Year |
Citation |
Score |
2019 |
Park EJ, Choi JM, Kwon KW. Behavior Modeling for Charge Storage in Single-Poly Floating Gate Device. Journal of Nanoscience and Nanotechnology. 19: 6727-6731. PMID 31027018 DOI: 10.1166/Jnn.2019.17112 |
0.301 |
|
2019 |
Kim C, Ahn S, Min J, Kwon K. Power Efficient and Reliable Nonvolatile TCAM With Hi-PFO and Semi-Complementary Driver Ieee Transactions On Circuits and Systems I-Regular Papers. 66: 605-615. DOI: 10.1109/Tcsi.2018.2867005 |
0.328 |
|
2019 |
Choi J, Park E, Woo J, Kwon K. A Highly Linear Neuromorphic Synaptic Device Based on Regulated Charge Trap/Detrap Ieee Electron Device Letters. 40: 1848-1851. DOI: 10.1109/Led.2019.2943113 |
0.301 |
|
2016 |
Ryu J, Kwon K. A Reliable 2T2MTJ Nonvolatile Static Gain Cell STT-MRAM With Self-Referencing Sensing Circuits for Embedded Memory Application Ieee Transactions On Magnetics. 52: 1-10. DOI: 10.1109/Tmag.2015.2495253 |
0.318 |
|
2014 |
An T, Choe K, Kwon KW, Kim S. Performance optimization study of finFETs considering parasitic capacitance and resistance Journal of Semiconductor Technology and Science. 14: 525-536. DOI: 10.5573/Jsts.2014.14.5.525 |
0.302 |
|
2014 |
Jeong Y, Kim H, Kim S, Kwon K, Chun J. An Inductive-coupling Link with a Complementary Switching Transmitter and an Integrating Receiver Journal of Semiconductor Technology and Science. 14: 227-234. DOI: 10.5573/Jsts.2014.14.2.227 |
0.317 |
|
2014 |
Kim S, Jin E, Kwon K, Kim J, Chun J. A 6.4-Gb/s Voltage-Mode Near-Ground Receiver With a One-Tap Data and Edge DFE Ieee Transactions On Circuits and Systems Ii-Express Briefs. 61: 438-442. DOI: 10.1109/Tcsii.2014.2320012 |
0.344 |
|
2014 |
Kim S, Jeong Y, Lee M, Kwon K, Chun J. A 5.2-Gb/s Low-Swing Voltage-Mode Transmitter With an AC-/DC-Coupled Equalizer and a Voltage Offset Generator Ieee Transactions On Circuits and Systems I: Regular Papers. 61: 213-225. DOI: 10.1109/Tcsi.2013.2262186 |
0.308 |
|
2013 |
Kim SY, Baek JM, Seo DJ, Park JK, Chun JH, Kwon KW. Power-efficient fast write and hidden refresh of ReRAM using an ADC-based sense amplifier Ieee Transactions On Circuits and Systems Ii: Express Briefs. 60: 776-780. DOI: 10.1109/Tcsii.2013.2281767 |
0.346 |
|
2013 |
Lee B, Jeon H, Kwon K, Lee H. Employment of a bi-layer of Ni(P)/Cu as a diffusion barrier in a Cu/Sn/Cu bonding structure for three-dimensional interconnects Acta Materialia. 61: 6736-6742. DOI: 10.1016/J.Actamat.2013.07.043 |
0.312 |
|
2012 |
Lee M, Kim S, Jeong Y, Bae J, Kwon K, Chun J. Low Power 4-Gb/s Receiver for GND-referenced Differential Signaling Journal of the Institute of Electronics Engineers of Korea. 49: 244-250. DOI: 10.5573/Ieek.2012.49.9.244 |
0.333 |
|
2012 |
Choi Y, Ko W, Kwon K, Chun J. A Study on the Modeling of a High-Voltage IGBT for SPICE Simulations Journal of the Institute of Electronics Engineers of Korea. 49: 194-200. DOI: 10.5573/Ieek.2012.49.12.194 |
0.319 |
|
2012 |
Moon J, Jung W, Kim J, Kwon K, Jun Y, Chun J. (A 2.0-GS/s 5-b Current Mode ADC-Based Receiver with Embedded Channel Equalizer ) Journal of the Institute of Electronics Engineers of Korea. 49: 184-193. DOI: 10.5573/Ieek.2012.49.12.184 |
0.307 |
|
2012 |
Lee G, Chun J, Cao S, Beebe SG, Kwon K, Dutton RW. Investigation on the Behavior of Stacked Devices Within Output Drivers Under ESD Conditions Ieee Transactions On Electron Devices. 59: 3313-3320. DOI: 10.1109/Ted.2012.2222888 |
0.328 |
|
2012 |
Lee B, Jeon H, Jeon S, Kwon K, Lee H. A Study on the Breakdown Mechanism of an Electroless-Plated Ni(P) Diffusion Barrier for Cu/Sn/Cu 3D Interconnect Bonding Structures Journal of Electronic Materials. 41: 109-114. DOI: 10.1007/S11664-011-1759-X |
0.309 |
|
2010 |
Baek JM, Chun JH, Kwon KW. A power-efficient voltage upconverter for embedded EEPROM application Ieee Transactions On Circuits and Systems Ii: Express Briefs. 57: 435-439. DOI: 10.1109/Tcsii.2010.2048351 |
0.346 |
|
2010 |
Lee K, Chun J, Kwon K. A low power CMOS compatible embedded EEPROM for passive RFID tag Microelectronics Journal. 41: 662-668. DOI: 10.1016/J.Mejo.2010.06.006 |
0.344 |
|
2008 |
Park J, Kim C, Kim S, Song I, Kim S, Kang D, Lim H, Yin H, Jung R, Lee E, Lee J, Kwon K, Park Y. Source/Drain Series-Resistance Effects in Amorphous Gallium–Indium Zinc-Oxide Thin Film Transistors Ieee Electron Device Letters. 29: 879-881. DOI: 10.1109/Led.2008.2000815 |
0.302 |
|
2004 |
Sim J, Kwon K, Chun K. Charge-transferred presensing, negatively precharged word-line, and temperature-insensitive power-up schemes for low-voltage DRAMs Ieee Journal of Solid-State Circuits. 39: 694-703. DOI: 10.1109/Jssc.2004.825224 |
0.332 |
|
1999 |
Kwon K, Lee H, Sinclair R. Solid-state amorphization at tetragonal-Ta/Cu interfaces Applied Physics Letters. 75: 935-937. DOI: 10.1063/1.124559 |
0.48 |
|
1999 |
Kwon K, Lee H, Sinclair R. Thermal Stability of The Copper/Tantalum Interfaces In Advanced Microelectronic Metallization Microscopy and Microanalysis. 5: 176-177. DOI: 10.1017/S1431927600014203 |
0.421 |
|
1999 |
Lee HJ, Kwon KW, Ryu C, Sinclair R. Thermal stability of a Cu/Ta multilayer: An intriguing interfacial reaction Acta Materialia. 47: 3965-3975. DOI: 10.1016/S1359-6454(99)00257-8 |
0.473 |
|
1997 |
Kwon K, Ryu C, Sinclair R, Wong SS. Evidence of heteroepitaxial growth of copper on beta-tantalum Applied Physics Letters. 71: 3069-3071. DOI: 10.1063/1.119439 |
0.457 |
|
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