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Allan Bower - Publications

Affiliations: 
Brown University, Providence, RI 
Area:
Applied Mechanics, Mechanical Engineering, Materials Science Engineering
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51 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2019 Chason E, Bower AF. Kinetic Monte Carlo simulations of stress and morphology evolution in polycrystalline thin films Journal of Applied Physics. 125: 115304. DOI: 10.1063/1.5085313  0.577
2019 Sun D, Lee H, Jeon C, Bower A, Kumar S, Park I, Ro Y, Ayer R. Evolution of Microstructure and Creep Behavior in an Fe-Ni-Cr-Nb-C Alloy during Service in Hydrocarbon Cracker Tubes Journal of Materials Engineering and Performance. 28: 6588-6602. DOI: 10.1007/S11665-019-04447-8  0.408
2017 Pei F, Buchovecky E, Bower A, Chason E. Stress evolution and whisker growth during thermal cycling of Sn films: A comparison of analytical modeling and experiments Acta Materialia. 129: 462-473. DOI: 10.1016/J.Actamat.2017.03.005  0.812
2016 Hulikal S, Chen C, Chason E, Bower A. Experimental Calibration of a Cahn-Hilliard Phase-Field Model for Phase Transformations in Li-Sn Electrodes Journal of the Electrochemical Society. 163: A2647-A2659. DOI: 10.1149/2.0701613Jes  0.389
2016 Pei F, Jadhav N, Buchovecky E, Bower AF, Chason E, Liu W, Tischler JZ, Ice GE, Xu R. In-situ synchrotron micro-diffraction study of surface, interface, grain structure, and strain/stress evolution during Sn whisker/hillock formation Journal of Applied Physics. 119. DOI: 10.1063/1.4942920  0.787
2016 Gerbig D, Bower A, Savic V, Hector LG. Coupling digital image correlation and finite element analysis to determine constitutive parameters in necking tensile specimens International Journal of Solids and Structures. 496-509. DOI: 10.1016/J.Ijsolstr.2016.06.038  0.358
2015 Nadimpalli SPV, Sethuraman VA, Abraham DP, Bower AF, Guduru PR. Stress evolution in lithium-ion composite electrodes during electrochemical cycling and resulting internal pressures on the cell casing Journal of the Electrochemical Society. 162: A2656-A2663. DOI: 10.1149/2.0341514Jes  0.31
2015 Bower AF, Guduru PR, Chason E. Analytical solutions for composition and stress in spherical elastic-plastic lithium-ion electrode particles containing a propagating phase boundary International Journal of Solids and Structures. DOI: 10.1016/J.Ijsolstr.2015.05.018  0.327
2015 Bower AF, Chason E, Guduru PR, Sheldon BW. A continuum model of deformation, transport and irreversible changes in atomic structure in amorphous lithium-silicon electrodes Acta Materialia. 98: 229-241. DOI: 10.1016/J.Actamat.2015.07.036  0.383
2015 Pei F, Bower AF, Chason E. Quantifying the Rates of Sn Whisker Growth and Plastic Strain Relaxation Using Thermally-Induced Stress Journal of Electronic Materials. DOI: 10.1007/S11664-015-3965-4  0.444
2014 Pei F, Briant CL, Kesari H, Bower AF, Chason E. Kinetics of Sn whisker nucleation using thermally induced stress Scripta Materialia. 93: 16-19. DOI: 10.1016/J.Scriptamat.2014.08.019  0.397
2014 Chen P, Ghassemi-Armaki H, Kumar S, Bower A, Bhat S, Sadagopan S. Microscale-calibrated modeling of the deformation response of dual-phase steels Acta Materialia. 65: 133-149. DOI: 10.1016/J.Actamat.2013.11.036  0.391
2014 Chason E, Pei F, Briant CL, Kesari H, Bower AF. Significance of Nucleation Kinetics in Sn Whisker Formation Journal of Electronic Materials. 43: 4435-4441. DOI: 10.1007/S11664-014-3379-8  0.483
2013 Chason E, Jadhav N, Pei F, Buchovecky E, Bower A. Growth of whiskers from Sn surfaces: Driving forces and growth mechanisms Progress in Surface Science. 88: 103-131. DOI: 10.1016/J.Progsurf.2013.02.002  0.823
2013 Ghassemi-Armaki H, Chen P, Bhat S, Sadagopan S, Kumar S, Bower A. Microscale-calibrated modeling of the deformation response of low-carbon martensite Acta Materialia. 61: 3640-3652. DOI: 10.1016/J.Actamat.2013.02.051  0.41
2012 Bower AF, Guduru PR. A simple finite element model of diffusion, finite deformation, plasticity and fracture in lithium ion insertion electrode materials Modelling and Simulation in Materials Science and Engineering. 20. DOI: 10.1088/0965-0393/20/4/045004  0.307
