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Carl V. Thompson - Publications

Affiliations: 
Materials Science and Engineering Massachusetts Institute of Technology, Cambridge, MA, United States 
Area:
research on thin films and nanostructures for use in micro- and nano-systems, especially electronic, electromechanical systems and electrochemical systems
Website:
http://dmse.mit.edu/faculty/profile/thompson
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248 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2020 Miao J, Wang B, Thompson CV. Kinetic Study of Lithiation-Induced Phase Transitions in Amorphous Germanium Thin Films Journal of the Electrochemical Society. 167: 90557. DOI: 10.1149/1945-7111/Ab9Eec  0.358
2020 Miao J, Wang B, Thompson CV. First-order amorphous-to-amorphous phase transitions during lithiation of silicon thin films Physical Review Materials. 4. DOI: 10.1103/Physrevmaterials.4.043608  0.379
2018 Miao J, Thompson CV. Kinetic Study of the Initial Lithiation of Amorphous Silicon Thin Film Anodes Journal of the Electrochemical Society. 165: A650-A656. DOI: 10.1149/2.1011803Jes  0.435
2018 Perego D, Heng JST, Wang X, Shao-Horn Y, Thompson CV. High-performance polycrystalline RuOx cathodes for thin film Li-ion batteries Electrochimica Acta. 283: 228-233. DOI: 10.1016/J.Electacta.2018.06.172  0.411
2017 Birnbaum AJ, Thompson CV, Steuben JC, Iliopoulos AP, Michopoulos JG. Oxygen-induced giant grain growth in Ag films Applied Physics Letters. 111: 163107. DOI: 10.1063/1.4998741  0.473
2017 Made RI, Gao Y, Syaranamual GJ, Sasangka WA, Zhang L, Nguyen XS, Tay YY, Herrin JS, Thompson CV, Gan CL. Characterisation of defects generated during constant current InGaN-on-silicon LED operation Microelectronics Reliability. 561-565. DOI: 10.1016/J.Microrel.2017.07.072  0.312
2017 Zheng W, Cheng Q, Wang D, Thompson CV. High-performance solid-state on-chip supercapacitors based on Si nanowires coated with ruthenium oxide via atomic layer deposition Journal of Power Sources. 341: 1-10. DOI: 10.1016/J.Jpowsour.2016.11.093  0.335
2016 Tan SC, Zhao H, Thompson CV. Fabrication of high aspect ratio AFM probes with different materials inspired by TEM "lift-out" method Journal of Vacuum Science and Technology B: Nanotechnology and Microelectronics. 34. DOI: 10.1116/1.4961595  0.305
2016 Sasangka WA, Syaranamual GJ, Made RI, Thompson CV, Gan CL. Threading dislocation movement in AlGaN/GaN-on-Si high electron mobility transistors under high temperature reverse bias stressing Aip Advances. 6: 095102. DOI: 10.1063/1.4962544  0.313
2016 Al-Obeidi A, Kramer D, Boles ST, Mönig R, Thompson CV. Mechanical measurements on lithium phosphorous oxynitride coated silicon thin film electrodes for lithium-ion batteries during lithiation and delithiation Applied Physics Letters. 109. DOI: 10.1063/1.4961234  0.702
2016 Kim GH, Ma W, Yildiz B, Thompson CV. Effect of annealing ambient on anisotropic retraction of film edges during solid-state dewetting of thin single crystal films Journal of Applied Physics. 120: 075306. DOI: 10.1063/1.4961205  0.435
2016 Zucker RV, Kim GH, Ye J, Carter WC, Thompson CV. The mechanism of corner instabilities in single-crystal thin films during dewetting Journal of Applied Physics. 119. DOI: 10.1063/1.4944712  0.429
2016 Zucker RV, Carter WC, Thompson CV. Power-law scaling regimes for solid-state dewetting of thin films Scripta Materialia. 116: 143-146. DOI: 10.1016/J.Scriptamat.2016.01.039  0.35
2016 Al-Obeidi A, Kramer D, Mönig R, Thompson CV. Mechanical stresses and crystallization of lithium phosphorous oxynitride-coated germanium electrodes during lithiation and delithiation Journal of Power Sources. 306: 817-825. DOI: 10.1016/J.Jpowsour.2015.12.057  0.37
2015 Omampuliyur RS, Bhuiyan M, Han Z, Jing Z, Li L, Fitzgerald EA, Thompson CV, Choi WK. Nanostructured Thin Film Silicon Anodes for Li-Ion Microbatteries. Journal of Nanoscience and Nanotechnology. 15: 4926-33. PMID 26373058 DOI: 10.1166/Jnn.2015.9831  0.45
2015 Lai CQ, Zheng W, Choi WK, Thompson CV. Metal assisted anodic etching of silicon. Nanoscale. 7: 11123-34. PMID 26059556 DOI: 10.1039/C5Nr01916H  0.375
2015 Yu HZ, Thompson CV. Stress engineering using low oxygen background pressures during Volmer-Weber growth of polycrystalline nickel films Journal of Vacuum Science and Technology a: Vacuum, Surfaces and Films. 33. DOI: 10.1116/1.4902957  0.521
2015 Sasangka WA, Gan CL, Lai D, Tan CS, Thompson CV. Characterization of the Young's modulus, residual stress and fracture strength of Cu-Sn-In thin films using combinatorial deposition and micro-cantilevers Journal of Micromechanics and Microengineering. 25. DOI: 10.1088/0960-1317/25/3/035023  0.36
2015 Jang SA, Lee HJ, Thompson CV, Ross CA, Oh YJ. Crystallographic analysis of the solid-state dewetting of polycrystalline gold film using automated indexing in a transmission electron microscope Apl Materials. 3. DOI: 10.1063/1.4937432  0.442
2015 Al-Obeidi A, Kramer D, Thompson CV, Mönig R. Mechanical stresses and morphology evolution in germanium thin film electrodes during lithiation and delithiation Journal of Power Sources. 297: 472-480. DOI: 10.1016/J.Jpowsour.2015.06.155  0.402
2015 Kim GH, Thompson CV. Effect of surface energy anisotropy on Rayleigh-like solid-state dewetting and nanowire stability Acta Materialia. 84: 190-201. DOI: 10.1016/J.Actamat.2014.10.028  0.376
2015 Khoo CY, Liu H, Sasangka WA, Made RI, Tamura N, Kunz M, Budiman AS, Gan CL, Thompson CV. Impact of deposition conditions on the crystallization kinetics of amorphous GeTe films Journal of Materials Science. DOI: 10.1007/S10853-015-9493-Z  0.405
2014 Lai C, Thompson CV, Choi WK. Manipulation of wetting directions using nanostructures with asymmetric surface energies Materials Research Society Symposium Proceedings. 1648. DOI: 10.1557/Opl.2014.226  0.308
2014 Yu HZ, Thompson CV. Response to "Comment on 'Correlation of shape changes of grain surfaces and reversible stress evolution during interruptions of polycrystalline film growth'" [Appl. Phys. Lett. 105, 246101 (2014)] Applied Physics Letters. 105. DOI: 10.1063/1.4903864  0.548
2014 Yu HZ, Thompson CV. Correlation of shape changes of grain surfaces and reversible stress evolution during interruptions of polycrystalline film growth Applied Physics Letters. 104. DOI: 10.1063/1.4871214  0.568
