
0.64 |
|
2015 |
Barako MT, Roy-Panzer S, English TS, Kodama T, Asheghi M, Kenny TW, Goodson KE. Thermal Conduction in Vertically Aligned Copper Nanowire Arrays and Composites. Acs Applied Materials & Interfaces. 7: 19251-9. PMID 26284489 DOI: 10.1021/acsami.5b05147 |
0.64 |
|
2015 |
Roy-Panzer S, Kodama T, Lingamneni S, Panzer MA, Asheghi M, Goodson KE. Thermal characterization and analysis of microliter liquid volumes using the three-omega method. The Review of Scientific Instruments. 86: 024901. PMID 25725871 DOI: 10.1063/1.4907353 |
0.64 |
|
2015 |
Houshmand F, Lee H, Asheghi M, Goodson KE. High heat flux subcooled flow boiling of methanol in microtubes Asme 2015 International Technical Conference and Exhibition On Packaging and Integration of Electronic and Photonic Microsystems, Interpack 2015, Collocated With the Asme 2015 13th International Conference On Nanochannels, Microchannels, and Minichannels. 3. DOI: 10.1115/IPACK2015-48734 |
0.64 |
|
2015 |
Lee H, Won Y, Houshmand F, Gorle C, Asheghi M, Goodson KE. Computational modeling of extreme heat flux microcooler for GaN-based HEMT Asme 2015 International Technical Conference and Exhibition On Packaging and Integration of Electronic and Photonic Microsystems, Interpack 2015, Collocated With the Asme 2015 13th International Conference On Nanochannels, Microchannels, and Minichannels. 2. DOI: 10.1115/IPACK2015-48670 |
0.64 |
|
2015 |
Liu T, Houshmand F, Gorle C, Scholl S, Lee H, Won Y, Asheghi M, Goodson K, Kazemi H, Vanhille K. Full scale simulation of an integrated monolithic heat sink for thermal management of a high power density gan-SiC chip Asme 2015 International Technical Conference and Exhibition On Packaging and Integration of Electronic and Photonic Microsystems, Interpack 2015, Collocated With the Asme 2015 13th International Conference On Nanochannels, Microchannels, and Minichannels. 1. DOI: 10.1115/IPACK2015-48592 |
0.64 |
|
2015 |
Dowling KM, Suria AJ, Won Y, Shankar A, Lee H, Asheghi M, Goodson KE, Senesky DG. Inductive coupled plasma etching of high aspect ratio silicon carbide microchannels for localized cooling Asme 2015 International Technical Conference and Exhibition On Packaging and Integration of Electronic and Photonic Microsystems, Interpack 2015, Collocated With the Asme 2015 13th International Conference On Nanochannels, Microchannels, and Minichannels. 3. DOI: 10.1115/IPACK2015-48409 |
0.64 |
|
2015 |
Zhang C, Rong G, Palko JW, Dusseault TJ, Asheghi M, Santiago JG, Goodson KE. Tailoring of permeability in copper inverse opal for electronic cooling applications Asme 2015 International Technical Conference and Exhibition On Packaging and Integration of Electronic and Photonic Microsystems, Interpack 2015, Collocated With the Asme 2015 13th International Conference On Nanochannels, Microchannels, and Minichannels. 2. DOI: 10.1115/IPACK2015-48262 |
0.64 |
|
2015 |
Gorlé C, Lee H, Houshmand F, Asheghi M, Goodson K, Parida PR. Validation study for VOF simulations of boiling in a microchannel Asme 2015 International Technical Conference and Exhibition On Packaging and Integration of Electronic and Photonic Microsystems, Interpack 2015, Collocated With the Asme 2015 13th International Conference On Nanochannels, Microchannels, and Minichannels. 3. DOI: 10.1115/IPACK2015-48129 |
0.64 |
|
2015 |
Scholl S, Gorle C, Houshmand F, Asheghi M, Goodson K, Verstraete T. Numerical optimization of advanced monolithic micro coolers for high heat flux microelectronics Asme 2015 International Technical Conference and Exhibition On Packaging and Integration of Electronic and Photonic Microsystems, Interpack 2015, Collocated With the Asme 2015 13th International Conference On Nanochannels, Microchannels, and Minichannels. 3. DOI: 10.1115/IPACK2015-48123 |
