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Dereje Agonafer - Publications

Affiliations: 
Mechanical Engineering University of Texas at Arlington, Arlington, TX, United States 
Area:
Mechanical Engineering, Electronics and Electrical Engineering
Website:
https://www.uta.edu/academics/faculty/profile?username=agonafer
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115 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2021 Kasukurthy R, Rachakonda A, Agonafer D. Design and Optimization of Control Strategy to Reduce Pumping Power in Dynamic Liquid Cooling Journal of Electronic Packaging. 143. DOI: 10.1115/1.4049018  0.38
2020 Misrak A, Chauhan T, Rajmane P, Bhandari R, Agonafer D. Impact of Aging on Mechanical Properties of Thermally Conductive Gap Fillers Journal of Electronic Packaging. 142. DOI: 10.1115/1.4045157  0.31
2020 Bansode PV, Shah JM, Gupta G, Agonafer D, Patel H, Roe D, Tufty R. Measurement of the Thermal Performance of a Custom-Build Single-Phase Immersion Cooled Server at Various High and Low Temperatures for Prolonged Time Journal of Electronic Packaging. 142. DOI: 10.1115/1.4045156  0.404
2019 Shah JM, Eiland R, Rajmane P, Siddarth A, Agonafer D, Mulay V. Reliability Considerations for Oil Immersion-Cooled Data Centers Journal of Electronic Packaging. 141: 21007. DOI: 10.1115/1.4042979  0.75
2018 Misrak A, Nguyen L, Kummerl S, Agonafer D. Characterization of Mechanical Properties and Creep Behavior of Woven Glass/Epoxy Substrates by Nanoindentation Journal of Microelectronics and Electronic Packaging. 15: 95-100. DOI: 10.4071/Imaps.654387  0.37
2018 Sahini M, Agonafer D. Thermal Performance Evaluation of a New Close-Coupled Cooling Solution including Cooling Failure Analysis Journal of Microelectronics and Electronic Packaging. 15: 21-34. DOI: 10.4071/Imaps.528113  0.45
2017 Eiland R, Fernandes JE, Nagendran B, Mulay V, Agonafer D. Effectiveness of Rack-Level Fans—Part I: Energy Savings Through Consolidation Journal of Electronic Packaging. 139: 41011. DOI: 10.1115/1.4038235  0.743
2017 Fernandes JE, Eiland R, Nagendran B, Mulay V, Agonafer D. Effectiveness of Rack-Level Fans: Part II - Control Strategies and System Redundancy Journal of Electronic Packaging. 139: 41012. DOI: 10.1115/1.4038014  0.739
2017 Eiland R, Fernandes JE, Vallejo M, Siddarth A, Agonafer D, Mulay V. Thermal Performance and Efficiency of a Mineral Oil Immersed Server Over Varied Environmental Operating Conditions Journal of Electronic Packaging. 139: 41005. DOI: 10.1115/1.4037526  0.323
2016 Lee H, Agonafer DD, Won Y, Houshmand F, Gorle C, Asheghi M, Goodson KE. Thermal modeling of extreme heat flux microchannel coolers for GaN-on-SiC semiconductor devices Journal of Electronic Packaging, Transactions of the Asme. 138. DOI: 10.1115/1.4032655  0.359
2016 Krishnamurthy S, Deshpande A, Islam MM, Agonafer D. Multi design variable optimization of QFN package on thick boards for enhanced board level reliability Proceedings of the 15th Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm 2016. 1546-1550. DOI: 10.1109/ITHERM.2016.7517732  0.309
2015 Sahini M, Gebrehiwot B, Agonafer D, Colapietro R. Thermal modeling of remote radio head units Asme 2015 International Technical Conference and Exhibition On Packaging and Integration of Electronic and Photonic Microsystems, Interpack 2015, Collocated With the Asme 2015 13th International Conference On Nanochannels, Microchannels, and Minichannels. 1. DOI: 10.1115/IPACK2015-48606  0.309
2015 Alkharabsheh S, Fernandes J, Gebrehiwot B, Agonafer D, Ghose K, Ortega A, Joshi Y, Sammakia B. A brief overview of recent developments in thermal management in data centers Journal of Electronic Packaging, Transactions of the Asme. 137. DOI: 10.1115/1.4031326  0.325
