| Year |
Citation |
Score |
| 2021 |
Aksit A, Lalwani AK, Kysar JW, West AC. Simulation assisted design for microneedle manufacturing: Computational modeling of two-photon templated electrodeposition. Journal of Manufacturing Processes. 66: 211-219. PMID 34012359 DOI: 10.1016/j.jmapro.2021.04.023 |
0.771 |
|
| 2020 |
Inaba Y, West AC, Banta S. Enhanced microbial corrosion of stainless steel by Acidithiobacillus ferrooxidans through the manipulation of substrate oxidation and overexpression of rus. Biotechnology and Bioengineering. PMID 32687219 DOI: 10.1002/Bit.27509 |
0.301 |
|
| 2020 |
Aksit A, Rastogi S, Nadal ML, Parker AM, Lalwani AK, West AC, Kysar JW. Drug delivery device for the inner ear: ultra-sharp fully metallic microneedles. Drug Delivery and Translational Research. PMID 32488817 DOI: 10.1007/S13346-020-00782-9 |
0.765 |
|
| 2020 |
Mayilvahanan K, Brady N, McCarthy AH, Wang L, Marschilok AC, Takeuchi K, Takeuchi E, West AC. Design Principles to Govern Electrode Fabrication for the Lithium Trivanadate Cathode Journal of the Electrochemical Society. 167: 100503. DOI: 10.1149/1945-7111/Ab91C8 |
0.362 |
|
| 2020 |
Barmak K, Ezzat S, Gusley R, Jog A, Kerdsongpanya S, Khaniya A, Milosevic E, Richardson W, Sentosun K, Zangiabadi A, Gall D, Kaden WE, Mucciolo ER, Schelling PK, West AC, et al. Epitaxial metals for interconnects beyond Cu Journal of Vacuum Science & Technology A. 38: 033406. DOI: 10.1116/6.0000018 |
0.317 |
|
| 2020 |
Donnelly CA, Vardner JT, Zhang Z, Banta S, West AC. Impact of Anode on Product Formation During the Electrochemical Reduction of Chalcopyrite Jom. 1-8. DOI: 10.1007/S11837-020-04100-Z |
0.377 |
|
| 2018 |
Lininger CN, Brady NW, West AC. Equilibria and Rate Phenomena from Atomistic to Mesoscale: Simulation Studies of Magnetite. Accounts of Chemical Research. PMID 29498267 DOI: 10.1021/Acs.Accounts.7B00531 |
0.376 |
|
| 2017 |
Bock DC, Pelliccione CJ, Zhang W, Timoshenko J, Knehr KW, West AC, Wang F, Li Y, Frenkel AI, Takeuchi ES, Takeuchi KJ, Marschilok AC. Size dependent behavior of Fe3O4 crystals during electrochemical (de)lithiation: an in situ X-ray diffraction, ex situ X-ray absorption spectroscopy, transmission electron microscopy and theoretical investigation. Physical Chemistry Chemical Physics : Pccp. PMID 28745341 DOI: 10.1039/C7Cp03312E |
0.304 |
|
| 2016 |
Bock D, Pelliccione CJ, Zhang W, Wang J, Knehr KW, Wang J, Wang F, West AC, Marschilok AC, Takeuchi KJ, Takeuchi ES. Dispersion of Nanocrystalline Fe3O4 Within Composite Electrodes: Insights on Battery Related Electrochemistry. Acs Applied Materials & Interfaces. PMID 27096464 DOI: 10.1021/Acsami.6B01134 |
0.393 |
|
| 2016 |
Spanos C, Berlinger SA, Jayan A, West AC. Inverse charging techniques for sulfation reversal in flooded lead-acid batteries Journal of the Electrochemical Society. 163: A1612-A1618. DOI: 10.1149/2.0761608Jes |
0.385 |
|
| 2016 |
Brady NW, Zhang Q, Knehr KW, Liu P, Marschilok AC, J. Takeuchi K, Takeuchi ES, West AC. Discharge, Relaxation, and Charge Model for the Lithium Trivanadate Electrode: Reactions, Phase Change, and Transport Journal of the Electrochemical Society. 163: A2890-A2898. DOI: 10.1149/2.0341614Jes |
0.311 |
|
| 2016 |