0.64 |
|
2015 |
Scholl S, Gorle C, Houshmand F, Liu T, Lee H, Won Y, Asheghi M, Goodson K, Kazemi H. Numerical simulation of advanced monolithic microcooler designs for high heat flux microelectronics Asme 2015 International Technical Conference and Exhibition On Packaging and Integration of Electronic and Photonic Microsystems, Interpack 2015, Collocated With the Asme 2015 13th International Conference On Nanochannels, Microchannels, and Minichannels. 2. DOI: 10.1115/IPACK2015-48122 |
0.64 |
|
2015 |
Cho J, Francis D, Chao PC, Asheghi M, Goodson KE. Cross-plane phonon conduction in polycrystalline silicon films Journal of Heat Transfer. 137. DOI: 10.1115/1.4029820 |
0.64 |
|
2015 |
Won Y, Cho J, Agonafer D, Asheghi M, Goodson KE. Fundamental Cooling Limits for High Power Density Gallium Nitride Electronics Ieee Transactions On Components, Packaging and Manufacturing Technology. DOI: 10.1109/TCPMT.2015.2433132 |
0.64 |
|
2015 |
Palko JW, Zhang C, Wilbur JD, Dusseault TJ, Asheghi M, Goodson KE, Santiago JG. Approaching the limits of two-phase boiling heat transfer: High heat flux and low superheat Applied Physics Letters. 107. DOI: 10.1063/1.4938202 |
0.64 |
|
2015 |
Dunham MT, Barako MT, LeBlanc S, Asheghi M, Chen B, Goodson KE. Power density optimization for micro thermoelectric generators Energy. 93: 2006-2017. DOI: 10.1016/j.energy.2015.10.032 |
0.64 |
|
2014 |
Jeyasingh R, Fong SW, Lee J, Li Z, Chang KW, Mantegazza D, Asheghi M, Goodson KE, Wong HS. Ultrafast characterization of phase-change material crystallization properties in the melt-quenched amorphous phase. Nano Letters. 14: 3419-26. PMID 24798660 DOI: 10.1021/nl500940z |
0.64 |
|
2014 |
Barako MT, Gao Y, Won Y, Marconnet AM, Asheghi M, Goodson KE. Reactive metal bonding of carbon nanotube arrays for thermal interface applications Ieee Transactions On Components, Packaging and Manufacturing Technology. 4: 1906-1913. DOI: 10.1109/TCPMT.2014.2369371 |
0.64 |
|
2014 |
Vasquez Guzman PA, Sood A, Mleczko MJ, Wang B, Wong Philip HS, Nishi Y, Asheghi M, Goodson KE. Cross plane thermal conductance of graphene-metal interfaces Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 1385-1389. DOI: 10.1109/ITHERM.2014.6892441 |
0.64 |
|
2014 |
Harrison KL, Dalvi C, Asheghi M, Howe RT. Analysis of asperity dominated contacts in nanoelectromechanical relays using thin films Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 1256-1260. DOI: 10.1109/ITHERM.2014.6892425 |
0.64 |
|
2014 |
Sood A, Cho J, Hobart KD, Feygelson T, Pate B, Asheghi M, Goodson KE. Anisotropic and nonhomogeneous thermal conduction in 1 μm thick CVD diamond Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 1192-1198. DOI: 10.1109/ITHERM.2014.6892415 |
0.64 |
|
2014 |
Cho J, Chu KK, Chao PC, McGray C, Asheghi M, Goodson KE. Thermal conduction normal to thin silicon nitride films on diamond and GaN Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 1186-1191. DOI: 10.1109/ITHERM.2014.6892414 |
0.64 |
|
2014 |
Lingamneni S, Asheghi M, Goodson KE. A parametric study of Microporous Metal Matrix-Phase Change Material composite heat spreaders for transient thermal applications Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 870-875. DOI: 10.1109/ITHERM.2014.6892372 |
0.64 |
|
2014 |
Sood A, Eryilmaz SB, Jeyasingh R, Cho J, Asheghi M, Wong HSP, Goodson KE. Thermal characterization of nanostructured superlattices of TiN/TaN: Applications as electrodes in phase change memory Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 765-770. DOI: 10.1109/ITHERM.2014.6892358 |
0.64 |
|
2014 |