2014 Boles ST, Thompson CV, Kraft O, Mönig R. Erratum: “In situ tensile and creep testing of lithiated silicon nanowires” [Appl. Phys. Lett. 103, 263906 (2013)] Applied Physics Letters. 104: 099902. DOI: 10.1063/1.4867539  0.679
2014 Yu HZ, Leib JS, Boles ST, Thompson CV. Fast and slow stress evolution mechanisms during interruptions of Volmer-Weber growth Journal of Applied Physics. 115. DOI: 10.1063/1.4863600  0.766
2014 Yu HZ, Thompson CV. Effects of oblique-angle deposition on intrinsic stress evolution during polycrystalline film growth Acta Materialia. 77: 284-293. DOI: 10.1016/J.Actamat.2014.05.060  0.549
2014 Yu HZ, Thompson CV. Grain growth and complex stress evolution during Volmer-Weber growth of polycrystalline thin films Acta Materialia. 67: 189-198. DOI: 10.1016/J.Actamat.2013.12.031  0.564
2013 Mitchell RR, Gallant BM, Shao-Horn Y, Thompson CV. Mechanisms of Morphological Evolution of Li2O2 Particles during Electrochemical Growth. The Journal of Physical Chemistry Letters. 4: 1060-4. PMID 26282021 DOI: 10.1021/Jz4003586  0.312
2013 Oh YJ, Kim JH, Thompson CV, Ross CA. Templated assembly of Co-Pt nanoparticles via thermal and laser-induced dewetting of bilayer metal films. Nanoscale. 5: 401-7. PMID 23175433 DOI: 10.1039/C2Nr32932H  0.325
2013 Boles ST, Thompson CV, Kraft O, Mönig R. In situ tensile and creep testing of lithiated silicon nanowires Applied Physics Letters. 103. DOI: 10.1063/1.4858394  0.698
2013 Hyun Kim G, Zucker RV, Ye J, Craig Carter W, Thompson CV. Quantitative analysis of anisotropic edge retraction by solid-state dewetting of thin single crystal films Journal of Applied Physics. 113. DOI: 10.1063/1.4788822  0.399
2013 Lai CQ, Cheng H, Choi WK, Thompson CV. Mechanics of catalyst motion during metal assisted chemical etching of silicon Journal of Physical Chemistry C. 117: 20802-20809. DOI: 10.1021/Jp407561K  0.321
2013 Zucker RV, Kim GH, Craig Carter W, Thompson CV. A model for solid-state dewetting of a fully-faceted thin film Comptes Rendus Physique. 14: 564-577. DOI: 10.1016/J.Crhy.2013.06.005  0.426
2012 Lai CQ, Thompson CV, Choi WK. Uni-, bi-, and tri-directional wetting caused by nanostructures with anisotropic surface energies. Langmuir : the Acs Journal of Surfaces and Colloids. 28: 11048-55. PMID 22746196 DOI: 10.1021/La301956Q  0.302
2012 Thompson CV. Solid-state dewetting of thin films Annual Review of Materials Research. 42: 399-434. DOI: 10.1146/Annurev-Matsci-070511-155048  0.442
2012 Giermann AL, Thompson CV. Three-dimensional graphoepitaxial alignment resulting from solid-state dewetting of Au films on surfaces with monoperiodic topography Applied Physics Letters. 101. DOI: 10.1063/1.4740277  0.447
2012 Jiang W, Bao W, Thompson CV, Srolovitz DJ. Phase field approach for simulating solid-state dewetting problems Acta Materialia. 60: 5578-5592. DOI: 10.1016/J.Actamat.2012.07.002  0.331
2011 Oh J, Thompson CV. Abnormal anodic aluminum oxide formation in confined structures for lateral pore arrays Journal of the Electrochemical Society. 158: C71-C75. DOI: 10.1149/1.3532778  0.305
2011 Oh J, Shin YC, Thompson CV. A tungsten interlayer process for fabrication of through-pore AAO scaffolds on gold substrates Journal of the Electrochemical Society. 158: K11-K15. DOI: 10.1149/1.3514606  0.302
2011 Choi ZS, Lee J, Lim MK, Gan CL, Thompson CV. Void dynamics in copper-based interconnects Journal of Applied Physics. 110. DOI: 10.1063/1.3611408  0.335
2011 Giermann AL, Thompson CV. Requirements for graphoepitaxial alignment through solid-state dewetting of Au films Journal of Applied Physics. 109. DOI: 10.1063/1.3567302  0.407
2011 Guo Q, Zhang L, Zeiger AS, Li Y, Van Vliet KJ, Thompson CV. Compositional dependence of Young's moduli for amorphous Cu-Zr films measured using combinatorial deposition on microscale cantilever arrays Scripta Materialia. 64: 41-44. DOI: 10.1016/J.Scriptamat.2010.08.061  0.411
2011 Ye J, Thompson CV. Anisotropic edge retraction and hole growth during solid-state dewetting of single crystal nickel thin films Acta Materialia. 59: 582-589. DOI: 10.1016/J.Actamat.2010.09.062  0.424
2011 Sasangka WA, Gan CL, Thompson CV, Choi WK, Wei J. Influence of bonding parameters on the interaction between Cu and noneutectic Sn-In solder thin films Journal of Electronic Materials. 40: 2329-2336. DOI: 10.1007/S11664-011-1747-1  0.316
2010 Ye J, Thompson CV. Regular pattern formation through the retraction and pinch-off of edges during solid-state dewetting of patterned single crystal films Physical Review B - Condensed Matter and Materials Physics. 82. DOI: 10.1103/Physrevb.82.193408  0.367
2010 Leib J, Thompson CV. Weak temperature dependence of stress relaxation in as-deposited polycrystalline gold films Physical Review B - Condensed Matter and Materials Physics. 82. DOI: 10.1103/Physrevb.82.121402  0.397
2010 Ye J, Thompson CV. Mechanisms of complex morphological evolution during solid-state dewetting of single-crystal nickel thin films Applied Physics Letters. 97. DOI: 10.1063/1.3480419  0.428
2010 Kim D, Makaram P, Thompson CV. Microscale oscillating crack propagation in silicon nitride thin films Applied Physics Letters. 97. DOI: 10.1063/1.3480408  0.329
2010 Makaram P, Joh J, Del Alamo JA, Palacios T, Thompson CV. Evolution of structural defects associated with electrical degradation in AlGaN/GaN high electron mobility transistors Applied Physics Letters. 96. DOI: 10.1063/1.3446869  0.303
2010 Chang SW, Oh J, Boles ST, Thompson CV. Fabrication of silicon nanopillar-based nanocapacitor arrays Applied Physics Letters. 96. DOI: 10.1063/1.3374889  0.695
2010 Guo Q, Noh JH, Liaw PK, Rack PD, Li Y, Thompson CV. Density change upon crystallization of amorphous Zr-Cu-Al thin films Acta Materialia. 58: 3633-3641. DOI: 10.1016/J.Actamat.2010.02.033  0.356
2010 THOMPSON CV, CLEVENGER LA, DEAVILLEZ R, MA E, MIURA H. ChemInform Abstract: Kinetics and Thermodynamics of Amorphous Silicide Formation in Metal/ Amorphous-Silicon Multilayer Thin Films Cheminform. 22: no-no. DOI: 10.1002/chin.199137287  0.31
2010 Chang SW, Chuang VP, Boles ST, Thompson CV. Metal-catalyzed etching of vertically aligned polysilicon and amorphous silicon nanowire arrays by etching direction confinement Advanced Functional Materials. 20: 4364-4370. DOI: 10.1002/Adfm.201000437  0.704
