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Kenneth E. Goodson - Publications

Affiliations: 
Mechanical Engineering Stanford University, Palo Alto, CA 
Area:
heat transfer in electronic nanostructures
Website:
https://profiles.stanford.edu/kenneth-goodson
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277 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2024 Su H, Kwon H, Xue F, Sato N, Bhat U, Tsai W, Bosman M, Asheghi M, Goodson KE, Pop E, Wang SX. Thermal Characterization of Ultrathin MgO Tunnel Barriers. Nano Letters. PMID 39503294 DOI: 10.1021/acs.nanolett.4c02571  0.575
2023 Perez C, McLeod AJ, Chen ME, Yi SI, Vaziri S, Hood R, Ueda ST, Bao X, Asheghi M, Park W, Talin AA, Kumar S, Pop E, Kummel AC, Goodson KE. High Thermal Conductivity of Submicrometer Aluminum Nitride Thin Films Sputter-Deposited at Low Temperature. Acs Nano. PMID 37796248 DOI: 10.1021/acsnano.3c05485  0.581
2023 Wang Y, Collinson DW, Kwon H, Miller RD, Lionti K, Goodson KE, Dauskardt RH. Linking Interfacial Bonding and Thermal Conductivity in Molecularly-Confined Polymer-Glass Nanocomposites with Ultra-High Interfacial Density. Small (Weinheim An Der Bergstrasse, Germany). e2301383. PMID 36971287 DOI: 10.1002/smll.202301383  0.31
2023 Khan AI, Yu H, Zhang H, Goggin JR, Kwon H, Wu X, Perez C, Neilson KM, Asheghi M, Goodson KE, Vora PM, Davydov A, Takeuchi I, Pop E. Energy Efficient Neuro-inspired Phase Change Memory Based on Ge Sb Te as a Novel Epitaxial Nanocomposite. Advanced Materials (Deerfield Beach, Fla.). e2300107. PMID 36720651 DOI: 10.1002/adma.202300107  0.457
2022 Khan AI, Wu X, Perez C, Won B, Kim K, Ramesh P, Kwon H, Tung MC, Lee Z, Oh IK, Saraswat K, Asheghi M, Goodson KE, Wong HP, Pop E. Unveiling the Effect of Superlattice Interfaces and Intermixing on Phase Change Memory Performance. Nano Letters. PMID 35876819 DOI: 10.1021/acs.nanolett.2c01869  0.492
2022 Zhou J, Wu Y, Kwon H, Li Y, Xiao X, Ye Y, Ma Y, Goodson KE, Hwang HY, Cui Y. Heat Conductor-Insulator Transition in Electrochemically Controlled Hybrid Superlattices. Nano Letters. PMID 35715219 DOI: 10.1021/acs.nanolett.2c01407  0.35
2022 Liu T, Asheghi M, Goodson KE. Multiobjective Optimization of Graded, Hybrid Micropillar Wicks for Capillary-Fed Evaporation. Langmuir : the Acs Journal of Surfaces and Colloids. 38: 221-230. PMID 34967627 DOI: 10.1021/acs.langmuir.1c02429  0.34
2021 Sood A, Sievers C, Shin YC, Chen V, Chen S, Smithe KKH, Chatterjee S, Donadio D, Goodson KE, Pop E. Engineering Thermal Transport across Layered Graphene-MoS Superlattices. Acs Nano. PMID 34813267 DOI: 10.1021/acsnano.1c06299  0.553
2021 Kwon H, Perez C, Park W, Asheghi M, Goodson KE. Thermal Characterization of Metal-Oxide Interfaces Using Time-Domain Thermoreflectance with Nanograting Transducers. Acs Applied Materials & Interfaces. PMID 34797056 DOI: 10.1021/acsami.1c12422  0.319
2021 Peng Y, Li W, Liu B, Jin W, Schaadt J, Tang J, Zhou G, Wang G, Zhou J, Zhang C, Zhu Y, Huang W, Wu T, Goodson KE, Dames C, et al. Integrated cooling (i-Cool) textile of heat conduction and sweat transportation for personal perspiration management. Nature Communications. 12: 6122. PMID 34675199 DOI: 10.1038/s41467-021-26384-8  0.596
2021 Kwon H, Khan AI, Perez C, Asheghi M, Pop E, Goodson KE. Uncovering Thermal and Electrical Properties of SbTe/GeTe Superlattice Films. Nano Letters. PMID 34270270 DOI: 10.1021/acs.nanolett.1c00947  0.572
2021 Xiong F, Yalon E, McClellan C, Zhang J, Aslan OB, Sood A, Sun J, Andolina CM, Al-Saidi WA, Goodson KE, Heinz T, Cui Y, Pop E. Tuning electrical and interfacial thermal properties of bilayer MoS2 via electrochemical intercalation. Nanotechnology. PMID 33601363 DOI: 10.1088/1361-6528/abe78a  0.535
2020 Kim Y, Kwon H, Han HS, Kim HK, Kim B, Lee BC, Lee J, Asheghi M, Prinz FB, Goodson KE, Lim J, Sim U, Park W. Tunable Dielectric and Thermal Properties of Oxide Dielectrics via Substrate Biasing in Plasma Enhanced Atomic Layer Deposition. Acs Applied Materials & Interfaces. PMID 32915545 DOI: 10.1021/Acsami.0C11086  0.433
2020 Park S, Siahrostami S, Park J, Mostaghimi AHB, Kim TR, Vallez L, Gill TM, Park W, Goodson KE, Sinclair R, Zheng X. Effect of Adventitious Carbon on Pit Formation of Monolayer MoS. Advanced Materials (Deerfield Beach, Fla.). e2003020. PMID 32743836 DOI: 10.1002/Adma.202003020  0.323
2020 Jung KW, Hazra S, Kwon H, Piazza A, Jih E, Asheghi M, Gupta MP, Degner M, Goodson KE. Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-Three-Dimensional Manifold Coolers—Part 2: Parametric Study of EMMCs for High Heat Flux (∼1 kW/cm2) Power Electronics Cooling Journal of Electronic Packaging. 142. DOI: 10.1115/1.4047883  0.441
2020 Hazra S, Jung KW, Iyengar M, Malone C, Asheghi M, Goodson KE. Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel Three-Dimensional-Manifold Coolers (EMMC)—Part 3: Addressing Challenges in Laser Micromachining-Based Manufacturing of Three-Dimensional-Manifolded Microcooler Devices Journal of Electronic Packaging. 142. DOI: 10.1115/1.4047847  0.359
2020 Jung KW, Cho E, Lee H, Kharangate C, Zhou F, Asheghi M, Dede EM, Goodson KE. Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-3D Manifold Coolers (EMMCs): Part 1—Experimental Study of Single-Phase Cooling Performance With R-245fa Journal of Electronic Packaging. 142. DOI: 10.1115/1.4047846  0.366
2020 Liu T, Palko JW, Katz JS, Zhou F, Dede EM, Asheghi M, Goodson KE. Steady-State Parametric Optimization and Transient Characterization of Heat Flow Regulation with Binary Diffusion Ieee Transactions On Components, Packaging and Manufacturing Technology. 1-1. DOI: 10.1109/Tcpmt.2020.3005880  0.309
2020 Guo P, Burrow JA, Sevison GA, Kwon H, Perez C, Hendrickson JR, Smith EM, Asheghi M, Goodson KE, Agha I, Sarangan AM. Tungsten-doped Ge2Sb2Te5 phase change material for high-speed optical switching devices Applied Physics Letters. 116: 131901. DOI: 10.1063/1.5142552  0.739
2020 Sevison GA, Farzinazar S, Burrow JA, Perez C, Kwon H, Lee J, Asheghi M, Goodson KE, Sarangan A, Hendrickson JR, Agha I. Phase Change Dynamics and Two-Dimensional 4-Bit Memory in Ge2Sb2Te5 via Telecom-Band Encoding Acs Photonics. 7: 480-487. DOI: 10.1021/Acsphotonics.9B01456  0.705
2020 Liu T, Dunham MT, Jung KW, Chen B, Asheghi M, Goodson KE. Characterization and thermal modeling of a miniature silicon vapor chamber for die-level heat redistribution International Journal of Heat and Mass Transfer. 152: 119569. DOI: 10.1016/J.Ijheatmasstransfer.2020.119569  0.491
2020 Kharangate CR, Libeer W, Palko J, Lee H, Shi J, Asheghi M, Goodson KE. Investigation of 3D manifold architecture heat sinks in air-cooled condensers Applied Thermal Engineering. 167: 114700. DOI: 10.1016/J.Applthermaleng.2019.114700  0.411
2020 Nguyen T, Phan H, Dowling KM, Yalamarthy AS, Dinh T, Balakrishnan V, Liu T, Chapin CA, Truong Q, Dau VT, Goodson KE, Senesky DG, Dao DV, Nguyen N. Lithography and Etching‐Free Microfabrication of Silicon Carbide on Insulator using Direct UV Laser Ablation Advanced Engineering Materials. 22: 1901173. DOI: 10.1002/Adem.201901173  0.341
2019 Sood A, Xiong F, Chen S, Wang H, Selli D, Zhang J, McClellan CJ, Sun J, Donadio D, Cui Y, Pop E, Goodson KE. Publisher Correction: An electrochemical thermal transistor. Nature Communications. 10: 4465. PMID 31562331 DOI: 10.1038/S41467-019-12471-4  0.54
2019 Sood A, Xiong F, Chen S, Cheaito R, Lian F, Asheghi M, Cui Y, Donadio D, Goodson KE, Pop E. Quasi-Ballistic Thermal Transport Across MoS Thin Films. Nano Letters. PMID 30808167 DOI: 10.1021/Acs.Nanolett.8B05174  0.638
2019 Flader IB, Chen Y, Yang Y, Ng EJ, Shin DD, Heinz DB, Ortiz LC, Alter AL, Park W, Goodson KE, Kenny TW. Micro-Tethering for Fabrication of Encapsulated Inertial Sensors With High Sensitivity Ieee\/Asme Journal of Microelectromechanical Systems. 28: 372-381. DOI: 10.1109/Jmems.2019.2900761  0.345
2019 Chen S, Sood A, Pop E, Goodson KE, Donadio D. Strongly tunable anisotropic thermal transport in MoS 2 by strain and lithium intercalation: first-principles calculations 2d Materials. 6: 025033. DOI: 10.1088/2053-1583/Ab0715  0.603
2019 Liu T, Palko JW, Katz JS, Dede EM, Zhou F, Asheghi M, Goodson KE. Tunable, passive thermal regulation through liquid to vapor phase change Applied Physics Letters. 115: 254102. DOI: 10.1063/1.5133795  0.469
2019 Xu RL, Muñoz Rojo M, Islam SM, Sood A, Vareskic B, Katre A, Mingo N, Goodson KE, Xing HG, Jena D, Pop E. Thermal conductivity of crystalline AlN and the influence of atomic-scale defects Journal of Applied Physics. 126: 185105. DOI: 10.1063/1.5097172  0.614