Dusseault TJ, Gires J, Barako MT, Won Y, Agonafer DD, Asheghi M, Santiago JG, Goodson KE. Inverse opals for fluid delivery in electronics cooling systems Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 750-755. DOI: 10.1109/ITHERM.2014.6892356 |
0.64 |
|
2014 |
Fong SW, Jeyasingh R, Asheghi M, Goodson KE, Wong HSP. Characterization of phase-change layer thermal properties using a micro-thermal stage Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 744-749. DOI: 10.1109/ITHERM.2014.6892355 |
0.64 |
|
2014 |
Barako MT, Weisse JM, Roy S, Kodama T, Dusseault TJ, Motoyama M, Asheghi M, Prinz FB, Zheng X, Goodson KE. Thermal conduction in nanoporous copper inverse opal films Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 736-743. DOI: 10.1109/ITHERM.2014.6892354 |
0.64 |
|
2014 |
Park W, Marconnet AM, Kodama T, Park J, Sinclair R, Asheghi M, Goodson KE. Phonon thermal conduction in periodically porous silicon nanobeams Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 637-640. DOI: 10.1109/ITHERM.2014.6892341 |
0.64 |
|
2014 |
Won Y, Barako MT, Agonafer DD, Asheghi M, Goodson KE. Mechanical and thermal properties of copper inverse opals for two-phase convection enhancement Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 326-332. DOI: 10.1109/ITHERM.2014.6892299 |
0.64 |
|
2014 |
Agonafer DD, Lopez K, Won Y, Palko J, Asheghi M, Santiago JG, Goodson KE. Phase-separation of wetting fluids using nanoporous alumina membranes and micro-glass capillaries Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 306-316. DOI: 10.1109/ITHERM.2014.6892297 |
0.64 |
|
2014 |
Cho J, Won Y, Francis D, Asheghi M, Goodson KE. Thermal interface resistance measurements for GaN-on-diamond composite substrates Technical Digest - Ieee Compound Semiconductor Integrated Circuit Symposium, Csic. DOI: 10.1109/CSICS.2014.6978583 |
0.64 |
|
2014 |
Agonafer DD, Palko J, Won Y, Lopez K, Dusseault T, Gires J, Asheghi M, Santiago JG, Goodson KE. Progress on phase separation microfluidics Technical Digest - Ieee Compound Semiconductor Integrated Circuit Symposium, Csic. DOI: 10.1109/CSICS.2014.6978575 |
0.64 |
|
2014 |
Won Y, Houshmand F, Agonafer D, Asheghi M, Goodson KE. Microfluidic heat exchangers for high power density GaN on SiC Technical Digest - Ieee Compound Semiconductor Integrated Circuit Symposium, Csic. DOI: 10.1109/CSICS.2014.6978568 |
0.64 |
|
2014 |
Cho J, Li Y, Hoke WE, Altman DH, Asheghi M, Goodson KE. Phonon scattering in strained transition layers for GaN heteroepitaxy Physical Review B - Condensed Matter and Materials Physics. 89. DOI: 10.1103/PhysRevB.89.115301 |
0.64 |
|
2014 |
Sood A, Rowlette JA, Caneau CG, Bozorg-Grayeli E, Asheghi M, Goodson KE. Thermal conduction in lattice-matched superlattices of InGaAs/InAlAs Applied Physics Letters. 105. DOI: 10.1063/1.4892575 |
0.64 |
|
2013 |
Lee J, Kodama T, Won Y, Asheghi M, Goodson KE. Impact of annealing on the thermoelectric properties Ge 2Sb2Te5 films Materials Research Society Symposium Proceedings. 1490: 223-228. DOI: 10.1557/opl.2012.1573 |
0.64 |
|
2013 |
Cho J, Chao PC, Asheghi M, Goodson KE. Conduction normal to polysilicon films on diamond Asme 2013 4th International Conference On Micro/Nanoscale Heat and Mass Transfer, Mnhmt 2013. DOI: 10.1115/MNHMT2013-22171 |
0.64 |
|
2013 |
Roy S, Kodama T, Lingamneni S, Panzer MA, Asheghi M, Goodson KE. Towards thermal characterization of pico-liter volumes using the 3omega method Asme International Mechanical Engineering Congress and Exposition, Proceedings (Imece). 8. DOI: 10.1115/IMECE2013-66428 |
0.64 |
|
2013 |
Marconnet AM, Asheghi M, Goodson KE. From the Casimir limit to phononic crystals: 20 years of phonon transport studies using silicon-on-insulator technology Journal of Heat Transfer. 135. DOI: 10.1115/1.4023577 |