2010 Nessim GD, Acquaviva D, Seita M, O'Brien KP, Thompson CV. The critical role of the underlayer material and thickness in growing vertically aligned carbon nanotubes and nanofibers on metallic substrates by chemical vapor deposition Advanced Functional Materials. 20: 1306-1312. DOI: 10.1002/Adfm.200902265  0.349
2009 Nessim GD, Seita M, O'Brien KP, Hart AJ, Bonaparte RK, Mitchell RR, Thompson CV. Low temperature synthesis of vertically aligned carbon nanotubes with electrical contact to metallic substrates enabled by thermal decomposition of the carbon feedstock. Nano Letters. 9: 3398-405. PMID 19719143 DOI: 10.1021/Nl900675D  0.319
2009 Leib J, Mönig R, Thompson CV. Direct evidence for effects of grain structure on reversible compressive deposition stresses in polycrystalline gold films. Physical Review Letters. 102: 256101. PMID 19659098 DOI: 10.1103/Physrevlett.102.256101  0.468
2009 Nayfeh OM, Antoniadis DA, Boles S, Ho C, Thompson CV. Formation of single tiers of bridging silicon nanowires for transistor applications using vapor-liquid-solid growth from short silicon-on-insulator sidewalls. Small (Weinheim An Der Bergstrasse, Germany). 5: 2440-4. PMID 19642093 DOI: 10.1002/Smll.200900855  0.704
2009 Oh YJ, Ross CA, Jung YS, Wang Y, Thompson CV. Cobalt nanoparticle arrays made by templated solid-state dewetting. Small (Weinheim An Der Bergstrasse, Germany). 5: 860-5. PMID 19189331 DOI: 10.1002/Smll.200801433  0.402
2009 Wang M, Chua SJ, Gao H, Leib JS, Thompson CV. A study on morphology control of ZnO electrodeposited on au surface Journal of the Electrochemical Society. 156: D517-D520. DOI: 10.1149/1.3222740  0.4
2009 Kim D, Giermann AL, Thompson CV. Solid-state dewetting of patterned thin films Applied Physics Letters. 95. DOI: 10.1063/1.3268477  0.337
2009 Boles ST, Fitzgerald EA, Thompson CV, Ho CKF, Pey KL. Catalyst proximity effects on the growth rate of Si nanowires Journal of Applied Physics. 106. DOI: 10.1063/1.3207821  0.716
2009 Boles ST, Thompson CV, Fitzgerald EA. Influence of indium and phosphine on Au-catalyzed InP nanowire growth on Si substrates Journal of Crystal Growth. 311: 1446-1450. DOI: 10.1016/J.Jcrysgro.2008.12.043  0.705
2009 Chang SW, Chuang VP, Boles ST, Ross CA, Thompson CV. Densely packed arrays of ultra-high-as pect-ratio silicon nanowires fabricated using block-copolymer lithography and metal-assisted etching Advanced Functional Materials. 19: 2495-2500. DOI: 10.1002/Adfm.200900181  0.697
2008 Li Y, Guo Q, Kalb JA, Thompson CV. Matching glass-forming ability with the density of the amorphous phase. Science (New York, N.Y.). 322: 1816-9. PMID 19095935 DOI: 10.1126/Science.1163062  0.311
2008 Choi WK, Liew TH, Dawood MK, Smith HI, Thompson CV, Hong MH. Synthesis of silicon nanowires and nanofin arrays using interference lithography and catalytic etching. Nano Letters. 8: 3799-802. PMID 18954118 DOI: 10.1021/Nl802129F  0.487
2008 Nessim GD, Hart AJ, Kim JS, Acquaviva D, Oh J, Morgan CD, Seita M, Leib JS, Thompson CV. Tuning of vertically-aligned carbon nanotube diameter and areal density through catalyst pre-treatment. Nano Letters. 8: 3587-93. PMID 18837566 DOI: 10.1021/Nl801437C  0.309
2008 Kalb JA, Guo Q, Zhang X, Li Y, Sow C, Thompson CV. Phase-change materials in optically triggered microactuators Journal of Microelectromechanical Systems. 17: 1094-1103. DOI: 10.1109/Jmems.2008.928708  0.325
2008 Guo Q, Li M, Li Y, Shi L, Chong TC, Kalb JA, Thompson CV. Crystallization-induced stress in thin phase change films of different thicknesses Applied Physics Letters. 93. DOI: 10.1063/1.3040314  0.384
2008 Wei FL, Gan CL, Tan TL, Hau-Riege CS, Marathe AP, Vlassak JJ, Thompson CV. Electromigration-induced extrusion failures in Cu/low-k interconnects Journal of Applied Physics. 104. DOI: 10.1063/1.2957057  0.305
2008 Tadepalli R, Turner KT, Thompson CV. Effects of patterning on the interface toughness of wafer-level Cu-Cu bonds Acta Materialia. 56: 438-447. DOI: 10.1016/J.Actamat.2007.10.016  0.32
2007 Choi ZS, Mönig R, Thompson CV. Dependence of the electromigration flux on the crystallographic orientations of different grains in polycrystalline copper interconnects Applied Physics Letters. 90. DOI: 10.1063/1.2742285  0.357
2007 Chang CW, Thompson CV, Gan CL, Pey KL, Choi WK, Lim YK. Effects of microvoids on the linewidth dependence of electromigration failure of dual-damascene copper interconnects Applied Physics Letters. 90. DOI: 10.1063/1.2714315  0.311
2007 Zang KY, Wang YD, Wang LS, Tripathy S, Chua SJ, Thompson CV. Nanoheteroepitaxy of GaN on a nanopore array of Si(111) surface Thin Solid Films. 515: 4505-4508. DOI: 10.1016/J.Tsf.2006.07.146  0.372
2006 Zang KY, Wang YD, Chua SJ, Wang LS, Tripathy S, Thompson CV. Nanoheteroepitaxial lateral overgrowth of GaN on nanoporous Si(111) Applied Physics Letters. 88. DOI: 10.1063/1.2189114  0.399
2005 Friesen C, Thompson CV. Comment on "Compressive stress in polycrystalline Volmer-Weber films". Physical Review Letters. 95: 229601; author reply. PMID 16384272 DOI: 10.1103/Physrevlett.95.229601  0.382
2005 Zang KY, Chua SJ, Thompson CV, Wang LS, Tripathy S, Chow SY. The effect of periodic silane burst on the properties of GaN on Si (111) substrates Materials Research Society Symposium Proceedings. 831: 221-226. DOI: 10.1557/Proc-831-E3.33  0.419
2005 Krishnan R, Nguyen HQ, Thompson CV, Choi WK, Foo YL. Wafer-level ordered arrays of aligned carbon nanotubes with controlled size and spacing on silicon Nanotechnology. 16: 841-845. DOI: 10.1088/0957-4484/16/6/038  0.361
2005 Le HQ, Chua SJ, Koh YW, Loh KP, Chen Z, Thompson CV, Fitzgerald EA. Growth of single crystal ZnO nanorods on GaN using an aqueous solution method Applied Physics Letters. 87. DOI: 10.1063/1.2041833  0.356
2005 Seel SC, Thompson CV. Piezoresistive microcantilevers for in situ stress measurements during thin film deposition Review of Scientific Instruments. 76. DOI: 10.1063/1.1947067  0.428
2005 Giermann AL, Thompson CV. Solid-state dewetting for ordered arrays of crystallographically oriented metal particles Applied Physics Letters. 86: 1-3. DOI: 10.1063/1.1885180  0.435
2004 Friesen C, Thompson CV. Correlation of stress and atomic-scale surface roughness evolution during intermittent homoepitaxial growth of (111)-oriented Ag and Cu. Physical Review Letters. 93: 056104. PMID 15323716 DOI: 10.1103/Physrevlett.93.056104  0.372
