Year |
Citation |
Score |
2020 |
Ren Z, Taur Y. Non-GCA modeling of near threshold I-V characteristics of DG MOSFETs Solid-State Electronics. 166: 107766. DOI: 10.1016/J.Sse.2020.107766 |
0.737 |
|
2019 |
Kavrik MS, Bostwick A, Rotenberg E, Tang K, Thomson E, Aoki T, Fruhberger B, Taur Y, McIntyre PC, Kummel AC. Understanding the Mechanism of Electronic Defects Suppression Enabled by Non-Idealities in Atomic Layer Deposition. Journal of the American Chemical Society. PMID 31779305 DOI: 10.1021/Jacs.9B06640 |
0.314 |
|
2019 |
Kavrik MS, Ercius P, Cheung J, Tang K, Wang Q, Fruhberger B, Kim MJ, Taur Y, McIntyre PC, Kummel AC. Engineering high-k/SiGe interface with ALD oxide for selective GeOx reduction. Acs Applied Materials & Interfaces. PMID 30938163 DOI: 10.1021/Acsami.8B22362 |
0.332 |
|
2019 |
Taur Y, Choi W, Zhang J, Su M. A Non-GCA DG MOSFET Model Continuous into the Velocity Saturation Region Ieee Transactions On Electron Devices. 66: 1160-1166. DOI: 10.1109/Ted.2019.2894685 |
0.488 |
|
2018 |
Kavrik MS, Thomson E, Chagarov E, Tang K, Ueda ST, Hou V, Aoki T, Kim MJ, Fruhberger B, Taur Y, McIntyre PC, Kummel AC. Ultra-Low defect density at sub-0.5 nm HfO2/SiGe interfaces via selective oxygen scavenging. Acs Applied Materials & Interfaces. PMID 30073827 DOI: 10.1021/Acsami.8B06547 |
0.38 |
|
2018 |
Pandey N, Lin H, Nandi A, Taur Y. Modeling of Short-Channel Effects in DG MOSFETs: Green’s Function Method Versus Scale Length Model Ieee Transactions On Electron Devices. 65: 3112-3119. DOI: 10.1109/Ted.2018.2845875 |
0.521 |
|
2018 |
Taur Y, Lin H. Modeling of DG MOSFET
$I$
–
$V$
Characteristics in the Saturation Region Ieee Transactions On Electron Devices. 65: 1714-1720. DOI: 10.1109/Ted.2018.2818943 |
0.557 |
|
2018 |
Parihar MS, Lee KH, Park HJ, Lacord J, Martinie S, Barbé J, Xu Y, El Dirani H, Taur Y, Cristoloveanu S, Bawedin M. Insight into carrier lifetime impact on band-modulation devices Solid-State Electronics. 143: 41-48. DOI: 10.1016/J.Sse.2017.12.007 |
0.376 |
|
2018 |
Cristoloveanu S, Lee K, Parihar M, El Dirani H, Lacord J, Martinie S, Le Royer C, Barbe J, Mescot X, Fonteneau P, Galy P, Gamiz F, Navarro C, Cheng B, Duan M, ... ... Taur Y, et al. A review of the Z 2 -FET 1T-DRAM memory: Operation mechanisms and key parameters Solid-State Electronics. 143: 10-19. DOI: 10.1016/J.Sse.2017.11.012 |
0.306 |
|
2017 |
Wu J, Taur Y. An All-Region I–V Model for 1-D Nanowire MOSFETs Ieee Transactions On Nanotechnology. 16: 1062-1066. DOI: 10.1109/Tnano.2017.2745447 |
0.538 |
|
2017 |
Lin H, Taur Y. Effect of Source–Drain Doping on Subthreshold Characteristics of Short-Channel DG MOSFETs Ieee Transactions On Electron Devices. 64: 4856-4860. DOI: 10.1109/Ted.2017.2766920 |
0.426 |
|
2017 |
Xie Q, Wang Z, Taur Y. Analysis of Short-Channel Effects in Junctionless DG MOSFETs Ieee Transactions On Electron Devices. 64: 3511-3514. DOI: 10.1109/Ted.2017.2716969 |
0.467 |
|
2017 |
Taur Y, Lacord J, Parihar MS, Wan J, Martinie S, Lee K, Bawedin M, Barbe J, Cristoloveanu S. A comprehensive model on field-effect pnpn devices (Z 2 -FET) Solid-State Electronics. 134: 1-8. DOI: 10.1016/J.Sse.2017.05.004 |