0.64 |
|
2013 |
Cho J, Li Z, Bozorg-Grayeli E, Kodama T, Francis D, Ejeckam F, Faili F, Asheghi M, Goodson KE. Improved thermal interfaces of GaN-Diamond composite substrates for HEMT applications Ieee Transactions On Components, Packaging and Manufacturing Technology. 3: 79-85. DOI: 10.1109/TCPMT.2012.2223818 |
0.64 |
|
2013 |
Won Y, Cho J, Agonafer D, Asheghi M, Goodson KE. Cooling limits for GaN HEMT technology Technical Digest - Ieee Compound Semiconductor Integrated Circuit Symposium, Csic. DOI: 10.1109/CSICS.2013.6659222 |
0.64 |
|
2013 |
Lee J, Bozorg-Grayeli E, Kim S, Asheghi M, Philip Wong HS, Goodson KE. Phonon and electron transport through Ge2Sb2Te 5 films and interfaces bounded by metals Applied Physics Letters. 102. DOI: 10.1063/1.4807141 |
0.64 |
|
2013 |
Bozorg-Grayeli E, Sood A, Asheghi M, Gambin V, Sandhu R, Feygelson TI, Pate BB, Hobart K, Goodson KE. Thermal conduction inhomogeneity of nanocrystalline diamond films by dual-side thermoreflectance Applied Physics Letters. 102. DOI: 10.1063/1.4796168 |
0.64 |
|
2013 |
Barako MT, Park W, Marconnet AM, Asheghi M, Goodson KE. Thermal cycling, mechanical degradation, and the effective figure of merit of a thermoelectric module Journal of Electronic Materials. 42: 372-381. DOI: 10.1007/s11664-012-2366-1 |
0.64 |
|
2012 |
Li Z, Tan S, Bozorg-Grayeli E, Kodama T, Asheghi M, Delgado G, Panzer M, Pokrovsky A, Wack D, Goodson KE. Phonon dominated heat conduction normal to Mo/Si multilayers with period below 10 nm. Nano Letters. 12: 3121-6. PMID 22563928 DOI: 10.1021/nl300996r |
0.64 |
|
2012 |
Lee J, Asheghi M, Goodson KE. Impact of thermoelectric phenomena on phase-change memory performance metrics and scaling. Nanotechnology. 23: 205201. PMID 22543873 DOI: 10.1088/0957-4484/23/20/205201 |
0.64 |
|
2012 |
Ahn C, Lee B, Jeyasingh RGD, Asheghi M, Hurkx F, Goodson KE, Wong HSP. Effect of resistance drift on the activation energy for crystallization in phase change memory Japanese Journal of Applied Physics. 51. DOI: 10.1143/JJAP.51.02BD06 |
0.64 |
|
2012 |
Li Z, Jeyasingh RGD, Lee J, Asheghi M, Wong HSP, Goodson KE. Electrothermal modeling and design strategies for multibit phase change memory Asme 2012 3rd International Conference On Micro/Nanoscale Heat and Mass Transfer, Mnhmt 2012. 777-783. DOI: 10.1115/MNHMT2012-75129 |
0.64 |
|
2012 |
Lee J, Kodama T, Won Y, Asheghi M, Goodson KE. Thermoelectric characterization of Ge2Sb2Te 5 films for phase-change memory Asme 2012 3rd International Conference On Micro/Nanoscale Heat and Mass Transfer, Mnhmt 2012. 687-693. DOI: 10.1115/MNHMT2012-75092 |
0.64 |
|
2012 |
Li Z, Tan S, Kodama T, Bozorg-Grayeli E, Asheghi M, Goodson KE. Electron-phonon coupled two-dimensional heat transfer in nanoscale metal/dielectric multilayers Asme 2012 Heat Transfer Summer Conf. Collocated With the Asme 2012 Fluids Engineering Div. Summer Meeting and the Asme 2012 10th Int. Conf. On Nanochannels, Microchannels and Minichannels, Ht 2012. 1: 579-587. DOI: 10.1115/HT2012-58350 |
0.64 |
|
2012 |
Li Z, Jeyasingh RGD, Lee J, Asheghi M, Wong HSP, Goodson KE. Electrothermal modeling and design strategies for multibit phase-change memory Ieee Transactions On Electron Devices. 59: 3561-3567. DOI: 10.1109/TED.2012.2219311 |
0.64 |
|
2012 |
Cho J, Bozorg-Grayeli E, Altman DH, Asheghi M, Goodson KE. Low thermal resistances at GaN-SiC interfaces for HEMT technology Ieee Electron Device Letters. 33: 378-380. DOI: 10.1109/LED.2011.2181481 |
0.64 |
|
2012 |
Lee J, Kim S, Marconnet A, In'T Zandt MAA, Asheghi M, Philip Wong HSP, Goodson KE. Thermoelectric characterization and power generation using a silicon-on-insulator substrate Journal of Microelectromechanical Systems. 21: 4-6. DOI: 10.1109/JMEMS.2011.2175704 |
