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John Papapolymerou

Affiliations:	2001-2015	Electrical and Computer Engineering	Georgia Institute of Technology, Atlanta, GA
	2015-	Electrical and Computer Engineering	Michigan State University, East Lansing, MI

Area:

RF circuits, antennas, mm-wave/THz circuits, RF packaging, RF MEMS

Website:

https://www.egr.msu.edu/people/profile/jpapapol

Google:

"Ioannis Papapolymerou" OR "John Papapolymerou"

Bio:

aka Ioannis Papapolymerou
https://msu.edu/honoredfaculty/directory/papapolymerou-Ioannis.html
https://ieeexplore.ieee.org/author/37279047700
https://scholar.google.com/citations?user=FUaWcKkAAAAJ&hl=en
https://www.proquest.com/openview/1bca0fec6ff52c4975cb992405cad33c/1

Tree Publications Similar researchers PubMed Report error

Parents

Linda P. B. Katehi	grad student	1999	University of Michigan
(MMIC passive and active structures)

Children

Carlos Alberto Donado Morcillo	research assistant	2008-2012	Georgia Tech
Guizhen Zheng	grad student	2005	Georgia Tech
Cesar A. Lugo	grad student	2006	Georgia Tech
Dane Thompson	grad student	2006	Georgia Tech
Kongpop U-yen	grad student	2006	Georgia Tech
Guoan Wang	grad student	2006	Georgia Tech
Nickolas Kingsley	grad student	2007	Georgia Tech
Peter L. Kirby	grad student	2007	Georgia Tech
Matthew A. Morton	grad student	2007	Georgia Tech
Symeon Nikolaou	grad student	2007	Georgia Tech
Bo Pan	grad student	2008	Georgia Tech
Pavlo Fedorenko	grad student	2009	Georgia Tech
Chung H. Poh	grad student	2011	Georgia Tech
Negar Tavassolian	grad student	2011	Georgia Tech
Arnaud L. Amadjikpe	grad student	2012	Georgia Tech
Eric A. Juntunen	grad student	2012	Georgia Tech
Chad E. Patterson	grad student	2012	Georgia Tech
Michael Thomas Craton	grad student	2016-2020	Michigan State (Physics Tree)

Collaborators

BETA: Related publications

Publications

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Craton MT, Konstantinou X, Albrecht JD, et al. (2020) A Chip-First Microwave Package Using Multimaterial Aerosol Jet Printing Ieee Transactions On Microwave Theory and Techniques. 68: 3418-3427
Craton MT, Albrecht JD, Chahal P, et al. (2020) In Situ Nanocomposite Fabrication for RF Electronics Applications With Additive Manufacturing Ieee Transactions On Microwave Theory and Techniques. 68: 1646-1659
Gjokaj V, Papapolymerou J, Albrecht JD, et al. (2020) A Compact Receive Module in 3-D Printed Vivaldi Antenna Ieee Transactions On Components, Packaging and Manufacturing Technology. 10: 343-346
Oakley C, Albrecht JD, Papapolymerou J, et al. (2019) Low-Loss Aerosol-Jet Printed Wideband Interconnects for Embedded Devices Ieee Transactions On Components, Packaging and Manufacturing Technology. 9: 2305-2313
Gjokaj V, Papapolymerou J, Albrecht JD, et al. (2019) Design and Fabrication of Additively Manufactured Hybrid Rigid-Flex RF Components Ieee Transactions On Components, Packaging and Manufacturing Technology. 9: 779-785
Craton MT, Albrecht JD, Chahal P, et al. (2019) A Chip-First Approach to Millimeter-Wave Circuit Packaging Ieee Microwave and Wireless Components Letters. 29: 116-118
Oakley C, Chahal P, Papapolymerou J, et al. (2017) Fabrication of X-band Oscillator on LCP Substrate Using Aerosol Printing International Symposium On Microelectronics. 2017: 000052-000055
Craton M, Ghazali MIM, Wright B, et al. (2017) 3D Printed Integrated Microfluidic Cooling for High Power RF Applications International Symposium On Microelectronics. 2017: 000675-000680
Pavlidis S, Alexopoulos G, Ulusoy AC, et al. (2017) Encapsulated Organic Package Technology for Wideband Integration of Heterogeneous MMICs Ieee Transactions On Microwave Theory and Techniques. 65: 438-448
Chlieh OL, Papapolymerou J. (2017) Hybrid Integrated Microfluidic Channels on Multilayer Organic Substrate and on Copper for Tuning and Cooling an RF Reconfigurable S-/C-Band GaN-Based Power Amplifier Ieee Transactions On Microwave Theory and Techniques. 65: 156-164

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