Brady NW, Knehr KW, Cama CA, Lininger CN, Lin Z, Marschilok AC, Takeuchi KJ, Takeuchi ES, West AC. Galvanostatic interruption of lithium insertion into magnetite: Evidence of surface layer formation Journal of Power Sources. 321: 106-111. DOI: 10.1016/J.Jpowsour.2016.04.117 |
0.364 |
|
| 2015 |
Knehr KW, Brady NW, Cama CA, Bock DC, Lin Z, Lininger CN, Marschilok AC, Takeuchi KJ, Takeuchi ES, West AC. Modeling the mesoscale transport of lithium-magnetite electrodes using insight from discharge and voltage recovery experiments Journal of the Electrochemical Society. 162: A2817-A2826. DOI: 10.1149/2.0961514Jes |
0.341 |
|
| 2015 |
Zhu R, Vallance M, Rahimian SK, West AC. Galvanostatic intermittent titration study of the positive electrode of a Na|Ni(Fe)-chloride cell Journal of the Electrochemical Society. 162: A2051-A2057. DOI: 10.1149/2.0471510Jes |
0.351 |
|
| 2014 |
Li X, Mercado R, Kernan T, West AC, Banta S. Addition of citrate to Acidithiobacillus ferrooxidans cultures enables precipitate-free growth at elevated pH and reduces ferric inhibition Biotechnology and Bioengineering. 111: 1940-1948. PMID 24771134 DOI: 10.1002/Bit.25268 |
0.305 |
|
| 2014 |
Vilinska A, Ponnurangam S, Chernyshova I, Somasundaran P, Eroglu D, Martinez J, West AC. Stabilization of Silicon Carbide (SiC) micro- and nanoparticle dispersions in the presence of concentrated electrolyte. Journal of Colloid and Interface Science. 423: 48-53. PMID 24703667 DOI: 10.1016/J.Jcis.2014.02.007 |
0.691 |
|
| 2014 |
Qiao F, West AC. The impact of cations on nucleus density during copper electrodeposition Electrochimica Acta. 150: 8-14. DOI: 10.1016/J.Electacta.2014.10.135 |
0.351 |
|
| 2014 |
Qiao F, Sun X, West AC. A shielded rotating disk setup with improved current distribution Journal of Applied Electrochemistry. 44: 945-952. DOI: 10.1007/S10800-014-0701-3 |
0.339 |
|
| 2013 |
Eroglu D, West AC. Mathematical modeling of Ni/SiC co-deposition in the presence of a cationic dispersant Journal of the Electrochemical Society. 160. DOI: 10.1149/2.052309Jes |
0.713 |
|
| 2013 |
Sahin A, Lin WT, Khunjar WO, Ran KC, Banta S, West AC. Electrochemical reduction of nitrite to ammonia for use in a bioreactor Journal of the Electrochemical Society. 160. DOI: 10.1149/2.042301Jes |
0.391 |
|
| 2013 |
Eroglu D, Vilinska A, Somasundaran P, West AC. Effect of a cationic polymer, polyethyleneimine, on Ni/SiC co-deposition Journal of the Electrochemical Society. 160. DOI: 10.1149/2.041302Jes |
0.728 |
|
| 2013 |
Eroglu D, Vilinska A, Somasundaran P, West AC. Use of dispersants to enhance incorporation rate of nano-particles into electrodeposited films Electrochimica Acta. 113: 628-634. DOI: 10.1016/J.Electacta.2013.09.113 |
0.7 |
|
| 2013 |
Yang L, Atanasova T, Radisic A, Deconinck J, West AC, Vereecken P. Wafer-scale Cu plating uniformity on thin Cu seed layers Electrochimica Acta. 104: 242-248. DOI: 10.1016/J.Electacta.2013.04.094 |
0.342 |
|
| 2013 |
Volov I, Sun X, Gadikota G, Shi P, West AC. Electrodeposition of copper-tin film alloys for interconnect applications Electrochimica Acta. 89: 792-797. DOI: 10.1016/J.Electacta.2012.11.102 |
0.8 |
|
| 2012 |
Volov I, Swanson E, O'Brien B, Novak SW, Boom Rvd, Dunn K, West AC. Pulse-Plating of Copper-Silver Alloys for Interconnect Applications Journal of the Electrochemical Society. 159: D677-D683. DOI: 10.1149/2.066211Jes |
0.776 |
|
| 2012 |