2015 Won Y, Cho J, Agonafer D, Asheghi M, Goodson KE. Fundamental Cooling Limits for High Power Density Gallium Nitride Electronics Ieee Transactions On Components, Packaging and Manufacturing Technology. DOI: 10.1109/Tcpmt.2015.2433132  0.33
2015 Mani D, Fernandes J, Eiland R, Agonafer D, Mulay V. Improving ducting to increase cooling performance of high-end web servers subjected to significant thermal shadowing - An experimental and computational study Annual Ieee Semiconductor Thermal Measurement and Management Symposium. 2015: 319-323. DOI: 10.1109/SEMI-THERM.2015.7100180  0.355
2015 Addagatla A, Fernandes J, Mani D, Agonafer D, Mulay V. Effect of warm water cooling for an isolated hybrid liquid cooled server Annual Ieee Semiconductor Thermal Measurement and Management Symposium. 2015: 203-207. DOI: 10.1109/SEMI-THERM.2015.7100161  0.35
2015 Sathyanarayan S, Gebrehiwot B, Sreeram V, Sawant D, Agonafer D, Kannan N, Hoverson J, Kaler M. Steady state CFD modeling of an IT pod and its cooling system Annual Ieee Semiconductor Thermal Measurement and Management Symposium. 2015: 189-194. DOI: 10.1109/SEMI-THERM.2015.7100159  0.324
2014 Mirza F, Naware G, Jain A, Agonafer D. Effect of through-silicon-via joule heating on device performance for low-powered mobile applications Journal of Electronic Packaging, Transactions of the Asme. 136. DOI: 10.1115/1.4028076  0.445
2014 Vasani R, Agonafer D. Numerical simulation of fogging in a square duct A data center perspective Annual Ieee Semiconductor Thermal Measurement and Management Symposium. 45-52. DOI: 10.1109/SEMI-THERM.2014.6892214  0.318
2013 Fernandes J, Ghalambor S, Docca A, Aldham C, Agonafer D, Chenelly E, Chan B, Ellsworth M. Combining computational fluid dynamics (CFD) and flow network modeling (FNM) for design of a multi-chip module (MCM) cold plate Asme 2013 International Technical Conference and Exhibition On Packaging and Integration of Electronic and Photonic Microsystems, Interpack 2013. 2. DOI: 10.1115/IPACK2013-73294  0.79
2013 Ghalambor S, Fernandes JE, Agonafer D, Mulay V. Improving the thermal performance of a forced convection air cooled solution - Part 1: Modification of heat sink assembly Asme 2013 International Technical Conference and Exhibition On Packaging and Integration of Electronic and Photonic Microsystems, Interpack 2013. 2. DOI: 10.1115/IPACK2013-73108  0.812
2013 Fernandes JE, Ghalambor S, Eiland R, Agonafer D, Mulay V. Improving the thermal performance of a forced convection air cooled solution - Part 2: Effect on system-level performance Asme 2013 International Technical Conference and Exhibition On Packaging and Integration of Electronic and Photonic Microsystems, Interpack 2013. 2. DOI: 10.1115/IPACK2013-73107  0.82
2013 Chauhan A, Sammakia B, Afram FF, Ghose K, Refai-Ahmed G, Agonafer D. Solving thermal issues in a three-dimensional-stacked-quad-core processor by microprocessor floor planning, microchannel cooling, and insertion of through-silicon-vias Journal of Electronic Packaging, Transactions of the Asme. 135. DOI: 10.1115/1.4025531  0.378
2013 Ghalambor S, Agonafer D, Haji-Sheikh A. Analytical thermal solution to a nonuniformly powered stack package with contact resistance Journal of Heat Transfer. 135. DOI: 10.1115/1.4024623  0.823
2012 Hirachan A, Agonafer D. Removing the hot-spots in high power devices using the thermoelectric cooler and micro heat pipe Asme International Mechanical Engineering Congress and Exposition, Proceedings (Imece). 9: 1189-1195. DOI: 10.1115/IMECE2012-89998  0.346
2012 Lingampalli S, Mirza F, Raman T, Agonafer D. Performance optimization of multi-core processors using core hopping - Thermal and structural Annual Ieee Semiconductor Thermal Measurement and Management Symposium. 112-117. DOI: 10.1109/STHERM.2012.6188835  0.334