2004 Giermann AL, Thompson CV, Smith HI. Templated formation of ordered metallic nano-particle arrays Materials Research Society Symposium Proceedings. 818: 37-42. DOI: 10.1557/Proc-818-M3.3.1  0.548
2004 Liew KP, Bernstein RA, Thompson CV. Stress development and relaxation during reactive film formation of Ni 2Si Journal of Materials Research. 19: 676-680. DOI: 10.1557/Jmr.2004.19.2.676  0.396
2004 Jia J, Li M, Thompson CV. Amorphization of silicon by femtosecond laser pulses Applied Physics Letters. 84: 3205-3207. DOI: 10.1063/1.1719280  0.313
2004 Friesen C, Seel SC, Thompson CV. Reversible stress changes at all stages of Volmer-Weber film growth Journal of Applied Physics. 95: 1011-1020. DOI: 10.1063/1.1637728  0.385
2004 Zhu TJ, Lu L, Thompson CV. Growth and properties of (001)-oriented Pb(Zr0.52Ti 0.48)O3/ LaNiO3 films on Si(001) substrates with TiN buffer layers Journal of Crystal Growth. 273: 172-178. DOI: 10.1016/J.Jcrysgro.2004.08.011  0.432
2004 Zang KY, Wang LS, Chua SJ, Thompson CV. Structural analysis of metalorganic chemical vapor deposited AIN nucleation layers on Si (1 1 1) Journal of Crystal Growth. 268: 515-520. DOI: 10.1016/J.Jcrysgro.2004.04.083  0.368
2003 Ross F, Thompson CV, Chiang T, Sawin HH. Ion-induced chemical vapor deposition of copper films with nanocellular microstructures Applied Physics Letters. 83: 1225-1227. DOI: 10.1063/1.1599964  0.433
2003 Seel SC, Thompson CV. Tensile stress generation during island coalescence for variable island-substrate contact angle Journal of Applied Physics. 93: 9038-9042. DOI: 10.1063/1.1571964  0.433
2003 Donthu SK, Vora MM, Lahiri SK, Thompson CV, Yi S. Activation energy determination for recrystallization in electroplated-copper films using differential scanning calorimetry Journal of Electronic Materials. 32: 531-534. DOI: 10.1007/S11664-003-0138-7  0.385
2003 Zang KY, Chua SJ, Wang LS, Thompson CV. Evolution of AlN buffer layers on silicon and effects on the properties of epitaxial GaN films Physica Status Solidi C: Conferences. 2067-2071. DOI: 10.1002/Pssc.200303477  0.391
2002 Friesen C, Thompson CV. Reversible stress relaxation during precoalescence interruptions of volmer-weber thin film growth. Physical Review Letters. 89: 126103. PMID 12225105 DOI: 10.1103/Physrevlett.89.126103  0.378
2001 Fayad WR, Andleigh VK, Thompson CV. Modeling of the effects of crystallographic orientation on electromigration-limited reliability of interconnects with bamboo grain structures Journal of Materials Research. 16: 413-416. DOI: 10.1557/Jmr.2001.0062  0.322
2001 Hau-Riege CS, Thompson CV. Electromigration in Cu interconnects with very different grain structures Applied Physics Letters. 78: 3451-3453. DOI: 10.1063/1.1355304  0.345
2001 Floro JA, Hearne SJ, Hunter JA, Kotula P, Chason E, Seel SC, Thompson CV. The dynamic competition between stress generation and relaxation mechanisms during coalescence of Volmer-Weber thin films Journal of Applied Physics. 89: 4886-4897. DOI: 10.1063/1.1352563  0.409
2001 Kobrinsky MJ, Dehm G, Thompson CV, Arzt E. Effects of thickness on the characteristic length scale of dislocation plasticity in Ag thin films Acta Materialia. 49: 3597-3607. DOI: 10.1016/S1359-6454(01)00225-7  0.32
2001 Thompson CV. Grain growth and evolution of other cellular structures Solid State Physics - Advances in Research and Applications. 55: 269-314. DOI: 10.1016/S0081-1947(01)80006-0  0.367
2001 Zhao J, Lu L, Thompson CV, Lu YF, Song WD. Preparation of (0 0 1)-oriented PZT thin films on silicon wafers using pulsed laser deposition Journal of Crystal Growth. 225: 173-177. DOI: 10.1016/S0022-0248(01)00865-X  0.43
2001 Hau-Riege CS, Hau-Riege SP, Thompson CV. Simulation of microstructural evolution induced by scanned laser annealing of metallic interconnects Journal of Electronic Materials. 30: 11-16. DOI: 10.1007/S11664-001-0208-7  0.31
2000 Kobrinsky MJ, Thompson CV. Activation volume for inelastic deformation in polycrystalline Ag films at low temperatures Materials Research Society Symposium - Proceedings. 594: 57-62. DOI: 10.1557/Proc-594-57  0.358
2000 Thompson CV. Structure evolution during processing of polycrystalline films Annual Review of Materials Science. 30: 159-190. DOI: 10.1146/Annurev.Matsci.30.1.159  0.451
2000 Fayad WR, Kobrinsky MJ, Thompson CV. Analytic model for the development of bamboo microstructures in thin film strips undergoing normal grain growth Physical Review B - Condensed Matter and Materials Physics. 62: 5221-5227. DOI: 10.1103/Physrevb.62.5221  0.441
2000 Seel SC, Thompson CV, Hearne SJ, Floro JA. Tensile stress evolution during deposition of Volmer-Weber thin films Journal of Applied Physics. 88: 7079-7088. DOI: 10.1063/1.1325379  0.41
2000 Hau-Riege CS, Thompson CV. Use of scanned laser annealing to control the bamboo grain length of Cu interconnects Applied Physics Letters. 77: 352-354. DOI: 10.1063/1.126973  0.351
2000 Hau-Riege SP, Thompson CV. In situ transmission electron microscope studies of the kinetics of abnormal grain growth in electroplated copper films Applied Physics Letters. 76: 309-311. DOI: 10.1063/1.125729  0.442
2000 Kobrinsky MJ, Thompson CV. Activation volume for inelastic deformation in polycrystalline Ag thin films Acta Materialia. 48: 625-633. DOI: 10.1016/S1359-6454(99)00403-6  0.461
1999 Thompson CV. On the grain size and coalescence stress resulting from nucleation and growth processes during formation of polycrystalline thin films Journal of Materials Research. 14: 3164-3168. DOI: 10.1557/Jmr.1999.0424  0.478
1999 Park Y, Andleigh VK, Thompson CV. Simulations of stress evolution and the current density scaling of electromigration-induced failure times in pure and alloyed interconnects Journal of Applied Physics. 85: 3546-3555. DOI: 10.1063/1.369714  0.322
1999 Hau-Riege CS, Thompson CV. Microstructural evolution induced by scanned laser annealing in Al interconnects Applied Physics Letters. 75: 1464-1466. DOI: 10.1063/1.124726  0.361
1999 Srikar VT, Thompson CV. Diffusion and electromigration of copper in SiO2-passivated single-crystal aluminum interconnects Applied Physics Letters. 74: 37-39. DOI: 10.1063/1.123125  0.312
1999 Srikar VT, Thompson CV. Dislocation pile-ups as sites for formation of electromigration-induced transgranular slit-like voids in Al interconnects Scripta Materialia. 42: 97-102. DOI: 10.1016/S1359-6462(99)00320-6  0.304