Eroglu D, West AC. Modeling of reaction kinetics and transport in the positive porous electrode in a sodium-iron chloride battery Journal of Power Sources. 203: 211-221. DOI: 10.1016/J.Jpowsour.2011.11.007 |
0.719 |
|
| 2012 |
Yang L, Radisic A, Nagar M, Deconinck J, Vereecken PM, West AC. Multi-scale modeling of direct copper plating on resistive non-copper substrates Electrochimica Acta. 78: 524-531. DOI: 10.1016/J.Electacta.2012.06.076 |
0.383 |
|
| 2011 |
Volov I, Mann O, Hoenersch Y, Wahl B, West AC. Chromatography of bis-(3-sulfopropyl) disulfide and its breakdown products by HPLC coupled with electrochemical detection Journal of Separation Science. 34: 2385-2390. PMID 21812114 DOI: 10.1002/Jssc.201100352 |
0.773 |
|
| 2011 |
Volov I, West AC. Interaction between SPS and MPS in the presence of ferrous and ferric ions Journal of the Electrochemical Society. 158. DOI: 10.1149/1.3593018 |
0.796 |
|
| 2011 |
Volov I, Saito T, West AC. Investigation of copper plating and additive interactions in the presence of Fe3+/Fe2+ redox couple Journal of the Electrochemical Society. 158. DOI: 10.1149/1.3575638 |
0.764 |
|
| 2011 |
Liu Z, Wu J, West AC. Electrochemical quartz crystal microbalance studies of gold oxidation in cyanide baths Electrochemical and Solid-State Letters. 14. DOI: 10.1149/1.3501991 |
0.641 |
|
| 2011 |
Liu Z, West AC. Modeling of galvanostatic pulse and pulsed reverse electroplating of gold Electrochimica Acta. 56: 3328-3333. DOI: 10.1016/J.Electacta.2011.01.020 |
0.615 |
|
| 2011 |
Liu Z, Zheng M, Hilty RD, West AC. The effect of pulse reversal on morphology of cobalt hard gold Electrochimica Acta. 56: 2546-2551. DOI: 10.1016/J.Electacta.2010.11.031 |
0.657 |
|
| 2010 |
Emekli U, West AC. Simulation of the effect of additives on electrochemical nucleation Journal of the Electrochemical Society. 157. DOI: 10.1149/1.3457433 |
0.787 |
|
| 2010 |
Liu Z, Zheng M, Hilty RD, West AC. Effect of morphology and hydrogen evolution on porosity of electroplated cobalt hard gold Journal of the Electrochemical Society. 157. DOI: 10.1149/1.3430076 |
0.686 |
|
| 2010 |
Emekli U, West AC. Electrochemical nucleation of copper: The effect of poly(ethylene glycol) Journal of the Electrochemical Society. 157. DOI: 10.1149/1.3327902 |
0.802 |
|
| 2010 |
Emekli U, West AC. Simulation of electrochemical nucleation in the presence of additives under galvanostatic and pulsed plating conditions Electrochimica Acta. 56: 977-984. DOI: 10.1016/J.Electacta.2010.10.002 |
0.8 |
|
| 2010 |
Lin JY, West AC. Adsorption-desorption study of benzotriazole in a phosphate-based electrolyte for Cu electrochemical mechanical planarization Electrochimica Acta. 55: 2325-2331. DOI: 10.1016/J.Electacta.2009.11.104 |
0.412 |
|
| 2009 |
Von Gutfeld RJ, Gallaway JW, West AC. In situ immersion plating of copper and nickel on aluminum using laser pulses for oxide removal Journal of the Electrochemical Society. 156. DOI: 10.1149/1.3244217 |
0.39 |
|
| 2009 |
Gallaway JW, Willey MJ, West AC. Copper filling of 100 nm trenches using PEG, PPG, and a triblock copolymer as plating suppressors Journal of the Electrochemical Society. 156. DOI: 10.1149/1.3142422 |
0.806 |
|
| 2009 |
Gallaway JW, Willey MJ, West AC. Acceleration kinetics of PEG, PPG, and a triblock copolymer by SPS during copper electroplating Journal of the Electrochemical Society. 156. DOI: 10.1149/1.3078405 |
0.81 |
|
| 2009 |