2012 Fernandes J, Ghalambor S, Agonafer D, Kamath V, Schmidt R. Multi-design variable optimization for a fixed pumping power of a water-cooled cold plate for high power electronics applications Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm. 684-692. DOI: 10.1109/ITHERM.2012.6231494  0.814
2012 Mirza F, Raman T, Arif Iftakher Mahmood M, Iqbal SM, Agonafer D. Parametric thermal analysis of TSVs in a 3-D module based on interconnect delay and silicon efficiency Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm. 150-156. DOI: 10.1109/ITHERM.2012.6231425  0.351
2012 Haji-Sheikh A, Ghalambor S, Agonafer D. Estimation of temperature between plates of different footprints by an iterative approach Inverse Problems in Science and Engineering. 20: 841-855. DOI: 10.1080/17415977.2011.653564  0.797
2012 Ghalambor S, Agonafer D, Haji-Sheikh A. Determination of steady state temperature in a two-layer body with different form factors International Journal of Heat and Mass Transfer. 55: 7434-7443. DOI: 10.1016/J.Ijheatmasstransfer.2012.07.030  0.788
2011 Romero D, Nabovati A, Refai-Ahmed G, Sellan DP, Ghalambor S, Shah N, Agonafer D, Amon CH. Enhanced thermal map prediction and floor plan optimization in electronic devices considering sub-continuum thermal effects Asme 2011 Pacific Rim Technical Conference and Exhibition On Packaging and Integration of Electronic and Photonic Systems, Interpack 2011. 2: 241-249. DOI: 10.1115/IPACK2011-52161  0.797
2011 Phan HN, Agonafer D. Thermoelectric cooling analysis using modified-graphical-method for multidimensional-heat-transfer-system Journal of Electronic Packaging, Transactions of the Asme. 133. DOI: 10.1115/1.4004847  0.714
2011 Rodrigo N, Ghalambor S, Haji-Sheikh A, Agonafer D. Analytical thermal model of a generic multi-layer spacerless 3D package Asme 2011 International Mechanical Engineering Congress and Exposition, Imece 2011. 11: 889-896.  0.797
2011 Mirza F, Raman T, Ghalambor S, Bastawros A, Agonafer D. Coupled computational thermal and mechanical analysis of a single chip flip chip module with low-k dielectric medium Asme 2011 International Mechanical Engineering Congress and Exposition, Imece 2011. 11: 353-358.  0.777
2010 Phan HN, Agonafer D. Response time analysis of an active cooling method for 3D-ICs utilizing multidimensional configured thermoelectric coolers Journal of Microelectronics and Electronic Packaging. 7: 73-78. DOI: 10.4071/1551-4897-7.2.73  0.703
2010 Karajgikar S, Mulay V, Agonafer D, Schmidt R. Cooling of data centers using airside economizers Proceedings of the Asme Interpack Conference 2009, Ipack2009. 2: 1001-1007. DOI: 10.1115/InterPACK2009-89356  0.753
2010 Menon AR, Lakhkar N, Karajgikar S, Agonafer D. Mechanical design optimization of a package on package Proceedings of the Asme Interpack Conference 2009, Ipack2009. 2: 177-184. DOI: 10.1115/InterPACK2009-89349  0.709
2010 Lakhkar N, Banerjee A, Refai-Ahmed G, Agonafer D. Multi-objective optimization of graphite heat spreader for portable systems applications Proceedings of the Asme Interpack Conference 2009, Ipack2009. 2: 571-578. DOI: 10.1115/InterPACK2009-89341  0.353
2010 Karajgikar S, Mulay V, Menon A, Agonafer D, Zhang J. Optimization of location of a power cell for energy efficient operation of air cool drives Proceedings of the Asme Interpack Conference 2009, Ipack2009. 2: 815-820. DOI: 10.1115/InterPACK2009-89189  0.735
2010 Karajgikar S, Agonafer D, Ghose K, Sammakia B, Refai-Ahmed G. Development of a numerical model for non-uniformly powered die to improve both thermal and device clock performance Proceedings of the Asme Interpack Conference 2009, Ipack2009. 2: 111-118. DOI: 10.1115/InterPACK2009-89188  0.755