0.519 |
|
2017 |
El Dirani H, Lee K, Parihar M, Lacord J, Martinie S, Barbe J, Mescot X, Fonteneau P, Broquin J, Ghibaudo G, Galy P, Gamiz F, Taur Y, Kim Y, Cristoloveanu S, et al. Ultra-low power 1T-DRAM in FDSOI technology Microelectronic Engineering. 178: 245-249. DOI: 10.1016/J.Mee.2017.05.047 |
0.32 |
|
2016 |
Wu J, Taur Y. Reduction of TFET OFF-Current and Subthreshold Swing by Lightly Doped Drain Ieee Transactions On Electron Devices. 63: 3342-3345. DOI: 10.1109/Ted.2016.2577589 |
0.47 |
|
2016 |
Taur Y, Wu J, Min J. A Short-Channel $I$ – $V$ Model for 2-D MOSFETs Ieee Transactions On Electron Devices. 63: 2550-2555. DOI: 10.1109/Ted.2016.2547949 |
0.551 |
|
2016 |
Wu J, Taur Y. A Continuous Semianalytic Current Model for DG and NW TFETs Ieee Transactions On Electron Devices. 63: 841-847. DOI: 10.1109/Ted.2015.2509468 |
0.537 |
|
2016 |
Taur Y, Wu J, Min J. Dimensionality dependence of TFET performance down to 0.1 v supply voltage Ieee Transactions On Electron Devices. 63: 877-880. DOI: 10.1109/Ted.2015.2508282 |
0.403 |
|
2016 |
Taur Y, Wu J. Examination of Two-Band $E(k)$ Relations for Band-to-Band Tunneling Ieee Transactions On Electron Devices. 63: 869-872. DOI: 10.1109/Ted.2015.2505505 |
0.32 |
|
2016 |
Gu S, Min J, Taur Y, Asbeck PM. Characterization of interface defects in ALD Al2O3/p-GaSb MOS capacitors using admittance measurements in range from kHz to GHz Solid-State Electronics. 118: 18-25. DOI: 10.1016/J.Sse.2016.01.001 |
0.331 |
|
2015 |
Wu J, Min J, Taur Y. Short-Channel Effects in Tunnel FETs Ieee Transactions On Electron Devices. 62: 3019-3024. DOI: 10.1109/Ted.2015.2458977 |
0.461 |
|
2015 |
Taur Y, Wu J, Min J. An Analytic Model for Heterojunction Tunnel FETs With Exponential Barrier Ieee Transactions On Electron Devices. 62: 1399-1404. DOI: 10.1109/Ted.2015.2407695 |
0.532 |
|
2015 |
Taur Y, Chen H, Xie Q, Ahn J, McIntyre PC, Lin D, Vais A, Veksler D. A Unified Two-Band Model for Oxide Traps and Interface States in MOS Capacitors Ieee Transactions On Electron Devices. 62: 813-820. DOI: 10.1109/Ted.2015.2389805 |
0.622 |
|
2015 |
Min J, Wu J, Taur Y. Analysis of Source Doping Effect in Tunnel FETs With Staggered Bandgap Ieee Electron Device Letters. 36: 1094-1096. DOI: 10.1109/Led.2015.2466676 |
0.396 |
|
2014 |
Chen H, Ahn J, McIntyre PC, Taur Y. Effects of oxide thickness and temperature on dispersions in InGaAs MOS C-V characteristics Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena. 32: 03D111. DOI: 10.1116/1.4864618 |
0.564 |
|
2014 |
Chen HP, Veksler D, Bersuker G, Taur Y. Modeling illumination effects on n- and p-Type InGaAs MOS at room and low temperatures Ieee Transactions On Electron Devices. 61: 1483-1487. DOI: 10.1109/Ted.2014.2312329 |
0.574 |
|
2014 |
Dou C, Lin D, Vais A, Ivanov T, Chen HP, Martens K, Kakushima K, Iwai H, Taur Y, Thean A, Groeseneken G. Determination of energy and spatial distribution of oxide border traps in In0.53Ga0.47As MOS capacitors from capacitance-voltage characteristics measured at various temperatures Microelectronics Reliability. 54: 746-754. DOI: 10.1016/J.Microrel.2013.12.023 |