Gallaway JW, West AC. The effect of acid on superconformal filling in 100 nm trenches Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures. 27: 2200-2205. DOI: 10.1116/1.3212933 |
0.311 |
|
| 2009 |
Emekli U, West AC. Effect of additives and pulse plating on copper nucleation onto Ru Electrochimica Acta. 54: 1177-1183. DOI: 10.1016/J.Electacta.2008.08.065 |
0.804 |
|
| 2009 |
Shattuck KG, West AC. An investigation of phosphate based ECMP electrolyte performance on feature scale planarization Journal of Applied Electrochemistry. 39: 1719-1724. DOI: 10.1007/S10800-009-9865-7 |
0.786 |
|
| 2008 |
Chen XJ, West AC, Cropek DM, Banta S. Detection of the superoxide radical anion using various alkanethiol monolayers and immobilized cytochrome c Analytical Chemistry. 80: 9622-9629. PMID 19072268 DOI: 10.1021/Ac800796B |
0.324 |
|
| 2008 |
Crowther O, West AC. Effect of electrolyte composition on lithium dendrite growth Journal of the Electrochemical Society. 155. DOI: 10.1149/1.2969424 |
0.78 |
|
| 2008 |
Gallaway JW, West AC. PEG, PPG, and their triblock copolymers as suppressors in copper electroplating Journal of the Electrochemical Society. 155. DOI: 10.1149/1.2958309 |
0.423 |
|
| 2008 |
Von Gutfeld RJ, West AC. In situ oxide removal from aluminum by laser pulses followed by electroplating Electrochemical and Solid-State Letters. 11. DOI: 10.1149/1.2940571 |
0.364 |
|
| 2008 |
Lin JY, West AC, Wan CC. Adsorption and desorption studies of glycine and benzotriazole during Cu oxidation in a chemical mechanical polishing bath Journal of the Electrochemical Society. 155. DOI: 10.1149/1.2905817 |
0.338 |
|
| 2008 |
Willey MJ, Emekli U, West AC. Uniformity effects when electrodepositing Cu onto resistive substrates in the presence of organic additives Journal of the Electrochemical Society. 155. DOI: 10.1149/1.2837857 |
0.789 |
|
| 2008 |
Bozic RG, West AC, Levicky R. Square wave voltammetric detection of 2,4,6-trinitrotoluene and 2,4-dinitrotoluene on a gold electrode modified with self-assembled monolayers Sensors and Actuators, B: Chemical. 133: 509-515. DOI: 10.1016/J.Snb.2008.03.017 |
0.37 |
|
| 2008 |
Shattuck KG, Lin JY, Cojocaru P, West AC. Characterization of phosphate electrolytes for use in Cu electrochemical mechanical planarization Electrochimica Acta. 53: 8211-8216. DOI: 10.1016/J.Electacta.2008.05.077 |
0.791 |
|
| 2008 |
Lin JY, West AC, Wan CC, Wang YY. Evaluation of post-Cu CMP cleaning of organic residues using microfluidic device Electrochemistry Communications. 10: 677-680. DOI: 10.1016/J.Elecom.2008.02.005 |
0.334 |
|
| 2008 |
Von Gutfeld RJ, West AC. Copper plating on titanium alloy 6-2-4-2 using an in situ high voltage pulse followed by plate-up Journal of Applied Electrochemistry. 38: 531-536. DOI: 10.1007/S10800-007-9468-0 |
0.403 |
|
| 2007 |
Willey MJ, Reid J, West AC. Adsorption kinetics of polyvinylpyrrolidone during copper electrodeposition Electrochemical and Solid-State Letters. 10. DOI: 10.1149/1.2436653 |
0.814 |
|
| 2007 |
Willey MJ, West AC. SPS adsorption and desorption during copper electrodeposition and its impact on PEG adsorption Journal of the Electrochemical Society. 154. DOI: 10.1149/1.2431320 |
0.806 |
|
| 2007 |
Von Gutfeld RJ, West AC. Voltage oxide removal for plating: A new method of electroplating oxide coated metals in situ Journal of Vacuum Science and Technology a: Vacuum, Surfaces and Films. 25: 319-323. DOI: 10.1116/1.2539356 |