2010 Phan HN, Agonafer D. Thermoelectric cooling analysis using modified graphical method Proceedings of the Asme Interpack Conference 2009, Ipack2009. 2: 33-37. DOI: 10.1115/InterPACK2009-89077  0.68
2010 Poornima Mynampati VN, Iqbal Mariam FA, Muralidharan B, Menon AR, Agonafer D, Hendrix M. Thermally based design optimization of telecommunication shelter Asme International Mechanical Engineering Congress and Exposition, Proceedings (Imece). 4: 421-426. DOI: 10.1115/IMECE2010-40949  0.385
2010 Mirza F, Muralidharan B, Mynampati P, Karajgikar S, Agonafer D. Coupled thermal and structural parametric analysis of TSVs in 3D electronics Asme International Mechanical Engineering Congress and Exposition, Proceedings (Imece). 10: 675-680. DOI: 10.1115/IMECE2010-40803  0.711
2010 Poornima Mynampati VN, Karajgikar S, Sheerah I, Agonafer D, Novotny S, Schmidt R. Rear door heat exchanger cooling performance in telecommunication data centers Asme International Mechanical Engineering Congress and Exposition, Proceedings (Imece). 4: 405-410. DOI: 10.1115/IMECE2010-40659  0.743
2010 Raghu A, Karajgikar S, Agonafer D, Sammakia B, Refai-Ahmed G. Thermal-Aware power migration in many-core processors Asme International Mechanical Engineering Congress and Exposition, Proceedings (Imece). 4: 385-392. DOI: 10.1115/IMECE2010-40232  0.739
2010 Mariam FAI, Mulay V, Karajgikar S, Agonafer D, Hendrix M. Thermal management of telecommunication cabinets using thermoelectric coolers Asme International Mechanical Engineering Congress and Exposition, Proceedings. 9: 1469-1475. DOI: 10.1115/IMECE2009-13136  0.777
2010 Karajgikar S, Sammakia B, Agonafer D, Amon C, Ghose K, Refai-Ahmed G. Effect of relocation of functional units of a non-uniformly powered microprocessor on thermal and device clock performance Asme International Mechanical Engineering Congress and Exposition, Proceedings. 5: 179-184. DOI: 10.1115/IMECE2009-11769  0.752
2010 Muralidharan B, Mariam FAI, Menon AR, Mynampati VNP, Agonafer D, Hendrix M. CFD modeling of environmental system options used for cooling of telecommunication shelters 2010 14th International Heat Transfer Conference, Ihtc 14. 3: 733-740. DOI: 10.1115/IHTC14-23280  0.383
2010 Karajgikar S, Agonafer D, Ghose K, Sammakia B, Amon C, Refai-Ahmed G. Multi-objective optimization to improve both thermal and device performance of a nonuniformly powered micro-architecture Journal of Electronic Packaging, Transactions of the Asme. 132: 0210081-0210088. DOI: 10.1115/1.4001852  0.785
2010 Phan HN, Agonafer D. Experimental analysis model of an active cooling method for 3D-ICs utilizing multidimensional configured thermoelectric coolers Journal of Electronic Packaging, Transactions of the Asme. 132: 0245011-0245014. DOI: 10.1115/1.4001831  0.727
2010 Karajgikar S, Rao S, Sin J, Agonafer D, Chiao JC, Popa D, Stephanou H. Electro-thermal analysis of in-plane micropump Ieee Transactions On Components and Packaging Technologies. 33: 329-339. DOI: 10.1109/Tcapt.2010.2040737  0.775
2010 Phan HN, Agonafer D. Experimental analysis model of an active cooling method for 3D-ICs utilizing a multidimensional configured thermoelectric Annual Ieee Semiconductor Thermal Measurement and Management Symposium. 55-58. DOI: 10.1109/STHERM.2010.5444315  0.701
2010 Muralidharan B, Iqbal Mariam FA, Karajgikar S, Agonafer D, Hendrix M. Energy minimization based fan configuration for double walled telecommunication cabinet with solar load Annual Ieee Semiconductor Thermal Measurement and Management Symposium. 270-277. DOI: 10.1109/STHERM.2010.5444278  0.745
2010 Agonafer KP, Lakhkar N, Agonafer D, Morrison A. Solar shroud design using computational fluid dynamics 2010 12th Ieee Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm 2010. DOI: 10.1109/ITHERM.2010.5501399  0.406
