Bing Shi, Ph.D.
Affiliations: | 2013 | Electrical Engineering | University of Maryland, College Park, College Park, MD |
Google:
"Bing Shi"Parents
Sign in to add mentor| Ankur Srivastava | grad student | 2013 | University of Maryland | |
| (Electro-thermal codesign in liquid cooled 3D ICs: Pushing the power-performance limits.) | ||||
BETA: Related publications
See more...
Publications
|
You can help our author matching system! If you notice any publications incorrectly attributed to this author, please sign in and mark matches as correct or incorrect. |
| Zhang Y, Shi B, Srivastava A. (2014) Statistical Framework for Designing On-Chip Thermal Sensing Infrastructure in Nanoscale Systems Ieee Transactions On Very Large Scale Integration Systems. 22: 270-279 |
| Shi B, Srivastava A. (2014) Optimized Micro-Channel Design for Stacked 3-D-ICs Ieee Transactions On Computer-Aided Design of Integrated Circuits and Systems. 33: 90-100 |
| Serafy C, Shi B, Srivastava A. (2014) A geometric approach to chip-scale TSV shield placement for the reduction of TSV coupling in 3D-ICs Integration. 47: 307-317 |
| Bar-Cohen A, Srivastava A, Shi B. (2013) Thermo-electrical co-design of three-dimensional integrated circuits: Challenges and opportunities Computational Thermal Sciences. 5: 441-458 |
| Shi B, Zhang Y, Srivastava A. (2013) Dynamic Thermal Management Under Soft Thermal Constraints Ieee Transactions On Very Large Scale Integration Systems. 21: 2045-2054 |
| Shi B, Srivastava A, Bar-Cohen A. (2013) Co-design of micro-fluidic heat sink and thermal through-silicon-vias for cooling of three-dimensional integrated circuit Iet Circuits, Devices and Systems. 7: 223-231 |
| Shi B, Srivastava A. (2013) Micro-Fluidic Cooling for Stacked 3D-ICs: Fundamentals, Modeling and Design Advances in Computers. 88: 79-124 |
| Shi B, Zhang Y, Srivastava A. (2012) Accelerating Gate Sizing Using Graphics Processing Units Ieee Transactions On Computer-Aided Design of Integrated Circuits and Systems. 31: 160-164 |
| Shi B, Srivastava A. (2011) Unified Datacenter Power Management Considering On-Chip and Air Temperature Constraints Sustainable Computing: Informatics and Systems. 1: 91-98 |