0.551 |
|
2013 |
Chen H, Ahn J, McIntyre PC, Taur Y. Comparison of Bulk-Oxide Trap Models: Lumped Versus Distributed Circuit Ieee Transactions On Electron Devices. 60: 3920-3924. DOI: 10.1109/Ted.2013.2281298 |
0.627 |
|
2013 |
Xie Q, Lee C, Xu J, Wann C, Sun JY, Taur Y. Comprehensive Analysis of Short-Channel Effects in Ultrathin SOI MOSFETs Ieee Transactions On Electron Devices. 60: 1814-1819. DOI: 10.1109/Ted.2013.2255878 |
0.461 |
|
2013 |
Taur Y, Chen H, Yuan Y, Yu B. Comments to “A Distributive-Transconductance Model for Border Traps in III-V/High-k MOS Capacitors” Ieee Electron Device Letters. 34: 1343-1344. DOI: 10.1109/Led.2013.2278097 |
0.622 |
|
2013 |
Chen H, Yuan Y, Yu B, Chang C, Wann C, Taur Y. Re-examination of the extraction of MOS interface-state density by C–V stretchout and conductance methods Semiconductor Science and Technology. 28: 085008. DOI: 10.1088/0268-1242/28/8/085008 |
0.559 |
|
2013 |
Yu B, Yuan Y, Chen H, Ahn J, McIntyre P, Taur Y. Effect and extraction of series resistance in Al2O3-InGaAs MOS with bulk-oxide trap Electronics Letters. 49: 492-493. DOI: 10.1049/El.2013.0433 |
0.323 |
|
2012 |
Chen HP, Yuan Y, Yu B, Ahn J, McIntyre PC, Asbeck PM, Rodwell MJW, Taur Y. Interface-State Modeling of Al 2O 3-InGaAs MOS From Depletion to Inversion Ieee Transactions On Electron Devices. DOI: 10.1109/Ted.2012.2205255 |
0.646 |
|
2012 |
Yuan Y, Yu B, Ahn J, McIntyre PC, Asbeck PM, Rodwell MJW, Taur Y. A distributed bulk-oxide trap model for Al 2O 3 InGaAs MOS devices Ieee Transactions On Electron Devices. 59: 2100-2106. DOI: 10.1109/Ted.2012.2197000 |
0.465 |
|
2012 |
Xie Q, Xu J, Taur Y. Review and Critique of Analytic Models of MOSFET Short-Channel Effects in Subthreshold Ieee Transactions On Electron Devices. 59: 1569-1579. DOI: 10.1109/Ted.2012.2191556 |
0.482 |
|
2012 |
Taur Y, Chen H, Wang W, Lo S, Wann C. On–Off Charge–Voltage Characteristics and Dopant Number Fluctuation Effects in Junctionless Double-Gate MOSFETs Ieee Transactions On Electron Devices. 59: 863-866. DOI: 10.1109/Ted.2011.2181392 |
0.664 |
|
2011 |
Chen HP, Lee VC, Ohoka A, Xiang J, Taur Y. Modeling and design of ferroelectric MOSFETs Ieee Transactions On Electron Devices. 58: 2401-2405. DOI: 10.1109/Ted.2011.2155067 |
0.657 |
|
2011 |
Yuan Y, Wang L, Yu B, Shin B, Ahn J, McIntyre PC, Asbeck PM, Rodwell MJW, Taur Y. A distributed model for border traps in Al2O3 - InGaAs MOS devices Ieee Electron Device Letters. 32: 485-487. DOI: 10.1109/Led.2011.2105241 |
0.463 |
|
2010 |
Asbeck PM, Wang L, Gu S, Taur Y, Yu ET. Tunneling MOSFETs based on III-V staggered heterojunctions Materials Research Society Symposium Proceedings. 1252: 3-9. DOI: 10.1557/Proc-1252-I02-04 |
0.464 |
|
2010 |
Asbeck P, Wang L, Gu S, Taur Y, Yu E. Tunneling MOSFETs Based on III-V Staggered Heterojunctions Mrs Proceedings. 1252. DOI: 10.1557/PROC-1252-I02-04 |
0.359 |
|
2010 |