2019 Okabe KL, Sood A, Yalon E, Neumann CM, Asheghi M, Pop E, Goodson KE, Wong HP. Understanding the switching mechanism of interfacial phase change memory Journal of Applied Physics. 125: 184501. DOI: 10.1063/1.5093907  0.585
2019 Kong D, Jung KW, Jung S, Jung D, Schaadt J, Iyengar M, Malone C, Kharangate CR, Asheghi M, Goodson KE, Lee H. Single-phase thermal and hydraulic performance of embedded silicon micro-pin fin heat sinks using R245fa International Journal of Heat and Mass Transfer. 141: 145-155. DOI: 10.1016/J.Ijheatmasstransfer.2019.05.073  0.448
2019 Jung KW, Kharangate CR, Lee H, Palko J, Zhou F, Asheghi M, Dede EM, Goodson KE. Embedded cooling with 3D manifold for vehicle power electronics application: Single-phase thermal-fluid performance International Journal of Heat and Mass Transfer. 130: 1108-1119. DOI: 10.1016/J.Ijheatmasstransfer.2018.10.108  0.472
2018 Sood A, Xiong F, Chen S, Wang H, Selli D, Zhang J, McClellan CJ, Sun J, Donadio D, Cui Y, Pop E, Goodson KE. An electrochemical thermal transistor. Nature Communications. 9: 4510. PMID 30375375 DOI: 10.1038/S41467-018-06760-7  0.639
2018 Zhang C, Palko JW, Rong G, Pringle KS, Barako MT, Dusseault TJ, Asheghi M, Santiago JG, Goodson KE. Tailoring permeability of microporous copper structures through template sintering. Acs Applied Materials & Interfaces. PMID 30096232 DOI: 10.1021/Acsami.8B03774  0.329
2018 Rong G, Palko JW, Oyarzun DI, Zhang C, Hämmerle J, Asheghi M, Goodson KE, Santiago JG. A method for quantifying in plane permeability of porous thin films. Journal of Colloid and Interface Science. 530: 667-674. PMID 30007196 DOI: 10.1016/J.Jcis.2018.05.062  0.342
2018 Park W, Sohn J, Romano G, Kodama T, Sood A, Katz JS, Kim BSY, So H, Ahn EC, Asheghi M, Kolpak AM, Goodson KE. Impact of thermally dead volume on phonon conduction along silicon nanoladders. Nanoscale. PMID 29873370 DOI: 10.1039/C8Nr01788C  0.461
2018 Sood A, Cheaito R, Bai T, Kwon H, Wang Y, Li C, Yates L, Bougher T, Graham S, Asheghi M, Goorsky M, Goodson KE. Direct Visualization of Thermal Conductivity Suppression Due to Enhanced Phonon Scattering Near Individual Grain Boundaries. Nano Letters. PMID 29631399 DOI: 10.1021/Acs.Nanolett.8B00534  0.446
2018 Lee H, Maitra T, Palko J, Kong D, Zhang C, Barako MT, Won Y, Asheghi M, Goodson KE. Enhanced Heat Transfer Using Microporous Copper Inverse Opals Journal of Electronic Packaging. 140. DOI: 10.1115/1.4040088  0.712
2018 Kharangate CR, Wook Jung K, Jung S, Kong D, Schaadt J, Iyengar M, Malone C, Lee H, Asheghi M, Goodson KE. Experimental Investigation of Embedded Micropin-Fins for Single-Phase Heat Transfer and Pressure Drop Journal of Electronic Packaging. 140. DOI: 10.1115/1.4039475  0.403
2018 Guo P, Burrow JA, Sevison GA, Sood A, Asheghi M, Hendrickson JR, Goodson KE, Agha I, Sarangan A. Improving the performance of Ge2Sb2Te5 materials via nickel doping: Towards RF-compatible phase-change devices Applied Physics Letters. 113: 171903. DOI: 10.1063/1.5053713  0.75
2018 Barako MT, Lingamneni S, Katz JS, Liu T, Goodson KE, Tice J. Optimizing the design of composite phase change materials for high thermal power density Journal of Applied Physics. 124: 145103. DOI: 10.1063/1.5031914  0.429
2018 Barako MT, English TS, Roy-Panzer S, Kenny TW, Goodson KE. Dielectric barrier layers by low-temperature plasma-enhanced atomic layer deposition of silicon dioxide Thin Solid Films. 649: 24-29. DOI: 10.1016/J.Tsf.2018.01.019  0.388
2018 Lorenzi B, Dettori R, Dunham MT, Melis C, Tonini R, Colombo L, Sood A, Goodson KE, Narducci D. Phonon Scattering in Silicon by Multiple Morphological Defects: A Multiscale Analysis Journal of Electronic Materials. 47: 5148-5157. DOI: 10.1007/S11664-018-6337-Z  0.411
2017 Agonafer DD, Lee H, Vasquez PA, Won Y, Jung KW, Lingamneni S, Ma B, Shan L, Shuai S, Du Z, Maitra T, Palko JW, Goodson KE. Porous micropillar structures for retaining low surface tension liquids. Journal of Colloid and Interface Science. 514: 316-327. PMID 29275250 DOI: 10.1016/J.Jcis.2017.12.011  0.661
2017 Barako MT, Isaacson SG, Lian F, Pop E, Dauskardt RH, Goodson KE, Tice J. Dense Aligned Copper Nanowire Composites as High Performance Thermal Interface Materials. Acs Applied Materials & Interfaces. PMID 29119783 DOI: 10.1021/Acsami.7B12313  0.615
2017 Yalon E, Aslan ÖB, Smithe KKH, McClellan CJ, Suryavanshi SV, Xiong F, Sood A, Neumann CM, Xu X, Goodson KE, Heinz TF, Pop E. Temperature Dependent Thermal Boundary Conductance of Monolayer MoS2 by Raman Thermometry. Acs Applied Materials & Interfaces. PMID 29053241 DOI: 10.1021/Acsami.7B11641  0.597
2017 Park W, Kodama T, Park J, Cho J, Sood A, Barako MT, Asheghi M, Goodson KE. Thermal Conduction across Metal-Dielectric Sidewall Interfaces. Acs Applied Materials & Interfaces. PMID 28786284 DOI: 10.1021/Acsami.7B06567  0.425
2017 Kodama T, Ohnishi M, Park W, Shiga T, Park J, Shimada T, Shinohara H, Shiomi J, Goodson KE. Modulation of thermal and thermoelectric transport in individual carbon nanotubes by fullerene encapsulation. Nature Materials. PMID 28759031 DOI: 10.1038/Nmat4946  0.416
2017 Park W, Romano G, Ahn EC, Kodama T, Park J, Barako MT, Sohn J, Kim SJ, Cho J, Marconnet AM, Asheghi M, Kolpak AM, Goodson KE. Phonon Conduction in Silicon Nanobeam Labyrinths. Scientific Reports. 7: 6233. PMID 28740212 DOI: 10.1038/S41598-017-06479-3  0.722
2017 Park W, Sood A, Park J, Asheghi M, Sinclair R, Goodson KE. Enhanced Thermal Conduction Through Nanostructured Interfaces Nanoscale and Microscale Thermophysical Engineering. 21: 134-144. DOI: 10.1080/15567265.2017.1296910  0.421
2017 Park W, Shin DD, Kim SJ, Katz JS, Park J, Ahn CH, Kodama T, Asheghi M, Kenny TW, Goodson KE. Phonon conduction in silicon nanobeams Applied Physics Letters. 110: 213102. DOI: 10.1063/1.4983790  0.454
2017 Cho J, Francis D, Altman DH, Asheghi M, Goodson KE. Phonon conduction in GaN-diamond composite substrates Journal of Applied Physics. 121: 055105. DOI: 10.1063/1.4975468  0.442
2017 Palko JW, Lee H, Zhang C, Dusseault TJ, Maitra T, Won Y, Agonafer DD, Moss J, Houshmand F, Rong G, Wilbur JD, Rockosi D, Mykyta I, Resler D, Altman D, ... ... Goodson KE, et al. Extreme Two-Phase Cooling from Laser-Etched Diamond and Conformal, Template-Fabricated Microporous Copper Advanced Functional Materials. 27: 1703265. DOI: 10.1002/Adfm.201703265  0.735
2016 Barako MT, Sood A, Zhang C, Wang J, Kodama T, Asheghi M, Zheng X, Braun PV, Goodson KE. Quasi-ballistic Electronic Thermal Conduction in Metal Inverse Opals. Nano Letters. PMID 26986050 DOI: 10.1021/Acs.Nanolett.6B00468  0.427
2016 Lee H, Agonafer DD, Won Y, Houshmand F, Gorle C, Asheghi M, Goodson KE. Thermal modeling of extreme heat flux microchannel coolers for GaN-on-SiC semiconductor devices Journal of Electronic Packaging, Transactions of the Asme. 138. DOI: 10.1115/1.4032655  0.73
2016 Dunham MT, Lorenzi B, Andrews SC, Sood A, Asheghi M, Narducci D, Goodson KE. Enhanced phonon scattering by nanovoids in high thermoelectric power factor polysilicon thin films Applied Physics Letters. 109: 253104. DOI: 10.1063/1.4972483  0.422
2016 Fong SW, Sood A, Chen L, Kumari N, Asheghi M, Goodson KE, Gibson GA, Wong HP. Thermal conductivity measurement of amorphous dielectric multilayers for phase-change memory power reduction Journal of Applied Physics. 120: 015103. DOI: 10.1063/1.4955165  0.467
2016 Bozorg-Grayeli E, Sood A, Asheghi M, Gambin V, Sandhu R, Feygelson TI, Pate BB, Hobart KD, Goodson KE. Erratum: “Thermal conduction inhomogeneity of nanocrystalline diamond films by dual-side thermoreflectance” [Appl. Phys. Lett. 102, 111907 (2013)] Applied Physics Letters. 108: 179903. DOI: 10.1063/1.4948382  0.331
2016 Sood A, Cho J, Hobart KD, Feygelson TI, Pate BB, Asheghi M, Cahill DG, Goodson KE. Anisotropic and inhomogeneous thermal conduction in suspended thin-film polycrystalline diamond Journal of Applied Physics. 119: 175103. DOI: 10.1063/1.4948335  0.449
2016 Cornett J, Chen B, Haidar S, Berney H, McGuinness P, Lane B, Gao Y, He Y, Sun N, Dunham M, Asheghi M, Goodson K, Yuan Y, Najafi K. Fabrication and Characterization of Bi2Te3-Based Chip-Scale Thermoelectric Energy Harvesting Devices Journal of Electronic Materials. 1-3. DOI: 10.1007/S11664-016-4992-5  0.312
2015 Ahn C, Fong SW, Kim Y, Lee S, Sood A, Neumann CM, Asheghi M, Goodson KE, Pop E, Wong HP. Energy-Efficient Phase-Change Memory with Graphene as Thermal Barrier. Nano Letters. PMID 26308280 DOI: 10.1021/Acs.Nanolett.5B02661  0.511