1999 Greiser J, Müller D, Müllner P, Thompson C, Arzt E. Growth of giant grains in silver thin films Scripta Materialia. 41: 709-714. DOI: 10.1016/S1359-6462(99)00205-5  0.454
1999 Riege SP, Thompson CV. Modeling of texture evolution in copper interconnects annealed in trenches Scripta Materialia. 41: 403-408. DOI: 10.1016/S1359-6462(99)00098-6  0.328
1999 Fayad W, Thompson CV, Frost HJ. Steady-state grain-size distributions resulting from grain growth in two dimensions Scripta Materialia. 40: 1199-1204. DOI: 10.1016/S1359-6462(99)00034-2  0.337
1999 Gao H, Zhang L, Nix WD, Thompson CV, Arzt E. Crack-like grain-boundary diffusion wedges in thin metal films Acta Materialia. 47: 2865-2878. DOI: 10.1016/S1359-6454(99)00178-0  0.376
1999 Riege SP, Thompson CV, Frost HJ. Simulation of the influence of particles on grain structure evolution in two-dimensional systems and thin films Acta Materialia. 47: 1879-1887. DOI: 10.1016/S1359-6454(99)00039-7  0.351
1998 Fayad W, Andleigh V, Thompson CV, Frost H. Grain Structure Statistics in As-Patterned and Annealed Interconnects Mrs Proceedings. 516. DOI: 10.1557/Proc-516-159  0.354
1998 Gouldstone A, Shen Y, Suresh S, Thompson CV. Evolution of stresses in passivated and unpassivated metal interconnects Journal of Materials Research. 13: 1956-1966. DOI: 10.1557/Jmr.1998.0275  0.318
1998 Kobrinsky MJ, Thompson CV. The thickness dependence of the flow stress of capped and uncapped polycrystalline Ag thin films Applied Physics Letters. 73: 2429-2431. DOI: 10.1063/1.122471  0.431
1998 Srikar VT, Thompson CV. The effect of Al3Ti capping layers on electromigration in single-crystal aluminum interconnects Applied Physics Letters. 72: 2677-2679. DOI: 10.1063/1.121096  0.307
1998 Thompson C. Interface Science. 6: 85-93. DOI: 10.1023/A:1008616620663  0.452
1997 Riege SP, Andleigh V, Thompson CV, Frost HJ. Modeling of Grain Structure Evolution and its Impact on the Reliability of Al(Cu) Thin Film Interconnects Mrs Proceedings. 490. DOI: 10.1557/Proc-490-219  0.387
1997 Chiang TP, Sawin HH, Thompson CV. Ion-induced chemical vapor deposition of high purity Cu films at room temperature using a microwave discharge H atom beam source Journal of Vacuum Science & Technology a: Vacuum, Surfaces, and Films. 15: 2677-2686. DOI: 10.1116/1.580942  0.34
1997 Chiang TP, Sawin HH, Thompson CV. Surface kinetic study of ion-induced chemical vapor deposition of copper for focused ion beam applications Journal of Vacuum Science and Technology. 15: 3104-3114. DOI: 10.1116/1.580853  0.329
1997 Knowlton BD, Clement JJ, Thompson CV. Simulation of the effects of grain structure and grain growth on electromigration and the reliability of interconnects Journal of Applied Physics. 81: 6073-6080. DOI: 10.1063/1.364446  0.339
1996 Bochi G, Ballentine CA, Inglefield HE, Thompson CV, O'Handley RC. Evidence for strong surface magnetoelastic anisotropy in epitaxial Cu/Ni/Cu(001) sandwiches. Physical Review. B, Condensed Matter. 53: R1729-R1732. PMID 9983692 DOI: 10.1103/Physrevb.53.R1729  0.317
1996 Thompson CV, Carel R. Grain Growth and Texture Evolution in Thin Films Materials Science Forum. 83-98. DOI: 10.4028/Www.Scientific.Net/Msf.204-206.83  0.458
1996 Bochi G, Ballentine CA, Inglefield HE, Thompson CV, O’Handley RC. Perpendicular magnetization and surface magnetoelastic anisotropy in epitaxial Cu/Ni/Cu (001) Journal of Applied Physics. 79: 5845. DOI: 10.1063/1.362144  0.326
1996 Frost HJ, Thompson CV. Computer simulation of grain growth Current Opinion in Solid State and Materials Science. 1: 361-368. DOI: 10.1016/S1359-0286(96)80026-X  0.346
1996 Carel R, Thompson CV, Frost HJ. Computer simulation of strain energy effects vs surface and interface energy effects on grain growth in thin films Acta Materialia. 44: 2479-2494. DOI: 10.1016/1359-6454(95)00365-7  0.455
1996 Inglefield H, Bochi G, Ballentine C, O'Handley R, Thompson C. Perpendicular magnetic anisotropy in epitaxial Cu/Ni/Cu/Si (001) Thin Solid Films. 275: 155-158. DOI: 10.1016/0040-6090(95)07031-1  0.368
1996 Thompson CV, Carel R. Stress and grain growth in thin films Journal of the Mechanics and Physics of Solids. 44: 657-673. DOI: 10.1016/0022-5096(96)00022-1  0.465
1995 Bochi G, Ballentine CA, Inglefield HE, Thompson CV, O'Handley RC, Hug HJ, Stiefel B, Moser A, Güntherodt H. Perpendicular magnetic anisotropy, domains, and misfit strain in epitaxial Ni/Cu1-xNix/Cu/Si (001) thin films. Physical Review. B, Condensed Matter. 52: 7311-7321. PMID 9979674 DOI: 10.1103/Physrevb.52.7311  0.326
1995 Seel SC, Carel R, Thompson CV. Texture Maps for Orientation Evolution During Grain Growth in Thin Films Mrs Proceedings. 403. DOI: 10.1557/Proc-403-63  0.494
1995 Knowlton BD, Frank RI, Thompson CV. The Effect of Cu Distribution on Post-Patterning Grain Growth and Reliability of Al-1%Cu Interconnects Mrs Proceedings. 391. DOI: 10.1557/Proc-391-361  0.362
1995 Thompson C, Joo Y, Knowlton B. Modeling of the Structure and Reliability of Near-Bamboo Interconnects Mrs Proceedings. 391. DOI: 10.1557/Proc-391-163  0.346
1995 Thompson C, Carel R. Texture development in polycrystalline thin films Materials Science and Engineering: B. 32: 211-219. DOI: 10.1016/0921-5107(95)03011-5  0.449
1995 Ro JS, Thompson CV, Melngailis J. Microstructure of gold grown by ion-induced deposition Thin Solid Films. 258: 333-335. DOI: 10.1016/0040-6090(94)06399-0  0.441
1994 Inglefield HE, Bochi G, Ballentine CA, O’Handley RC, Thompson CV. Misfit Strain Relief Beyond the Critical Thickness Using Curvature Measurements and in Situ Characterization of the Magneto-Optic Kerr Effect Mrs Proceedings. 356. DOI: 10.1557/Proc-356-265  0.372
1994 Floro JA, Thompson CV. Mean Field Analysis of Orientation Selective Grain Growth Driven By Interface-Energy Anisotropy Mrs Proceedings. 343. DOI: 10.1557/Proc-343-65  0.424
1994 Carel R, Thompson CV, Frost HJ. Computer Simulation of Strain Energy and Surface- and Interface-Energy on Grain Growth in Thin Films Mrs Proceedings. 343. DOI: 10.1557/Proc-343-49  0.398
1994 Thompson CV. Grain Growth in Polycrystalline Thin Films Mrs Proceedings. 343. DOI: 10.1557/Proc-343-3  0.482
1994 Frost H, Hayashi Y, Thompson C, Walton D. The Effect of Variability Among Grain Boundary Energies on Grain Growth in Thin Film Strips Mrs Proceedings. 338. DOI: 10.1557/Proc-338-295  0.413