2009 Mulay V, Agonafer D, Schmidt R. Liquid cooling for thermal management of data centers Asme International Mechanical Engineering Congress and Exposition, Proceedings. 6: 95-101. DOI: 10.1115/IMECE2008-68743  0.354
2009 Trivedi A, Agonafer D, Sivanandan D, Hendrix M, Sahrapour A. Compact modeling of a telecommunication cabinet Asme International Mechanical Engineering Congress and Exposition, Proceedings. 10: 1561-1568. DOI: 10.1115/IMECE2008-68134  0.345
2009 Kaisare A, Agonafer D, Haji-Sheikh A, Chrysler G, Mahajan R. Development of analytical model to a temperature distribution of a first level package With a nonuniformly powered die Journal of Electronic Packaging, Transactions of the Asme. 131: 0110051-0110057. DOI: 10.1115/1.3068303  0.806
2009 Menon AR, Karajgikar S, Agonafer D. Thermal design optimization of a package on package Annual Ieee Semiconductor Thermal Measurement and Management Symposium. 329-335. DOI: 10.1109/STHERM.2009.4810784  0.774
2009 Mariam FAI, Raju U, Mulay V, Agonafer D, Sivanandan D, Hendrix M. Thermal design considerations of air-cooled high powered telecommunication cabinets Annual Ieee Semiconductor Thermal Measurement and Management Symposium. 222-227. DOI: 10.1109/STHERM.2009.4810767  0.379
2009 Karajgikar S, Nagaraj V, Agonafer D. Effect of flip chip package architecture on stresses in the bump passivation opening Proceedings - Electronic Components and Technology Conference. 936-942. DOI: 10.1109/ECTC.2009.5074125  0.703
2009 Prakash S, Akberov R, Agonafer D, Armijo AD, Shannon MA. Influence of boundary conditions on sub-millimeter combustion Energy and Fuels. 23: 3549-3557. DOI: 10.1021/Ef900040Q  0.305
2008 Nagaraj V, Karajgikar S, Agonafer D, Pekin S. Bump electromigration and back end design rules Asme International Mechanical Engineering Congress and Exposition, Proceedings. 11: 377-384. DOI: 10.1115/IMECE2007-43766  0.695
2008 Mulay V, Karajgikar S, Agonafer D, Schmidt R, Iyengar M. Parametric study of hybrid cooling solution for thermal management of data centers Asme International Mechanical Engineering Congress and Exposition, Proceedings. 8: 519-526. DOI: 10.1115/IMECE2007-43761  0.777
2008 Kaisare A, Agonafer D, Haji-Sheikh A, Chrysler G, Mahajan R. Development of an analytical model to a temperature distribution of first level package with a non-uniformly powered die Asme International Mechanical Engineering Congress and Exposition, Proceedings. 5: 443-449. DOI: 10.1115/IMECE2007-43736  0.402
2008 Udakeri R, Mulay V, Agonafer D. Comparison of overhead supply and underfloor supply with rear heat exchanger in high density data center clusters Annual Ieee Semiconductor Thermal Measurement and Management Symposium. 165-172. DOI: 10.1109/STHERM.2008.4509385  0.399
2008 Lakhkar N, Hossain M, Agonafer D. CFD modeling of a thermoelectric device for electronics cooling applications 2008 11th Ieee Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, I-Therm. 889-895. DOI: 10.1109/ITHERM.2008.4544360  0.34
2008 Raju U, Kaisare A, Agonafer D, Haji-Sheikh A, Chrysler G, Mahajan R. Multi-objective optimization entailing computer architecture and thermal design for non-uniformly powered microprocessors 2008 11th Ieee Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, I-Therm. 432-440. DOI: 10.1109/ITHERM.2008.4544302  0.383
2008 Karajgikar S, Nagaraj V, Agonafer D, Pekin S. Flip chip back end design parameters to reduce bump electromigration Proceedings - Electronic Components and Technology Conference. 347-353. DOI: 10.1109/ECTC.2008.4549994  0.709
2008 Agonafer D, Kaisare A, Hossain MM, Lee Y, Dewan-Sandur BP, Dishongh T, Pekin S. Thermo-mechanical challenges in stacked packaging Heat Transfer Engineering. 29: 134-148. DOI: 10.1080/01457630701673170  0.77