2015 Barako MT, Roy-Panzer S, English TS, Kodama T, Asheghi M, Kenny TW, Goodson KE. Thermal Conduction in Vertically Aligned Copper Nanowire Arrays and Composites. Acs Applied Materials & Interfaces. 7: 19251-9. PMID 26284489 DOI: 10.1021/Acsami.5B05147  0.495
2015 Agonafer DD, Lopez K, Palko JW, Won Y, Santiago JG, Goodson KE. Burst behavior at a capillary tip: Effect of low and high surface tension. Journal of Colloid and Interface Science. 455: 1-5. PMID 26046980 DOI: 10.1016/J.Jcis.2015.05.033  0.665
2015 Roy-Panzer S, Kodama T, Lingamneni S, Panzer MA, Asheghi M, Goodson KE. Thermal characterization and analysis of microliter liquid volumes using the three-omega method. The Review of Scientific Instruments. 86: 024901. PMID 25725871 DOI: 10.1063/1.4907353  0.469
2015 Cho J, Goodson KE. Thermal transport: Cool electronics. Nature Materials. 14: 136-7. PMID 25613710 DOI: 10.1038/Nmat4194  0.401
2015 Cho J, Li Z, Asheghi M, Goodson KE. NEAR-JUNCTION THERMAL MANAGEMENT: THERMAL CONDUCTION IN GALLIUM NITRIDE COMPOSITE SUBSTRATES Annual Review of Heat Transfer. 18: 7-45. DOI: 10.1615/Annualrevheattransfer.2015011335  0.428
2015 Lee H, Won Y, Houshmand F, Gorle C, Asheghi M, Goodson KE. Computational modeling of extreme heat flux microcooler for GaN-based HEMT Asme 2015 International Technical Conference and Exhibition On Packaging and Integration of Electronic and Photonic Microsystems, Interpack 2015, Collocated With the Asme 2015 13th International Conference On Nanochannels, Microchannels, and Minichannels. 2. DOI: 10.1115/IPACK2015-48670  0.658
2015 Liu T, Houshmand F, Gorle C, Scholl S, Lee H, Won Y, Asheghi M, Goodson K, Kazemi H, Vanhille K. Full scale simulation of an integrated monolithic heat sink for thermal management of a high power density gan-SiC chip Asme 2015 International Technical Conference and Exhibition On Packaging and Integration of Electronic and Photonic Microsystems, Interpack 2015, Collocated With the Asme 2015 13th International Conference On Nanochannels, Microchannels, and Minichannels. 1. DOI: 10.1115/IPACK2015-48592  0.678
2015 Dowling KM, Suria AJ, Won Y, Shankar A, Lee H, Asheghi M, Goodson KE, Senesky DG. Inductive coupled plasma etching of high aspect ratio silicon carbide microchannels for localized cooling Asme 2015 International Technical Conference and Exhibition On Packaging and Integration of Electronic and Photonic Microsystems, Interpack 2015, Collocated With the Asme 2015 13th International Conference On Nanochannels, Microchannels, and Minichannels. 3. DOI: 10.1115/IPACK2015-48409  0.613
2015 Scholl S, Gorle C, Houshmand F, Liu T, Lee H, Won Y, Asheghi M, Goodson K, Kazemi H. Numerical simulation of advanced monolithic microcooler designs for high heat flux microelectronics Asme 2015 International Technical Conference and Exhibition On Packaging and Integration of Electronic and Photonic Microsystems, Interpack 2015, Collocated With the Asme 2015 13th International Conference On Nanochannels, Microchannels, and Minichannels. 2. DOI: 10.1115/IPACK2015-48122  0.651
2015 Cho J, Francis D, Chao PC, Asheghi M, Goodson KE. Cross-plane phonon conduction in polycrystalline silicon films Journal of Heat Transfer. 137. DOI: 10.1115/1.4029820  0.432
2015 Won Y, Cho J, Agonafer D, Asheghi M, Goodson KE. Fundamental Cooling Limits for High Power Density Gallium Nitride Electronics Ieee Transactions On Components, Packaging and Manufacturing Technology. DOI: 10.1109/Tcpmt.2015.2433132  0.724
2015 Sabry Aly MM, Gao M, Hills G, Lee C, Pitner G, Shulaker MM, Wu TF, Asheghi M, Bokor J, Franchetti F, Goodson KE, Kozyrakis C, Markov I, Olukotun K, Pileggi L, et al. Energy-Efficient Abundant-Data Computing: The N3XT 1,000x Computer. 48: 24-33. DOI: 10.1109/Mc.2015.376  0.461
2015 Won Y, Gao Y, Guzman De Villoria R, Wardle BL, Xiang R, Maruyama S, Kenny TW, Goodson KE. Nonhomogeneous morphology and the elastic modulus of aligned carbon nanotube films Journal of Micromechanics and Microengineering. 25. DOI: 10.1088/0960-1317/25/11/115023  0.686
2015 Shi L, Dames C, Lukes JR, Reddy P, Duda J, Cahill DG, Lee J, Marconnet A, Goodson KE, Bahk JH, Shakouri A, Prasher RS, Felts J, King WP, Han B, et al. Evaluating broader impacts of nanoscale thermal transport research Nanoscale and Microscale Thermophysical Engineering. 19: 127-165. DOI: 10.1080/15567265.2015.1031857  0.781
2015 Palko JW, Zhang C, Wilbur JD, Dusseault TJ, Asheghi M, Goodson KE, Santiago JG. Approaching the limits of two-phase boiling heat transfer: High heat flux and low superheat Applied Physics Letters. 107. DOI: 10.1063/1.4938202  0.404
2015 Dunham MT, Barako MT, LeBlanc S, Asheghi M, Chen B, Goodson KE. Power density optimization for micro thermoelectric generators Energy. 93: 2006-2017. DOI: 10.1016/J.Energy.2015.10.032  0.402
2014 Jeyasingh R, Fong SW, Lee J, Li Z, Chang KW, Mantegazza D, Asheghi M, Goodson KE, Wong HS. Ultrafast characterization of phase-change material crystallization properties in the melt-quenched amorphous phase. Nano Letters. 14: 3419-26. PMID 24798660 DOI: 10.1021/Nl500940Z  0.376
2014 Barako MT, Gao Y, Won Y, Marconnet AM, Asheghi M, Goodson KE. Reactive metal bonding of carbon nanotube arrays for thermal interface applications Ieee Transactions On Components, Packaging and Manufacturing Technology. 4: 1906-1913. DOI: 10.1109/Tcpmt.2014.2369371  0.811
2014 Sood A, Cho J, Hobart KD, Feygelson T, Pate B, Asheghi M, Goodson KE. Anisotropic and nonhomogeneous thermal conduction in 1 μm thick CVD diamond Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 1192-1198. DOI: 10.1109/ITHERM.2014.6892415  0.336
2014 Cho J, Chu KK, Chao PC, McGray C, Asheghi M, Goodson KE. Thermal conduction normal to thin silicon nitride films on diamond and GaN Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 1186-1191. DOI: 10.1109/ITHERM.2014.6892414  0.336
2014 Dusseault TJ, Gires J, Barako MT, Won Y, Agonafer DD, Asheghi M, Santiago JG, Goodson KE. Inverse opals for fluid delivery in electronics cooling systems Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 750-755. DOI: 10.1109/ITHERM.2014.6892356  0.596
2014 Park W, Marconnet AM, Kodama T, Park J, Sinclair R, Asheghi M, Goodson KE. Phonon thermal conduction in periodically porous silicon nanobeams Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 637-640. DOI: 10.1109/ITHERM.2014.6892341  0.723
2014 Won Y, Barako MT, Agonafer DD, Asheghi M, Goodson KE. Mechanical and thermal properties of copper inverse opals for two-phase convection enhancement Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 326-332. DOI: 10.1109/ITHERM.2014.6892299  0.669
2014 Agonafer DD, Lopez K, Won Y, Palko J, Asheghi M, Santiago JG, Goodson KE. Phase-separation of wetting fluids using nanoporous alumina membranes and micro-glass capillaries Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 306-316. DOI: 10.1109/ITHERM.2014.6892297  0.598
2014 Cho J, Won Y, Francis D, Asheghi M, Goodson KE. Thermal interface resistance measurements for GaN-on-diamond composite substrates Technical Digest - Ieee Compound Semiconductor Integrated Circuit Symposium, Csic. DOI: 10.1109/CSICS.2014.6978583  0.671
2014 Agonafer DD, Palko J, Won Y, Lopez K, Dusseault T, Gires J, Asheghi M, Santiago JG, Goodson KE. Progress on phase separation microfluidics Technical Digest - Ieee Compound Semiconductor Integrated Circuit Symposium, Csic. DOI: 10.1109/CSICS.2014.6978575  0.586
2014 Won Y, Houshmand F, Agonafer D, Asheghi M, Goodson KE. Microfluidic heat exchangers for high power density GaN on SiC Technical Digest - Ieee Compound Semiconductor Integrated Circuit Symposium, Csic. DOI: 10.1109/CSICS.2014.6978568  0.65
2014 Cho J, Li Y, Hoke WE, Altman DH, Asheghi M, Goodson KE. Phonon scattering in strained transition layers for GaN heteroepitaxy Physical Review B - Condensed Matter and Materials Physics. 89. DOI: 10.1103/Physrevb.89.115301  0.386
2014 Sood A, Rowlette JA, Caneau CG, Bozorg-Grayeli E, Asheghi M, Goodson KE. Thermal conduction in lattice-matched superlattices of InGaAs/InAlAs Applied Physics Letters. 105. DOI: 10.1063/1.4892575  0.405
2014 Cahill DG, Braun PV, Chen G, Clarke DR, Fan S, Goodson KE, Keblinski P, King WP, Mahan GD, Majumdar A, Maris HJ, Phillpot SR, Pop E, Shi L. Nanoscale thermal transport. II. 2003-2012 Applied Physics Reviews. 1. DOI: 10.1063/1.4832615  0.706