1994 Floro JA, Thompson CV, Card R, Bristowe PD. Competition between strain and interface energy during epitaxial grain growth in Ag films on Ni(001) Journal of Materials Research. 9: 2411-2424. DOI: 10.1557/Jmr.1994.2411  0.418
1994 Joo YC, Thompson CV. Analytic model for the grain structures of near-bamboo interconnects Journal of Applied Physics. 76: 7339-7346. DOI: 10.1063/1.357979  0.348
1994 Bochi G, Balentine CA, Inglefield HE, Bogomolov SS, Thompson CV, O’Handley RC. Magnetic anisotropy in epitaxial Ni/Cu(001) thin films: Effects of misfit strain on perpendicular magnetic anisotropy (abstract) Journal of Applied Physics. 75: 6430-6430. DOI: 10.1063/1.356976  0.313
1993 Thompson CV, Lloyd JR. Electromigration and IC Interconnects Mrs Bulletin. 18: 19-25. DOI: 10.1557/S088376940003904X  0.332
1993 Frost H, Hayashi Y, Thompson C, Walton D. Grain Growth in Thin Films With Variable Grain Boundary Energy Mrs Proceedings. 317. DOI: 10.1557/Proc-317-485  0.363
1993 Frost H, Hayashi Y, Thompson C, Walton D. The Effect of Solute Drag on Grain Growth in Thin Films Mrs Proceedings. 317. DOI: 10.1557/Proc-317-431  0.389
1993 Floro JA, Carel R, Thompson CV. Energy Minimization During Epitaxial Grain Growth: Strain VS. Interfacial Energy Mrs Proceedings. 317. DOI: 10.1557/Proc-317-419  0.448
1993 Bochi G, Ballentine CA, Inglefield HE, Bogomolov SS, Thompson CV, Ohandley RC. Magnetic Anisotropy in Epitaxial Ni/Cu (100) Thin Films Mrs Proceedings. 313. DOI: 10.1557/Proc-313-309  0.376
1993 Thompson C. The Effect of Thermal History On Interconnect Reliability Mrs Proceedings. 309. DOI: 10.1557/Proc-309-383  0.348
1993 Inglefield H, Ballentine C, Bochi G, Bogomolov S, O'Handley R, Thompson C. Use of Magneto-Optic Kerr Effect Measurements to Study Strain and Misfit Accommodation in Thin Films of Ni/Cu (100) Mrs Proceedings. 308. DOI: 10.1557/Proc-308-765  0.403
1993 Thompson CV. The yield stress of polycrystalline thin films Journal of Materials Research. 8: 237-238. DOI: 10.1557/Jmr.1993.0237  0.429
1993 Thompson CV. Texture evolution during grain growth in polycrystalline films Scripta Metallurgica Et Materiala. 28: 167-172. DOI: 10.1016/0956-716X(93)90557-9  0.464
1993 Floro JA, Thompson CV. Numerical analysis of interface energy-driven coarsening in thin films and its connection to grain growth Acta Metallurgica Et Materialia. 41: 1137-1147. DOI: 10.1016/0956-7151(93)90161-K  0.449
1993 Thompson CV, Kahn H. Effects of microstructure on interconnect and via reliability: Multimodal failure statistics Journal of Electronic Materials. 22: 581-587. DOI: 10.1007/Bf02666402  0.31
1992 Frost HJ, Thompson CV, Walton DT. Abnormal Grain Growth in Thin Films due to Anisotropy of Free-Surface Energies Materials Science Forum. 543-550. DOI: 10.4028/Www.Scientific.Net/Msf.94-96.543  0.432
1992 Walton DT, Frost HJ, Thompson CV. Modelling of Grain Growth in Thin Film Strips Materials Science Forum. 531-536. DOI: 10.4028/Www.Scientific.Net/Msf.94-96.531  0.446
1992 Thompson CV. Experimental and Theoretical Aspects of Grain Growth in Thin Films Materials Science Forum. 245-258. DOI: 10.4028/Www.Scientific.Net/Msf.94-96.245  0.445
1992 Thompson CV. The Origins of Epitaxial Orientations in thin Films Mrs Proceedings. 280. DOI: 10.1557/Proc-280-307  0.463
1992 Longworth HP, Thompson CV. Electromigration in Bicrystal Al Lines Mrs Proceedings. 265. DOI: 10.1557/Proc-265-95  0.312
1992 Ma E, Clevenger LA, Thompson CV. Nucleation of an intermetallic at thin-film interfaces: VSi2 contrasted with Al3Ni Journal of Materials Research. 7: 1350-1355. DOI: 10.1557/Jmr.1992.1350  0.4
1992 Walton DT, Frost HJ, Thompson CV. Development of near-bamboo and bamboo microstructures in thin-film strips Applied Physics Letters. 61: 40-42. DOI: 10.1063/1.107661  0.423
1992 Longworth HP, Thompson CV. Experimental study of electromigration in bicrystal aluminum lines Applied Physics Letters. 60: 2219-2221. DOI: 10.1063/1.107035  0.316
1992 Evans PV, Smith DA, Thompson CV. Absence of electrical activity at high-angle grain boundaries in zone-melt-recrystallized silicon-on-insulator films Applied Physics Letters. 60: 439-441. DOI: 10.1063/1.106627  0.412
1992 Frost HJ, Thompson CV, Walton DT. Simulation of thin film grain structures-II. Abnormal grain growth Acta Metallurgica Et Materialia. 40: 779-793. DOI: 10.1016/0956-7151(92)90020-F  0.423
1992 Jiran E, Thompson CV. Capillary instabilities in thin, continuous films Thin Solid Films. 208: 23-28. DOI: 10.1016/0040-6090(92)90941-4  0.424
1991 Thompson C. Dopant and Ion Beam Enhanced Grain Growth in Polycrystalline Silicon Films Defect and Diffusion Forum. 59: 33-46. DOI: 10.4028/www.scientific.net/DDF.59.33  0.306
1991 Miura H, Ma E, Thompson CV. Initial Evolution of Cobalt Silicides in The Cobalt/Amorphous-Silicon Thin Film System Mrs Proceedings. 230. DOI: 10.1557/PROC-230-139  0.325
1991 Walton DT, Frost HJ, Thompson CV. Computer Simulation of Grain Growth in Thin-film Interconnect Lines Mrs Proceedings. 225. DOI: 10.1557/Proc-225-219  0.412
1991 Miura H, Ma E, Thompson CV. Initial sequence and kinetics of silicide formation in cobalt/amorphous- silicon multilayer thin films Journal of Applied Physics. 70: 4287-4294. DOI: 10.1063/1.349106  0.386
1991 Ma E, Thompson CV, Clevenger LA. Nucleation and growth during reactions in multilayer Al/Ni films: The early stage of Al3Ni formation Journal of Applied Physics. 69: 2211-2218. DOI: 10.1063/1.348722  0.322
1991 Longworth HP, Thompson CV. Abnormal grain growth in aluminum alloy thin films Journal of Applied Physics. 69: 3929-3940. DOI: 10.1063/1.348452  0.401
1991 Kahn H, Thompson CV. Effect of applied mechanical stress on the electromigration failure times of aluminum interconnects Applied Physics Letters. 59: 1308-1310. DOI: 10.1063/1.105483  0.302
1990 Ma E, Thompson C, Clevenger L. A Calorimetric Study of the Kinetics of Al3Ni Nucleation and Growth During Reactions in Al/Ni Thin Films Mrs Proceedings. 205. DOI: 10.1557/Proc-205-203  0.396
1990 Ma E, Clevenger L, Thompson C, Tu K. Kinetic and Thermodynamic Aspects of Phase Evolution in Ti/a-Si Multilayer Films Mrs Proceedings. 187. DOI: 10.1557/Proc-187-83  0.395
