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Niru Kumari, Ph.D. - Publications

Affiliations: 
2010 Mechanical Engineering Purdue University, West Lafayette, IN, United States 
Area:
Mechanical Engineering
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14 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2017 Chen L, Kumari N, Chen S, Hou Y. Thermal conductivity of multilayer dielectric films from molecular dynamics simulations Rsc Advances. 7: 26194-26201. DOI: 10.1039/C7Ra03275G  0.313
2016 Fong SW, Sood A, Chen L, Kumari N, Asheghi M, Goodson KE, Gibson GA, Wong HP. Thermal conductivity measurement of amorphous dielectric multilayers for phase-change memory power reduction Journal of Applied Physics. 120: 015103. DOI: 10.1063/1.4955165  0.312
2012 Breen TJ, Walsh EJ, Punch J, Shah AJ, Bash CE, Rubenstein B, Heath S, Kumari N. From Chip to Cooling Tower Data Center Modeling: Influence of Air-Stream Containment on Operating Efficiency Journal of Electronic Packaging. 134: 41006. DOI: 10.1115/1.4007110  0.316
2012 Dash S, Kumari N, Garimella SV. Frequency-dependent transient response of an oscillating electrically actuated droplet Journal of Micromechanics and Microengineering. 22. DOI: 10.1088/0960-1317/22/7/075004  0.606
2011 Kumari N, Garimella SV. Electrowetting-induced dewetting transitions on superhydrophobic surfaces. Langmuir : the Acs Journal of Surfaces and Colloids. 27: 10342-6. PMID 21770408 DOI: 10.1021/La2027412  0.498
2011 Dash S, Kumari N, Dicuangco M, Garimella SV. Single-step fabrication and characterization of ultrahydrophobic surfaces with hierarchical roughness Asme 2011 Pacific Rim Technical Conference and Exhibition On Packaging and Integration of Electronic and Photonic Systems, Interpack 2011. 1: 685-692. DOI: 10.1115/IPACK2011-52046  0.423
2011 Dash S, Kumari N, Garimella SV. Characterization of ultrahydrophobic hierarchical surfaces fabricated using a single-step fabrication methodology Journal of Micromechanics and Microengineering. 21. DOI: 10.1088/0960-1317/21/10/105012  0.562
2011 Kumari N, Garimella SV. Characterization of the heat transfer accompanying electrowetting or gravity-induced droplet motion International Journal of Heat and Mass Transfer. 54: 4037-4050. DOI: 10.1016/J.Ijheatmasstransfer.2011.04.015  0.562
2010 Kumari N, Bahadur V, Hodes M, Salamon T, Lyons A, Kolodner P, Garimella SV. Numerical analysis of mist-cooled high power components in cabinets Proceedings of the Asme Interpack Conference 2009, Ipack2009. 2: 933-944. DOI: 10.1115/InterPACK2009-89269  0.606
2010 Kumari N, Bahadur V, Hodes M, Salamon T, Kolodner P, Lyons A, Garimella SV. Analysis of evaporating mist flow for enhanced convective heat transfer International Journal of Heat and Mass Transfer. 53: 3346-3356. DOI: 10.1016/J.Ijheatmasstransfer.2010.02.027  0.636
2008 Kumari N, Abraham J. Interactions of decelerating drops movingd in tandem Atomization and Sprays. 18: 191-241. DOI: 10.1615/Atomizspr.V18.I3.10  0.312
2008 Kumari N, Bahadur V, Garimella SV. Electrical actuation of dielectric droplets Journal of Micromechanics and Microengineering. 18. DOI: 10.1088/0960-1317/18/8/085018  0.65
2008 Kumari N, Bahadur V, Garimella SV. Electrical actuation of electrically conducting and insulating droplets using ac and dc voltages Journal of Micromechanics and Microengineering. 18. DOI: 10.1088/0960-1317/18/10/105015  0.647
2007 Kumari N, Krishnan S, Garimella SV. Analysis and performance comparison of competing desktop cooling technologies 2007 Proceedings of the Asme Interpack Conference, Ipack 2007. 2: 1018-1027. DOI: 10.1115/IPACK2007-33407  0.48
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