2014 Yee SK, Leblanc S, Goodson KE, Dames C. Reply to the 'comment on "$ per W metrics for thermoelectric power generation: Beyond ZT"' by G. Nunes, Jr, Energy Environ. Sci., 2014, 7, DOI: 10.1039/C3EE43700K Energy and Environmental Science. 7: 3441-3442. DOI: 10.1039/C4Ee01119H  0.35
2014 Leblanc S, Yee SK, Scullin ML, Dames C, Goodson KE. Material and manufacturing cost considerations for thermoelectrics Renewable and Sustainable Energy Reviews. 32: 313-327. DOI: 10.1016/J.Rser.2013.12.030  0.343
2014 Lee J, Yoon YJ, Eaton JK, Goodson KE, Bai SJ. Analysis of oxide (Al2O3, CuO, and ZnO) and CNT nanoparticles disaggregation effect on the thermal conductivity and the viscosity of nanofluids International Journal of Precision Engineering and Manufacturing. 15: 703-710. DOI: 10.1007/S12541-014-0390-1  0.53
2013 Won Y, Gao Y, Panzer MA, Xiang R, Maruyama S, Kenny TW, Cai W, Goodson KE. Zipping, entanglement, and the elastic modulus of aligned single-walled carbon nanotube films. Proceedings of the National Academy of Sciences of the United States of America. 110: 20426-30. PMID 24309375 DOI: 10.1073/Pnas.1312253110  0.719
2013 Bozorg-Grayeli E, Reifenberg JP, Asheghi M, Wong HP, Goodson KE. THERMAL TRANSPORT IN PHASE CHANGE MEMORY MATERIALS Annual Review of Heat Transfer. 16: 397-428. DOI: 10.1615/Annualrevheattransfer.V16.130  0.339
2013 Lee J, Kodama T, Won Y, Asheghi M, Goodson KE. Impact of annealing on the thermoelectric properties Ge 2Sb2Te5 films Materials Research Society Symposium Proceedings. 1490: 223-228. DOI: 10.1557/Opl.2012.1573  0.683
2013 Lingamneni S, Marconnet AM, Goodson KE. 3D packaging materials based on graphite nanoplatelet and aluminum nitride nanocomposites Asme International Mechanical Engineering Congress and Exposition, Proceedings (Imece). 10. DOI: 10.1115/IMECE2013-66419  0.623
2013 Touzelbaev MN, Miler J, Yang Y, Refai-Ahmed G, Goodson KE. High-efficiency transient temperature calculations for applications in dynamic thermal management of electronic devices Journal of Electronic Packaging, Transactions of the Asme. 135. DOI: 10.1115/1.4024747  0.747
2013 Gao Y, Marconnet AM, Xiang R, Maruyama S, Goodson KE. Heat capacity, thermal conductivity, and interface resistance extraction for single-walled carbon nanotube films using frequency-domain thermoreflectance Ieee Transactions On Components, Packaging and Manufacturing Technology. 3: 1524-1532. DOI: 10.1109/Tcpmt.2013.2254175  0.749
2013 Cho J, Li Z, Bozorg-Grayeli E, Kodama T, Francis D, Ejeckam F, Faili F, Asheghi M, Goodson KE. Improved thermal interfaces of GaN-Diamond composite substrates for HEMT applications Ieee Transactions On Components, Packaging and Manufacturing Technology. 3: 79-85. DOI: 10.1109/Tcpmt.2012.2223818  0.468
2013 Won Y, Cho J, Agonafer D, Asheghi M, Goodson KE. Cooling limits for GaN HEMT technology Technical Digest - Ieee Compound Semiconductor Integrated Circuit Symposium, Csic. DOI: 10.1109/CSICS.2013.6659222  0.607
2013 Marconnet AM, Panzer MA, Goodson KE. Thermal conduction phenomena in carbon nanotubes and related nanostructured materials Reviews of Modern Physics. 85: 1295-1326. DOI: 10.1103/Revmodphys.85.1295  0.741
2013 Lee J, Bozorg-Grayeli E, Kim S, Asheghi M, Philip Wong HS, Goodson KE. Phonon and electron transport through Ge2Sb2Te 5 films and interfaces bounded by metals Applied Physics Letters. 102. DOI: 10.1063/1.4807141  0.42
2013 Bozorg-Grayeli E, Sood A, Asheghi M, Gambin V, Sandhu R, Feygelson TI, Pate BB, Hobart K, Goodson KE. Thermal conduction inhomogeneity of nanocrystalline diamond films by dual-side thermoreflectance Applied Physics Letters. 102. DOI: 10.1063/1.4796168  0.431
2013 Barako MT, Park W, Marconnet AM, Asheghi M, Goodson KE. Thermal cycling, mechanical degradation, and the effective figure of merit of a thermoelectric module Journal of Electronic Materials. 42: 372-381. DOI: 10.1007/S11664-012-2366-1  0.726
2012 Weisse JM, Marconnet AM, Kim DR, Rao PM, Panzer MA, Goodson KE, Zheng X. Thermal conductivity in porous silicon nanowire arrays. Nanoscale Research Letters. 7: 554. PMID 23039084 DOI: 10.1186/1556-276X-7-554  0.753
2012 Li Z, Tan S, Bozorg-Grayeli E, Kodama T, Asheghi M, Delgado G, Panzer M, Pokrovsky A, Wack D, Goodson KE. Phonon dominated heat conduction normal to Mo/Si multilayers with period below 10 nm. Nano Letters. 12: 3121-6. PMID 22563928 DOI: 10.1021/Nl300996R  0.434
2012 Lee J, Asheghi M, Goodson KE. Impact of thermoelectric phenomena on phase-change memory performance metrics and scaling. Nanotechnology. 23: 205201. PMID 22543873 DOI: 10.1088/0957-4484/23/20/205201  0.405
2012 Yoneoka S, Lee J, Liger M, Yama G, Kodama T, Gunji M, Provine J, Howe RT, Goodson KE, Kenny TW. Electrical and thermal conduction in atomic layer deposition nanobridges down to 7 nm thickness. Nano Letters. 12: 683-6. PMID 22224582 DOI: 10.1021/Nl203548W  0.474
2012 Lee J, Kodama T, Won Y, Asheghi M, Goodson KE. Thermoelectric characterization of Ge2Sb2Te 5 films for phase-change memory Asme 2012 3rd International Conference On Micro/Nanoscale Heat and Mass Transfer, Mnhmt 2012. 687-693. DOI: 10.1115/MNHMT2012-75092  0.617
2012 LeBlanc S, Swartzentruber B, Martinez J, Christoforo G, Kodama T, Goodson K. Nanoscale Manipulation, Heating, and Welding of Nanowires Journal of Heat Transfer. 134. DOI: 10.1115/1.4006724  0.312
2012 Li Z, Jeyasingh RGD, Lee J, Asheghi M, Wong HSP, Goodson KE. Electrothermal modeling and design strategies for multibit phase change memory Asme 2012 3rd International Conference On Micro/Nanoscale Heat and Mass Transfer, Mnhmt 2012. 777-783. DOI: 10.1109/Ted.2012.2219311  0.368
2012 Cho J, Bozorg-Grayeli E, Altman DH, Asheghi M, Goodson KE. Low thermal resistances at GaN-SiC interfaces for HEMT technology Ieee Electron Device Letters. 33: 378-380. DOI: 10.1109/Led.2011.2181481  0.424
2012 Lee J, Kim S, Marconnet A, In'T Zandt MAA, Asheghi M, Philip Wong HSP, Goodson KE. Thermoelectric characterization and power generation using a silicon-on-insulator substrate Journal of Microelectromechanical Systems. 21: 4-6. DOI: 10.1109/Jmems.2011.2175704  0.706
2012 Won Y, Gao Y, De Villoria RG, Wardle BL, Kenny TW, Goodson KE. Crust removal and effective modulus of aligned multi-walled carbon nanotube films Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm. 1070-1076. DOI: 10.1109/ITHERM.2012.6231543  0.621
2012 Bozorg-Grayeli E, Li Z, Gambin V, Asheghi M, Goodson KE. Thermal conductivity, anisotropy, and interface resistances of diamond on poly-AlN Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm. 1059-1064. DOI: 10.1109/ITHERM.2012.6231541  0.303
2012 Cho J, Li Z, Bozorg-Grayeli E, Kodama T, Francis D, Ejeckam F, Faili F, Asheghi M, Goodson KE. Thermal characterization of GaN-on-diamond substrates for HEMT applications Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm. 435-439. DOI: 10.1109/ITHERM.2012.6231463  0.308
2012 Kodama T, Park W, Marconnet A, Lee J, Asheghi M, Goodson KE. In-plane thermal conductivity measurement on nanoscale conductive materials with on-substrate device configuration Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm. 250-255. DOI: 10.1109/ITHERM.2012.6231437  0.32
2012 Marconnet AM, Kodama T, Asheghi M, Goodson KE. Phonon conduction in periodically porous silicon nanobridges Nanoscale and Microscale Thermophysical Engineering. 16: 199-219. DOI: 10.1080/15567265.2012.732195  0.751
2012 Bozorg-Grayeli E, Li Z, Asheghi M, Delgado G, Pokrovsky A, Panzer M, Wack D, Goodson KE. Thermal conduction properties of Mo/Si multilayers for extreme ultraviolet optics Journal of Applied Physics. 112. DOI: 10.1063/1.4759450  0.469
2012 Lee J, Kodama T, Won Y, Asheghi M, Goodson KE. Phase purity and the thermoelectric properties of Ge 2Sb 2Te 5 films down to 25 nm thickness Journal of Applied Physics. 112. DOI: 10.1063/1.4731252  0.689
2012 Leblanc S, Phadke S, Kodama T, Salleo A, Goodson KE. Electrothermal phenomena in zinc oxide nanowires and contacts Applied Physics Letters. 100. DOI: 10.1063/1.4703935  0.441
2012 Won Y, Lee J, Asheghi M, Kenny TW, Goodson KE. Phase and thickness dependent modulus of Ge 2Sb 2Te 5 films down to 25 nm thickness Applied Physics Letters. 100. DOI: 10.1063/1.3699227  0.67
2012 Marconnet A, Panzer M, Yerci S, Minissale S, Wang X, Zhang X, Dal Negro L, Goodson KE. Thermal conductivity and photoluminescence of light-emitting silicon nitride films Applied Physics Letters. 100. DOI: 10.1063/1.3682508  0.73
2012 Gao Y, Kodama T, Won Y, Dogbe S, Pan L, Goodson KE. Impact of nanotube density and alignment on the elastic modulus near the top and base surfaces of aligned multi-walled carbon nanotube films Carbon. 50: 3789-3798. DOI: 10.1016/J.Carbon.2012.04.004  0.687
