Jonathan D. Emery, Ph.D.

Affiliations: 
2013 Materials Science and Engineering Northwestern University, Evanston, IL 
Area:
Atomic-scale X-ray studies of gas/solid, liquid/solid and solid/solid interfaces, ultrathin films, membranes, and nanoparticles.
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"Jonathan Emery"
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SNBCP

Parents

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Michael Bedzyk grad student 2013 Northwestern
 (Synchrotron X-ray Studies of Pristine, Intercalated, and Functionalized Epitaxial Graphene on Silicon Carbide(0001).)
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Publications

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Liu P, Zhang Y, Liu C, et al. (2021) Thermal Atomic Layer Deposition of Gold: Mechanistic Insights, Nucleation, and Epitaxy. Acs Applied Materials & Interfaces
Campbell GP, Mannix AJ, Emery JD, et al. (2018) Resolving the chemically discrete structure of synthetic borophene polymorphs. Nano Letters
Kim JJ, Suh HS, Zhou C, et al. (2018) Mechanistic understanding of tungsten oxide in-plane nanostructure growth via sequential infiltration synthesis. Nanoscale
Zeng L, Turrisi R, Fu B, et al. (2018) Measuring Dipole Inversion in Self-Assembled Nano-Dielectric Molecular Layers. Acs Applied Materials & Interfaces
Jurca T, Moody MJ, Henning A, et al. (2017) Low-Temperature Atomic Layer Deposition of MoS2 Films. Angewandte Chemie (International Ed. in English)
Park HJ, So MC, Gosztola DJ, et al. (2016) Layer-by-Layer Assembled Films of Perylene Diimide- and Squaraine-Containing Metal-Organic Framework-like Materials: Solar Energy Capture and Directional Energy Transfer. Acs Applied Materials & Interfaces
Emery JD, Schlepütz CM, Guo P, et al. (2016) Epitaxial Atomic Layer Deposition of Sn-Doped Indium Oxide Crystal Growth and Design. 16: 640-645
Klug JA, Weimer MS, Emery JD, et al. (2015) A modular reactor design for in situ synchrotron x-ray investigation of atomic layer deposition processes. The Review of Scientific Instruments. 86: 113901
Elam JW, Biswas M, Darling SB, et al. (2015) New insights into sequential infiltration synthesis Ecs Transactions. 69: 147-157
Proffit DE, Philippe T, Emery JD, et al. (2015) Thermal stability of amorphous Zn-In-Sn-O films Journal of Electroceramics. 34: 167-174
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