Song J, Yuan Y, Yu B, Xiong W, Taur Y. Compact Modeling of Experimental n- and p-Channel FinFETs Ieee Transactions On Electron Devices. 57: 1369-1374. DOI: 10.1109/Ted.2010.2047067 |
0.783 |
|
2010 |
Wang L, Yu E, Taur Y, Asbeck P. Design of Tunneling Field-Effect Transistors Based on Staggered Heterojunctions for Ultralow-Power Applications Ieee Electron Device Letters. 31: 431-433. DOI: 10.1109/Led.2010.2044012 |
0.375 |
|
2010 |
Xie Q, Xu J, Ren T, Taur Y. A 2D analytical model for SCEs in MOSFETs with high-kgate dielectric Semiconductor Science and Technology. 25: 035012. DOI: 10.1088/0268-1242/25/3/035012 |
0.527 |
|
2010 |
Wang L, Asbeck PM, Taur Y. Self-consistent 1-D Schrödinger-Poisson solver for III-V heterostructures accounting for conduction band non-parabolicity Solid-State Electronics. 54: 1257-1262. DOI: 10.1016/J.Sse.2010.06.018 |
0.444 |
|
2010 |
Wang W, Lu H, Song J, Lo S, Taur Y. Compact modeling of quantum effects in symmetric double-gate MOSFETs Microelectronics Journal. 41: 688-692. DOI: 10.1016/J.Mejo.2010.05.007 |
0.793 |
|
2009 |
Wang L, Yu B, Asbeck PM, Taur Y, Rodwell M. Performance comparison of scaled III-V and Si ballistic nanowire MOSFETs International Journal of High Speed Electronics and Systems. 19: 15-22. DOI: 10.1142/S0129156409006059 |
0.441 |
|
2009 |
Yu B, Yuan Y, Song J, Taur Y. A Two-Dimensional Analytical Solution for Short-Channel Effects in Nanowire MOSFETs Ieee Transactions On Electron Devices. 56: 2357-2362. DOI: 10.1109/Ted.2009.2028048 |
0.794 |
|
2009 |
Song J, Yu B, Xiong W, Taur Y. Gate-Length-Dependent Strain Effect in n- and p-Channel FinFETs Ieee Transactions On Electron Devices. 56: 533-536. DOI: 10.1109/Ted.2008.2011840 |
0.755 |
|
2009 |
Singisetti U, Wistey MA, Burek GJ, Baraskar AK, Thibeault BJ, Gossard AC, Rodwell MJW, Shin B, Kim EJ, McIntyre PC, Yu B, Yuan Y, Wang D, Taur Y, Asbeck P, et al. In0.53Ga0.47As Channel MOSFETs with self-aligned InAs source/drain formed by MEE regrowth Ieee Electron Device Letters. 30: 1128-1130. DOI: 10.1109/Led.2009.2031304 |
0.403 |
|
2009 |
Yuan Y, Yu B, Song J, Taur Y. An analytic model for threshold voltage shift due to quantum confinement in surrounding gate MOSFETs with anisotropic effective mass Solid-State Electronics. 53: 140-144. DOI: 10.1016/J.Sse.2008.10.010 |
0.77 |
|
2008 |
Yu B, Song J, Yuan Y, Lu W, Taur Y. A Unified Analytic Drain–Current Model for Multiple-Gate MOSFETs Ieee Transactions On Electron Devices. 55: 2157-2163. DOI: 10.1109/Ted.2008.926228 |
0.823 |
|
2008 |
Yu B, Wang L, Yuan Y, Asbeck PM, Taur Y. Scaling of nanowire transistors Ieee Transactions On Electron Devices. 55: 2846-2858. DOI: 10.1109/Ted.2008.2005163 |
0.456 |
|
2008 |
Lu H, Yu B, Taur Y. A unified charge model for symmetric double-gate and surrounding-gate MOSFETs Solid-State Electronics. 52: 67-72. DOI: 10.1016/J.Sse.2007.06.018 |
0.826 |
|
2007 |
Yu B, Lu H, Liu M, Taur Y. Explicit Continuous Models for Double-Gate and Surrounding-Gate MOSFETs Ieee Transactions On Electron Devices. 54: 2715-2722. DOI: 10.1109/Ted.2007.904410 |