2012 Won Y, Gao Y, Panzer MA, Dogbe S, Pan L, Kenny TW, Goodson KE. Mechanical characterization of aligned multi-walled carbon nanotube films using microfabricated resonators Carbon. 50: 347-355. DOI: 10.1016/J.Carbon.2011.08.009  0.706
2011 Marconnet AM, Yamamoto N, Panzer MA, Wardle BL, Goodson KE. Thermal conduction in aligned carbon nanotube-polymer nanocomposites with high packing density. Acs Nano. 5: 4818-25. PMID 21598962 DOI: 10.1021/Nn200847U  0.725
2011 Kim S, Lee B, Asheghi M, Hurkx F, Reifenberg JP, Goodson KE, Wong HSP. Resistance and threshold switching voltage drift behavior in phase-change memory and their temperature dependence at microsecond time scales studied using a micro-thermal stage Ieee Transactions On Electron Devices. 58: 584-592. DOI: 10.1109/Ted.2010.2095502  0.366
2011 Bozorg-Grayeli E, Reifenberg JP, Panzer MA, Rowlette JA, Goodson KE. Temperature-dependent thermal properties of phase-change memory electrode materials Ieee Electron Device Letters. 32: 1281-1283. DOI: 10.1109/Led.2011.2158796  0.448
2011 Li Z, Lee J, Reifenberg JP, Asheghi M, Jeyasingh RGD, Wong HSP, Goodson KE. Grain boundaries, phase impurities, and anisotropic thermal conduction in phase-change memory Ieee Electron Device Letters. 32: 961-963. DOI: 10.1109/Led.2011.2150193  0.406
2011 Lee J, Kim S, Jeyasingh R, Asheghi M, Wong HSP, Goodson KE. Microthermal stage for electrothermal characterization of phase-change memory Ieee Electron Device Letters. 32: 952-954. DOI: 10.1109/Led.2011.2144952  0.47
2011 Bozorg-Grayeli E, Li Z, Asheghi M, Delgado G, Pokrovsky A, Panzer M, Wack D, Goodson KE. High temperature thermal properties of thin tantalum nitride films Applied Physics Letters. 99. DOI: 10.1063/1.3672098  0.506
2011 Ahn C, Lee B, Jeyasingh RGD, Asheghi M, Hurkx GAM, Goodson KE, Philip Wong HS. Crystallization properties and their drift dependence in phase-change memory studied with a micro-thermal stage Journal of Applied Physics. 110. DOI: 10.1063/1.3667295  0.352
2011 Lee J, Li Z, Reifenberg JP, Lee S, Sinclair R, Asheghi M, Goodson KE. Thermal conductivity anisotropy and grain structure in Ge 2Sb2Te5 films Journal of Applied Physics. 109. DOI: 10.1063/1.3573505  0.448
2011 Jain A, Goodson KE. Thermal microdevices for biological and biomedical applications Journal of Thermal Biology. 36: 209-218. DOI: 10.1016/J.Jtherbio.2011.02.006  0.6
2011 Steinbrenner JE, Lee ES, Hidrovo CH, Eaton JK, Goodson KE. Impact of channel geometry on two-phase flow in fuel cell microchannels Journal of Power Sources. 196: 5012-5020. DOI: 10.1016/J.Jpowsour.2011.02.032  0.508
2011 Won Y, Wang EN, Goodson KE, Kenny TW. 3-D visualization of flow in microscale jet impingement systems International Journal of Thermal Sciences. 50: 325-331. DOI: 10.1016/J.Ijthermalsci.2010.08.005  0.738
2011 David MP, Steinbrenner JE, Miler J, Goodson KE. Adiabatic and diabatic two-phase venting flow in a microchannel International Journal of Multiphase Flow. 37: 1135-1146. DOI: 10.1016/J.Ijmultiphaseflow.2011.06.013  0.321
2011 David MP, Miler J, Steinbrenner JE, Yang Y, Touzelbaev M, Goodson KE. Hydraulic and thermal characteristics of a vapor venting two-phase microchannel heat exchanger International Journal of Heat and Mass Transfer. 54: 5504-5516. DOI: 10.1016/J.Ijheatmasstransfer.2011.07.040  0.77
2011 Gharagozloo PE, Goodson KE. Temperature-dependent aggregation and diffusion in nanofluids International Journal of Heat and Mass Transfer. 54: 797-806. DOI: 10.1016/J.Ijheatmasstransfer.2010.06.058  0.358
2010 Rogacs A, Steinbrenner JE, Rowlette JA, Weisse JM, Zheng XL, Goodson KE. Characterization of the wettability of thin nanostructured films in the presence of evaporation. Journal of Colloid and Interface Science. 349: 354-60. PMID 20579656 DOI: 10.1016/J.Jcis.2010.05.063  0.388
2010 Panzer MA, Duong HM, Okawa J, Shiomi J, Wardle BL, Maruyama S, Goodson KE. Temperature-dependent phonon conduction and nanotube engagement in metalized single wall carbon nanotube films. Nano Letters. 10: 2395-400. PMID 20503983 DOI: 10.1021/Nl100443X  0.408
2010 Miler JL, Flynn R, Refai-Ahmed G, Touzelbaev M, David M, Steinbrenner J, Goodson KE. Effects of transient heating on two-phase flow response in microchannel heat exchangers Proceedings of the Asme Interpack Conference 2009, Ipack2009. 2: 563-569. DOI: 10.1115/InterPACK2009-89325  0.733
2010 Won YJ, Lee JH, Wang EN, Goodson KE, Kenny TW. An optimization design for a MEMS fabricated jet impingement cooling device Proceedings of the Asme Interpack Conference 2009, Ipack2009. 1: 491-496. DOI: 10.1115/InterPACK2009-89257  0.694
2010 Miler JL, Refai-Ahmed G, Touzelbaev MN, David MP, Steinbrenner JE, Goodson KE. Reduced-order fluidic model for flow instabilities in two-phase microfluidic heat exchangers Asme 2010 8th International Conference On Nanochannels, Microchannels, and Minichannels Collocated With 3rd Joint Us-European Fluids Engineering Summer Meeting, Icnmm2010. 155-161. DOI: 10.1115/FEDSM-ICNMM2010-30878  0.726
2010 Lee J, Gharagozloo PE, Kolade B, Eaton JK, Goodson KE. Nanofluid convection in microtubes Journal of Heat Transfer. 132: 1-5. DOI: 10.1115/1.4001637  0.594
2010 Reifenberg JP, Chang KW, Panzer MA, Kim S, Rowlette JA, Asheghi M, Wong HSP, Goodson KE. Thermal boundary resistance measurements for phase-change memory devices Ieee Electron Device Letters. 31: 56-58. DOI: 10.1109/Led.2009.2035139  0.446
2010 Fang C, Steinbrenner JE, Wang FM, Goodson KE. Impact of wall hydrophobicity on condensation flow and heat transfer in silicon microchannels Journal of Micromechanics and Microengineering. 20. DOI: 10.1088/0960-1317/20/4/045018  0.352
2010 Ju YS, Kurabayashi K, Goodson KE. Thermal Characterization Of Ic Passivation Layers Using Joule Heating And Optical Thermometry Microscale Thermophysical Engineering. 2: 101-110. DOI: 10.1080/108939598200015  0.692
2010 Gharagozloo PE, Goodson KE. Aggregate fractal dimensions and thermal conduction in nanofluids Journal of Applied Physics. 108. DOI: 10.1063/1.3481423  0.336
2010 Fang C, David M, Wang Fm, Goodson KE. Influence of film thickness and cross-sectional geometry on hydrophilic microchannel condensation International Journal of Multiphase Flow. 36: 608-619. DOI: 10.1016/J.Ijmultiphaseflow.2010.04.005  0.363
2010 Gao Y, Marconnet AM, Panzer MA, Leblanc S, Dogbe S, Ezzahri Y, Shakouri A, Goodson KE. Nanostructured interfaces for thermoelectrics Journal of Electronic Materials. 39: 1456-1462. DOI: 10.1007/S11664-010-1256-7  0.754
2009 Kodama T, Jain A, Goodson KE. Heat conduction through a DNA-gold composite. Nano Letters. 9: 2005-9. PMID 19435380 DOI: 10.1021/Nl900272M  0.602
2009 Fogg DW, Goodson KE. Bubble-induced water hammer and cavitation in microchannel flow boiling Journal of Heat Transfer. 131: 1-12. DOI: 10.1115/1.3216381  0.306
2009 Kolade B, Goodson KE, Eaton JK. Convective performance of nanofluids in a laminar thermally developing tube flow Journal of Heat Transfer. 131: 1-8. DOI: 10.1115/1.3013831  0.638
2009 Pettes AM, Hodes MS, Goodson KE. Optimized thermoelectric refrigeration in the presence of thermal boundary resistance Ieee Transactions On Advanced Packaging. 32: 423-430. DOI: 10.1109/Tadvp.2008.924221  0.443
2009 Lee J, Reifenberg JP, Li Z, Hom L, Asheghi M, Kim S, Wong HSP, Goodson KE. Measurement of anisotropy in the thermal conductivity of Ge 2Sb2Te5 films Proceedings - 2009 10th Non-Volatile Memory Technology Symposium, Nvmts 2009. 52-57. DOI: 10.1109/NVMT.2009.5429777  0.305
2009 Panzer MA, Shandalov M, Rowlette JA, Oshima Y, Chen YW, McIntyre PC, Goodson KE. Thermal properties of ultrathin hafnium oxide gate dielectric films Ieee Electron Device Letters. 30: 1269-1271. DOI: 10.1109/Led.2009.2032937  0.469
2009 Rowlette JA, Kekatpure RD, Panzer MA, Brongersma ML, Goodson KE. Nonradiative recombination in strongly interacting silicon nanocrystals embedded in amorphous silicon-oxide films Physical Review B - Condensed Matter and Materials Physics. 80. DOI: 10.1103/Physrevb.80.045314  0.311
2009 Buongiorno J, Venerus DC, Prabhat N, McKrell T, Townsend J, Christianson R, Tolmachev YV, Keblinski P, Hu LW, Alvarado JL, Bang IC, Bishnoi SW, Bonetti M, Botz F, Cecere A, ... ... Goodson KE, et al. A benchmark study on the thermal conductivity of nanofluids Journal of Applied Physics. 106. DOI: 10.1063/1.3245330  0.429