0.356 |
|
| 2007 |
Willey MJ, West AC. Nucleation on resistive substrates: Analysis of effect on film uniformity Electrochimica Acta. 52: 6484-6489. DOI: 10.1016/J.Electacta.2007.04.049 |
0.8 |
|
| 2006 |
Willey MJ, West AC. Microfluidic studies of adsorption and desorption of polyethylene glycol during copper electrodeposition Journal of the Electrochemical Society. 153. DOI: 10.1149/1.2335587 |
0.798 |
|
| 2006 |
Willey MJ, West AC. A microfluidic device to measure electrode response to changes in electrolyte composition Electrochemical and Solid-State Letters. 9. DOI: 10.1149/1.2201253 |
0.805 |
|
| 2006 |
Başol BM, West AC. Study on mechanically induced current suppression and super filling mechanisms Electrochemical and Solid-State Letters. 9. DOI: 10.1149/1.2173191 |
0.38 |
|
| 2005 |
Chao PG, Tang Z, Angelini E, West AC, Costa KD, Hung CT. Dynamic osmotic loading of chondrocytes using a novel microfluidic device. Journal of Biomechanics. 38: 1273-81. PMID 15863112 DOI: 10.1016/J.Jbiomech.2004.06.016 |
0.758 |
|
| 2005 |
Zheng M, Willey M, West AC. Electrochemical nucleation of copper on ruthenium effect of Cl -, PEG, and SPS Electrochemical and Solid-State Letters. 8. DOI: 10.1149/1.2035701 |
0.811 |
|
| 2005 |
West AC, Shao I, Deligianni H. Numerical simulation of electrochemical planarization of copper overburden Journal of the Electrochemical Society. 152. DOI: 10.1149/1.2001227 |
0.381 |
|
| 2005 |
Lee JM, West AC. Impact of pulse parameters on current distribution in high aspect ratio vias and through-holes Journal of the Electrochemical Society. 152. DOI: 10.1149/1.2001188 |
0.368 |
|
| 2005 |
West AC, Deligianni H, Andricacos PC. Electrochemical planarization of interconnect metallization Ibm Journal of Research and Development. 49: 37-48. DOI: 10.1147/Rd.491.0037 |
0.355 |
|
| 2005 |
Betti R, West AC, Vermaas G, Cao Y. Corrosion and embrittlement in high-strength wires of suspension bridge cables Journal of Bridge Engineering. 10: 151-162. DOI: 10.1061/(Asce)1084-0702(2005)10:2(151) |
0.305 |
|
| 2004 |
Zheng M, West AC. Simulation of the influence of reactant depletion on nucleation rate in electrodeposition Journal of the Electrochemical Society. 151. DOI: 10.1149/1.1758722 |
0.474 |
|
| 2004 |
Lee JM, Hachman JT, Kelly JJ, West AC. Improvement of current distribution uniformity on substrates for microelectromechanical systems Journal of Microlithography, Microfabrication and Microsystems. 3: 146-151. DOI: 10.1117/1.1631924 |
0.343 |
|
| 2003 |
Radisic A, Cao Y, Taephaisitphongse P, West AC, Searson PC. Direct copper electrodeposition on TaN barrier layers Journal of the Electrochemical Society. 150. DOI: 10.1149/1.1565137 |
0.776 |
|
| 2003 |
Leonard EF, Tang Z, West AC, Shapley NC. MEMBRANELESS DIALYSIS IN A MICROFLUIDIC CONFIGURATION Asaio Journal. 49: 222. DOI: 10.1097/00002480-200303000-00321 |
0.759 |
|
| 2002 |
Radisic A, West AC, Searson PC. Influence of additives on nucleation and growth of copper on n-Si(111) from acidic sulfate solutions Journal of the Electrochemical Society. 149. DOI: 10.1149/1.1430719 |
0.343 |
|
| 2002 |
Tang Z, Hong S, Djukic D, Modi V, West AC, Yardley J, Osgood RM. Electrokinetic flow control for composition modulation in a microchannel Journal of Micromechanics and Microengineering. 12: 870-877. DOI: 10.1088/0960-1317/12/6/319 |