1990 Thompson CV, Clevenger LA, DeAvillez R, Ma E, Miura H. Kinetics and Thermodynamics of Amorphous Silicide Formation in Metal/Amorphous-Silicon Multilayer Thin Films Mrs Proceedings. 187. DOI: 10.1557/Proc-187-61  0.409
1990 Floro JA, Thompson CV. Epitaxial Grain Growth and Orientation Metastability in Heteroepitaxial Thin Films Mrs Proceedings. 187. DOI: 10.1557/Proc-187-273  0.474
1990 Cammarata RC, Thompson CV, Hayzelden C, Tu KN. Silicide precipitation and silicon crystallization in nickel implanted amorphous silicon thin films Journal of Materials Research. 5: 2133-2138. DOI: 10.1557/Jmr.1990.2133  0.432
1990 De Avillez RR, Clevenger LA, Thompson CV, Tu KN. Quantitative investigation of titanium/amorphous-silicon multilayer thin film reactions Journal of Materials Research. 5: 593-600. DOI: 10.1557/Jmr.1990.0593  0.421
1990 Thompson CV. Grain Growth in Thin Films Annual Review of Materials Science. 20: 245-268. DOI: 10.1146/Annurev.Ms.20.080190.001333  0.475
1990 Clevenger LA, Thompson CV, de Avillez RR, Ma E. Nucleation controlled phase selection in vanadium/amorphous‐silicon multilayer thin films Journal of Vacuum Science & Technology a: Vacuum, Surfaces, and Films. 8: 1566-1571. DOI: 10.1116/1.576766  0.404
1990 Kim HJ, Thompson CV. The effects of dopants on surface-energy-driven secondary grain growth in silicon films Journal of Applied Physics. 67: 757-767. DOI: 10.1063/1.345756  0.44
1990 Clevenger LA, Thompson CV. Nucleation-limited phase selection during reactions in nickel/amorphous- silicon multilayer thin films Journal of Applied Physics. 67: 1325-1333. DOI: 10.1063/1.345685  0.427
1990 Clevenger LA, Thompson CV, Tu KN. Explosive silicidation in nickel/amorphous-silicon multilayer thin films Journal of Applied Physics. 67: 2894-2898. DOI: 10.1063/1.345429  0.435
1990 Thompson CV, Floro J, Smith HI. Epitaxial grain growth in thin metal films Journal of Applied Physics. 67: 4099-4104. DOI: 10.1063/1.344969  0.624
1990 Ma E, Thompson CV, Clevenger LA, Tu KN. Self-propagating explosive reactions in Al/Ni multilayer thin films Applied Physics Letters. 57: 1262-1264. DOI: 10.1063/1.103504  0.392
1990 Frost H, Thompson C, Walton D. Simulation of thin film grain structures—I. Grain growth stagnation Acta Metallurgica Et Materialia. 38: 1455-1462. DOI: 10.1016/0956-7151(90)90114-V  0.433
1990 Cho J, Thompson CV. Electromigration-induced failures in interconnects with bimodal grain size distributions Journal of Electronic Materials. 19: 1207-1212. DOI: 10.1007/Bf02673334  0.332
1990 Jiran E, Thompson CV. Capillary instabilities in thin films Journal of Electronic Materials. 19: 1153-1160. DOI: 10.1007/Bf02673327  0.42
1989 Ma E, Clevenger L, Thompson C, DeAvillez R, Tu K. Structural Transitions in Titanium/Amorphous-Silicon Multilayers Mrs Proceedings. 163. DOI: 10.1557/Proc-163-961  0.419
1989 Im J, Lipman WJ, Miaoulis I, Chenb C, Thompson C. Numerical Modeling of Energy-Beam Induced Localized Melting of Thin SI Films Mrs Proceedings. 157. DOI: 10.1557/Proc-157-455  0.356
1989 Phillips JM, Palmer JE, Hecker NE, Thompson CV. The Effect of Annealing on the Structure of Epitaxial CaF2 Films on Si(100) Mrs Proceedings. 148. DOI: 10.1557/Proc-148-191  0.441
1989 De Avillez RR, Clevenger LA, Thompson CV. Relaxation phenomena in evaporated amorphous silicon films Journal of Materials Research. 4: 1057-1059. DOI: 10.1557/Jmr.1989.1057  0.388
1989 Coffey KR, Clevenger LA, Barmak K, Rudman DA, Thompson CV. Experimental evidence for nucleation during thin‐film reactions Applied Physics Letters. 55: 852-854. DOI: 10.1063/1.102447  0.336
1989 Palmer JE, Burns G, Fonstad CG, Thompson CV. Effect of As4 overpressure on initial growth of gallium arsenide on silicon by molecular beam epitaxy Applied Physics Letters. 55: 990-992. DOI: 10.1063/1.101698  0.418
1989 Cho J, Thompson CV. Grain size dependence of electromigration-induced failures in narrow interconnects Applied Physics Letters. 54: 2577-2579. DOI: 10.1063/1.101054  0.325
1989 Spaepen F, Thompson CV. Calorimetric studies of reactions in thin films and multilayers Applied Surface Science. 38: 1-12. DOI: 10.1016/0169-4332(89)90513-8  0.617
1989 Atwater HA, Thompson CV, Kim HJ. The role of point defects in ion-bombardment-enhanced and dopant-enhanced grain growth in silicon thin films Nuclear Inst. and Methods in Physics Research, B. 39: 64-67. DOI: 10.1016/0168-583X(89)90742-8  0.566
1988 Atwater HA, Thompson CV, Smith HI. Interface-limited grain-boundary motion during ion bombardment. Physical Review Letters. 60: 112-115. PMID 10038212 DOI: 10.1103/Physrevlett.60.112  0.562
1988 Blauner PG, Ro JS, Butt Y, Thompson CV, Melngailis J. The Microstructure of Gold Films Written by Focused Ion Beam Induced Deposition Mrs Proceedings. 129. DOI: 10.1557/Proc-129-483  0.396
1988 Atwater HA, Thompson CV, Smith HI. Mechanisms for crystallographic orientation in the crystallization of thin silicon films from the melt Journal of Materials Research. 3: 1232-1237. DOI: 10.1557/Jmr.1988.1232  0.641
1988 Clevenger LA, Thompson CV, Cammarata RC, Tu KN. Reaction kinetics of nickel/silicon multilayer films Applied Physics Letters. 52: 795-797. DOI: 10.1063/1.99644  0.579
1988 Atwater HA, Thompson CV, Smith HI. Ion-bombardment-enhanced grain growth in germanium, silicon, and gold thin films Journal of Applied Physics. 64: 2337-2353. DOI: 10.1063/1.341665  0.659
1988 Atwater HA, Thompson CV. Point defect enhanced grain growth in silicon thin films: The role of ion bombardment and dopants Applied Physics Letters. 53: 2155-2157. DOI: 10.1063/1.100303  0.549
1988 Thompson CV. Coarsening of particles on a planar substrate: Interface energy anisotropy and application to grain growth in thin films Acta Metallurgica. 36: 2929-2934. DOI: 10.1016/0001-6160(88)90175-7  0.446
1988 Frost HJ, Thompson CV. Computer simulation of microstructural evolution in thin films Journal of Electronic Materials. 17: 447-458. DOI: 10.1007/Bf02652132  0.426
1988 KIM H, THOMPSON CV. ChemInform Abstract: Kinetic Modeling of Grain Growth in Polycrystalline Silicon Films Doped with Phosphorus or Boron. Cheminform. 19. DOI: 10.1002/chin.198852006  0.363
1987 Cammarata RC, Thompson CV, Garrison SM. Secondary Grain Growth During Rapid Thermal Annealing of Doped Polysilicon Films Mrs Proceedings. 92. DOI: 10.1557/Proc-92-335  0.482
1987 Im JS, Chen CK, Thompson CV, Geis MW, Tomita H. Liquid-Solid Interface Morphologies and Defect Structures in Zone-Melting-Recrystallized Silicon-On-Insulator Films Mrs Proceedings. 107. DOI: 10.1557/Proc-107-169  0.436