2009 Chandorkar SA, Candler RN, Duwel A, Melamud R, Agarwal M, Goodson KE, Kenny TW. Multimode thermoelastic dissipation Journal of Applied Physics. 105. DOI: 10.1063/1.3072682  0.325
2009 Jain A, Ness K, Goodson KE. Theoretical and experimental investigation of spatial temperature gradient effects on cells using a microfabricated microheater platform Sensors and Actuators, B: Chemical. 143: 286-294. DOI: 10.1016/J.Snb.2009.08.035  0.812
2009 Fogg D, David M, Goodson K. Non-invasive measurement of void fraction and liquid temperature in microchannel flow boiling Experiments in Fluids. 46: 725-736. DOI: 10.1007/S00348-008-0604-3  0.324
2008 David MP, Marconnet A, Goodson KE. Hydrodynamic and thermal performance of a vapor-venting microchannel copper heat exchanger Proceedings of the 6th International Conference On Nanochannels, Microchannels, and Minichannels, Icnmm2008. 1363-1370. DOI: 10.1115/ICNMM2008-62269  0.326
2008 Jain A, Goodson KE. Measurement of the thermal conductivity and heat capacity of freestanding shape memory thin films using the 3ω method Journal of Heat Transfer. 130. DOI: 10.1115/1.2945904  0.652
2008 Panzer MA, Zhang G, Mann D, Hu X, Pop E, Dai H, Goodson KE. Thermal properties of metal-coated vertically aligned single-wall nanotube arrays Journal of Heat Transfer. 130. DOI: 10.1115/1.2885159  0.639
2008 Rowlette JA, Goodson KE. Fully coupled nonequilibrium electron-phonon transport in nanometer-scale silicon FETs Ieee Transactions On Electron Devices. 55: 220-232. DOI: 10.1109/Ted.2007.911043  0.397
2008 Reifenberg JP, Kencke DL, Goodson KE. The impact of thermal boundary resistance in phase-change memory devices Ieee Electron Device Letters. 29: 1112-1114. DOI: 10.1109/Led.2008.2003012  0.406
2008 Gharagozloo PE, Eaton JK, Goodson KE. Diffusion, aggregation, and the thermal conductivity of nanofluids Applied Physics Letters. 93. DOI: 10.1063/1.2977868  0.604
2008 Panzer MA, Goodson KE. Thermal resistance between low-dimensional nanostructures and semi-infinite media Journal of Applied Physics. 103. DOI: 10.1063/1.2903519  0.442
2008 Hu XJ, Jain A, Goodson KE. Investigation of the natural convection boundary condition in microfabricated structures International Journal of Thermal Sciences. 47: 820-824. DOI: 10.1016/J.Ijthermalsci.2007.07.011  0.603
2008 Fang C, Hidrovo C, Wang F, Eaton J, Goodson K. 3-D numerical simulation of contact angle hysteresis for microscale two phase flow International Journal of Multiphase Flow. 34: 690-705. DOI: 10.1016/J.Ijmultiphaseflow.2007.08.008  0.54
2008 Oh DW, Jain A, Eaton JK, Goodson KE, Lee JS. Thermal conductivity measurement and sedimentation detection of aluminum oxide nanofluids by using the 3ω method International Journal of Heat and Fluid Flow. 29: 1456-1461. DOI: 10.1016/J.Ijheatfluidflow.2008.04.007  0.728
2007 Goodson KE. Materials science. Ordering up the minimum thermal conductivity of solids. Science (New York, N.Y.). 315: 342-3. PMID 17234938 DOI: 10.1126/Science.1138067  0.418
2007 Gharagozloo PE, Goodson KE, Eaton JK. Impact of thermodiffusion on temperature fields in stationary nanofluids 2007 Proceedings of the Asme Interpack Conference, Ipack 2007. 2: 993-998. DOI: 10.1115/IPACK2007-33293  0.434
2007 Kim DR, Koo JM, Fang C, Steinbrenner JE, Lee ES, Wang FM, Hidrovo CH, Eaton JK, Goodson KE. Compact model of slug flow in microchannels Proceedings of the 5th International Conference On Nanochannels, Microchannels and Minichannels, Icnmm2007. 321-330. DOI: 10.1115/ICNMM2007-30146  0.418
2007 Lee J, Flynn RD, Goodson KE, Eaton JK. Convective heat transfer of nanofluids (DI water-AL2O 3) in micro-channels 2007 Proceedings of the Asme/Jsme Thermal Engineering Summer Heat Transfer Conference - Ht 2007. 1: 843-850. DOI: 10.1115/HT2007-32630  0.49
2007 King WP, Goodson KE. Thermomechanical formation of nanoscale polymer indents with a heated silicon tip Journal of Heat Transfer. 129: 1600-1604. DOI: 10.1115/1.2764088  0.576
2007 Hu XJ, Panzer MA, Goodson KE. Infrared microscopy thermal characterization of opposing carbon nanotube arrays Journal of Heat Transfer. 129: 91-93. DOI: 10.1115/1.2401202  0.452
2007 Reifenberg JP, Panzer MA, Kim S, Gibby AM, Zhang Y, Wong S, Wong HSP, Pop E, Goodson KE. Thickness and stoichiometry dependence of the thermal conductivity of GeSbTe films Applied Physics Letters. 91. DOI: 10.1063/1.2784169  0.637
2007 Pop E, Mann DA, Goodson KE, Dai H. Electrical and thermal transport in metallic single-wall carbon nanotubes on insulating substrates Journal of Applied Physics. 101. DOI: 10.1063/1.2717855  0.606
2007 Steinbrenner JE, Hidrovo CH, Wang FM, Vigneron S, Lee ES, Kramer TA, Cheng CH, Eaton JK, Goodson KE. Measurement and modeling of liquid film thickness evolution in stratified two-phase microchannel flows Applied Thermal Engineering. 27: 1722-1727. DOI: 10.1016/J.Applthermaleng.2006.07.020  0.564
2007 Wang FM, Steinbrenner JE, Hidrovo CH, Kramer TA, Lee ES, Vigneron S, Cheng CH, Eaton JK, Goodson KE. Investigation of two-phase transport phenomena in microchannels using a microfabricated experimental structure Applied Thermal Engineering. 27: 1728-1733. DOI: 10.1016/J.Applthermaleng.2006.07.014  0.546
2006 Mann D, Pop E, Cao J, Wang Q, Goodson K, Dai H. Thermally and molecularly stimulated relaxation of hot phonons in suspended carbon nanotubes. The Journal of Physical Chemistry. B. 110: 1502-5. PMID 16471703 DOI: 10.1021/Jp0563991  0.547
2006 Pop E, Mann D, Wang Q, Goodson K, Dai H. Thermal conductance of an individual single-wall carbon nanotube above room temperature. Nano Letters. 6: 96-100. PMID 16402794 DOI: 10.1021/Nl052145F  0.616
2006 Kenny TW, Goodson KE, Santiago JG, Wang E, Koo JMO, Jiang L, Pop E, Sinha S, Zhang L, Fogg D, Yao S, Flynn R, Chang CH, Hidrovo CH. Advanced cooling technologies for microprocessors International Journal of High Speed Electronics and Systems. 16: 301-313. DOI: 10.1142/S0129156406003655  0.73
2006 Oh DW, Jain A, Eaton JK, Goodson KE, Lee JS. Thermal conductivity measurement of aluminum oxide nanofluids using the 3-omega method American Society of Mechanical Engineers, Heat Transfer Division, (Publication) Htd. DOI: 10.1115/IMECE2006-14196  0.525
2006 Hu XJ, Padilla AA, Xu J, Fisher TS, Goodson KE. 3-omega measurements of vertically oriented carbon nanotubes on silicon Journal of Heat Transfer. 128: 1109-1113. DOI: 10.1115/1.2352778  0.432
2006 Sinha S, Pop E, Dutton RW, Goodson KE. Non-equilibrium phonon distributions in sub-100 nm silicon transistors Journal of Heat Transfer. 128: 638-647. DOI: 10.1115/1.2194041  0.67
2006 Pop E, Goodson KE. Thermal phenomena in nanoscale transistors Journal of Electronic Packaging, Transactions of the Asme. 128: 102-108. DOI: 10.1115/1.2188950  0.623
2006 Pop E, Sinha S, Goodson KE. Heat generation and transport in nanometer-scale transistors Proceedings of the Ieee. 94: 1587-1601. DOI: 10.1109/JPROC.2006.879794  0.481
2006 Panzer M, Zhang G, Mann D, Hu X, Pop E, Dai H, Goodson KE. Thermal properties of metal-coated vertically-aligned single wall nanotube films Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 2006: 1306-1313. DOI: 10.1109/ITHERM.2006.1645496  0.507
2006 Hidrovo CH, Kramer TA, Wang EN, Vigneron S, Steinbrenner JE, Koo JM, Wang FM, Fogg DW, Flynn RD, Lee ES, Cheng CH, Kenny TW, Eaton JK, Goodson KE. Two-phase microfluidics for semiconductor circuits and fuel cells Heat Transfer Engineering. 27: 53-63. DOI: 10.1080/01457630500523816  0.697
2006 Sinha S, Goodson KE. Thermal conduction in sub-100 nm transistors Microelectronics Journal. 37: 1148-1157. DOI: 10.1016/J.Mejo.2005.07.015  0.616
2006 Wang EN, Devasenathipathy S, Lin H, Hidrovo CH, Santiago JG, Goodson KE, Kenny TW. A hybrid method for bubble geometry reconstruction in two-phase microchannels Experiments in Fluids. 40: 847-858. DOI: 10.1007/S00348-006-0123-Z  0.543
2005 Pop E, Mann D, Cao J, Wang Q, Goodson K, Dai H. Negative differential conductance and hot phonons in suspended nanotube molecular wires. Physical Review Letters. 95: 155505. PMID 16241738 DOI: 10.1103/Physrevlett.95.155505  0.583
2005 Sinha S, Goodson KE. Review: Multiscale Thermal Modeling in Nanoelectronics International Journal For Multiscale Computational Engineering. 3: 107-133. DOI: 10.1615/Intjmultcompeng.V3.I1.80  0.597
2005 McConnell AD, Goodson KE. Thermal Conduction In Silicon Micro- And Nanostructures Annual Review of Heat Transfer. 14: 129-168. DOI: 10.1615/Annualrevheattransfer.V14.120  0.456