0.64 |
|
2012 |
Hom L, Durieux A, Miler J, Asheghi M, Ramani K, Goodson KE. Calibration methodology for interposing liquid coolants for infrared thermography of microprocessors Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm. 1412-1419. DOI: 10.1109/ITHERM.2012.6231585 |
0.64 |
|
2012 |
Barako MT, Gao Y, Marconnet AM, Asheghi M, Goodson KE. Solder-bonded carbon nanotube thermal interface materials Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm. 1225-1233. DOI: 10.1109/ITHERM.2012.6231562 |
0.64 |
|
2012 |
Bozorg-Grayeli E, Li Z, Gambin V, Asheghi M, Goodson KE. Thermal conductivity, anisotropy, and interface resistances of diamond on poly-AlN Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm. 1059-1064. DOI: 10.1109/ITHERM.2012.6231541 |
0.64 |
|
2012 |
Cho J, Li Z, Bozorg-Grayeli E, Kodama T, Francis D, Ejeckam F, Faili F, Asheghi M, Goodson KE. Thermal characterization of GaN-on-diamond substrates for HEMT applications Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm. 435-439. DOI: 10.1109/ITHERM.2012.6231463 |
0.64 |
|
2012 |
Kodama T, Park W, Marconnet A, Lee J, Asheghi M, Goodson KE. In-plane thermal conductivity measurement on nanoscale conductive materials with on-substrate device configuration Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm. 250-255. DOI: 10.1109/ITHERM.2012.6231437 |
0.64 |
|
2012 |
Aminfar A, Bozorg Grayeli E, Asheghi M, Goodson KE. Analysis of HEMT multilayered structures using a 2D finite volume model Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm. 224-234. DOI: 10.1109/ITHERM.2012.6231434 |
0.64 |
|
2012 |
Park W, Barako MT, Marconnet AM, Asheghi M, Goodson KE. Effect of thermal cycling on commercial thermoelectric modules Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm. 107-112. DOI: 10.1109/ITHERM.2012.6231420 |
0.64 |
|
2012 |
Barako MT, Park W, Marconnet AM, Asheghi M, Goodson KE. A reliability study with infrared imaging of thermoelectric modules under thermal cycling Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm. 86-92. DOI: 10.1109/ITHERM.2012.6231417 |
0.64 |
|
2012 |
Marconnet AM, Motoyama M, Barako MT, Gao Y, Pozder S, Fowler B, Ramakrishna K, Mortland G, Asheghi M, Goodson KE. Nanoscale conformable coatings for enhanced thermal conduction of carbon nanotube films Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm. 15-19. DOI: 10.1109/ITHERM.2012.6231408 |
0.64 |
|
2012 |
Cho J, Li Y, Altman DH, Hoke WE, Asheghi M, Goodson KE. Temperature dependent thermal resistances at GaN-substrate interfaces in GaN composite substrates Technical Digest - Ieee Compound Semiconductor Integrated Circuit Symposium, Csic. DOI: 10.1109/CSICS.2012.6340094 |
0.64 |
|
2012 |
Marconnet AM, Kodama T, Asheghi M, Goodson KE. Phonon conduction in periodically porous silicon nanobridges Nanoscale and Microscale Thermophysical Engineering. 16: 199-219. DOI: 10.1080/15567265.2012.732195 |
0.64 |
|
2012 |
Bozorg-Grayeli E, Li Z, Asheghi M, Delgado G, Pokrovsky A, Panzer M, Wack D, Goodson KE. Thermal conduction properties of Mo/Si multilayers for extreme ultraviolet optics Journal of Applied Physics. 112. DOI: 10.1063/1.4759450 |
0.64 |
|
2012 |
Lee J, Kodama T, Won Y, Asheghi M, Goodson KE. Phase purity and the thermoelectric properties of Ge 2Sb 2Te 5 films down to 25 nm thickness Journal of Applied Physics. 112. DOI: 10.1063/1.4731252 |
0.64 |
|
2012 |
Won Y, Lee J, Asheghi M, Kenny TW, Goodson KE. Phase and thickness dependent modulus of Ge 2Sb 2Te 5 films down to 25 nm thickness Applied Physics Letters. 100. DOI: 10.1063/1.3699227 |
0.64 |
|
2011 |