0.768 |
|
| 2001 |
Spanier JE, West AC, Herman IP. Electrochemical Impedance Spectroscopy of 6H-SiC in Aqueous Hydrofluoric Acid Journal of the Electrochemical Society. 148: C663-C667. DOI: 10.1149/1.1396652 |
0.373 |
|
| 2001 |
Cao Y, Taephaisitphongse P, Chalupa R, West AC. Three-Additive Model of Superfilling of Copper Journal of the Electrochemical Society. 148. DOI: 10.1149/1.1377898 |
0.779 |
|
| 2001 |
Taephaisitphongse P, Cao Y, West AC. Electrochemical and Fill Studies of a Multicomponent Additive Package for Copper Deposition Journal of the Electrochemical Society. 148. DOI: 10.1149/1.1376636 |
0.798 |
|
| 2001 |
West AC, Mayer S, Reid J. A superfilling model that predicts bump formation Electrochemical and Solid-State Letters. 4. DOI: 10.1149/1.1375856 |
0.306 |
|
| 2001 |
Cao Y, Searson PC, West AC. Direct Numerical Simulation of Nucleation and Three-Dimensional, Diffusion-Controlled Growth Journal of the Electrochemical Society. 148: C376. DOI: 10.1149/1.1365144 |
0.306 |
|
| 2001 |
Calabrese Barton S, West AC. Electrodissolution of Zinc at the Limiting Current Journal of the Electrochemical Society. 148. DOI: 10.1149/1.1365141 |
0.38 |
|
| 2001 |
Calabrese Barton S, West AC. Electrohydrodynamic Impedance in the Presence of Nonuniform Transport Properties Journal of the Electrochemical Society. 148. DOI: 10.1149/1.1357173 |
0.326 |
|
| 2001 |
Chalupa R, Chen M, Modi V, West AC. Limiting Current Density on a Line Electrode in Impinging Slot-Jet Flows Journal of the Electrochemical Society. 148. DOI: 10.1149/1.1342180 |
0.792 |
|
| 2001 |
Barton SC, Patterson T, Wang E, Fuller TF, West AC. Mixed-reactant, strip-cell direct methanol fuel cells Journal of Power Sources. 96: 329-336. DOI: 10.1016/S0378-7753(00)00663-7 |
0.361 |
|
| 2001 |
Cao Y, West AC. Direct numerical simulation of nucleation and three-dimensional, diffusion-controlled growth on disk microelectrodes Journal of Electroanalytical Chemistry. 514: 103-108. DOI: 10.1016/S0022-0728(01)00625-8 |
0.373 |
|
| 2001 |
Chalupa R, Chen M, Modi V, West AC. High Schmidt mass transfer in a turbulent impinging slot-jet flow International Journal of Heat and Mass Transfer. 44: 3775-3785. DOI: 10.1016/S0017-9310(01)00042-4 |
0.778 |
|
| 2000 |
West AC. Theory of filling of high-aspect ratio trenches and vias in presence of additives Journal of the Electrochemical Society. 147: 227-232. DOI: 10.1149/1.1393179 |
0.327 |
|
| 2000 |
Chen M, Chalupa R, West AC, Modi V. High Schmidt mass transfer in a laminar impinging slot jet flow International Journal of Heat and Mass Transfer. 43: 3907-3915. DOI: 10.1016/S0017-9310(00)00052-1 |
0.781 |
|
| 1999 |
Kelly JJ, Tian C, West AC. Leveling and microstructural effects of additives for copper electrodeposition Journal of the Electrochemical Society. 146: 2540-2545. DOI: 10.1149/1.1391968 |
0.383 |
|
| 1999 |
Kelly JJ, West AC. Leveling of 200 nm features by organic additives Electrochemical and Solid-State Letters. 2: 561-563. DOI: 10.1149/1.1390904 |
0.337 |
|
| 1999 |
Baker BC, West AC. A flow modulation study of nickel–iron codeposition Electrochimica Acta. 44: 1567-1576. DOI: 10.1016/S0013-4686(98)00279-5 |
0.307 |
|
| 1998 |
Vidal R, West AC. Aluminum and Aluminum Alloy Dissolution in Concentrated Phosphoric Acid Journal of the Electrochemical Society. 145: 4067-4073. DOI: 10.1149/1.1838916 |