0.816 |
|
2007 |
Yu B, Lu W, Lu H, Taur Y. Analytic Charge Model for Surrounding-Gate MOSFETs Ieee Transactions On Electron Devices. 54: 492-496. DOI: 10.1109/Ted.2006.890264 |
0.781 |
|
2007 |
Lu H, Lu W, Taur Y. Effect of body doping on double-gate MOSFET characteristics Semiconductor Science and Technology. 23: 015006. DOI: 10.1088/0268-1242/23/1/015006 |
0.793 |
|
2007 |
Cai M, Liu M, Taur Y. Simulation study of the noise figure of nanometer-gate nMOS transistors near the scaling limit Solid-State Electronics. 51: 667-673. DOI: 10.1016/J.Sse.2007.02.014 |
0.307 |
|
2006 |
Liu M, Cai M, Yu B, Taur Y. Effect of Gate Overlap and Source/Drain Doping Gradient on 10-nm CMOS Performance Ieee Transactions On Electron Devices. 53: 3146-3149. DOI: 10.1109/Ted.2006.885103 |
0.675 |
|
2006 |
Lu H, Taur Y. An analytic potential model for symmetric and asymmetric DG MOSFETs Ieee Transactions On Electron Devices. 53: 1161-1168. DOI: 10.1109/Ted.2006.872093 |
0.831 |
|
2006 |
Lu W, Taur Y. On the scaling limit of ultrathin SOI MOSFETs Ieee Transactions On Electron Devices. 53: 1137-1141. DOI: 10.1109/Ted.2006.871879 |
0.327 |
|
2005 |
Sleva S, Taur Y. The Influence of Source and Drain Junction Depth on the Short-Channel Effect in MOSFETs Ieee Transactions On Electron Devices. 52: 2814-2816. DOI: 10.1109/Ted.2005.859614 |
0.469 |
|
2004 |
Liang X, Taur Y. A 2-D Analytical Solution for SCEs in DG MOSFETs Ieee Transactions On Electron Devices. 51: 1385-1391. DOI: 10.1109/Ted.2004.832707 |
0.713 |
|
2004 |
Taur Y, Liang X, Wang W, Lu H. A Continuous, Analytic Drain-Current Model for DG MOSFETs Ieee Electron Device Letters. 25: 107-109. DOI: 10.1109/Led.2003.822661 |
0.815 |
|
2002 |
Taur Y. CMOS design near the limit of scaling Ibm Journal of Research and Development. 46: 213-222. DOI: 10.1147/Rd.462.0213 |
0.327 |
|
2002 |
Floyd BA, Shi L, Taur Y, Lagnado I. A 23.8-GHz SOI CMOS tuned amplifier Ieee Transactions On Microwave Theory and Techniques. 50: 2193-2196. DOI: 10.1109/Tmtt.2002.802334 |
0.312 |
|
2002 |
Rosenthal PA, Taur Y, Yu ET. Direct measurement and characterization of n+ superhalo implants in a 120 nm gate-length Si metal–oxide–semiconductor field-effect transistor using cross-sectional scanning capacitance microscopy Applied Physics Letters. 81: 3993-3995. DOI: 10.1063/1.1522819 |
0.384 |
|
2002 |
Taur Y. Transistors and IC design Advances in Computers. 55: 237-279. DOI: 10.1016/S0065-2458(01)80031-0 |
0.3 |
|
2002 |
Frank DJ, Taur Y. Design considerations for CMOS near the limits of scaling Solid-State Electronics. 46: 315-320. DOI: 10.1016/S0038-1101(01)00102-2 |
0.391 |
|
2001 |
Taur Y. Analytic solutions of charge and capacitance in symmetric and asymmetric double-gate MOSFETs Ieee Transactions On Electron Devices. 48: 2861-2869. DOI: 10.1109/16.974719 |
0.565 |
|
2000 |
Taur Y. An analytical solution to a double-gate MOSFET with undoped body Ieee Electron Device Letters. 21: 245-247. DOI: 10.1109/55.841310 |
0.525 |
|
2000 |