2011 Cipoletti DE, Bower AF, Krajewski PE. A microstructure-based model of the deformation mechanisms and flow stress during elevated-temperature straining of a magnesium alloy Scripta Materialia. 64: 931-934. DOI: 10.1016/J.Scriptamat.2010.12.033  0.424
2011 Bower AF, Guduru PR, Sethuraman VA. A finite strain model of stress, diffusion, plastic flow, and electrochemical reactions in a lithium-ion half-cell Journal of the Mechanics and Physics of Solids. 59: 804-828. DOI: 10.1016/J.Jmps.2011.01.003  0.398
2011 Du N, Qi Y, Krajewski PE, Bower AF. The effect of solute atoms on aluminum grain boundary sliding at elevated temperature Metallurgical and Materials Transactions a: Physical Metallurgy and Materials Science. 42: 651-659. DOI: 10.1007/S11661-010-0326-Z  0.6
2010 Sethuraman VA, Srinivasan V, Bower AF, Guduru PR. In situ measurements of stress-potential coupling in lithiated silicon Journal of the Electrochemical Society. 157: A1253-A1261. DOI: 10.1149/1.3489378  0.332
2010 Jadhav N, Buchovecky EJ, Reinbold L, Kumar S, Bower AF, Chason E. Understanding the correlation between intermetallic growth, stress evolution, and Sn whisker nucleation Ieee Transactions On Electronics Packaging Manufacturing. 33: 183-192. DOI: 10.1109/Tepm.2010.2043847  0.823
2010 Wei Y, Bower AF, Gao H. Analytical model and molecular dynamics simulations of the size dependence of flow stress in amorphous intermetallic nanowires at temperatures near the glass transition Physical Review B - Condensed Matter and Materials Physics. 81. DOI: 10.1103/Physrevb.81.125402  0.381
2010 Singh N, Bower AF, Shankar S. A three-dimensional model of electromigration and stress induced void nucleation in interconnect structures Modelling and Simulation in Materials Science and Engineering. 18. DOI: 10.1088/0965-0393/18/6/065006  0.462
2010 Du N, Bower AF, Krajewski PE. Numerical simulations of void growth in aluminum alloy AA5083 during elevated temperature deformation Materials Science and Engineering A. 527: 4837-4846. DOI: 10.1016/J.Msea.2010.04.010  0.69
2010 Du N, Qi Y, Krajewski PE, Bower AF. Aluminum R3 grain boundary sliding enhanced by vacancy diffusion Acta Materialia. 58: 4245-4252. DOI: 10.1016/J.Actamat.2010.04.016  0.638
2010 Krajewski PE, Hector LG, Du N, Bower AF. Microstructure-based multiscale modeling of elevated temperature deformation in aluminum alloys Acta Materialia. 58: 1074-1086. DOI: 10.1016/J.Actamat.2009.10.023  0.634
2010 Jadhav N, Buchovecky E, Chason E, Bower A. Real-time SEM/FIB studies of whisker growth and surface modification Jom. 62: 30-37. DOI: 10.1007/S11837-010-0105-8  0.78
2009 Buchovecky EJ, Du N, Bower AF. A model of Sn whisker growth by coupled plastic flow and grain boundary diffusion Applied Physics Letters. 94. DOI: 10.1063/1.3136865  0.801
2009 Cipoletti DE, Bower AF, Qi Y, Krajewski PE. The influence of heterogeneity in grain boundary sliding resistance on the constitutive behavior of AA5083 during high-temperature deformation Materials Science and Engineering: A. 504: 175-182. DOI: 10.1016/J.Msea.2008.10.037  0.377
2009 Buchovecky E, Jadhav N, Bower AF, Chason E. Finite element modeling of stress evolution in Sn films due to growth of the Cu 6Sn 5 intermetallic compound Journal of Electronic Materials. 38: 2676-2684. DOI: 10.1007/S11664-009-0911-3  0.822
2008 Kumar K, Reinbold L, Bower A, Chason E. Plastic deformation processes in Cu/Sn bimetallic films Journal of Materials Research. 23: 2916-2934. DOI: 10.1557/Jmr.2008.0351  0.407
2008 Du N, Bower AF, Krajewski PE, Taleff EM. The influence of a threshold stress for grain boundary sliding on constitutive response of polycrystalline Al during high temperature deformation Materials Science and Engineering: A. 494: 86-91. DOI: 10.1016/J.Msea.2007.10.089  0.663
2008 Tello JS, Bower AF. Numerical simulations of stress generation and evolution in Volmer-Weber thin films Journal of the Mechanics and Physics of Solids. 56: 2727-2747. DOI: 10.1016/J.Jmps.2008.02.008  0.808