Kim S, Lee B, Asheghi M, Hurkx F, Reifenberg JP, Goodson KE, Wong HSP. Resistance and threshold switching voltage drift behavior in phase-change memory and their temperature dependence at microsecond time scales studied using a micro-thermal stage Ieee Transactions On Electron Devices. 58: 584-592. DOI: 10.1109/TED.2010.2095502 |
0.64 |
|
2011 |
Li Z, Lee J, Reifenberg JP, Asheghi M, Jeyasingh RGD, Wong HSP, Goodson KE. Grain boundaries, phase impurities, and anisotropic thermal conduction in phase-change memory Ieee Electron Device Letters. 32: 961-963. DOI: 10.1109/LED.2011.2150193 |
0.64 |
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2011 |
Lee J, Kim S, Jeyasingh R, Asheghi M, Wong HSP, Goodson KE. Microthermal stage for electrothermal characterization of phase-change memory Ieee Electron Device Letters. 32: 952-954. DOI: 10.1109/LED.2011.2144952 |
0.64 |
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2011 |
Bozorg-Grayeli E, Li Z, Asheghi M, Delgado G, Pokrovsky A, Panzer M, Wack D, Goodson KE. High temperature thermal properties of thin tantalum nitride films Applied Physics Letters. 99. DOI: 10.1063/1.3672098 |
0.64 |
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2011 |
Ahn C, Lee B, Jeyasingh RGD, Asheghi M, Hurkx GAM, Goodson KE, Philip Wong HS. Crystallization properties and their drift dependence in phase-change memory studied with a micro-thermal stage Journal of Applied Physics. 110. DOI: 10.1063/1.3667295 |
0.64 |
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2011 |
Lee J, Li Z, Reifenberg JP, Lee S, Sinclair R, Asheghi M, Goodson KE. Thermal conductivity anisotropy and grain structure in Ge 2Sb2Te5 films Journal of Applied Physics. 109. DOI: 10.1063/1.3573505 |
0.64 |
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2010 |
Li Z, Lee J, Reifenberg JP, Asheghi M, Philip Wong HS, Goodson KE. IN-plane thermal conduction and conductivity anisotropy in Ge 2Sb2Te5 films for phase change memory Asme International Mechanical Engineering Congress and Exposition, Proceedings (Imece). 10: 651-658. DOI: 10.1115/IMECE2010-40459 |
0.64 |
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2010 |
Reifenberg JP, Chang KW, Panzer MA, Kim S, Rowlette JA, Asheghi M, Wong HSP, Goodson KE. Thermal boundary resistance measurements for phase-change memory devices Ieee Electron Device Letters. 31: 56-58. DOI: 10.1109/LED.2009.2035139 |
0.64 |
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2010 |
Wong HSP, Raoux S, Kim S, Liang J, Reifenberg JP, Rajendran B, Asheghi M, Goodson KE. Phase change memory Proceedings of the Ieee. 98: 2201-2227. DOI: 10.1109/JPROC.2010.2070050 |
0.64 |
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2010 |
Lee J, Reifenberg JP, Bozorg-Grayeli E, Hom L, Li Z, Kim S, Asheghi M, Wong HSP, Goodson KE. Decoupled thermal resistances of phase change material and their impact on PCM devices 2010 12th Ieee Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm 2010. DOI: 10.1109/ITHERM.2010.5501412 |
0.64 |
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2009 |
Lee J, Reifenberg JP, Li Z, Hom L, Asheghi M, Kim S, Wong HSP, Goodson KE. Measurement of anisotropy in the thermal conductivity of Ge 2Sb2Te5 films Proceedings - 2009 10th Non-Volatile Memory Technology Symposium, Nvmts 2009. 52-57. DOI: 10.1109/NVMT.2009.5429777 |
0.64 |
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2008 |
Small E, Sadeghipour SM, Pileggi L, Asheghi M. Thermal analyses of confined cell design for Phase Change Random Access Memory (PCRAM) 2008 11th Ieee Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, I-Therm. 1046-1054. DOI: 10.1109/ITHERM.2008.4544378 |
0.64 |
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2008 |