0.321 |
|
| 1998 |
Kelly JJ, West AC. Copper Deposition in the Presence of Polyethylene Glycol: II. Electrochemical Impedance Spectroscopy Journal of the Electrochemical Society. 145: 3477-3481. DOI: 10.1149/1.1838830 |
0.412 |
|
| 1998 |
Kelly JJ, West AC. Copper Deposition in the Presence of Polyethylene Glycol: I. Quartz Crystal Microbalance Study Journal of the Electrochemical Society. 145: 3472-3476. DOI: 10.1149/1.1838829 |
0.374 |
|
| 1998 |
West AC, Cheng C, Baker BC. Pulse Reverse Copper Electrodeposition in High Aspect Ratio Trenches and Vias Journal of the Electrochemical Society. 145: 3070-3074. DOI: 10.1149/1.1838766 |
0.353 |
|
| 1998 |
Cheng C, West AC. Flow Modulation as a Means of Studying Leveling Agents Journal of the Electrochemical Society. 145: 560-564. DOI: 10.1149/1.1838303 |
0.377 |
|
| 1998 |
Kelly JJ, Rahman KMA, Durning CJ, West AC. Effect of current distribution on quartz crystal microbalance measurements Journal of the Electrochemical Society. 145: 492-497. DOI: 10.1149/1.1838291 |
0.315 |
|
| 1998 |
Desprez P, Matlosz M, Yang JD, West AC. Estimation of Front Velocity in Electrodeposition onto Highly Resistive Substrates Journal of the Electrochemical Society. 145: 165-171. DOI: 10.1149/1.1838230 |
0.334 |
|
| 1998 |
CHEN Q, MODI V, WEST AC. Journal of Applied Electrochemistry. 28: 579-587. DOI: 10.1023/A:1003241917179 |
0.344 |
|
| 1997 |
Cheng C, West AC. Nickel Deposition in the Presence of Coumarin: An Electrochemical Impedance Spectroscopy Study Journal of the Electrochemical Society. 144: 3050-3056. DOI: 10.1149/1.1837957 |
0.39 |
|
| 1997 |
Baker BC, West AC. Electrochemical Impedance Spectroscopy Study of Nickel‐Iron Deposition: II. Theoretical Interpretation Journal of the Electrochemical Society. 144: 169-175. DOI: 10.1149/1.1837380 |
0.396 |
|
| 1997 |
Baker BC, West AC. Electrochemical Impedance Spectroscopy Study of Nickel‐Iron Deposition: I. Experimental Results Journal of the Electrochemical Society. 144: 164-169. DOI: 10.1149/1.1837379 |
0.363 |
|
| 1997 |
Yang JD, West AC. Current distributions governed by coupled concentration and potential fields Aiche Journal. 43: 811-817. DOI: 10.1002/Aic.690430326 |
0.345 |
|
| 1996 |
Vidal R, West AC. High-rate dissolution of copper in cupric-sulfate electrolytes Electrochimica Acta. 41: 2417-2424. DOI: 10.1016/0013-4686(96)00022-9 |
0.382 |
|
| 1996 |
West AC, Fuller TF. Influence of rib spacing in proton-exchange membrane electrode assemblies Journal of Applied Electrochemistry. 26: 557-565. DOI: 10.1007/Bf00253453 |
0.342 |
|
| 1995 |
Vidal R, West AC. Copper Electropolishing in Concentrated Phosphoric Acid II. Theoretical Interpretation Journal of the Electrochemical Society. 142: 2689-2694. DOI: 10.1149/1.2050075 |
0.319 |
|
| 1995 |
Vidal R, West AC. Copper Electropolishing in Concentrated Phosphoric Acid I. Experimental Findings Journal of the Electrochemical Society. 142: 2682-2689. DOI: 10.1149/1.2050074 |
0.377 |
|
| 1995 |
DeBecker B, Modi V, Yang D, Duby PF, West AC. Mass-Transfer-Limited Current Distributions on Electrode Arrays in the Presence of a Shear Flow Journal of the Electrochemical Society. 142: 3413-3419. DOI: 10.1149/1.2049996 |
0.38 |
|
| 1995 |
