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Michael J. Bozack - Publications

Affiliations: 
Auburn University, Auburn, AL, United States 
Area:
Mechanical Engineering, Metallurgy Engineering, Materials Science Engineering
Website:
https://www.auburn.edu/academic/cosam/faculty/physics/bozack/AUSSL/biography.html
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9 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2019 Raj A, Sanders T, Sridhar S, Evans JL, Bozack MJ, Johnson WR, Carpenter DM. Thermal Shock Reliability of Isothermally Aged Doped Lead-Free Solder With Semiparametric Estimation Ieee Transactions On Components, Packaging and Manufacturing Technology. 9: 1082-1093. DOI: 10.1109/Tcpmt.2019.2909052  0.339
2017 Bozack MJ, Snipes EK, Flowers GT. Influence of Small Weight Percentages of Bi and Systematic Coefficient of Thermal Expansion Variations on Sn Whiskering Ieee Transactions On Components, Packaging and Manufacturing Technology. 7: 338-344. DOI: 10.1109/Tcpmt.2016.2601694  0.327
2015 Hai Z, Zhang J, Shen C, Evans JL, Bozack MJ, Basit MM, Suhling JC. Reliability comparison of aged sac fine-pitch ball grid array packages versus surface finishes Ieee Transactions On Components, Packaging and Manufacturing Technology. 5: 828-837. DOI: 10.1109/Tcpmt.2015.2420566  0.328
2013 Zhang J, Hai Z, Thirugnanasambandam S, Evans JL, Bozack MJ, Zhang Y, Suhling JC. Thermal aging effects on the thermal cycling reliability of lead-free fine pitch packages Ieee Transactions On Components, Packaging and Manufacturing Technology. 3: 1348-1357. DOI: 10.1109/Tcpmt.2013.2251932  0.335
2012 Zhang J, Thirugnanasambandam S, Evans JL, Bozack MJ, Sesek R. Impact of isothermal aging on the long-term reliability of fine-pitch ball grid array packages with different Sn-Ag-Cu solder joints Ieee Transactions On Components, Packaging and Manufacturing Technology. 2: 1317-1327. DOI: 10.1109/Tcpmt.2012.2198476  0.323
2008 Zhou Y, Ahyi C, Isaacs-Smith T, Bozack M, Tin C, Williams J, Park M, Cheng A, Park J, Kim D, Wang D, Preble EA, Hanser A, Evans K. Formation, etching and electrical characterization of a thermally grown gallium oxide on the Ga-face of a bulk GaN substrate Solid-State Electronics. 52: 756-764. DOI: 10.1016/J.Sse.2007.10.045  0.32
2006 Adedeji AV, Ahyi AC, Williams JR, Bozack MJ, Mohney SE, Liu B, Scofield JD. Composite ohmic contacts to SiC Materials Science Forum. 879-882. DOI: 10.4028/Www.Scientific.Net/Msf.527-529.879  0.325
2004 Suhling JC, Gale HS, Johnson RW, Islam MN, Shete T, Lall P, Bozack MJ, Evans JL, Seto P, Gupta T, Thompson JR. Thermal cycling reliability of lead‐free chip resistor solder joints Soldering & Surface Mount Technology. 16: 77-87. DOI: 10.1108/09540910410537354  0.308
1998 Oder TN, Williams JR, Bozack MJ, Iyer V, Mohney SE, Crofton J. High temperature stability of chromium boride ohmic contacts to p-type 6H-SiC Journal of Electronic Materials. 27: 324-329. DOI: 10.1007/S11664-998-0409-4  0.353
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