Ryu HJ, Klein LJ, Asheghi M, Hamann HF. Experimental investigation of nanoscale thermal transport in hotspots at cryogenic temperatures 2008 11th Ieee Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, I-Therm. 925-930. DOI: 10.1109/ITHERM.2008.4544366 |
0.64 |
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2007 |
Yang Y, Zhu J, Jeong T, Asheghi M. Predictions of field-dependent thermal and electrical transport in a Cu/CoFe multilayer 2007 Proceedings of the Asme/Jsme Thermal Engineering Summer Heat Transfer Conference - Ht 2007. 2: 905-909. DOI: 10.1115/HT2007-32831 |
0.64 |
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2006 |
Li P, Pileggi LT, Asheghi M, Chandra R. IC thermal simulation and modeling via efficient multigrid-based approaches Ieee Transactions On Computer-Aided Design of Integrated Circuits and Systems. 25: 1763-1776. DOI: 10.1109/TCAD.2005.858276 |
0.64 |
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2006 |
Sadeghipour SM, Pileggi L, Asheghi M. Phase change random access memory, thermal analysis Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 2006: 660-665. DOI: 10.1109/ITHERM.2006.1645408 |
0.64 |
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2006 |
Lo K, Wenjun L, Pileggi L, Asheghi M. An electronic packaging design for reduction of thermal interface resistance Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 2006: 525-528. DOI: 10.1109/ITHERM.2006.1645389 |
0.64 |
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2006 |
Yang Y, Sadeghipour SM, Liu W, Asheghi M, Touzelbaev M. Thermal characterization of the high-thermal-conductivity dielectrics High Thermal Conductivity Materials. 69-118. DOI: 10.1007/0-387-25100-6_3 |
0.64 |
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2004 |
Asheghi M, Liu W, Goodson KE. Effect of phonon dispersion on transport properties of single-crystalline dielectrics American Society of Mechanical Engineers, Electronic and Photonic Packaging, Epp. 4: 113-123. DOI: 10.1115/IMECE2004-62244 |
0.64 |
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2004 |
Li P, Pileggi LT, Asheghi M, Chandra R. Efficient full-chip thermal modeling and analysis Ieee/Acm International Conference On Computer-Aided Design, Digest of Technical Papers, Iccad. 319-326. DOI: 10.1109/ICCAD.2004.1382594 |
0.64 |
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2004 |
Yang Y, Shojaeizadeh S, Bain JA, Zhu JG, Asheghi M. Detailed modeling of temperature rise in giant magnetoresistive sensor during an electrostatic discharge event Journal of Applied Physics. 95: 6780-6782. DOI: 10.1063/1.1652426 |
0.64 |
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2002 |
Asheghi M, Yang Y, Sadeghipour SM, Bain JA, Barmak K, Jhon MS, Gellman AJ, Schlesinger E, Zhu JG, White RM. Nanoscale energy transport in information technology research with an application to high-density data storage devices and systems American Society of Mechanical Engineers, Heat Transfer Division, (Publication) Htd. 372: 1-14. DOI: 10.1115/IMECE2002-32110 |
0.64 |
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2001 |
Sverdrup PG, Sinha S, Asheghi M, Uma S, Goodson KE. Measurement of ballistic phonon conduction near hotspots in silicon Applied Physics Letters. 78: 3331-3333. DOI: 10.1063/1.1371536 |
0.64 |
|
2001 |
Uma S, McConnell AD, Asheghi M, Kurabayashi K, Goodson KE. Temperature-dependent thermal conductivity of undoped polycrystalline silicon layers International Journal of Thermophysics. 22: 605-616. DOI: 10.1023/A:1010791302387 |
0.64 |
|
1999 |
Kurabayashi K, Asheghi M, Touzelbaev M, Goodson KE. Measurement of the thermal conductivity anisotropy in polyimide films Journal of Microelectromechanical Systems. 8: 180-191. DOI: 10.1109/84.767114 |
0.64 |
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