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Boya Cui - Publications

Affiliations: 
2017 Electrical Engineering and Computer Science Northwestern University, Evanston, IL 
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8 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2018 Easley J, Arkun E, Cui B, Carmody M, Peng L, Grayson M, Phillips J. Analysis of Carrier Transport in n -Type Hg 1−x Cd x Te with Ultra-Low Doping Concentration Journal of Electronic Materials. 47: 5699-5704. DOI: 10.1007/S11664-018-6431-2  0.384
2017 Cui B, Audu CO, Liao Y, Nguyen ST, Farha OK, Hupp JT, Grayson M. Thermal Conductivity of ZIF-8 Thin-Film Under Ambient Gas Pressure. Acs Applied Materials & Interfaces. PMID 28791860 DOI: 10.1021/Acsami.7B06662  0.527
2017 Cui B, Grayson MA. Background subtraction in Fourier-domain mobility spectrum analysis for resolving low-mobility carriers Proceedings of Spie. 10111. DOI: 10.1117/12.2256345  0.331
2016 Cui B, Buchholz DB, Zeng L, Bedzyk M, Chang RPH, Grayson M. Long-term Room Temperature Instability in Thermal Conductivity of InGaZnO Thin Films Mrs Advances. 1: 1631-1636. DOI: 10.1557/Adv.2016.142  0.443
2016 Cui B, Zeng L, Keane D, Bedzyk MJ, Buchholz DB, Chang RPH, Yu X, Smith J, Marks TJ, Xia Y, Facchetti AF, Medvedeva JE, Grayson M. Thermal Conductivity Comparison of Indium Gallium Zinc Oxide Thin Films: Dependence on Temperature, Crystallinity, and Porosity Journal of Physical Chemistry C. 120: 7467-7475. DOI: 10.1021/Acs.Jpcc.5B12105  0.53
2015 Cui B, Tang Y, Grayson M. Introducing Fourier-domain mobility spectrum analysis (FMSA) to deduce multi-component carrier mobility and density Proceedings of Spie - the International Society For Optical Engineering. 9370. DOI: 10.1117/12.2179825  0.489
2015 Tang Y, Cui B, Zhou C, Grayson M. p × n-Type Transverse Thermoelectrics: A Novel Type of Thermal Management Material Journal of Electronic Materials. 44: 2095-2104. DOI: 10.1007/S11664-015-3666-Z  0.525
2014 Zhou C, Cui B, Vurgaftman I, Canedy CL, Kim CS, Kim M, Bewley WW, Merritt CD, Abell J, Meyer JR, Grayson M. Thermal conductivity tensors of the cladding and active layers of interband cascade lasers Applied Physics Letters. 105. DOI: 10.1063/1.4905279  0.549
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