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Pradeep Lall

Affiliations: 
Auburn University, Auburn, AL, United States 
Area:
Mechanical Engineering, Electronics and Electrical Engineering
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"Pradeep Lall"
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Mohd N. Islam grad student 2005 Auburn University
Dhananjay R. Panchagade grad student 2007 Auburn University

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Publications

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Lall P, Thomas T. (2021) Principal Component Analysis and Independent Component Analysis-Based Prognostic Health Monitoring of Electronic Assemblies Subjected to Simultaneous Temperature-Vibration Loads Journal of Electronic Packaging. 143
Lall P, Yadav V, Suhling JC, et al. (2020) Evolution of Anand Parameters with Elevated Temperature Aging for SAC Leadfree Alloys Journal of Electronic Packaging
Lall P, Narangaparambil J, Leever B, et al. (2020) Flexure and Twist Test Reliability Assurance of Flexible Electronics Journal of Electronic Packaging. 142
Lall P, Thomas T, Yadav V, et al. (2020) Acceleration Factor Modeling of Flexible Electronic Substrates From Actual Human Body Measurements Journal of Electronic Packaging. 142
Lall P, Deshpande S, Nguyen L. (2017) Development of Model for Identification of Process Parameters for Wet Decapsulation of Copper–Aluminum Wirebond in PEMs Ieee Transactions On Components, Packaging and Manufacturing Technology. 7: 1280-1292
Hasnine M, Suhling JC, Prorok BC, et al. (2017) Anisotropic Mechanical Properties of SAC Solder Joints in Microelectronic Packaging and Prediction of Uniaxial Creep Using Nanoindentation Creep Experimental Mechanics. 57: 603-614
Lall P, Mirza KM, Harsha M, et al. (2016) Microstructural Indicators for Assessment of Effect of Prolonged and Intermittent Storage on Reliability of Lead-free Electronics Ieee Transactions On Device and Materials Reliability. 16: 304-317
Lall P, Deshpande S, Nguyen L, et al. (2016) Microstructural Indicators for Prognostication of Copper-Aluminum Wire Bond Reliability Under High-Temperature Storage and Temperature Humidity Ieee Transactions On Components, Packaging and Manufacturing Technology
Mustafa M, Suhling JC, Lall P. (2016) Experimental determination of fatigue behavior of lead free solder joints in microelectronic packaging subjected to isothermal aging Microelectronics Reliability. 56: 136-147
Lall P, Zhang H. (2015) Assessment of Lumen Degradation and Remaining Life of Light-Emitting Diodes Using Physics-Based Indicators and Particle Filter Journal of Electronic Packaging. 137
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