2007 Trivedi A, Lakhkar N, Iyengar M, Ellsworth M, Schmidt R, Agonafer D. Experimental and computational characterization of a heat sink tester 2007 Proceedings of the Asme Interpack Conference, Ipack 2007. 1: 643-652. DOI: 10.1115/IPACK2007-33975  0.391
2007 Trivedi A, Agonafer D, Kaisare A, Refai-Ahmed G. Effect of heat sink assembly on mechanical reliability of a wire bonded plastic ball grid array package 2007 Proceedings of the Asme Interpack Conference, Ipack 2007. 2: 873-882. DOI: 10.1115/IPACK2007-33687  0.335
2007 Mulay V, Karajgikar S, Agonafer D, Schmidt R, Iyengar M, Nigen J. Computational study of hybrid cooling solution for thermal management of data centers 2007 Proceedings of the Asme Interpack Conference, Ipack 2007. 1: 723-731. DOI: 10.1115/IPACK2007-33000  0.781
2007 Kaisare A, Agonafer D, Haji-Sheikh A, Chrysler G, Mahajan R. Developmet of an analytical model to a temperature distribution of first level package with a non-uniformly powered die Asme International Mechanical Engineering Congress and Exposition, Proceedings (Imece). 5: 443-449. DOI: 10.1115/IMECE200743736  0.4
2007 Banerjee A, Lakhkar N, Riaz S, Refai-Ahmed G, Agonafer D. Multi-objective parametrization of graphite heat spreader for portable systems applications Asme International Mechanical Engineering Congress and Exposition, Proceedings (Imece). 5: 79-85. DOI: 10.1115/IMECE200742927  0.354
2006 Baekyoung S, Chepuri K, Dewan-Sandur, Yongje L, Agonafer D, Amon C. Thermal enhancement of stacked dies using thermal vias American Society of Mechanical Engineers, Heat Transfer Division, (Publication) Htd. DOI: 10.1115/IMECE2006-15352  0.379
2006 Kaisare A, Agonafer D, Haji-shiekh A, Chrysler G, Mahajan R. Approximate analytical model for a first level package with non-uniformly powered die American Society of Mechanical Engineers, Heat Transfer Division, (Publication) Htd. DOI: 10.1115/IMECE2006-13436  0.377
2006 Bhopte S, Agonafer D, Schmidt R, Sammakia B. Optimization of data center room layout to minimize rack inlet air temperature Journal of Electronic Packaging, Transactions of the Asme. 128: 380-387. DOI: 10.1115/1.2356866  0.422
2006 Hossain MM, Yongje L, Akhter R, Agonafer D, Dishongh T. Computational modeling of the reliability of stacked low density interconnects devices Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 2006: 1088-1096. DOI: 10.1109/ITHERM.2006.1645466  0.31
2006 Bedekar V, Karajgikar S, Agonafer D, Iyyengar M, Schmidt R. Effect of CRAC location on fixed rack layout Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 2006: 421-425. DOI: 10.1109/ITHERM.2006.1645373  0.755
2006 Dewan-Sandur BP, Kaisare A, Agonafer D, Amon C, Pekin S, Dishongh T. Thermal management of die stacking architecture that includes memory and logic processor Proceedings - Electronic Components and Technology Conference. 2006: 1963-1968. DOI: 10.1109/ECTC.2006.1645929  0.337
2006 Kaisare A, Agonafer D, Haji-shiekh A, Chrysler G, Mahajan R. Design rule for minimizing thermal resistance in a non-uniformly powered microprocessor Annual Ieee Semiconductor Thermal Measurement and Management Symposium. 2006: 108-115.  0.361
2006 Smith B, Romero D, Agonafer D, Gu J, Amon CH. Aerogel for microsystems thermal insolation: System design and process development Proceedings of the Asme/Pacific Rim Technical Conference and Exhibition On Integration and Packaging of Mems, Nems, and Electronic Systems: Advances in Electronic Packaging 2005. 2327-2336.  0.339
2006 Hossain MM, Lee Y, Akhter R, Agonafer D, Pekin S, Dishongh T. Reliability of stack packaging varying the die stacking architectures for flash memory applications Annual Ieee Semiconductor Thermal Measurement and Management Symposium. 2006: 222-229.  0.315