Taur Y. MOSFET channel length: extraction and interpretation Ieee Transactions On Electron Devices. 47: 160-170. DOI: 10.1109/16.817582 |
0.47 |
|
1999 |
Lo S-, Buchanan DA, Taur Y. Modeling and characterization of quantization, polysilicon depletion, and direct tunneling effects in MOSFETs with ultrathin oxides Ibm Journal of Research and Development. 43: 327-337. DOI: 10.1147/Rd.433.0327 |
0.47 |
|
1999 |
Taur Y. The incredible shrinking transistor Ieee Spectrum. 36: 25-29. DOI: 10.1109/6.774961 |
0.338 |
|
1998 |
Frank DJ, Taur Y, Wong HSP. Generalized scale length for two-dimensional effects in MOSFET's Ieee Electron Device Letters. 19: 385-387. DOI: 10.1109/55.720194 |
0.39 |
|
1998 |
Taur Y, Ning TH. FEOL technology trend Materials Chemistry and Physics. 52: 191-199. DOI: 10.1016/S0254-0584(97)02029-4 |
0.36 |
|
1998 |
Philip Wong H, Taur Y, Frank DJ. Discrete random dopant distribution effects in nanometer-scale MOSFETs Microelectronics Reliability. 38: 1447-1456. DOI: 10.1016/S0026-2714(98)00053-5 |
0.427 |
|
1997 |
Wann C, Assaderaghi F, Shi L, Chan K, Cohen S, Hovel H, Jenkins K, Lee Y, Sadana D, Viswanathan R, Wind S, Taur Y. High-performance 0.07-μm CMOS with 9.5-ps gate delay and 150 GHz f/sub T/ Ieee Electron Device Letters. 18: 625-627. DOI: 10.1109/55.644091 |
0.361 |
|
1997 |
Lo SH, Buchanan DA, Taur Y, Wang W. Quantum-mechanical modeling of electron tunneling current from the inversion layer of ultra-thin-oxide nMOSFET's Ieee Electron Device Letters. 18: 209-211. DOI: 10.1109/55.568766 |
0.415 |
|
1995 |
Wind SJ, Taur Y, Mii Y, Frank DJ, Wong H, Buchanan DA, Rishton SA, Bucchignano JJ, Lii Y, Jenkins KA. Probing the Limits of Silicon-Based Nanoelectronics Mrs Proceedings. 380. DOI: 10.1557/Proc-380-179 |
0.362 |
|
1995 |
Wind SJ, Taur Y, Lee YH, Mii Y, Viswanathan RG, Bucchignano JJ, Pomerene AT, Sicina RM, Milkove KR, Stiebritz JW, Roy RA, Hu CK, Manny MP, Cohen S, Chen W. Lithography and fabrication processes for sub-100 nm scale complementary metal-oxide semiconductor Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures. 13: 2688-2695. DOI: 10.1116/1.588050 |
0.397 |
|
1995 |
Taur Y, Mii Y, Logan R, Wong H. On "effective channel length" in 0.1-μm MOSFETs Ieee Electron Device Letters. 16: 136-138. DOI: 10.1109/55.372493 |
0.398 |
|
1994 |
Mii Y, Rishton S, Taur Y, Kern D, Lii T, Lee K, Jenkins KA, Quinlan D, Brown T, Danner D, Sewell F, Polcari M. Experimental High Performance Sub-0.1 μm Channel nMOSFET's Ieee Electron Device Letters. 15: 28-30. DOI: 10.1109/55.289472 |
0.39 |
|
1994 |
Hsu CC-, Wen D, Wordeman MR, Taur Y, Ning TH. A comprehensive study of hot-carrier instability in p- and n-type poly-Si gated MOSFET's Ieee Transactions On Electron Devices. 41: 675-680. DOI: 10.1109/16.285016 |
0.404 |
|
1994 |
Buchanan DA, DiMaria DJ, Chang CA, Taur Y. Defect generation in 3.5 nm silicon dioxide films Applied Physics Letters. 65: 1820-1822. DOI: 10.1063/1.112854 |
0.305 |
|
1993 |
Taur Y, Cohen S, Wind S, Lii T, Hsu C, Quinlan D, Chang CA, Buchanan D, Agnello P, Mii YJ, Reeves C, Acovic A, Kesan V. Experimental 0.1-um p-Channel MOSFET with p+-Polysilicon Gate on 35-A Gate Oxide Ieee Electron Device Letters. 14: 304-306. DOI: 10.1109/55.215206 |