2005 Lee ES, Hidrovo CH, Steinbrenner JE, Wang FM, Vigneron S, Goodson KE, Eaton JK. Flow structures and frictional characteristics on two-phase flow in microchannels in PEM fuel cells Proceedings of the American Society of Mechanical Engineers Fluids Engineering Division Summer Conference. 1: 899-906. DOI: 10.1115/FEDSM2005-77369  0.428
2005 Koo JM, Im S, Jiang L, Goodson KE. Integrated microchannel cooling for three-dimensional electronic circuit architectures Journal of Heat Transfer. 127: 49-58. DOI: 10.1115/1.1839582  0.645
2005 Im S, Srivastava N, Banerjee K, Goodson KE. Scaling analysis of multilevel interconnect temperatures for high-performance ICs Ieee Transactions On Electron Devices. 52: 2710-2719. DOI: 10.1109/Ted.2005.859612  0.554
2005 Jain A, Ness KD, Fishman HA, Goodson KE. Investigation of temperature gradient effects on neurite outgrowh in nerve cells using a microfabricated heater structure 2005 3rd Ieee/Embs Special Topic Conference On Microtechnology in Medicine and Biology. 2005: 398-399. DOI: 10.1109/MMB.2005.1548487  0.729
2005 Pop E, Dutton RW, Goodson KE. Monte Carlo simulation of Joule heating in bulk and strained silicon Applied Physics Letters. 86: 1-3. DOI: 10.1063/1.1870106  0.576
2005 Sinha S, Schelling PK, Phillpot SR, Goodson KE. Scattering of g -process longitudinal optical phonons at hotspots in silicon Journal of Applied Physics. 97. DOI: 10.1063/1.1831549  0.5
2005 Schelling PK, Shi L, Goodson KE. Managing heat for electronics Materials Today. 8: 30-35. DOI: 10.1016/S1369-7021(05)70935-4  0.393
2005 Zhang L, Wang EN, Goodson KE, Kenny TW. Phase change phenomena in silicon microchannels International Journal of Heat and Mass Transfer. 48: 1572-1582. DOI: 10.1016/J.Ijheatmasstransfer.2004.09.048  0.572
2005 Flynn RD, Kramer TA, Koo JM, Cheng CH, Fogg DW, Wang EN, Goodson KE. Convective boiling in silicon microchannels with localized heating and thermometry Proceedings of the 3rd International Conference On Microchannels and Minichannels, 2005. 125-130.  0.535
2005 Ness KD, Mariella RP, Long GW, Goodson KE, Belgrader P. DNA purification of biothreat agents using a micropillar chip Proceedings of the 3rd International Conference On Microchannels and Minichannels, 2005. 769-778.  0.706
2005 Hidrovo CH, Wang FM, Steinbrenner JE, Lee ES, Vigneron S, Cheng CH, Eaton JK, Goodson KE. Water slug detachment in two-phase hydrophobic microchannel flows Proceedings of the 3rd International Conference On Microchannels and Minichannels, 2005. 709-715.  0.423
2004 Wheeler EK, Benett W, Stratton P, Richards J, Chen A, Christian A, Ness KD, Ortega J, Li LG, Weisgraber TH, Goodson K, Milanovich F. Convectively driven polymerase chain reaction thermal cycler. Analytical Chemistry. 76: 4011-6. PMID 15253636 DOI: 10.1021/Ac034941G  0.783
2004 Vigneron S, Hidrovo CH, Wang FM, Lee ES, Steinbrenner JE, Kramer TA, Eaton JK, Goodson KE. 1D homogeneous modeling of microchannel two-phase flow with distributed liquid water injection from walls American Society of Mechanical Engineers, Advanced Energy Systems Division (Publication) Aes. 44: 23-30. DOI: 10.1115/IMECE2004-61759  0.441
2004 Hidrovo CH, Wang FM, Lee ES, Vigneron S, Steinbrenner JE, Paidipati JV, Kramer TA, Eaton JK, Goodson KE. Experimental investigation and visualization of two-phase flow and water transport in microchannels American Society of Mechanical Engineers, Fluids Engineering Division (Publication) Fed. 260: 205-212. DOI: 10.1115/IMECE2004-61401  0.432
2004 Sinha S, Schelling PK, Phillpot SR, Goodson KE. Atomistic simulations of G-type phonons in silicon devices Proceedings of the Asme Heat Transfer/Fluids Engineering Summer Conference 2004, Ht/Fed 2004. 4: 433-439. DOI: 10.1115/Ht-Fed2004-56429  0.481
2004 Wang EN, Devasenathipathy S, Santiago JG, Goodson KE, Kenny TW. Nucleation and growth of vapor bubbles in a heated silicon microchannel Journal of Heat Transfer. 126: 497-498. DOI: 10.1115/1.1811716  0.57
2004 Wang EN, Zhang L, Jiang L, Koo JM, Maveety JG, Sanchez EA, Goodson KE, Kenny TW. Correction to "Micromachined Jets for Liquid Impingement Cooling of VLSI Chips" Journal of Microelectromechanical Systems. 13: 1072. DOI: 10.1109/Jmems.2004.840851  0.514
2004 Wang EN, Zhang L, Jiang L, Koo JM, Maveety JG, Sanchez EA, Goodson KE, Kenny TW. Micromachined jets for liquid impingement cooling of VLSI chips Journal of Microelectromechanical Systems. 13: 833-842. DOI: 10.1109/Jmems.2004.835768  0.708
2004 Pop E, Dutton RW, Goodson KE. Analytic band Monte Carlo model for electron transport in Si including acoustic and optical phonon dispersion Journal of Applied Physics. 96: 4998-5005. DOI: 10.1063/1.1788838  0.536
2004 King WP, Kenny TW, Goodson KE. Comparison of thermal and piezoresistive sensing approaches for atomic force microscopy topography measurements Applied Physics Letters. 85: 2086-2088. DOI: 10.1063/1.1787160  0.572
2003 Chu D, Wong W, Goodson KE, Pease RFW. Transient temperature measurements of resist heating using nanothermocouples Journal of Vacuum Science & Technology B. 21: 2985-2989. DOI: 10.1116/1.1624255  0.429
2003 Cahill DG, Ford WK, Goodson KE, Mahan GD, Majumdar A, Maris HJ, Merlin R, Phillpot SR. Nanoscale thermal transport Journal of Applied Physics. 93: 793-818. DOI: 10.1063/1.1524305  0.476
2002 Chu D, Bilir DT, Fabian R, Pease W, Goodson KE. Submicron thermocouple measurements of electron-beam resist heating Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures. 20: 3044-3046. DOI: 10.1116/1.1523023  0.303
2002 King WP, Goodson KE. Thermal Writing and Nanoimaging With a Heated Atomic Force Microscope Cantilever Journal of Heat Transfer. 124: 597-597. DOI: 10.1115/1.1502634  0.565
2002 Cahill DG, Goodson K, Majumdar A. Thermometry and thermal transport in micro/nanoscale solid-state devices and structures Journal of Heat Transfer. 124: 223-241. DOI: 10.1115/1.1454111  0.535
2002 Jiang L, Mikkelsen J, Koo J, Huber D, Yao S, Zhang L, Zhou P, Maveety JG, Prasher R, Santiago JG, Kenny TW, Goodson KE. Closed-loop electroosmotic microchannel cooling system for VLSI circuits Ieee Transactions On Components and Packaging Technologies. 25: 347-355. DOI: 10.1109/Tcapt.2002.800599  0.648
2002 King WP, Kenny TW, Goodson KE, Cross GLW, Despont M, Dürig UT, Rothuizen H, Binnig G, Vettiger P. Design of atomic force microscope cantilevers for combined thermomechanical writing and thermal reading in array operation Journal of Microelectromechanical Systems. 11: 765-774. DOI: 10.1109/Jmems.2002.803283  0.568
2002 Zhang L, Koo J, Jiang L, Asheghi M, Goodson KE, Santiago JG, Kenny TW. Measurements and modeling of two-phase flow in microchannels with nearly constant heat flux boundary conditions Ieee\/Asme Journal of Microelectromechanical Systems. 11: 12-19. DOI: 10.1109/84.982858  0.571
2002 Asheghi M, Kurabayashi K, Kasnavi R, Goodson KE. Thermal conduction in doped single-crystal silicon films Journal of Applied Physics. 91: 5079-5088. DOI: 10.1063/1.1458057  0.667
2001 Fletcher DA, Goodson KE, Kino GS. Focusing in microlenses close to a wavelength in diameter. Optics Letters. 26: 399-401. PMID 18040333 DOI: 10.1364/Ol.26.000399  0.486
2001 Chu D, Touzelbaev M, Goodson KE, Babin S, Pease RF. Thermal conductivity measurements of thin-film resist Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures. 19: 2874-2877. DOI: 10.1116/1.1421557  0.78
2001 Sverdrup PG, Ju YS, Goodson KE. Sub-continuum simulations of heat conduction in silicon-on-insulator transistors Journal of Heat Transfer. 123: 130-137. DOI: 10.1115/1.1337651  0.817
2001 Fletcher DA, Crozier KB, Guarini KW, Minne SC, Kino GS, Quate CF, Goodson KE. Microfabricated silicon solid immersion lens Journal of Microelectromechanical Systems. 10: 450-459. DOI: 10.1109/84.946806  0.526
2001 McConnell AD, Uma S, Goodson KE. Thermal conductivity of doped polysilicon layers Journal of Microelectromechanical Systems. 10: 360-369. DOI: 10.1109/84.946782  0.826
2001 Fletcher DA, Crozier KB, Quate CF, Kino GS, Goodson KE, Simanovskii D, Palanker DV. Refraction contrast imaging with a scanning microlens Applied Physics Letters. 78: 3589-3591. DOI: 10.1063/1.1377318  0.628
2001 Touzelbaev MN, Zhou P, Venkatasubramanian R, Goodson KE. Thermal characterization of Bi2Te3/Sb2Te3 superlattices Journal of Applied Physics. 90: 763-767. DOI: 10.1063/1.1374458  0.795
2001 Sverdrup PG, Sinha S, Asheghi M, Uma S, Goodson KE. Measurement of ballistic phonon conduction near hotspots in silicon Applied Physics Letters. 78: 3331-3333. DOI: 10.1063/1.1371536  0.826