De Becker B, Modi V, Duby P, West AC. Mass Transfer to a Line Electrode in Presence of a Periodic Fluid Flow Journal of the Electrochemical Society. 142: 3001-3007. DOI: 10.1149/1.2048676 |
0.367 |
|
| 1994 |
Vidal R, Duby P, West AC. A mathematical model of ionic transport in a porous diaphragm of a chrome-alum cell Metallurgical and Materials Transactions B. 25: 351-358. DOI: 10.1007/Bf02663384 |
0.328 |
|
| 1994 |
West AC, Matlosz M. A boundary element method for transient diffusion Journal of Applied Electrochemistry. 24: 261-267. DOI: 10.1007/Bf00242894 |
0.311 |
|
| 1993 |
West AC. Comparison of Modeling Approaches for a Porous Salt Film Journal of the Electrochemical Society. 140: 403-408. DOI: 10.1149/1.2221058 |
0.324 |
|
| 1993 |
West AC. Ohmic Interactions within Electrode Ensembles Journal of the Electrochemical Society. 140: 134-139. DOI: 10.1149/1.2056074 |
0.373 |
|
| 1992 |
Grimm RD, West AC, Landolt D. AC Impedance Study of Anodically Formed Salt Films on Iron in Chloride Solution Journal of the Electrochemical Society. 139: 1622-1629. DOI: 10.1149/1.2069467 |
0.58 |
|
| 1992 |
Matlosz M, Vallotton PH, West AC, Landolt D. Nonuniform Current Distribution and Thickness During Electrodeposition onto Resistive Substrates Journal of the Electrochemical Society. 139: 752-761. DOI: 10.1149/1.2069297 |
0.588 |
|
| 1992 |
West AC, Madore C, Matlosz M, Landolt D. Shape Changes During Through-Mask Electrochemical Micromachining of Thin Metal Films Journal of the Electrochemical Society. 139: 499-506. DOI: 10.1149/1.2069245 |
0.575 |
|
| 1992 |
West AC, Grimm RD, Landolt D, Deslouis C, Tribollet B. Electrohydrodynamic impedance study of anodically formed salt films on iron in chloride solutions Journal of Electroanalytical Chemistry. 330: 693-706. DOI: 10.1016/0022-0728(92)80337-4 |
0.571 |
|
| 1992 |
Madore C, West AC, Matlosz M, Landolt D. Design Considerations for a cylindrical hull cell with forced convection Electrochimica Acta. 37: 69-74. DOI: 10.1016/0013-4686(92)80013-C |
0.539 |
|
| 1992 |
West AC, Matlosz M, Landolt D. Primary current distribution in the Hull cell and related trapezoidal geometries Journal of Applied Electrochemistry. 22: 301-303. DOI: 10.1007/Bf01030192 |
0.498 |
|
| 1991 |
West AC, Newman J. Current Distributions on Recessed Electrodes Journal of the Electrochemical Society. 138: 1620-1625. DOI: 10.1149/1.2085844 |
0.517 |
|
| 1991 |
West AC, Matlosz M, Landolt D. Normalized and average current distributions on unevenly spaced patterns Journal of the Electrochemical Society. 138: 728-735. DOI: 10.1149/1.2085666 |
0.528 |
|
| 1990 |
West AC, Sukamto JH, Newman J. A Criterion to Verify Current Distribution Calculations Journal of the Electrochemical Society. 137: 2745-2752. DOI: 10.1149/1.2087051 |
0.486 |
|
| 1989 |
West AC, Newman J. Corrections to Kinetic Measurements Taken on a Disk Electrode Journal of the Electrochemical Society. 136: 139-143. DOI: 10.1149/1.2096573 |
0.502 |
|
| 1989 |
West AC, Newman J. Interpretation of Kinetic Rate Data Taken in a Channel Flow Cell Journal of the Electrochemical Society. 136: 3755-3759. DOI: 10.1149/1.2096542 |
0.486 |
|
| 1989 |
West AC, Newman J. Current Distribution near an Electrode Edge as a Primary Distribution Is Approached Journal of the Electrochemical Society. 136: 2935-2939. DOI: 10.1149/1.2096376 |
0.495 |
|
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