Jiangang Du, Ph.D. - Publications

Affiliations: 
2007 Case Western Reserve University, Cleveland Heights, OH, United States 
Area:
Electronics and Electrical Engineering, Materials Science Engineering, Mechanical Engineering

13 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2016 Jiang J, Wang Y, Du J, Yang H, Hao J. Properties of a-C:H:Si thin films deposited by middle-frequency magnetron sputtering Applied Surface Science. 379: 516-522. DOI: 10.1016/j.apsusc.2016.04.014  0.352
2013 Du J, Zorman CA. A polycrystalline SiC-on-Si architecture for capacitive pressure sensing applications beyond 400 °c: Process development and device performance Journal of Materials Research. 28: 120-128. DOI: 10.1557/Jmr.2012.260  0.593
2012 Scott KM, Du J, Lester HA, Masmanidis SC. Variability of acute extracellular action potential measurements with multisite silicon probes. Journal of Neuroscience Methods. 211: 22-30. PMID 22971352 DOI: 10.1016/J.Jneumeth.2012.08.005  0.32
2011 Du J, Blanche TJ, Harrison RR, Lester HA, Masmanidis SC. Multiplexed, high density electrophysiology with nanofabricated neural probes. Plos One. 6: e26204. PMID 22022568 DOI: 10.1371/Journal.Pone.0026204  0.319
2010 Sadek AS, Karabalin RB, Du J, Roukes ML, Koch C, Masmanidis SC. Wiring nanoscale biosensors with piezoelectric nanomechanical resonators. Nano Letters. 10: 1769-73. PMID 20380440 DOI: 10.1021/Nl100245Z  0.332
2010 Du J, Zorman CA. The process and mechanism of low temperature silicon carbide-to-silicon direct bonding using amorphous hydrogenated silicon carbide films Micro and Nanosystems. 2: 100-107. DOI: 10.2174/1876402911002020100  0.562
2009 Du J, Riedel-Kruse IH, Nawroth JC, Roukes ML, Laurent G, Masmanidis SC. High-resolution three-dimensional extracellular recording of neuronal activity with microfabricated electrode arrays. Journal of Neurophysiology. 101: 1671-8. PMID 19091921 DOI: 10.1152/Jn.90992.2008  0.331
2009 Du J, Roukes ML, Masmanidis SC. Dual-side and three-dimensional microelectrode arrays fabricated from ultra-thin silicon substrates Journal of Micromechanics and Microengineering. 19. DOI: 10.1088/0960-1317/19/7/075008  0.449
2008 Duzhko V, Du J, Zorman CA, Singer KD. Electric field patterning of organic nanoarchitectures with self-assembled molecular fibers Journal of Physical Chemistry C. 112: 12081-12084. DOI: 10.1021/Jp805010K  0.455
2007 Hess A, Parro R, Du J, Dunning J, Scardelletti M, Zorman CA. PECVD silicon carbide as a thin film packaging material for microfabricated neural electrodes Materials Research Society Symposium Proceedings. 1009: 8-13. DOI: 10.1557/Proc-1009-U04-03  0.577
2006 Du J, Singh N, Summers JB, Zorman CA. Development of PECVD SiC for MEMS using 3MS as the precursor Materials Research Society Symposium Proceedings. 911: 283-288. DOI: 10.1557/Proc-0911-B05-28  0.567
2004 Young DJ, Du J, Zorman CA, Ko WH. High-temperature single-crystal 3C-SiC capacitive pressure sensor Ieee Sensors Journal. 4: 464-470. DOI: 10.1109/Jsen.2004.830301  0.552
2004 Du J, Ko WH, Young DJ. Single crystal silicon MEMS fabrication based on smart-cut technique Sensors and Actuators a: Physical. 112: 116-121. DOI: 10.1016/J.Sna.2003.11.027  0.418
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