2005 Smith B, Romero D, Agonafer D, Gu J, Amon CH. Aerogel for microsystems thermal insulation: System design and process development Proceedings of the Asme Summer Heat Transfer Conference. 4: 753-762. DOI: 10.1115/HT2005-72663  0.339
2005 Karajgikar S, Lakhkar N, Agonafer D, Schmidt R. Impact of area contact between sensor bulb and evaporator return line on modular refrigeration unit: Computational and experimental Journal of Heat Transfer. 127: 95-100. DOI: 10.1115/1.1839585  0.76
2005 Mulay V, Kulkarni A, Agonafer D, Schmidt R. Effect of the location and the properties of thermostatic expansion valve sensor bulb on the stability of a refrigeration system Journal of Heat Transfer. 127: 85-94. DOI: 10.1115/1.1839584  0.822
2005 Borovic B, Lewis FL, Agonafer D, Kolesar ES, Hossain MM, Popa DO. Method for determining a dynamical state - Space model for control of thermal MEMS devices Journal of Microelectromechanical Systems. 14: 961-970. DOI: 10.1109/Jmems.2005.851856  0.377
2005 Akhter R, Sandur BPD, Hossain M, Kaisare A, Agonafer D, Lawrence K, Dishongh T. Design for stackability of flash memory devices based on thermal optimization Aiaa/Ieee Digital Avionics Systems Conference - Proceedings. 2. DOI: 10.1109/DASC.2005.1563484  0.336
2005 Karajgikar S, Ahn W, Agonafer D. Effect of continuous and discontinuous fabrication and reflow processes on PWB warpage Proceedings of the Asme/Pacific Rim Technical Conference and Exhibition On Integration and Packaging of Mems, Nems, and Electronic Systems: Advances in Electronic Packaging 2005. 1187-1192.  0.729
2005 Kaisare A, Agonafer D, Haji-shiekh A, Chrysler G, Mahajan R. Thermal based optimization of functional block distributions in a nonuniformly powered die Proceedings of the Asme/Pacific Rim Technical Conference and Exhibition On Integration and Packaging of Mems, Nems, and Electronic Systems: Advances in Electronic Packaging 2005. 675-682.  0.361
2004 Jagarkal SG, Hossain MM, Agonafer D, Lulu M, Reh S. Design optimization and reliability of PWB level electronic package Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 2: 368-376. DOI: 10.1115/1.2429704  0.421
2004 Makwana Y, Agonafer D, Manole D. Impact of TXV and compressor in the stability of a high-end computer refrigeration system Journal of Electronic Packaging, Transactions of the Asme. 126: 554-559. DOI: 10.1115/1.1827272  0.469
2004 Bhopte S, Alshuqairi MS, Agonafer D, Refai-Ahmed G. Mixed convection of impinging air cooling over heat sink in telecom system application Journal of Electronic Packaging, Transactions of the Asme. 126: 519-523. DOI: 10.1115/1.1827267  0.378
2004 Xu L, Reinikainen T, Ren W, Wang BP, Han Z, Agonafer D. A simulation-based multi-objective design optimization of electronic packages under thermal cycling and bending Microelectronics Reliability. 44: 1977-1983. DOI: 10.1016/J.Microrel.2004.04.024  0.356
2004 Agonafer D, Ibarra J, McGee K, Platt F, Harris K. Heat pipe optimization team the heat pipe assisted heat sink project Innovations in Engineering Education 2004: Mechanical Engineering Education, Mechanical Engineering Technology Department Heads. 363-372.  0.324
2004 Karajgikar S, Lakhkar N, Agonafer D, Schmidt R. Impact of area contact between sensor bulb and evaporator return line on MRU - Part II, experimental work Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 1: 232-236.  0.784
2003 Makwana Y, Agonafer D, Manole D. Performance of a Masterflux Compressor in a Refrigeration Unit For High End Computer System Application American Society of Mechanical Engineers, Electronic and Photonic Packaging, Epp. 3: 533-538. DOI: 10.1115/IMECE2003-55050  0.394