2001 King WP, Kenny TW, Goodson KE, Cross G, Despont M, Dürig U, Rothuizen H, Binnig GK, Vettiger P. Atomic force microscope cantilevers for combined thermomechanical data writing and reading Applied Physics Letters. 78: 1300-1302. DOI: 10.1063/1.1351846  0.614
2001 Uma S, McConnell AD, Asheghi M, Kurabayashi K, Goodson KE. Temperature-dependent thermal conductivity of undoped polycrystalline silicon layers International Journal of Thermophysics. 22: 605-616. DOI: 10.1023/A:1010791302387  0.827
2001 Touzelbaev MN, Goodson KE. Impact of Experimental Timescale and Geometry on Thin-Film Thermal Property Measurements International Journal of Thermophysics. 22: 243-263. DOI: 10.1023/A:1006724123069  0.791
2000 Cross GL, Despont M, Drechsler U, Dürig UT, Rothuizen H, Binnig GK, Vettiger P, King WP, Goodson KE. Thermomechanical Formation an Thermal Sensing of Nanometer-Scal Indenatations in PMMA Thin Films for Parallel and Dense AFM Data Storage Mrs Proceedings. 649. DOI: 10.1557/Proc-649-Q2.3  0.581
2000 Fletcher DA, Crozier KB, Quate CF, Kino GS, Goodson KE, Simanovskii D, Palanker DV. Near-field infrared imaging with a microfabricated solid immersion lens Applied Physics Letters. 77: 2109-2111. DOI: 10.1063/1.1313368  0.645
2000 Dürig U, Cross G, Despont M, Drechsler U, Häberle W, Lutwyche M, Rothuizen H, Stutz R, Widmer R, Vettiger P, Binnig G, King W, Goodson K. Tribology Letters. 9: 25-32. DOI: 10.1023/A:1018844124754  0.486
1999 Goodson KE, Ju YS. Heat conduction in novel electronic films Annual Review of Materials Science. 29: 261-293. DOI: 10.1146/Annurev.Matsci.29.1.261  0.418
1999 Kurabayashi K, Asheghi M, Touzelbaev M, Goodson KE. Measurement of the thermal conductivity anisotropy in polyimide films Journal of Microelectromechanical Systems. 8: 180-191. DOI: 10.1109/84.767114  0.813
1999 Chui BW, Asheghi M, Ju YS, Goodson KE, Kenny TW, Mamin HJ. Intrinsic-Carrier Thermal Runaway In Silicon Microcantilevers Microscale Thermophysical Engineering. 3: 217-228. DOI: 10.1080/108939599199765  0.493
1999 Kurabayashi K, Goodson KE. Impact of molecular orientation on thermal conduction in spin-coated polyimide films Journal of Applied Physics. 86: 1925-1931. DOI: 10.1063/1.370989  0.635
1999 Ju YS, Goodson KE. Process-dependent thermal transport properties of silicon-dioxide films deposited using low-pressure chemical vapor deposition Journal of Applied Physics. 85: 7130-7134. DOI: 10.1063/1.370523  0.476
1999 Ju YS, Goodson KE. Phonon scattering in silicon films with thickness of order 100 nm Applied Physics Letters. 74: 3005-3007. DOI: 10.1063/1.123994  0.453
1999 Ju Y, Kurabayashi K, Goodson K. Thermal characterization of anisotropic thin dielectric films using harmonic Joule heating Thin Solid Films. 339: 160-164. DOI: 10.1016/S0040-6090(98)01328-5  0.667
1998 Asheghi M, Touzelbaev MN, Goodson KE, Leung YK, Wong SS. Temperature-Dependent Thermal Conductivity of Single-Crystal Silicon Layers in SOI Substrates Journal of Heat Transfer. 120: 30-36. DOI: 10.1115/1.2830059  0.791
1998 Ju YS, Goodson KE. Short-time-scale thermal mapping of microdevices using a scanning thermoreflectance technique Journal of Heat Transfer-Transactions of the Asme. 120: 306-313. DOI: 10.1115/1.2824246  0.385
1998 Chaudhari AM, Woudenberg TM, Allin M, Goodson KE. Transient liquid crystal thermometry of microfabricated PCR vessel arrays Journal of Microelectromechanical Systems. 7: 345-354. DOI: 10.1109/84.735341  0.352
1998 Chui BW, Stowe TD, Ju YS, Goodson KE, Kenny TW, Mamin HJ, Terris BD, Ried RP, Rugar D. Low-stiffness silicon cantilevers with integrated heaters and piezoresistive sensors for high-density AFM thermomechanical data storage Journal of Microelectromechanical Systems. 7: 69-77. DOI: 10.1109/84.661386  0.409
1998 Touzelbaev MN, Goodson KE. Applications of micron-scale passive diamond layers for the integrated circuits and microelectromechanical systems industries☆ Diamond and Related Materials. 7: 1-14. DOI: 10.1016/S0925-9635(97)00199-4  0.758
1997 Touzelbaev MN, Goodson KE. Impact of Nucleation Density on Thermal Resistance near Diamond-Substrate Boundaries Journal of Thermophysics and Heat Transfer. 11: 506-512. DOI: 10.2514/2.6291  0.771
1997 Ju YS, Goodson KE. Size effect on thermal conduction in silicon-on-insulator devices under electrostatic discharge (ESD) conditions Japanese Journal of Applied Physics. 36. DOI: 10.1143/Jjap.36.L798  0.469
1997 Chui BW, Mamin HJ, Terris BD, Rugar D, Goodson KE, Kenny TW. Micromachined heaters with 1-/spl mu/s thermal time constants for AFM thermomechanical data storage Sensors. 2: 1085-1088. DOI: 10.1109/Sensor.1997.635387  0.416
1997 Goodson K, Kurabayashi K, Pease R. Improved heat sinking for laser-diode arrays using microchannels in CVD diamond Ieee Transactions On Components, Packaging, and Manufacturing Technology: Part B. 20: 104-109. DOI: 10.1109/96.554536  0.681
1997 Leung Y, Paul AK, Goodson KE, Plummer JD, Wong SS. Heating mechanisms of LDMOS and LIGBT in ultrathin SOI Ieee Electron Device Letters. 18: 414-416. DOI: 10.1109/55.622514  0.417
1997 Ju YS, Käding OW, Leung YK, Wong SS, Goodson KE. Short-timescale thermal mapping of semiconductor devices Ieee Electron Device Letters. 18: 169-171. DOI: 10.1109/55.568750  0.413
1997 Asheghi M, Leung YK, Wong SS, Goodson KE. Phonon-boundary scattering in thin silicon layers Applied Physics Letters. 71: 1798-1800. DOI: 10.1063/1.119402  0.437
1996 Yoon JU, Kim GN, Krska JY, Chung JE, Allen LP, Goodson K, Kaeding O, Nauka K. Correlation of Electrical and Physical Properties of SIMOX BOX Affected by Various Implantation Parameters Mrs Proceedings. 446: 193. DOI: 10.1557/Proc-446-193  0.309
1996 Goodson KE. Thermal Conduction in Nonhomogeneous CVD Diamond Layers in Electronic Microstructures Journal of Heat Transfer-Transactions of the Asme. 118: 279-286. DOI: 10.1115/1.2825842  0.365
1995 Goodson KE. Impact Of Cvd Diamond Layers On The Thermal Engineering Of Electronic Systems Annual Review of Heat Transfer. 6: 323-353. DOI: 10.1615/Annualrevheattransfer.V6.80  0.33
1995 Goodson KE, Flik MI, Su LT, Antoniadis DA. Prediction and Measurement of Temperature Fields in Silicon-on-Insulator Electronic Circuits Journal of Heat Transfer-Transactions of the Asme. 117: 574-581. DOI: 10.1115/1.2822616  0.426
1995 Goodson KE, Käding OW, Rösler M, Zachai R. Experimental investigation of thermal conduction normal to diamond‐silicon boundaries Journal of Applied Physics. 77: 1385-1392. DOI: 10.1063/1.358950  0.42
1995 Goodson KE, Käding OW, Rösner M, Zachai R. Thermal conduction normal to diamond‐silicon boundaries Applied Physics Letters. 66: 3134-3136. DOI: 10.1063/1.113625  0.462
1994 Goodson KE, Flik MI. Solid layer thermal-conductivity measurement techniques Applied Mechanics Reviews. 47: 101-112. DOI: 10.1115/1.3111073  0.384
1994 Goodson KE, Flik MI, Su LT, Antoniadis DA. Prediction and Measurement of the Thermal Conductivity of Amorphous Dielectric Layers Journal of Heat Transfer-Transactions of the Asme. 116: 317-324. DOI: 10.1115/1.2911402  0.394
1994 Su LT, Chung JE, Dimitri AA, Goodson KE, Flik MI. Measurement and Modeling of Self-Heating in SOI NMOSFET’s Ieee Transactions On Electron Devices. 41: 69-75. DOI: 10.1109/16.259622  0.721
1994 Käding OW, Skurk H, Goodson KE. Thermal conduction in metallized silicon‐dioxide layers on silicon Applied Physics Letters. 65: 1629-1631. DOI: 10.1063/1.112933  0.373
1993 Goodson KE, Flik MI. Electron and Phonon Thermal Conduction in Epitaxial High-Tc Superconducting Films Journal of Heat Transfer. 115: 17-25. DOI: 10.1115/1.2910646  0.454
1993 Goodson KE, Flik MI, Su LT, Antoniadis DA. Annealing-temperature dependence of the thermal conductivity of LPCVD silicon-dioxide layers Ieee Electron Device Letters. 14: 490-492. DOI: 10.1109/55.244740  0.75
1993 Flik MI, Zhang ZM, Goodson KE. Intrinsic superconducting radiation detector Applied Physics Letters. 62: 2862-2864. DOI: 10.1063/1.109182  0.669
1992 Flik MI, Zhang ZM, Goodson KE, Siegal MP, Phillips JM. Electron scattering rate in epitaxial YBa2Cu3O7 superconducting films. Physical Review. B, Condensed Matter. 46: 5606-5614. PMID 10004349 DOI: 10.1103/Physrevb.46.5606  0.741
1992 Flik MI, Choi BI, Goodson KE. Heat Transfer Regimes in Microstructures Journal of Heat Transfer. 114: 666-674. DOI: 10.1115/1.2911332  0.412
1992 Flik MI, Goodson KE. Thermal Analysis of Electron-Beam Absorption in Low-Temperature Superconducting Films Journal of Heat Transfer. 114: 264-270. DOI: 10.1115/1.2911256  0.428
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