1987 Kim H, Thompson CV. Kinetic Modeling of Grain Growth in Polycrystalline Silicon Films Doped with Phosphorus and Boron Mrs Proceedings. 106. DOI: 10.1557/Proc-106-143  0.413
1987 Thompson CV. Grain Growth in Polycrystalline Silicon Films Mrs Proceedings. 106. DOI: 10.1557/Proc-106-115  0.465
1987 Clevenger LA, Thompson CV, Cammarata RC, Tu KN. The Effect of Layer Thickness on the Reaction Kinetics of Nickel/Silicon Multilayer Films Mrs Proceedings. 103. DOI: 10.1557/Proc-103-191  0.421
1987 Ro J, Dubner A, Thompson C, Melngailis J. Microstructure of Gold Films Grown by Ion Induced Deposition Mrs Proceedings. 101. DOI: 10.1557/Proc-101-255  0.404
1987 Cammarata RC, Thompson CV, Tu KN. NiSi2 precipitation in nickel-implanted silicon films Applied Physics Letters. 51: 1106-1108. DOI: 10.1063/1.99003  0.611
1987 Im JS, Tomita H, Thompson CV. Cellular and dendritic morphologies on stationary and moving liquid-solid interfaces in zone-melting recrystallization Applied Physics Letters. 51: 685-687. DOI: 10.1063/1.98334  0.332
1987 Palmer JE, Thompson CV, Smith HI. Grain growth and grain size distributions in thin germanium films Journal of Applied Physics. 62: 2492-2497. DOI: 10.1063/1.339460  0.609
1987 Garrison SM, Cammarata RC, Thompson CV, Smith HI. Surface-energy-driven grain growth during rapid thermal annealing (<10 s) of thin silicon films Journal of Applied Physics. 61: 1652-1655. DOI: 10.1063/1.338055  0.602
1987 Frost HJ, Thompson CV. The effect of nucleation conditions on the topology and geometry of two-dimensional grain structures Acta Metallurgica. 35: 529-540. DOI: 10.1016/0001-6160(87)90258-6  0.369
1987 Thompson CV, Frost HJ, Spaepen F. The relative rates of secondary and normal grain growth Acta Metallurgica. 35: 887-890. DOI: 10.1016/0001-6160(87)90166-0  0.558
1986 Thompson CV, Maiorino CD. Very Large Grained Aluminum Alloy Thin Films for Interconnects The Japan Society of Applied Physics. DOI: 10.7567/Ssdm.1986.A-10-1  0.417
1986 Wong CC, Smith HI, Thompson CV. Surface‐energy‐driven secondary grain growth in thin Au films Applied Physics Letters. 48: 335-337. DOI: 10.1063/1.96543  0.62
1986 Kim H, Thompson CV. Compensation of grain growth enhancement in doped silicon films Applied Physics Letters. 48: 399-401. DOI: 10.1063/1.96510  0.453
1986 Srolovitz DJ, Thompson CV. Beading instabilities in thin film lines with bamboo microstructures Thin Solid Films. 139: 133-141. DOI: 10.1016/0040-6090(86)90331-7  0.4
1985 Frost HJ, Thompson CV. Modelling of Thin Film Grain Structures and Grain Growth Mrs Proceedings. 63. DOI: 10.1557/PROC-63-233  0.329
1985 Thompson CV, Smith HI. Secondary Grain Growth in Thin Films Mrs Proceedings. 57. DOI: 10.1557/Proc-57-499  0.612
1985 Kim H, Thompson CV. The Effects of Dopants on Surface-Energy-Driven Secondary Grain Growth in Ultrathin Si Films Mrs Proceedings. 54. DOI: 10.1557/Proc-54-729  0.448
1985 Smith HI, Geis MW, Thompson CV, Chen CK. Crystalline Films on Amorphous Substrates by Zone Melting and Surface-Energy-Driven Grain Growth in Conjunction with Patferning Mrs Proceedings. 53. DOI: 10.1557/Proc-53-3  0.624
1985 Atwater HA, Smith HI, Thompson CV. Enhancement of Grain Growth In Ultra-Thin Germanium Films By Ion Bombardment Mrs Proceedings. 51. DOI: 10.1557/Proc-51-337  0.639
1985 Wong CC, Smith HI, Thompson CV. Secondary Grain Growth and Graphoepitaxy in thin Au films on Submicrometer-Period Gratings Mrs Proceedings. 47. DOI: 10.1557/Proc-47-35  0.6
1985 Thompson CV. Secondary grain growth in thin films of semiconductors: Theoretical aspects Journal of Applied Physics. 58: 763-772. DOI: 10.1063/1.336194  0.454
1984 Yonehara T, Smith HI, Palmer JE, Thompson CV. Surface-Energy-Driven Graphoepitaxy in Ultrathin Films of Ge The Japan Society of Applied Physics. DOI: 10.7567/Ssdm.1984.B-10-1  0.551
1984 Thompson C. Solid Phase Processes for Semiconductor-On-Insulator Mrs Proceedings. 35. DOI: 10.1557/Proc-35-711  0.461
1984 Yonehara T, Smith HI, Thompson CV, Palmer JE. Graphoepitaxy of Ge on SiO2 by solid-state surface-energy-driven grain growth Applied Physics Letters. 45: 631-633. DOI: 10.1063/1.95336  0.592
1984 Thompson CV, Smith HI. Surface-energy-driven secondary grain growth in ultrathin (<100 nm) films of silicon Applied Physics Letters. 44: 603-605. DOI: 10.1063/1.94842  0.626
1984 Atwater H, Smith HI, Thompson C, Geis M. Zone-melting recrystallization of thick silicon on insulator films Materials Letters. 2: 269-273. DOI: 10.1016/0167-577X(84)90128-9  0.662
1983 Wong C, Keavney C, Atwater H, Thompson C, Smith H. Zone Melting Recrystallization of InSb Films on Oxidized Si Wafers Mrs Proceedings. 23. DOI: 10.1557/Proc-23-627  0.664
1983 Smith HI, Thompson C, Geis M, Atwater H, Yonehara T, Wong C. Zone Melting Recrystallization of Patterned Films and Low-Temperature Graphoepitaxy Mrs Proceedings. 23. DOI: 10.1557/Proc-23-459  0.681
1983 Atwater HA, Thompson CV, Smith HI, Geis MW. Orientation filtering by growth‐velocity competition in zone‐melting recrystallization of silicon on SiO2 Applied Physics Letters. 43: 1126-1128. DOI: 10.1063/1.94255  0.602
1983 Smith HI, Geis M, Thompson C, Atwater H. Silicon-on-insulator by graphoepitaxy and zone-melting recrystallization of patterned films Journal of Crystal Growth. 63: 527-546. DOI: 10.1016/0022-0248(83)90165-3  0.689
1983 Smith HI, Thompson CV, Atwater HA. Graphoepitaxy and zone-melting recrystallization of patterned films Journal of Crystal Growth. 65: 337-338. DOI: 10.1016/0022-0248(83)90070-2  0.632
1983 Thompson CV, Greer AL, Spaepen F. Crystal nucleation in amorphous (Au100 - yCuy)77Si9Ge14 alloys Acta Metallurgica. 31: 1883-1894. DOI: 10.1016/0001-6160(83)90134-7  0.56
1983 Thompson CV, Spaepen F. Homogeneous crystal nucleation in binary metallic melts Acta Metallurgica. 31: 2021-2027. DOI: 10.1016/0001-6160(83)90019-6  0.528
1981 Thompson C, Spaepen F. The Effect of Solute on the homogeneous Crystal Nucleation Frequency in Metallic Melts Mrs Proceedings. 9. DOI: 10.1557/Proc-9-603  0.54
1979 Thompson CV, Spaepen F. On the approximation of the free energy change on crystallization Acta Metallurgica. 27: 1855-1859. DOI: 10.1016/0001-6160(79)90076-2  0.533
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