2003 Lakhkar N, Karajgikar S, Agonafer D, Schmidt R. The impact of Area Contact Between Sensor Bulb and Evaporator Return Line in a Modular Refrigeration Unit - Part I, Computational Study American Society of Mechanical Engineers, Electronic and Photonic Packaging, Epp. 3: 651-656. DOI: 10.1115/IMECE2003-42254  0.791
2003 Novotny S, Ahn W, Agonafer D. A Methodology for an Integrated (Electrical/Mechanical) Design of PWBA American Society of Mechanical Engineers, Electronic and Photonic Packaging, Epp. 3: 721-727. DOI: 10.1115/1.1827268  0.575
2003 Nnanna AGA, Haji-Sheikh A, Agonafer D. Effect of variable heat transfer coefficient, fin geometry, and curvature on the thermal performance of extended surfaces Journal of Electronic Packaging, Transactions of the Asme. 125: 456-460. DOI: 10.1115/1.1602711  0.401
2003 Haji-Sheikh A, Beck JV, Agonafer D. Steady-state heat conduction in multi-layer bodies International Journal of Heat and Mass Transfer. 46: 2363-2379. DOI: 10.1016/S0017-9310(02)00542-2  0.308
2003 Kulkarni A, Agonafer D, Schmidt R. Effect of the thermostatic expansion valve characteristics on the stability of a refrigeration system - Part II Advances in Electronic Packaging. 2: 613-619.  0.33
2003 Guggari S, Agonafer D, Belady C, Stahl L. A hybrid methodology for the optimization of data center room layout Advances in Electronic Packaging. 2: 605-612.  0.325
2002 Ellsworth MJ, Schmidt RR, Agonafer D. Design and analysis of a scheme to mitigate condensation on an assembly used to cool a processor module Ibm Journal of Research and Development. 46: 753-760. DOI: 10.1147/Rd.466.0753  0.462
2002 Kulkarni A, Mulay V, Agonafer D, Schmidt R. Effect of the thermostatic expansion valve characteristics on the stability of a refrigeration system - Part I Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 403-407. DOI: 10.1115/IMECE2003-42536  0.375
2002 Kulkarni A, Mulay V, Agonafer D, Schmidt T. Effect of the thermostatic expansion valve characteristics on the stability of a refrigeration system-Part I Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm. 2002: 403-407. DOI: 10.1109/ITHERM.2002.1012484  0.378
2001 Han Z, Agonafer D. Numerical simulations of the natural convective heat transfer inside an electronic device Advances in Electronic Packaging. 3: 1775-1780.  0.328
2001 Kaisare AD, Agonafer D, Lam P. A three dimensional thermo-mechanical analysis of a BGA package Advances in Electronic Packaging. 3: 1781-1785.  0.795
2001 Agonafer D, Han ZX, Schmidt R. Numerical prediction of the thermal resistance of cold plate Advances in Electronic Packaging. 2: 983-987.  0.381
1999 Free A, Kehmeier D, Agonafer D. Driving PCA thermal analysis using IDF 4.0 data exchange American Society of Mechanical Engineers, Eep. 26.  0.301
1997 Agonafer D, Vimba A. Solid Model Based Preprocessor to CFD Code for Applications to Electronic Cooling Systems Journal of Electronic Packaging, Transactions of the Asme. 119: 138-143. DOI: 10.1115/1.2792220  0.332
1989 Linton RL, Agonafer D. Thermal model of a PC American Society of Mechanical Engineers, Heat Transfer Division, (Publication) Htd. 121: 69-72. DOI: 10.1115/1.2905501  0.329
1989 Agonafer D, Moffatt DF. Numerical modeling of forced convection heat transfer for modules mounted on circuit boards American Society of Mechanical Engineers, Heat Transfer Division, (Publication) Htd. 121: 1-5. DOI: 10.1115/1.2904386  0.38
1988 Thornhill AM, Glakpe EK, Agonafer D. Prediction of natural convection in horizontal annular enclosures at high Rayleigh numbers International Communications in Heat and Mass Transfer. 15: 785-797. DOI: 10.1016/0735-1933(88)90021-8  0.351
1988 Agonafer D, Furkay S. Numerical and experimental investigation of heat transfer phenomena over an electronic module . 85.  0.321
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