2008 WEI Y, BOWER A, GAO H. Recoverable creep deformation and transient local stress concentration due to heterogeneous grain-boundary diffusion and sliding in polycrystalline solids Journal of the Mechanics and Physics of Solids. 56: 1460-1483. DOI: 10.1016/J.Jmps.2007.08.007  0.48
2008 Wei Y, Bower AF, Gao H. Enhanced strain-rate sensitivity in fcc nanocrystals due to grain-boundary diffusion and sliding Acta Materialia. 56: 1741-1752. DOI: 10.1016/J.Actamat.2007.12.028  0.374
2007 Tello JS, Bower AF, Chason E, Sheldon BW. Kinetic model of stress evolution during coalescence and growth of polycrystalline thin films. Physical Review Letters. 98: 216104. PMID 17677789 DOI: 10.1103/Physrevlett.98.216104  0.801
2007 Bower AF, Shankar S. A finite element model of electromigration induced void nucleation, growth and evolution in interconnects Modelling and Simulation in Materials Science and Engineering. 15: 923-940. DOI: 10.1088/0965-0393/15/8/008  0.459
2007 Wei Y, Bower AF, Gao H. Recoverable creep deformation due to heterogeneous grain-boundary diffusion and sliding Scripta Materialia. 57: 933-936. DOI: 10.1016/J.Scriptamat.2007.07.031  0.362
2007 Sheldon BW, Bhandari A, Bower AF, Raghavan S, Weng X, Redwing JM. Steady-state tensile stresses during the growth of polycrystalline films Acta Materialia. 55: 4973-4982. DOI: 10.1016/J.Actamat.2007.05.008  0.562
2007 Agarwal S, Briant CL, Krajewski PE, Bower AF, Taleff EM. Experimental validation of two-dimensional finite element method for simulating constitutive response of polycrystals during high temperature plastic deformation Journal of Materials Engineering and Performance. 16: 170-178. DOI: 10.1007/S11665-007-9028-0  0.403
2005 Singh N, Bower AF, Gan D, Yoon S, Ho PS, Leu J, Shankar S. Numerical simulations and experimental measurements of stress relaxation by interface diffusion in a patterned copper interconnect structure Journal of Applied Physics. 97: 013539. DOI: 10.1063/1.1829372  0.442
2004 Tang Z, Bower A, Chuang T. Numerical simulations of the growth and deflection of a stress-corrosion notch on the interface between two reactive solids International Journal of Fracture. 127: 1-20. DOI: 10.1023/B:FRAC.0000035070.99093.77  0.434
2002 Rajamani A, Sheldon BW, Chason E, Bower AF. Intrinsic tensile stress and grain boundary formation during Volmer-Weber film growth Applied Physics Letters. 81: 1204-1206. DOI: 10.1063/1.1494459  0.559
2002 Fridline D, Bower A. Numerical simulations of stress induced void evolution and growth in interconnects Journal of Applied Physics. 91: 2380-2390. DOI: 10.1063/1.1428097  0.755
2002 Bhate DN, Bower AF, Kumar A. A phase field model for failure in interconnect lines due to coupled diffusion mechanisms Journal of the Mechanics and Physics of Solids. 50: 2057-2083. DOI: 10.1016/S0022-5096(02)00019-4  0.725
2000 Bhate DN, Kumar A, Bower AF. Diffuse interface model for electromigration and stress voiding Journal of Applied Physics. 87: 1712-1721. DOI: 10.1063/1.372082  0.424
1997 Xia L, Bower A, Suo Z, Shih C. A finite element analysis of the motion and evolution of voids due to strain and electromigration induced surface diffusion Journal of the Mechanics and Physics of Solids. 45: 1473-1493. DOI: 10.1016/S0022-5096(97)00013-6  0.394
1995 Bower A, Freund L. Finite Element Analysis of Electromigration and Stress Induced Diffusion in Deformable Solids Mrs Proceedings. 391. DOI: 10.1557/PROC-391-177  0.459
1993 Bower AF, Ortiz M. The Influence of Grain Size on the Toughness of Monolithic Ceramics Journal of Engineering Materials and Technology. 115: 228-236. DOI: 10.1115/1.2904212  0.308
1988 Freund LB, Bower A, Ramirez JC. Mechanics of Elastic Dislocations in Strained Layer Structures Mrs Proceedings. 130. DOI: 10.1557/Proc-130-139  0.38
1986 Olver A, Spikes H, Bower A, Johnson K. The residual stress distribution in a plastically deformed model asperity Wear. 107: 151-174. DOI: 10.1016/0043-1648(86)90025-6  0.328
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