0.379 |
|
1993 |
Taur Y, Hsu C, Wu B, Kiehl R, Davari B, Shahidi G. Saturation transconductance of deep-submicron-channel MOSFETs Solid-State Electronics. 36: 1085-1087. DOI: 10.1016/0038-1101(93)90185-S |
0.365 |
|
1992 |
Hsu CCH, Acovic A, Dori L, Wu B, Lii T, Quinlan D, DiMaria D, Taur Y, Wordeman M, Ning T. A High Speed, Low Power P-Channel Flash EEPROM Using Silicon Rich Oxide as Tunneling Dielectric The Japan Society of Applied Physics. DOI: 10.7567/Ssdm.1992.Pa2-2 |
0.348 |
|
1992 |
Warnock J, Shahidi G, Dasvari B, Wu B, Taur Y, Wong C, Jenkins K, Chen C. BiCMOS technology with 60 GHz n-p-n bipolar and 0.25 mu m CMOS Ieee Electron Device Letters. 13: 578-580. DOI: 10.1109/55.192841 |
0.355 |
|
1992 |
Taur Y, Zicherman DS, Lombardi DR, Restle PJ, Hsu CH, Hanafi HI, Wordeman MR, Davari B, Shahidi GG. A New “Shift and Ratio” Method for MOSFET Channel-Length Extraction Ieee Electron Device Letters. 13: 267-269. DOI: 10.1109/55.145049 |
0.419 |
|
1992 |
Davari B, Chang W, Petrillo K, Wong C, Moy D, Taur Y, Wordeman M, Sun J, Hsu C, Polcari M. A high-performance 0.25- mu m CMOS technology. II. Technology Ieee Transactions On Electron Devices. 39: 967-975. DOI: 10.1109/16.127490 |
0.383 |
|
1992 |
Chang W, Davari B, Wordeman M, Taur Y, Hsu C, Rodriguez M. A high-performance 0.25- mu m CMOS technology. I. Design and characterization Ieee Transactions On Electron Devices. 39: 959-966. DOI: 10.1109/16.127489 |
0.36 |
|
1989 |
Wong C, Piccirillo J, Bhattacharyya A, Taur Y, Hanafi H. Sidewall oxidation of polycrystalline-silicon gate Ieee Electron Device Letters. 10: 420-422. DOI: 10.1109/55.34729 |
0.412 |
|
1987 |
Taur Y, Sun JY-, Moy D, Wang LK, Davari B, Klepner SP, Ting C. Source—Drain contact resistance in CMOS with self-aligned TiSi 2 Ieee Transactions On Electron Devices. 34: 575-580. DOI: 10.1109/T-Ed.1987.22965 |
0.327 |
|
1987 |
Sun JY-, Taur Y, Dennard RH, Klepner SP. Submicrometer-channel CMOS for low-temperature operation Ieee Transactions On Electron Devices. 34: 19-27. DOI: 10.1109/T-Ed.1987.22881 |
0.466 |
|
1986 |
Lai FJ, Wang LK, Taur Y, Sun JY-, Petrillo KE, Chicotka SK, Petrillo EJ, Polcari MR, Bucelot TJ, Zicherman DS. A highly latchup-immune 1-µm CMOS technology fabricated with 1-MeV ion implantation and self-aligned TiSi 2 Ieee Transactions On Electron Devices. 33: 1308-1320. DOI: 10.1109/T-Ed.1986.22664 |
0.403 |
|
1985 |
Taur Y, Hu GJ, Dennard RH, Terman LM, Ting C, Petrillo KE. A self-aligned 1-µm-channel CMOS technology with retrograde n-well and thin epitaxy Ieee Transactions On Electron Devices. 32: 203-209. DOI: 10.1109/T-Ed.1985.21930 |
0.398 |
|
1985 |
Taur Y, Hu GJ, Dennard RH, Terman LM, Ting CY, Petrillo KE. A Self-Aligned 1-μm-Channel CMOS Technology with Retrograde n-Well and Thin Epitaxy Ieee Journal of Solid-State Circuits. 20: 123-129. DOI: 10.1109/Jssc.1985.1052284 |
0.365 |
|
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